JP2001168491A - Printed wiring board, and manufacturing method therefor - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a method for manufacturing a printed wiring board for manufacturing a multilayer board with a high degree of integration in less manufacturing processes and wide design width when mounting parts, and the printed wiring board. SOLUTION: In this method for manufacturing a multilayer plate by the conductor bump penetration method, interlayer connection between a wiring layer 1a and a wiring layer 5a on the upper and lower surfaces of a multilayer board 7a is formed by forcing a group of conductor bumps 2, 2, etc., nearly in a conical shape formed by a conductive composition in the direction of the thickness of the multilayer board 7a, a dielectric composition or a resistive composition is applied onto a conductor plate 5 at a side for applying the group of conductor bumps 2, 2, etc., before drying, and a passive element member 6 is formed, and the passive element member is inserted into the gap between specific, adjacent conductor bumps 2a and 2b when applying the groups of conductive bumps 2, 2, etc. By bringing the conductor bumps 2a and 2b into contact each other, near both the ends of the passive element member 6, a passive element such as a capacitor C and a resistor R is formed in the multilayer board 7a.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a printed wiring board, and more particularly, to a multilayer board having electrical conduction between a plurality of wiring layers and a method for manufacturing such a multilayer board.

[0002]

2. Description of the Related Art Conventionally, in a so-called multi-layer board in which a plurality of wiring layers are interposed between substrates on which a plurality of insulating base materials are laminated, as a method of interlayer connection, a conductive via or a through-hole plating layer is used. There is known a method of burying a conductive member in a thickness direction of a substrate.

[0003] Among them, the conductor bump penetration method using a printing technique has attracted attention from the viewpoint of a manufacturing process. FIG. 39 is a vertical sectional view showing the manufacturing process of the conductor bump penetration method.
In this conductor bump penetration method, substantially conical conductor bump groups 102, 102,... Are formed on a conductor plate 101 such as a copper foil by a printing technique using a conductive composition such as a silver paste. The insulating base material prepreg 103 is provided on the groups 102, 102,.
4 are pressed by a roller press or the like in this state to allow the conductive bump groups 102, 102,.
By contacting the tip sides of 2, 102,... With the conductor plate 104, an interlayer connection is formed between the conductor plate 101 and the conductor plate 104.

In order to mount various elements on this multilayer board, wiring layers 101a and 104a as outermost layers are respectively formed on the conductor plate 101 or 104 which is the outermost layer of the multilayer board, and the element is formed on the outermost wiring layer. Fix or connect.

[0005] Therefore, it is desirable that the outermost surface of the multilayer board is flat, and in that a multilayer board having a flat surface can be formed, the conductor bump penetration method employs a method of forming conductive vias and a through-hole plating layer. This is advantageous as compared with the forming method.

[0006] By the way, with the reduction in size and weight of mobile phones and various information terminal devices, the miniaturization of semiconductor components is increasingly desired, and it is essential to further improve the degree of integration of semiconductor components.

[0007]

However, in the above-described conventional multilayer board in which semiconductor components are mounted on the outermost layer, since the area of the multilayer board itself tends to be reduced, the degree of integration is naturally limited. There is.

Therefore, a method of embedding a part of a semiconductor component in a multilayer board has been proposed. For example, Japanese Unexamined Patent Publication
JP-A-343855 and JP-A-9-214090 disclose a method of embedding a passive element such as a resistor in a through hole formed in a thickness direction of a multilayer board.

However, these methods require a step of forming a through-hole for embedding a passive element and a step of filling the through-hole with a passive element precursor. However, there is a problem that it is not profitable in terms of manufacturing cost.

The present invention has been made to solve the above-mentioned conventional problems. That is, the present invention provides a method for manufacturing a printed wiring board capable of manufacturing a multi-layer board having a high degree of integration with a minimum number of manufacturing steps and a wide design when mounting components, and such a printed wiring board. The purpose is to:

[0011]

According to the present invention, there is provided a method for manufacturing a printed wiring board, comprising: an insulating base material; and a first wiring layer and a second wiring layer provided on both surfaces of the insulating base material. A conductive bump group formed through the insulating base material in the thickness direction and connecting the first wiring layer and the second wiring layer; and the first wiring layer and the second A passive element member made of a dielectric composition or a resistive composition that is buried in contact with the plurality of conductor bumps between the wiring layers and forms a passive element between the plurality of conductor bumps.

The above printed wiring board is manufactured by the following method.

That is, in the method for manufacturing a pudding wiring board according to the present invention, a step of forming a substantially conical conductive bump group on a first conductive plate and a step of placing an insulating base material on the conductive bump group Pressing the first conductive plate and the insulating base material to penetrate the conductive bump group through the insulating base material; and forming a dielectric composition or a resistive composition on the second conductive plate. Applying an object to form a passive element member, and placing the first conductor plate and the second conductor plate with the conductor bump group and the passive element member facing each other; The first conductive plate and the second conductive plate are pressed such that at least two of the conductive bump groups are in contact with the passive element member, and a passive element is formed between at least two of the conductive bump groups. Forming the first conductive plate and the second conductive plate Comprising a step of forming the respective first wiring layer and the second wiring layer is patterned, the.

In the printed wiring board and the method of manufacturing the same, the passive element member may be provided between the conductor bumps, and may be provided between the conductor bumps and the conductor plate. May be further disposed between the tip side of the conductor bump and the conductor plate, or may be disposed between the bottom side of the conductor bump and the conductor plate.

According to another method of manufacturing a printed wiring board of the present invention, a step of forming a substantially conical conductive bump group on a first conductive plate and a step of placing an insulating base material on the conductive bump group Pressing the first conductive plate and the insulating base material to penetrate the conductive bump group through the insulating base material; and a portion of the second conductive plate where the conductive bumps abut. And a step of applying a dielectric composition or a resistive composition between a portion where the conductive bumps abut, to form a passive element member, and the first conductive plate and the second conductive plate, Placing the conductive bump group and the passive element member in the facing direction; and pressing the first and second conductive plates to set the conductive bump group to the second conductive plate. A passive element between the conductive bump and the passive element member. And forming, the first of the first respectively by patterning the conductive plate and second conductive plate
Forming a second wiring layer and a second wiring layer.

