JP2796200B2 - Manufacturing method of coil substrate - Google Patents
Manufacturing method of coil substrateInfo
- Publication number
- JP2796200B2 JP2796200B2 JP3097656A JP9765691A JP2796200B2 JP 2796200 B2 JP2796200 B2 JP 2796200B2 JP 3097656 A JP3097656 A JP 3097656A JP 9765691 A JP9765691 A JP 9765691A JP 2796200 B2 JP2796200 B2 JP 2796200B2
- Authority
- JP
- Japan
- Prior art keywords
- coil
- substrate
- uncured resin
- circuit pattern
- circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000000758 substrate Substances 0.000 title claims description 41
- 238000004519 manufacturing process Methods 0.000 title claims description 15
- 239000011347 resin Substances 0.000 claims description 64
- 229920005989 resin Polymers 0.000 claims description 64
- 239000000463 material Substances 0.000 claims description 15
- 238000007747 plating Methods 0.000 claims description 14
- 238000003780 insertion Methods 0.000 claims description 9
- 230000037431 insertion Effects 0.000 claims description 9
- 238000007731 hot pressing Methods 0.000 claims description 7
- 238000007639 printing Methods 0.000 claims description 7
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 5
- 239000011889 copper foil Substances 0.000 claims description 4
- 238000000034 method Methods 0.000 description 21
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 4
- 239000004020 conductor Substances 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
- 238000005530 etching Methods 0.000 description 4
- 239000011521 glass Substances 0.000 description 3
- 229910000679 solder Inorganic materials 0.000 description 3
- 239000004593 Epoxy Substances 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 239000003054 catalyst Substances 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- 239000004744 fabric Substances 0.000 description 2
- 229910052742 iron Inorganic materials 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 229910000976 Electrical steel Inorganic materials 0.000 description 1
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 239000004809 Teflon Substances 0.000 description 1
- 229920006362 Teflon® Polymers 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 239000011737 fluorine Substances 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- MOFOBJHOKRNACT-UHFFFAOYSA-N nickel silver Chemical compound [Ni].[Ag] MOFOBJHOKRNACT-UHFFFAOYSA-N 0.000 description 1
- 239000010956 nickel silver Substances 0.000 description 1
- 239000004745 nonwoven fabric Substances 0.000 description 1
- 238000000059 patterning Methods 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
Landscapes
- Windings For Motors And Generators (AREA)
- Manufacture Of Motors, Generators (AREA)
Description
【０００１】[0001]
【産業上の利用分野】この発明は、コイル基板、特に偏
平モータ用の駆動コイルを有するコイル基板の製造方法
に関する。BACKGROUND OF THE INVENTION This invention, the coil substrate, relates to manufacturing methods of the coil substrates having particular driving coil for flat motors.
【０００２】[0002]
【従来の技術】ステンレススチールやニッケル等の平板
状導電板に回路を形成し、この回路をプリプレグ基板に
熱プレスで転写し、プリプレグ基板上に導体回路を形成
した導体回路板及びその製造方法が知られている（特開
昭６３−６９２９１号公報）。2. Description of the Related Art A conductor circuit board in which a circuit is formed on a flat conductive plate made of stainless steel, nickel, or the like, and the circuit is transferred to a prepreg substrate by hot pressing, and a conductor circuit is formed on the prepreg board, and a method of manufacturing the same. This is known (JP-A-63-69291).
【０００３】[0003]
【発明が解決しようとする課題】上記従来の回路板は平
板状導電板に形成した回路を転写することによって得ら
れるものであるから、メッキ工程などを含む製造工程が
複雑であり、また、良好な転写を行わせるために平板状
導電板の表面を研磨加工等により平滑性に優れた状態に
しなければならなかったり、あるいは、埋め込み型回路
板であるから、配線引き回わし用端子が樹脂層に埋没
し、そのため回路板に実装されるコイル等と回路との結
線に難があるなどの問題点が残されている。Since the above-mentioned conventional circuit board is obtained by transferring a circuit formed on a flat conductive plate, a manufacturing process including a plating step and the like is complicated, and a good circuit is obtained. For smooth transfer, the surface of the flat conductive plate must be made to have excellent smoothness by polishing or the like, or since it is an embedded circuit board, the wiring routing terminals are made of a resin layer. However, there are still problems such as difficulty in connecting a coil or the like mounted on a circuit board to a circuit.