According to the method for manufacturing a printed wiring board, the following printed wiring board is obtained. That is, another printed wiring board according to the present invention includes an insulating base material, a first wiring layer and a second wiring layer respectively provided on both surfaces of the insulating base material, and a thickness of the insulating base material. A conductive bump group formed between the first wiring layer and the second wiring layer for interlayer connection between the first wiring layer and the second wiring layer; A passive element member made of a dielectric composition or a resistive composition forming a passive element between the two conductive bumps.

Still another method of manufacturing a printed wiring board according to the present invention includes a step of forming a first group of substantially conical conductive bumps on a first conductive plate, and a step of forming a first group of conductive bumps on the first group of conductive bumps. Mounting the insulating base material, and pressing the first conductive plate and the first insulating base material to penetrate the first conductive bump group through the first insulating base material. Forming a first passive element member by applying a dielectric composition or a resistive composition to a gap on a portion of the second conductor plate where the first conductor bump abuts, The first conductor plate and the second conductor plate are combined with the first conductor bump group and the first conductor plate.
Placing the first conductive plate and the second conductive plate against each other, and pressing the first conductive plate and the second conductive plate.
Contacting the first conductive bumps with the second conductive plate, thereby forming a first passive element between the first conductive bump and the first passive element member; Patterning the conductive plate and the second conductive plate to form a first wiring layer and a second wiring layer, respectively, to obtain a first stacked body; A step of applying a second dielectric composition or a resistive composition to a gap at a portion where the second conductor bump abuts to form a second passive element member; and forming a substantially conical shape on the third conductor plate. Forming a second conductive bump group, placing a second insulating base material on the second conductive bump group, forming the third conductive plate and the second insulating base on the second conductive bump group. Pressing a material to penetrate the second conductive bump group through the second insulating base material;
Placing the laminated body of the third and the third conductive plate with the second passive element member and the second conductive bump group facing each other; and placing the first laminated body and the third conductive plate on the third conductive plate. Pressing the conductive plate to bring the second group of conductive bumps into contact with the first wiring layer, whereby a second passive bump is formed between the second conductive bump and the second passive element member. Forming an element; and patterning the third conductive plate to form a third wiring layer.

According to the above method, the following printed wiring board is obtained. That is, still another printed wiring board according to the present invention includes a first insulating base material and a first insulating base material.
A first wiring layer disposed on the second surface of the first insulating substrate, a second wiring layer disposed on the second surface of the first insulating substrate, and a thickness of the first insulating substrate. A first conductive bump group formed to penetrate the first wiring layer and connect the first wiring layer and the second wiring layer, and disposed between at least two conductive bumps of the first conductive bump group. A first passive element member comprising a dielectric composition or a resistive composition for forming a first passive element between the two conductive bumps;
A second insulating base material laminated on the first surface of the first insulating base material via the first wiring base, and a second insulating base material opposite to the first wiring layer. A third wiring layer disposed on the side surface of the second insulating substrate, and penetrating in a thickness direction of the second insulating base material, and connecting the first wiring layer and the third wiring layer. A second conductive bump group having a substantially conical shape and a second passive element formed between the two conductive bumps and disposed between at least two conductive bumps of the second conductive bump group. A second passive element member made of a dielectric composition or a resistive composition.

In the printed wiring board and the method of manufacturing the same, the first passive element and the second passive element may be of the same type or of different types.

[0020] Still another method of manufacturing a printed wiring board according to the present invention includes a step of forming a group of substantially conical conductive bumps on a first conductive plate, and placing an insulating base material on the group of conductive bumps. Pressing the first conductive plate and the insulating base material to penetrate the group of conductive bumps through the insulating base material; and contacting the conductive bumps on the second conductive plate with the conductive bumps. Forming a passive element member by applying a dielectric composition or a resistive composition to the periphery of the contacting portion; and connecting the first conductive plate and the second conductive plate to the conductive bump group and the passive element. Placing the member so as to face the member, and pressing the first conductive plate and the second conductive plate via the insulating base material to remove a part of the conductive bump group into the second conductive plate. And a part of the other conductive bump group is connected to the passive element portion. Forming a passive element between the group of conductive bumps, the passive element member, and the second conductive plate, thereby forming a first conductive plate and a second conductive plate. And pattern the first
Forming a second wiring layer and a second wiring layer.

According to this method, the following printed wiring board is obtained. That is, still another printed wiring board according to the present invention includes an insulating base material, a first wiring layer and a second wiring layer respectively disposed on both surfaces of the insulating base material, A first conductor bump group formed through the material in the thickness direction and connecting the first wiring layer and the second wiring layer; the insulating base material and the first wiring layer or the first conductive bump group; A passive element member buried between the second wiring layer and made of a dielectric composition or a resistive composition, and formed so as to penetrate in a thickness direction of the insulating base material; Or a second element for forming a passive element between a second wiring layer and the passive element member.
And a conductive bump group.

In the printed wiring board, the passive element member may be interposed between a tip end of the second conductive bump group and the first wiring layer or the second wiring layer.

In the above printed wiring board, the passive element member may be interposed between the bottom surface of the second conductive bump group and the first wiring layer or the second wiring layer. good.

In still another method of manufacturing a printed wiring board according to the present invention, a step of forming a group of substantially conical conductive bumps on a first conductive plate, and placing an insulating base material on the group of conductive bumps. A step of pressing the first conductive plate and the insulating base material to penetrate the conductive bump group through the insulating base material, and a step of pressing the first conductive plate and the insulating base material through the insulating base material. A step of applying a dielectric composition or a resistive composition to a portion where a part of the conductor bumps abut, to form a passive element member, and the first conductor plate and the second conductor plate, Placing the conductive bump group and the passive element member in the facing direction; and pressing the first and second conductive plates to set the conductive bump group to the second conductive plate. A passive element between the part of the conductive bumps and the passive element member. Forming a comprises a step of forming a first of the first wiring layer respectively by patterning the conductive plate and second conductive plate and the second wiring layer.

According to this method, the following printed wiring board is obtained. That is, still another printed wiring board according to the present invention includes a step of applying a dielectric composition or a resistive composition to a part of a first conductor plate to form a passive element member; Forming a substantially conical conductive bump group on a plate and on the passive element member; placing an insulating base material on the conductive bump group and further mounting a second conductive plate thereon; Pressing the first conductive plate and the second conductive plate to cause the group of conductive bumps to penetrate the insulating base material, and at the same time, the first conductive plate, the passive element member, and the conductive bump Forming a passive element with a portion of the group;
Patterning the first conductive plate and the second conductive plate to form a first wiring layer and a second wiring layer, respectively.

Still another printed wiring board according to the present invention comprises: an insulating base material; a first wiring layer and a second wiring layer provided on both surfaces of the insulating base material; The first wiring layer and the second wiring layer are connected to each other in the thickness direction of the insulating base material, and the first wiring layer and the second wiring And a bump forming a passive element between the layers.

This printed wiring board is manufactured, for example, by the following method. That is, still another method of manufacturing a printed wiring board according to the present invention includes a step of forming a substantially conical bump group using a dielectric composition or a resistive composition on a first conductive plate; Placing an insulating base material on the bump group, and further mounting a second conductive plate thereon;
Pressing the conductor plate and the second conductor plate to allow the bump group to penetrate the insulating base material and simultaneously abut the second conductor plate, whereby the first conductor plate, Forming a passive element between the bump and the second conductor plate; and patterning the first and second conductor plates to form a first wiring layer and a second wiring layer, respectively. And a step of forming

In the present invention, since the dielectric composition or the resistive composition is applied to the surface of the conductor plate during the manufacturing process by the conductor bump penetration method, a through hole is formed or a dielectric material is formed in the through hole. The trouble of filling the composition or the resistive composition can be omitted. As a result, compared to the manufacturing process of the conductor bump penetration method,
Passive elements can be formed in the multilayer board by adding only a few steps, and an increase in the number of manufacturing steps can be minimized.

In the present invention, a passive element member made of a dielectric composition or a resistive composition is embedded between an insulating base material and a conductor plate or a wiring layer laminated on the insulating base material. Since a passive element is formed between the conductive bump, the conductive plate, and the wiring layer, a predetermined passive element can be built in the multilayer board. Therefore, the outermost layer surface of the multilayer board can be widely used, and more elements and components can be mounted, so that the degree of integration can be further improved.

[0030]

DESCRIPTION OF THE PREFERRED EMBODIMENTS (First Embodiment) Hereinafter, a method for manufacturing a printed wiring board according to an embodiment of the present invention will be described. FIG. 1 is a flowchart showing a flow of a method of manufacturing a printed wiring board according to the present embodiment, and FIGS. 2 to 15 are vertical cross-sectional views schematically showing steps of the method of manufacturing the printed wiring board. .

As shown in FIG. 2, first, a substantially conical conductive bump group is formed on one surface of a conductive plate 1 (first conductive plate) such as a copper foil by using a conductive composition such as a silver paste by a printing technique. Are formed (step 1).

Next, as shown in FIG. 3, an insulating base material prepreg as an insulating base material (hereinafter referred to simply as “prepreg”) is placed on the conductive bump groups 2, 2,. 3) is placed (step 2). In this state, the conductor plate 1 is formed by, for example, passing between rollers formed of an elastic material.
Are pressed (Step 3), the conductor bump groups 2, 2,... Penetrate through the prepreg 3 and penetrate to the opposite side. At the same time, the tip portions of the conductive bump groups 2, 2,... Are pressed against the elastic material of the rollers to have a rounded shape, and the laminated body 4 as shown in FIG. 4 is obtained.

On the other hand, another conductor plate (second conductor plate) 5 is prepared separately from the laminate 4 and a passive element is formed on one surface of the conductor plate 5 as shown in FIG. The composition to be applied is applied using, for example, a printing technique (step 1 ′) to form the passive element member 6. As a composition such as a dielectric composition or a resistive composition constituting the passive element member 6, a powder or fine particles having predetermined electric characteristics such as a silver paste can be used in a resin and a solvent thereof. Dispersed materials may be mentioned. The passive element member 6 formed by applying the composition forms a dielectric layer or a resistor layer by drying after application, and is combined with a conductor plate constituting a wiring layer, thereby forming a capacitor or a resistor. Function as

As a position where the passive element member is formed, there is a gap between two adjacent conductor bumps 2 as shown in FIG. 6 indicate the outer shape of the conductor bump 2, the larger circle indicates the bottom surface of the conductor bump 2, and the smaller circle indicates the conductor plate 5.
2 shows the contact surface of the conductor bump 2 abutted on the surface.

As a modification of the position shown in FIG.
As shown in FIG. 7, a method of applying a rectangular shape including two adjacent conductive bumps 2, 2 or a method of applying an oblong shape including two adjacent conductive bumps 2, 2 as shown in FIG. As shown in FIG. 9, a method of applying a shape having a semicircular cutout portion so as to be in contact with the inner halves of the side surfaces of the two adjacent conductor bumps 2 and 2 is exemplified.