【０００４】[0004]
【０００５】[0005]
【課題を解決するための手段】 請求項１記載の発明は、
ベース材の両面に未硬化樹脂の層を設けた基板を用い、
この基板の一方の面の未硬化樹脂層の表面側からフレー
ム回路パターン及び該フレーム回路パターンに接続され
るコイル体の少なくとも一部を、また、上記基板の他方
の面の未硬化樹脂の表面側からヨーク板の少なくとも一
部をそれぞれ熱プレスにより埋め込み、その後、上記未
硬化樹脂を硬化させて形成することを特徴とするもので
ある。請求項２記載の発明は、ベース材の片面に未硬化
樹脂を設けた基板を用い、この基板の上記未硬化樹脂の
表面にフレーム回路パターン及び該フレーム回路パター
ンに接続されるコイル体を乗せ、熱プレスにより上記回
路パターン及び上記コイル体の少なくとも一部を上記未
硬化樹脂に埋め込んで一体化することを特徴とするもの
である。請求項３記載の発明は、ベース材の片面に未硬
化樹脂を設けた基板を用い、この基板の上記未硬化樹脂
の表面にコイル体が圧入されるコイル圧入凹部を熱プレ
スにより形成し、その後、上記コイル挿入凹部を含めた
上記樹脂部表面に、上記コイル圧入凹部に上記コイル体
を保持させたとき上記コイル体が備える接続端子に接続
される銅箔又はフレーム回路パターンを形成することを
特徴とするものである。 According to the first aspect of the present invention,
Using a substrate provided with uncured resin layers on both sides of the base material,
The frame circuit pattern and at least a part of the coil body connected to the frame circuit pattern from one surface of the uncured resin layer on one surface of the substrate, and the uncured resin surface on the other surface of the substrate. , At least a part of the yoke plate is embedded by a hot press, and then the uncured resin is cured to form the yoke plate. The invention according to claim 2 uses a substrate having an uncured resin provided on one surface of a base material, and places a frame circuit pattern and a coil body connected to the frame circuit pattern on the surface of the uncured resin of the substrate, At least a part of the circuit pattern and the coil body is embedded in the uncured resin by heat pressing to be integrated. The invention according to claim 3 uses a substrate in which an uncured resin is provided on one surface of a base material, and forms a coil press-fitting recess into which a coil body is press-fitted on the surface of the uncured resin by hot pressing. Forming, on the surface of the resin portion including the coil insertion recess, a copper foil or a frame circuit pattern to be connected to a connection terminal provided in the coil body when the coil body is held in the coil press-fitting recess. It is assumed that.
【０００６】請求項４記載の発明は、ベース材の片面に
未硬化樹脂を設けた基板を用い、この基板の上記未硬化
樹脂の表面に熱プレスによりコイル体を埋め込むと共に
上記未硬化樹脂を硬化させた後、上記樹脂表面に上記コ
イル体に接続される回路パターンを印刷又はメッキによ
り形成することを特徴とするものである。According to a fourth aspect of the present invention, a substrate having an uncured resin provided on one surface of a base material is used, and a coil body is embedded by hot pressing on the surface of the uncured resin of the substrate, and the uncured resin is cured. After that, a circuit pattern to be connected to the coil body is formed on the resin surface by printing or plating.
【０００７】[0007]
【０００８】[0008]
【作用】プリプレグ基板へのコイル、ヨークの埋め込み
及び回路の同時形成によりコイル基板が一体成形され、
コイル基板の薄型化、製造工程の簡略化が図られ、プリ
プレグ基板上に回路形成を行うことにより、プリント配
線基板が不要となり部品点数が削減する。更に、ヨーク
板をコイル体下の必要部分に所定の形状にて一体成形す
れば、従来の鉄板基板が不要となり、コイル基板の小型
・軽量化が図れる。The coil substrate is integrally formed by embedding the coil and yoke in the prepreg substrate and simultaneously forming the circuit.
The thickness of the coil substrate can be reduced and the manufacturing process can be simplified. By forming a circuit on the prepreg substrate, a printed wiring board is not required and the number of components can be reduced. Furthermore, if the yoke plate is integrally formed in a required shape below the coil body in a predetermined shape, the conventional iron plate substrate becomes unnecessary and the size and weight of the coil substrate can be reduced.