Next, after the dielectric composition or the resistive composition is applied, it is dried to form the passive element member 6 (step 2 '). The conductor plate 5 and the laminate 4 obtained in this way are
0, the passive element member 6 and the conductive bump groups 2, 2,
Are placed in a direction in which the tip of... Faces (Step 4).
In this state, when the conductor plate 5 and the laminate 4 are pressed by, for example, being passed between roller presses (Step 5), the conductor bump groups 2, 2 protruding from the upper surface of the prepreg 3 in FIG.
The tip portions of 2,... Are brought into contact with the surface of the conductor plate 5, and an interlayer connection between the conductor plates 1 and 5 is formed as shown in FIG. At the same time, a contact is formed between the passive element member 6 and a part of each side surface of the two adjacent conductor bumps 2a and 2b, and the laminated body 7 as shown in FIG. 11 is formed.

The conductor plate 1 and the conductor plate 5 on each of the upper and lower surfaces of the laminate 7 thus obtained are patterned by, for example, etching to form a wiring pattern 1a and a wiring pattern 5a, respectively. A plate 7a is formed.

Further, by removing the conductive plate 5 at the portion where the passive element member 6 is in contact by the patterning, the conductive bumps 2a and 2b, the wiring layers 5a and 5a contacting at the heads of the conductive bumps 2a and 2b, And the passive element member 6 is combined to form one passive element.

The state of engagement between the passive element member 6 and the two conductor bumps 2a and 2b which are in contact with the passive element member 6 and constitute a part of the terminal of the passive element is as shown in FIG. In addition to a state in which the insides of the side surfaces of the bumps 2a and 2b are connected to each other, some modified examples can be considered.

For example, as shown in FIG. 13, the passive element member 6 is completely penetrated. This corresponds to the vertical section of the arrangement shown in FIG. Alternatively, as shown in FIG. 14, a part of each of the front ends of the conductor bumps 2 a and 2 b is in contact with the left and right ends of the passive element member 6, respectively.

Further, as shown in FIG. 15, the respective ends of the conductor bumps 2a and 2b do not completely penetrate the passive element member 6, but are locked in the middle of the passive element member 6. Is also good.

As described in detail above, according to the present embodiment, the dielectric composition or the resistive composition is applied to the surface of the conductive plate in the process of manufacturing the multilayer board for connecting layers using the conductive bump group. In addition, there is no need to perform operations such as piercing a through-hole only for embedding a passive element or filling the through-hole with a dielectric composition or a resistive composition.

As a result, it is only necessary to add a step of forming a passive element member to the manufacturing step of the conductor bump penetration method, and the passive element is formed in the multilayer board while minimizing the additional step. be able to.

In this embodiment, a passive element member made of a dielectric composition or a resistive composition is embedded between an insulating base material and a conductor plate or a wiring layer laminated on the insulating base material. Since a passive element is formed between the conductive bump, the conductive plate, and the wiring layer, a predetermined passive element can be built in the multilayer board. Therefore, the outermost layer surface of the multilayer board can be widely used, and more elements and components can be mounted, so that the degree of integration can be further improved.

The difference in the degree of integration between the semiconductor package using the multilayer board according to the present embodiment and the conventional semiconductor package using the multilayer board will be described. FIG. 16 is a vertical sectional view of a semiconductor package using a conventional multilayer board, and FIG. 17 is a vertical sectional view of a semiconductor package using the multilayer board according to the present embodiment.

In the conventional multilayer board, when connecting the semiconductor chip 56 and the power supply line side wiring layer 51a with a resistor R, a capacitor C, etc., as shown in FIG. A passive element 55 such as a resistor or a capacitor is connected between a wiring layer 54a connected to the semiconductor chip 56 and a wiring layer 54b connected to the semiconductor chip 56, and a space for connecting the passive element 55 is required. . This has been an obstacle for increasing the degree of integration.

On the other hand, in the multilayer board of this embodiment, the passive element member 60 for forming a passive element such as a resistor or a capacitor is used.
And the conductive bumps 52a and the conductive bumps 5 in the insulating base material 53.
2b, only by connecting the semiconductor chip 56 to the wiring layer 54b as shown in FIG. 17, a passive element is interposed between the power supply line side wiring layer 51a and the semiconductor chip 56. The inserted wiring can be formed. for that reason,
Space for disposing the passive element 55 on the upper surface of the substrate is not required, so that the semiconductor package can be reduced in size and the degree of integration can be improved.

The present invention is not limited to the contents of the above embodiment.

For example, in the above embodiment, the passive element member is disposed between two adjacent conductor bumps, but three or more conductor bumps may be in contact with one passive element member. Further, in the above embodiment, the multilayer board 7a composed of so-called two wiring layers in which the wiring layers 1a and 5a are formed on both surfaces of one insulating base material has been described as an example, but the present invention is not limited to three or more layers. Needless to say, it can also be used for a multilayer board composed of the above wiring layers.

Further, in the present embodiment, the insulating base material used for penetrating the conductor bumps may be a synthetic resin reinforced with a reinforcing material such as glass cloth or mat, organic synthetic fiber cloth or mat, or paper. System sheet.
The thickness is preferably about 20 to 400 μm. here,
As the synthetic resin, for example, a polycarbonate resin, a polysulfone resin, a thermoplastic polyimide resin, a polytetrafluoroethylene hexafluoropropylene resin, a thermoplastic resin such as a polyetheretherketone resin, an epoxy resin, a bismaleimide triazine resin, a polyimide resin, Thermosetting resins such as phenolic resins, polyester resins, and melamine resins, and rubbers such as butadiene rubber, butyl rubber, natural rubber, neoprene rubber, and silicone rubber are exemplified.

When forming the substantially conical conductive bumps by using a conductive composition, for example, a substantially conical conductive bump group having a high aspect ratio is formed by a printing method using a relatively thick metal mask. Can be formed. The height of the group of substantially conical conductive bumps is generally 20 to 500 μm.
Degrees are possible.