【０００９】[0009]
【実施例】図１，２において、円形のベース材１の表裏
両面には樹脂層２，３がそれぞれ設けられており、一方
の樹脂層２には花弁状に並んだ複数のコイル体Ｃ１，Ｃ
２，・・・・が、そして他の樹脂層３には磁路を形成するた
めのドーナツ状のヨーク板５がそれぞれ埋め込まれて本
発明のコイル基板が形成されている。1 and 2, resin layers 2 and 3 are provided on both front and back surfaces of a circular base material 1, and one resin layer 2 has a plurality of coil bodies C1 and C1 arranged in a petal shape. C
The doughnut-shaped yoke plates 5 for forming a magnetic path are respectively embedded in the other resin layers 3 to form the coil substrate of the present invention.
【００１０】各コイル体Ｃ１，Ｃ２，・・・・は、所定のコ
イル体同士が、一部を樹脂層２内に埋設された回路パタ
ーンによって接続されている。例えば、コイル体Ｃ１の
内側端子とコイル体Ｃ４の外側端子とが銅箔からなる回
路パターンＣ1-4により、また、コイル体Ｃ２の内側端
子とコイル体Ｃ５の外側端子とが回路パターンＣ2-5に
より、そしてコイル体Ｃ３，Ｃ４，Ｃ５の各内側が互に
回路パターンＣ3-4-5でそれぞれ接続されている。Each of the coil bodies C1, C2,... Is connected to a predetermined coil body by a circuit pattern partially embedded in the resin layer 2. For example, the inner terminal of the coil C1 and the outer terminal of the coil C4 are formed by a circuit pattern C 1-4 made of copper foil, and the inner terminal of the coil C2 and the outer terminal of the coil C5 are formed by a circuit pattern C 2. -5 , and the insides of the coil bodies C3, C4, and C5 are connected to each other by a circuit pattern C3-4-5 .
【００１１】コイルＣ１，Ｃ２及びＣ６の各外側端子
は、モータの駆動回路（図示されず）に接続される端子
ａ，ｂ，ｃとして樹脂層２の周縁に引き出されている。
なお、端子ａ，ｂ，ｃは、図１に示すように樹脂層２の
表面に形成してもよいし、樹脂層２の外周面を一部切欠
いてそこに端子部を形成してもよい。あるいは、裏面側
の樹脂層３に形成してもよい。The outer terminals of the coils C1, C2 and C6 are led out to the periphery of the resin layer 2 as terminals a, b and c which are connected to a motor drive circuit (not shown).
In addition, the terminals a, b, and c may be formed on the surface of the resin layer 2 as shown in FIG. 1, or a terminal portion may be formed by partially cutting out the outer peripheral surface of the resin layer 2. . Alternatively, it may be formed on the resin layer 3 on the back side.
【００１２】コイル体と回路パターンとの結線は、図３
に示すように、コイル体Ｃ５を例にとると、同コイル体
Ｃ５の外側端子Ｃ５ａと回路パターンＣ1-5の端子Ｃ５
ｃとが、そして同コイル体Ｃ５の内側端子Ｃ５ｂと回路
パターンＣ1-5の端子Ｃ５ｄとが、コイル体Ｃ５が樹脂
層２に埋め込まれることによって互に接触することで行
われる。The connection between the coil body and the circuit pattern is shown in FIG.
As shown in, taking the coil body C5 example, the terminal of the outer terminal C5a and the circuit pattern C 1-5 of the coil body C5 C5
and c, and the terminal C5d inner terminal C5b and the circuit pattern C 1-5 of the coil body C5 is, the coil body C5 is carried out by contacting each other by being buried in the resin layer 2.
【００１３】ベース材１の材料としては、ガラスクロス
あるいはポリエステル、ガラス不織布、紙などが採用さ
れ、ベース材１の両面に設けられる樹脂としてはポリイ
ミド、エポキシ、フェノールなどが用いられる。As a material of the base material 1, glass cloth, polyester, glass nonwoven fabric, paper, or the like is employed, and as a resin provided on both sides of the base material 1, polyimide, epoxy, phenol, or the like is used.
【００１４】次に、コイル基板の４つの製造方法、
（１）フレーム法、（２）メッキ法、（３）成形法及び
（４）印刷法を説明する。Next, there are four methods for manufacturing the coil substrate,
The (1) frame method, (2) plating method, (3) molding method, and (4) printing method will be described.