In the present invention, as a means for forming a group of substantially conical conductive bumps made of a conductive metal, for example, a gold or copper ball is pressed to a predetermined position on the surface of a supporting base such as a copper foil and then separated. Thereby, a conductor (element) group having a substantially conical shape with a sharp tip can be formed. Further, it is also possible to inject molten metal into a plate in which a concave portion corresponding to the shape of a substantially conical conductor is formed beforehand to form a substantially conical conductor bump group. As still another means, a photosensitive resist is applied thickly on the support film surface, and the support film is removed after forming a group of depressions having a trapezoidal concave portion with a sharp tip by exposing from the support film side. Then, a metal film may be formed on the support film-removed surface, and plated with copper, gold, silver, solder, or the like to form minute substantially conical conductive bumps at predetermined positions.

In the present invention, examples of the substrate supporting the group of substantially conical conductive bumps include a releasable film or a metal foil.
It may be a single sheet or a patterned sheet, and its shape is not particularly limited.

Further, in the present invention, as means for penetrating the substantially conical conductive bumps through the synthetic resin sheet, for example, a support base having a group of substantially conical conductive bumps formed thereon, a synthetic resin sheet or the like may be rolled. While rewinding,
Heating to soften the resin component, for example, a metal with small dimensions and deformation, a hard heat-resistant resin, or a ceramic roller, and a roller that elastically deforms when pressed on the synthetic resin side, for example, By passing between the rubber rollers as described above, a substantially conical conductive bump penetrates, and a multilayer board having both ends exposed on the surface of the synthetic resin sheet can be continuously manufactured. .

(Second Embodiment) Hereinafter, a second embodiment of the present invention will be described. Note that, of the embodiments after this embodiment, the description of the same parts as the preceding embodiment will be omitted.

FIG. 18 is a flowchart showing the flow of the method for manufacturing a printed wiring board according to the present embodiment.
19 to 23 are vertical sectional views schematically showing each step of the manufacturing method.

To manufacture the printed wiring board according to the present embodiment, a multilayer board 7a is formed according to steps 1a to 6a in FIG. The steps 1a to 6a are performed in the first
The steps 1b to 2b of the present embodiment are the same as the steps 1 to 6 of the embodiment, except that the composition for forming the passive element member 6 is named “first composition 1”. Are the same as Steps 1 ′ to 2 ′ of the embodiment.

Steps 1a to 6a and 1b to 2
b, the multilayer board 7a as shown in FIG. 19 is obtained, and the wiring layer 5 formed on the upper surface side of the multilayer board 7a in the drawing is obtained.
A composition 2 for forming a passive element is applied, for example, using a printing technique over the wiring layer 5b and the wiring layer 5c (Step 7)
a), a passive element member 8 (first passive element member) as shown in FIG. 20 is formed.

The second passive element member 8 may form a passive element having the same property as the passive element member 6 or may form a passive element having a different property. Since it is advantageous in the manufacturing process to form the passive elements on the same layer, it is preferable to dispose passive elements having different properties when the layers to be formed are different as shown in FIG. For example, if the passive element member 6 is formed by applying a resistive composition constituting the resistor R, the passive element member 8
Is preferably applied with a dielectric composition constituting the capacitor C.

After the application of the second composition as shown in FIG. 20, the second composition is dried to form the second passive element member 8 (step 8a) to obtain the laminate 7b.

On the other hand, a conductor plate 11 is prepared separately from the laminated body 7b, and the conductor bump groups 12, 12,
Are formed (step 1c), the prepreg 13 is placed thereon (step 2c), and pressed (step 3c).
c), forming a laminate 14 as shown in FIG.

Next, the laminated body 7b and the laminated body 14 are mounted in such a manner that the front end side of the conductive bump groups 12, 12,... And the second passive element member 8 face each other as shown in FIG. (Step 9a).

Thereafter, in this state, the laminate 7b and the laminate 14 are pressed by, for example, being passed between roller presses (step 10a), and the conductor bump groups 12, 12,
Are brought into contact with the wiring layers 5a to 5b. At this time, a part of the conductor bump groups 12, 12,.
2a and 12b) penetrate the second passive element member 8 and then come into contact with the wiring layers 5b and 5c. By penetrating the second passive element member 8, the conductive bumps 12a and 12b come into contact with the passive element member 8 to form a second passive element, and form a laminate 15 as shown in FIG. .

Next, the conductor plate 11 on the upper surface in the figure of the laminate 15 is patterned by, for example, etching (step 11a), and the wiring layer 11a is formed to form a multilayer board 16 as shown in FIG. Is obtained.

In this embodiment, since two different types of passive elements are embedded in different insulating base materials, a unique effect that the integration degree can be further improved is obtained.

In the present embodiment, since different types of passive element members are formed on different insulating base material layers, there is no need to separately apply two types of compositions on the same layer. Man-hours can be minimized.

(Third Embodiment) In the present embodiment, the first
The same laminated body 4 as the laminated body 4 used in the embodiment is used.

FIG. 24 is a flowchart showing the flow of the method for manufacturing a printed wiring board according to the present embodiment.
25 to 27 are vertical cross-sectional views schematically showing each step of the manufacturing method.

To manufacture the printed wiring board according to the present embodiment, the steps 1d to 3d in FIG. 24 are performed to obtain the laminate 4 as shown in FIG. A separate conductor plate 21 is prepared separately from the laminated body 4, and the first composition is applied to one surface of the conductor plate 21 at a position where the conductor bump 2 a is abutted by using, for example, a printing technique. (Step 1e). Further, at this time, the second composition may be applied to a position where the conductive bump 2b abuts. The first composition and the second composition may be compositions that form passive elements of the same type, or may be compositions that form passive elements of different types.

The first composition and, if desired, the second composition are applied onto the conductive plate 21 and then dried (step 2).
e), the passive element member 22 and the passive element member 23 as shown in FIG. 25 are formed.