【００１５】（１）フレーム法（図４） 図４(a）に示すように、ガラスクロスからなるベース材
１の両面に未硬化樹脂層２，３を設けたプリプレグ１０
を用意する。プリプレグ１０の一方の未硬化樹脂層２の
上に、(b）に示すように、コイル体Ｃと予じめハンダＣ
ａなどにより接続された回路フレーム１１を載せ、他方
の未硬化樹脂層３にはヨーク板５が当てがわれる。(1) Frame method (FIG. 4) As shown in FIG. 4A, a prepreg 10 in which uncured resin layers 2 and 3 are provided on both surfaces of a base material 1 made of glass cloth.
Prepare On one of the uncured resin layers 2 of the prepreg 10, as shown in FIG.
The circuit frame 11 connected by a or the like is mounted, and the yoke plate 5 is applied to the other uncured resin layer 3.
【００１６】熱を加えながら、コイル体Ｃとヨーク板５
を、(c）に示すように、各未硬化樹脂層２，３に押し込
んで未硬化樹脂層２に回路フレーム１１の一部とコイル
体Ｃを、そして未硬化樹脂層３にヨーク板５をそれぞれ
埋め込む。While applying heat, the coil body C and the yoke plate 5
Is pressed into the uncured resin layers 2 and 3 as shown in (c), a part of the circuit frame 11 and the coil body C are placed on the uncured resin layer 2, and the yoke plate 5 is placed on the uncured resin layer 3. Embed each one.
【００１７】回路フレーム１１は、銅箔、洋白箔をプレ
ス加工あるいはエッチングによって配線パターンに形成
したものである。The circuit frame 11, the copper foil is obtained by forming a nickel silver foil wiring pattern by pressing or etching.
【００１８】（２）メッキ法（図５） 図５(a）に示すように、ベース材１及び未硬化樹脂層
２，３からなるプリプレグ１０の未硬化樹脂層２上にメ
ッキにより回路パターン１２を形成し、(b）に示すよう
に、回路パターン１２上にコイル体Ｃを載せて回路パタ
ーン１２とコイル体Ｃとをリフローにより結線し、未硬
化樹脂層３にヨーク板５を当てがい、熱を加えながら、
コイル体Ｃとヨーク板５を、(c）に示すように各未硬化
樹脂層２，３に押し込む。(2) Plating Method (FIG. 5) As shown in FIG. 5A, a circuit pattern 12 is formed on the uncured resin layer 2 of the prepreg 10 comprising the base material 1 and the uncured resin layers 2 and 3 by plating. Is formed, and as shown in (b), the coil body C is mounted on the circuit pattern 12, the circuit pattern 12 and the coil body C are connected by reflow, and the yoke plate 5 is applied to the uncured resin layer 3, While applying heat,
The coil body C and the yoke plate 5 are pushed into the respective uncured resin layers 2 and 3 as shown in FIG.
【００１９】未硬化樹脂層２上の本実施例におけるメッ
キ法による回路パターン１２は、未硬化樹脂層２に触媒
レジンを塗布し、これを所定のパターンに露光し、現像
し、現像されたパターンに導電体をメッキすることによ
り形成されるが、未硬化樹脂層２にパネルメッキを施こ
し、その上に、塗布によりレジスト層を形成し、これを
露光・現像したのちエッチングを行って回路パターンを
形成してもよい（エッチング法）。パネルメッキの代り
にＣｕ箔を貼付してもよい。もう一つの回路パターン形
成法として、未硬化樹脂層２に触媒レジン（ポリカーボ
ネート、エポキシ系等）または導電性ペーストで回路パ
ターンを印刷し、その上に導電体メッキを行う方法（印
刷法）を採用することもできる。The circuit pattern 12 on the uncured resin layer 2 by the plating method in this embodiment is obtained by applying a catalyst resin to the uncured resin layer 2, exposing it to a predetermined pattern, developing, and developing the developed pattern. Is formed by plating a conductor on the uncured resin layer 2. The uncured resin layer 2 is subjected to panel plating, a resist layer is formed on the uncured resin layer 2 by application, and the resist layer is exposed and developed, and then etched to perform circuit patterning. May be formed (etching method). A Cu foil may be attached instead of the panel plating. Another circuit pattern forming method, catalysts les di in to the uncured resin layer 2 (polycarbonate, epoxy, etc.) or conductive paste to print a circuit pattern, a method (printing method) for performing a conductor plating thereon Can also be adopted.