Thereafter, the conductor plate 21 and the laminated body 4 are connected to the conductor bump groups 2a, 2b, 2, 2, as shown in FIG.
And the passive element members 22 and 23 are placed so as to face each other (step 4d). In this state, when the conductor plate 21 and the laminate 4 are pressed by, for example, being passed between roller presses (step 5d), the conductor bumps 2a abut on the lower surface side of the passive element member 22 in the drawing, and the conductor bumps 2b are .. At the same time as contacting the lower surface side of the member 23 in the drawing, the front end sides of the conductor bump groups 2, 2,. The formed laminate 24 is obtained.

The upper and lower conductor plates 1 and 21 of the laminate 24 thus obtained are patterned by, for example, etching (step 6d) to form a wiring layer 1a and a wiring layer 21a, respectively.
Is obtained.

According to the present embodiment, since the passive elements are formed in the thickness direction of the substrate between the conductor bumps 2a and the conductor bumps 2b and the conductor plate 21, the wiring layer 21a extends in the horizontal direction in the drawing. Can be formed in the substrate. Therefore, since various semiconductor elements can be mounted on the wiring layer 21a at a higher density, a unique effect that the degree of integration can be further improved can be obtained.

It is needless to say that the passive element members 22 and 23 may be formed by using the same dielectric composition or resistive composition.

(Fourth Embodiment) FIG. 28 is a flowchart showing a flow of a method of manufacturing a printed wiring board according to the present embodiment, and FIGS. 29 to 33 schematically show each step of the manufacturing method. FIG.

To manufacture the printed wiring board according to the present embodiment, first, a conductive plate 31 such as a copper foil is prepared, and a dielectric composition or a resistive composition is formed on the conductive plate 31 by using, for example, a printing technique. An object is applied (step 1f). The conductor plate 31 coated with the dielectric composition or the resistive composition is dried (step 2f) to obtain a conductor plate 31A on which the passive element members 32, 32 are formed as shown in FIG.

Next, on the surface of the conductive plate 31A on which the passive elements 32, 32 are formed, a substantially conical conductive bump group 33, 33 made of a conductive composition such as silver paste is formed by using, for example, a printing technique. After forming (step 3f), a conductor plate 31B as shown in FIG. 30 is obtained.

At this time, the conductor bumps 33a are formed on the upper surfaces of the passive element members 32.

The prepreg 34 is placed on the conductor bump groups 33a, 33a, 33, 33,... Of the conductor plate 31B thus obtained.
And another conductive plate 35 is placed thereon (step 4).
f) In this state, when the conductor plate 31B, the prepreg 34, and the conductor plate 35 are pressed by, for example, being passed between roller presses (step 5f), the conductor bump groups 33a, 33a, 33, 33,. ., And the front ends of the conductor bump groups 33a, 33a, 33, 33,... Abut the lower surface of the conductor plate 35, and the conductor plate 31 and the conductor plate 35 as shown in FIG. The laminated body 36 obtained is obtained.

When the conductor plates 31 and 35 on the upper and lower surfaces of the laminate 36 thus obtained are patterned by, for example, an etching process (step 6f), a multilayer plate 37 as shown in FIG. 33 is formed.

In this embodiment, since the passive element member 32 is disposed on the bottom surface side of the conductor bump 33, the conductor bump 3
The connection with 3 is ensured. In addition, since the thickness of the passive element member 32 is constant throughout, it is possible to obtain a specific effect that it is easy to set the performance of the passive element to a desired value.

According to the present embodiment, the conductor bumps 3
Since the passive elements are formed in the thickness direction of the substrate between 3a and the conductive plates 31 and 33, the passive elements in which the wiring layers 31a and 35a are extremely small in the horizontal direction in the drawing are formed in the substrate. Can be. Therefore, the wiring layers 31a, 35
Since various semiconductor elements can be mounted at a higher density on a, the effect of further improving the degree of integration can be obtained.

(Fifth Embodiment) FIG. 34 is a flowchart showing a flow of a method of manufacturing a printed wiring board according to the present embodiment, and FIGS. 35 to 38 schematically show steps of the manufacturing method. FIG.

In order to manufacture the printed wiring board according to the present embodiment, first, a conductive plate 41 such as a copper foil is prepared, and a dielectric composition or a resistive composition or the like is formed on the conductive plate 41 by, for example, a printing technique. Are formed using the composition for forming the desired passive element (step 1g), and then these bump groups 42, 42,... Are dried (step 2g). Thus, a conductor plate 41A as shown in FIG. 35 is obtained.

Next, as shown in FIG. 36, the insulating base material prepreg 4 is placed on the bump groups 42, 42,.
3 and another conductive plate 44 thereon (step 3g).

Thereafter, in this state, the conductor plate 41A, the prepreg 43, and the conductor plate 44 are pressed by a method such as passing between roller presses (Step 4).
g), the bump groups 42, 42,... penetrate the insulating base material prepreg 43, and at the same time, the front ends of the bump groups 42, 42,. A laminate 45 having an interlayer connection with the conductor plate 44 is obtained.

The conductor plates 41 and 44 disposed on the upper and lower surfaces of the laminate 45 thus obtained are patterned by, for example, etching (step 5g), and the wiring as shown in FIG. A multilayer board 46 on which the layers 41a and 44a are respectively formed is obtained.

In this embodiment, since the bump itself is made of a dielectric composition or a resistive composition, the bump itself functions as a passive element such as a capacitor C or a resistor R after the completion of the multilayer board. Therefore, the degree of integration can be further improved.

The resistance built into the substrate (the resistance formed in the substrate by applying and printing the resistor composition) described in each of the above embodiments, the capacitor embedded in the substrate (formed in the substrate by coating and printing the capacitor composition) Condenser)
Can be used as any resistor or capacitor of an electric circuit formed on a printed wiring board. Especially when it is formed at a power supply terminal or GND terminal connection part, the design change of a semiconductor device mounted on the board is possible. It is particularly effective that the terminal position is unlikely to be changed due to this.