【００２０】（３）成形法（図６） 図６(a）に示すように、未硬化樹脂層２にテフロン（商
品名）などの離型シート１３を介してプレス型１４によ
り熱を加えながらコイル挿入凹部１５を形成し、次に
(b）に示すように、このコイル挿入凹部１５の底面、側
壁の一部及び樹脂層２の一部に、前記のメッキ法あるい
はエッチング法により配線引き回わし回路１６を形成し
たのち、マイナス公差で成形されたコイル挿入凹部１５
に、図(c）に示すようにコイル体Ｃを圧入する。コイル
体Ｃの挿入凹部１５への圧入により、コイルの内外側各
端子と回路１６、たとえば図３に示すＣ５ａとＣ５ｃ，
及びＣ５ｂとＣ５ｄとが互に圧接することにより結線さ
れるが、より信頼性を確保するためにはコイル圧入時
に、各端子に導電ペーストを塗布すればよい。(3) Forming Method (FIG. 6) As shown in FIG. 6A, the uncured resin layer 2 is heated by a press die 14 through a release sheet 13 such as Teflon (trade name). Form the coil insertion recess 15 and then
As shown in (b), a wiring routing circuit 16 is formed on the bottom surface, a part of the side wall, and a part of the resin layer 2 of the coil insertion concave part 15 by the plating method or the etching method, and then has a minus tolerance. Coil insertion recess 15 formed by
Then, the coil body C is press-fitted as shown in FIG. By press-fitting the coil body C into the insertion recess 15, the inner and outer terminals of the coil and the circuit 16, for example, C5a and C5c shown in FIG.
And C5b and C5d are connected by pressure contact with each other, but in order to ensure more reliability, conductive paste may be applied to each terminal at the time of coil press-fitting.
【００２１】離型シート１３の代りにリリーザゲン、ダ
イフリー５４１（商品名）等のシリコン系、フッソ系な
どの離型剤を用いてもよい。また、コイル挿入凹部１５
を成形するときヨーク板５を同時に未硬化樹脂３に圧入
する。Instead of the release sheet 13, a release agent such as a silicone-based or fluorine-based release agent such as Lirezagen or Daifree 541 (trade name) may be used. Also, the coil insertion recess 15
The yoke plate 5 is pressed into the uncured resin 3 at the same time.
【００２２】（４）印刷法（図７） 図７(a）に示すように、コイル体Ｃとヨーク板５とを、
未硬化樹脂層２と３とに熱プレスによりそれぞれ圧入す
る。この場合、コイル体Ｃの結線用端子に樹脂が被ぶら
ないように、かつ半田ペーストのスクリーン印刷が可能
なレベルまで浮かしておく。次に(b）に示すように、配
線引き回わし用回路１７をメッキ法、エッチング法ある
いは印刷法で形成する。その後、半田ペーストをスクリ
ーン印刷しリフローによりコイル体と回路との結線を行
う。(4) Printing Method (FIG. 7) As shown in FIG. 7A, the coil body C and the yoke plate 5 are
Each of the uncured resin layers 2 and 3 is press-fitted by a hot press. In this case, the connection terminals of the coil body C are floated so that the resin does not cover the connection terminals and the solder paste is screen-printed with solder paste. Next, as shown in (b), the wiring routing circuit 17 is formed by plating, etching or printing. Thereafter, the solder paste is screen-printed, and the coil body and the circuit are connected by reflow.
【００２３】ヨーク板５としてはケイ素鋼板、鉄板、パ
ーメンジュール等が用いられる。またコイル体として
は、巻回式で作られたスライスコイル、すなわち、巻回
コイルを所定数接着等によって一体化し、その後、０．
６〜０．８ｍｍの厚さにスライスした偏平コイルが用い
られる。As the yoke plate 5, a silicon steel plate, an iron plate, permendur or the like is used. As the coil body, a wound coil made of a wound type coil, that is, a wound coil is integrated by a predetermined number of adhesives and the like, and then the coil is wound.
A flat coil sliced to a thickness of 6 to 0.8 mm is used.