Further, since the passive elements connected to these terminals have a wide allowable range of characteristic fluctuation, the embodiment of the present invention is particularly effective.

[0091]

According to the present invention, the dielectric composition or the resistive composition is applied to the surface of the conductor plate during the manufacturing process by the conductor bump penetration method. The trouble of filling the inside with the dielectric composition or the resistive composition can be omitted. As a result, the passive element can be formed in the multilayer board by adding only a few steps as compared with the manufacturing process of the conductor bump penetration method, and an increase in the number of manufacturing processes can be minimized.

In the present invention, a passive element member made of a dielectric composition or a resistive composition is embedded between an insulating base material and a conductor plate or a wiring layer laminated on the insulating base material. Since a passive element is formed between the conductive bump, the conductive plate, and the wiring layer, a predetermined passive element can be built in the multilayer board. Therefore, the outermost layer surface of the multilayer board can be widely used, and more elements and components can be mounted, so that the degree of integration can be further improved.

[Brief description of the drawings]

FIG. 1 is a flowchart illustrating a flow of a method for manufacturing a printed wiring board according to a first embodiment.

FIG. 2 is a vertical sectional view showing a manufacturing process of the printed wiring board according to the first embodiment.

FIG. 3 is a vertical sectional view showing a manufacturing process of the printed wiring board according to the first embodiment.

FIG. 4 is a vertical sectional view showing the manufacturing process of the printed wiring board according to the first embodiment.

FIG. 5 is a vertical sectional view showing the manufacturing process of the printed wiring board according to the first embodiment.

FIG. 6 is a vertical sectional view showing the manufacturing process of the printed wiring board according to the first embodiment.

FIG. 7 is a vertical sectional view showing the manufacturing process of the printed wiring board according to the first embodiment.

FIG. 8 is a vertical sectional view showing the manufacturing process of the printed wiring board according to the first embodiment.

FIG. 9 is a vertical sectional view showing the manufacturing process of the printed wiring board according to the first embodiment.

FIG. 10 is a vertical sectional view showing the manufacturing process of the printed wiring board according to the first embodiment.

FIG. 11 is a vertical sectional view showing the manufacturing process of the printed wiring board according to the first embodiment.

FIG. 12 is a vertical sectional view showing the manufacturing process of the printed wiring board according to the first embodiment.

FIG. 13 is a vertical sectional view showing the manufacturing process of the printed wiring board according to the first embodiment.

FIG. 14 is a vertical sectional view showing the manufacturing process of the printed wiring board according to the first embodiment.

FIG. 15 is a vertical sectional view showing the manufacturing process of the printed wiring board according to the first embodiment.

FIG. 16 is a vertical sectional view of a semiconductor package using a conventional multilayer board.

FIG. 17 is a vertical sectional view of a semiconductor package using the multilayer board according to the first embodiment.

FIG. 18 is a flowchart illustrating a flow of a method for manufacturing a printed wiring board according to the second embodiment.

FIG. 19 is a vertical sectional view showing the manufacturing process of the printed wiring board according to the second embodiment.

FIG. 20 is a vertical sectional view showing the manufacturing process of the printed wiring board according to the second embodiment.

FIG. 21 is a vertical sectional view showing the manufacturing process of the printed wiring board according to the second embodiment.

FIG. 22 is a vertical sectional view showing the manufacturing process of the printed wiring board according to the second embodiment.

FIG. 23 is a vertical sectional view showing the manufacturing process of the printed wiring board according to the second embodiment.

FIG. 24 is a flowchart showing a flow of a method for manufacturing a printed wiring board according to the third embodiment.

FIG. 25 is a vertical sectional view showing the manufacturing process of the printed wiring board according to the third embodiment.

FIG. 26 is a vertical sectional view showing the manufacturing process of the printed wiring board according to the third embodiment.

FIG. 27 is a vertical sectional view showing the manufacturing process of the printed wiring board according to the third embodiment.

FIG. 28 is a flowchart showing a flow of a method for manufacturing a printed wiring board according to the fourth embodiment.

FIG. 29 is a vertical sectional view showing the manufacturing process of the printed wiring board according to the fourth embodiment.

FIG. 30 is a vertical sectional view showing the manufacturing process of the printed wiring board according to the fourth embodiment.

FIG. 31 is a vertical sectional view showing the manufacturing process of the printed wiring board according to the fourth embodiment;

FIG. 32 is a vertical sectional view showing the manufacturing process of the printed wiring board according to the fourth embodiment;

FIG. 33 is a vertical sectional view showing the manufacturing process of the printed wiring board according to the fourth embodiment;

FIG. 34 is a flowchart showing a flow of a method for manufacturing a printed wiring board according to the fifth embodiment.

FIG. 35 is a vertical sectional view showing the manufacturing process of the printed wiring board according to the fifth embodiment;

FIG. 36 is a vertical sectional view showing the manufacturing process of the printed wiring board according to the fifth embodiment.

FIG. 37 is a vertical sectional view showing the manufacturing process of the printed wiring board according to the fifth embodiment;

FIG. 38 is a vertical sectional view showing the manufacturing process of the printed wiring board according to the fifth embodiment;

FIG. 39 is a vertical sectional view showing steps of a conventional method for manufacturing a printed wiring board.

[Explanation of symbols]

 3 prepreg (insulating base material), 1a wiring layer (first wiring layer), 5a wiring layer (second wiring layer), 2 conductor bump, 6 passive element member, 1 conductor plate ( 1st conductor plate), 5 ... conductor plate (2nd conductor plate).