【００２４】[0024]
【発明の効果】プレプリグ板を用いた発明によれば、フ
レームや回路と接続されるコイル体、ヨーク板を樹脂層
に埋め込み、圧入するので、コイル基板が一体成形さ
れ、コイル基板が軽量薄型化し、またコイル基板の製造
工程が簡略化する。また、コイルと配線回路が一体化さ
れ、かつ、結線用端子が一体的に設けられるので、コス
トダウンも図ることができる。さらに、フレーム回路パ
ターンやコイル体、ヨーク板が、埋め込まれた樹脂の硬
化作用によって密着して位置保持されるので、フレーム
回路パターンやコイル体、ヨーク板を、位置ズレを起こ
すことなく確実に樹脂層に保持できる。 According to the invention using the prepreg plate, the coil body and the yoke plate connected to the frame and the circuit are embedded in the resin layer and press-fitted, so that the coil substrate is integrally formed, and the coil substrate is reduced in weight and thickness. Also, the manufacturing process of the coil substrate is simplified. Further, since the coil and the wiring circuit are integrated and the connection terminal is provided integrally, the cost can be reduced. In addition, the frame circuit
The turn, coil body and yoke plate are
The frame is held in close contact by the
The circuit pattern, coil body and yoke plate may be misaligned.
It can be reliably held on the resin layer without causing any problem.
【図１】この発明に係るコイル基板の平面図である。1 is a plan view of the coil substrate according to the present invention.
【図２】図１のＡ−Ａ拡大断面図である。FIG. 2 is an enlarged sectional view taken along line AA of FIG.
【図３】樹脂層に形成されたコイル挿入凹部とこれに装
着されるコイル体とを示す傾斜図である。FIG. 3 is a perspective view showing a coil insertion recess formed in a resin layer and a coil body mounted on the recess.
【図４】この発明のフレーム法によるコイル基板の製造
方法の説明図である。FIG. 4 is an explanatory diagram of a method of manufacturing a coil substrate by a frame method according to the present invention.
【図５】この発明のメッキ法によるコイル基板の製造方
法の説明図である。FIG. 5 is an explanatory diagram of a method of manufacturing a coil substrate by a plating method according to the present invention.
【図６】この発明の成形法によるコイル基板の製造方法
の説明図である。FIG. 6 is an explanatory diagram of a method for manufacturing a coil substrate by the molding method of the present invention.
【図７】この発明の印刷法によるコイル基板の製造方法
の説明図である。FIG. 7 is an explanatory diagram of a method of manufacturing a coil substrate by a printing method according to the present invention.
１ ベース材 ２，３ 樹脂層 ５ ヨーク板 １０ プリプレグ板 １１ 回路フレーム １２ 回路パターン １５ コイル挿入穴 １６，１７ 回路 REFERENCE SIGNS LIST 1 base material 2, 3 resin layer 5 yoke plate 10 prepreg plate 11 circuit frame 12 circuit pattern 15 coil insertion hole 16, 17 circuit
───────────────────────────────────────────────────── フロントページの続き (72)発明者 松山 泰治 長野県駒ケ根市赤穂14−888番地・株式 会社三協精機製作所駒ケ根工場内 (72)発明者 丹羽 伸一 長野県駒ケ根市赤穂14−888番地・株式 会社三協精機製作所駒ケ根工場内 (56)参考文献 実開 平２−122552（ＪＰ，Ｕ) 実開 平２−68673（ＪＰ，Ｕ) 実開 昭62−11348（ＪＰ，Ｕ) (58)調査した分野(Int.Cl.6，ＤＢ名) H02K 3/00 - 3/52 H02K 15/02,15/12 H02K 29/00──────────────────────────────────────────────────続 き Continued on the front page (72) Inventor Taiji Matsuyama 14-888 Ako, Komagane City, Nagano Prefecture / In the Komagane Plant of Sankyo Seiki Seisakusho Co., Ltd. (72) Inventor Shinichi Niwa 14-888 Ako Komagane City, Nagano Prefecture In the Komagane Plant of Sankyo Seiki Seisakusho Co., Ltd. (56) References JP-A 2-122552 (JP, U) JP-A 2-68673 (JP, U) JP-A 62-11348 (JP, U) (58) Field surveyed (Int.Cl. 6 , DB name) H02K 3/00-3/52 H02K 15 / 02,15 / 12 H02K 29/00
Claims (4)
基板を用い、この基板の一方の面の未硬化樹脂層の表面
側からフレーム回路パターン及び該フレーム回路パター
ンに接続されるコイル体の少なくとも一部を、また、上
記基板の他方の面の未硬化樹脂の表面側からヨーク板の
少なくとも一部をそれぞれ熱プレスにより埋め込み、そ
の後、上記未硬化樹脂を硬化させて形成するコイル基板
の製造方法。1. A substrate having an uncured resin layer provided on both sides of a base material, and a frame circuit pattern and a coil connected to the frame circuit pattern from one surface of the uncured resin layer on one surface of the substrate. A coil substrate formed by embedding at least a part of the body and at least a part of the yoke plate from the surface side of the uncured resin on the other surface of the substrate by hot pressing, and then curing the uncured resin. Manufacturing method.
を用い、この基板の上記未硬化樹脂の表面にフレーム回
路パターン及び該フレーム回路パターンに接続されるコ
イル体を乗せ、熱プレスにより上記回路パターン及び上
記コイル体の少なくとも一部を上記未硬化樹脂に埋め込
んで一体化するコイル基板の製造方法。2. A substrate having an uncured resin provided on one surface of a base material, a frame circuit pattern and a coil connected to the frame circuit pattern are placed on the surface of the uncured resin of the substrate, and the substrate is subjected to hot pressing. A method of manufacturing a coil substrate, in which at least a part of the circuit pattern and the coil body is embedded in the uncured resin and integrated.
を用い、この基板の上記未硬化樹脂の表面にコイル体が
圧入されるコイル圧入凹部を熱プレスにより形成し、そ
の後、上記コイル挿入凹部を含めた上記樹脂部表面に、
上記コイル圧入凹部に上記コイル体を保持させたとき上
記コイル体が備える接続端子に接続される銅箔又はフレ
ーム回路パターンを形成するコイル基板の製造方法。3. A substrate having an uncured resin provided on one surface of a base material, and a coil press-fitting recess into which a coil body is press-fitted is formed on the surface of the uncured resin by hot pressing. On the surface of the resin part including the insertion recess,
A method of manufacturing a coil substrate, wherein a copper foil or a frame circuit pattern is formed to be connected to a connection terminal of the coil when the coil is held in the coil press-fit recess.
を用い、この基板の上記未硬化樹脂の表面に熱プレスに
よりコイル体を埋め込むと共に上記未硬化樹脂を硬化さ
せた後、上記樹脂表面に上記コイル体に接続される回路
パターンを印刷又はメッキにより形成するコイル基板の
製造方法。4. A substrate having an uncured resin provided on one surface of a base material, a coil body is embedded by hot pressing on the surface of the uncured resin of the substrate, and the uncured resin is cured. A method of manufacturing a coil substrate, wherein a circuit pattern connected to the coil body is formed on a surface by printing or plating.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3097656A JP2796200B2 (en) | 1991-04-26 | 1991-04-26 | Manufacturing method of coil substrate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3097656A JP2796200B2 (en) | 1991-04-26 | 1991-04-26 | Manufacturing method of coil substrate |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH04331431A JPH04331431A (en) | 1992-11-19 |
| JP2796200B2 true JP2796200B2 (en) | 1998-09-10 |
Family
ID=14198118
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3097656A Expired - Lifetime JP2796200B2 (en) | 1991-04-26 | 1991-04-26 | Manufacturing method of coil substrate |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2796200B2 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4571685B2 (en) | 2008-12-12 | 2010-10-27 | 本田技研工業株式会社 | Stator coil of axial gap type rotating electrical machine |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5274806A (en) * | 1976-12-02 | 1977-06-23 | Toshiba Corp | Manufacturing of electronic instrument use frame |
| JPS5537871A (en) * | 1978-09-11 | 1980-03-17 | Toshiba Corp | Method and device for manufacturing electrically-insulated coil |
| JPS61141977U (en) * | 1985-02-19 | 1986-09-02 | ||
| JPS6211348U (en) * | 1985-07-03 | 1987-01-23 | ||
| JPH0268673U (en) * | 1988-11-10 | 1990-05-24 | ||
| JPH02122552U (en) * | 1989-03-15 | 1990-10-08 |
-
1991
- 1991-04-26 JP JP3097656A patent/JP2796200B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH04331431A (en) | 1992-11-19 |
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