──────────────────────────────────────────────────続 き Continued on the front page (51) Int.Cl. ⁷ Identification symbol FI Theme coat ゛ (Reference) H05K 3/46 H05K 3/46 BF term (Reference) 4E351 AA01 BB03 BB05 BB22 BB26 BB30 BB31 BB46 BB49 CC12 CC21 DD04 DD05 DD52 DD54 EE01 GG20 5E317 AA24 BB12 BB14 BB25 CC22 CC25 CD36 GG17 5E346 AA06 AA12 AA13 AA14 AA15 AA22 AA32 AA35 AA43 BB01 BB16 BB20 CC21 CC25 DD02 DD07 DD09 DD12 DD32 EE02 EE25 EE02 EE09 HEEFFEEH

Claims (13)

[Claims] An insulating substrate; a first wiring layer and a second wiring layer respectively disposed on both surfaces of the insulating substrate; A conductive bump group formed between the first wiring layer and the second wiring layer, the conductive bump group being interposed between the first wiring layer and the second wiring layer, and being embedded between the first wiring layer and the second wiring layer; A passive element member made of a dielectric composition or a resistive composition forming a passive element therebetween. A step of forming a group of substantially conical conductive bumps on the first conductive plate; a step of placing an insulating base material on the group of conductive bumps; Pressing an insulating base material to penetrate the conductive bump group through the insulating base material; and applying a dielectric composition or a resistive composition on the second conductive plate to form a passive element member And placing the first conductor plate and the second conductor plate with the conductor bump group and the passive element member facing each other; and placing the first conductor plate and the second conductor plate together. Pressing a conductive plate between at least two of the conductive bumps to form a passive element between at least two of the conductive bumps; and a first conductive plate. And the second conductor plate are patterned to form a first wiring layer and a second Forming a second wiring layer. 2. A method for manufacturing a printed wiring board, comprising: A step of forming a group of substantially conical conductive bumps on the first conductive plate; a step of placing an insulating base material on the group of conductive bumps; Pressing an insulative base material to penetrate the conductive bump group through the insulative base material; and forming a portion of the second conductive plate where the conductive bump abuts and where the conductive bump abuts. A step of forming a passive element member by applying a dielectric composition or a resistive composition between the first conductive plate and the second conductive plate, the conductive bump group and the passive element member And placing the first and second conductor plates against each other so that the group of conductor bumps abuts on the second conductor plate. Forming a passive element between the bump and the passive element member; and the first conductive plate And forming a first wiring layer and a second wiring layer by patterning the second conductor plate and the second wiring layer, respectively. 4. An insulating base material, a first wiring layer and a second wiring layer respectively disposed on both surfaces of the insulating base material, and formed in a thickness direction of the insulating base material, A conductive bump group for interlayer-connecting the first wiring layer and the second wiring layer, a passive element disposed between at least two conductive bumps of the conductive bump group, and a passive element between the two conductive bumps; And a passive element member made of a dielectric composition or a resistive composition. 5. A step of forming a first group of substantially conical conductive bumps on a first conductive plate, and a step of placing a first insulating base material on the first group of conductive bumps. Pressing the first conductive plate and the first insulating base material to penetrate the first conductive bump group through the first insulating base material; Applying a dielectric composition or a resistive composition to a gap between portions where the first conductive bumps abut,
Forming a first passive element member; placing the first conductor plate and the second conductor plate such that the first conductor bump group and the first passive element member face each other; Pressing the first conductor plate and the second conductor plate to bring the first conductor bump group into contact with the second conductor plate;
A step of forming a first passive element between the first conductive bump and the first passive element member; and patterning the first and second conductive plates and the second conductive plate, respectively. Forming a first wiring layer and a second wiring layer to obtain a first stacked body; and forming a second dielectric layer in a gap on the first wiring layer where the second conductive bump abuts. Applying a conductive composition or a resistive composition to form a second passive element member; forming a substantially conical second conductive bump group on a third conductive plate; Placing a second insulating base material on the second conductive bump group, and pressing the third conductive plate and the second insulating base material so that the second conductive bump group is A step of penetrating through a second insulating base material, the first laminate and the third conductor plate being connected to the second passive element member, Placing the second conductor bump group facing the second conductor bump group, and pressing the first laminate and the third conductor plate so as to remove the second conductor bump group from the first wiring layer. Abut
A step of forming a second passive element between the second conductive bump and the second passive element member, and a step of patterning the third conductive plate to form a third wiring layer A method for manufacturing a printed wiring board, comprising: 6. A first insulating base material, a first wiring layer disposed on a first surface of the first insulating base material, and a second wiring layer of the first insulating base material. A second wiring layer disposed on the surface of the first insulating base material, formed in the thickness direction of the first insulating base material,
A first connecting the first wiring layer and the second wiring layer;
And a dielectric composition or a resistive composition disposed between at least two conductor bumps of the first conductor bump group to form a first passive element between the two conductor bumps. A first passive element member comprising:
A second insulating base material laminated on a surface of the second insulating base material; a third wiring layer disposed on a surface of the second insulating base material opposite to the first wiring layer; 2 is formed penetrating in the thickness direction of the insulating base material,
A second conductor bump group for interlayer connection between the first wiring layer and the third wiring layer; and a second conductor bump group disposed between at least two conductor bumps of the second conductor bump group. A second passive element member made of a dielectric composition or a resistive composition that forms a second passive element with the bump. 7. A step of forming a group of substantially conical conductive bumps on a first conductive plate; a step of placing an insulating base material on the group of conductive bumps; Pressing an insulative base material to penetrate the conductive bump group through the insulative base material; and forming a dielectric composition or a resistive material around a portion of the second conductive plate where the conductive bump contacts. A step of applying a composition to form a passive element member; and a step of placing the first conductor plate and the second conductor plate with the conductor bump group and the passive element member facing each other. And pressing the first conductor plate and the second conductor plate via the insulating base material to bring a part of the conductor bump group into contact with the second conductor plate, and A part of the conductive bumps are brought into contact with the passive element member, whereby the conductive bumps are Forming a passive element between the passive element member and the second conductive plate; and patterning the first conductive plate and the second conductive plate to form a first wiring layer and a second conductive plate, respectively. Forming a wiring layer; and a method for manufacturing a printed wiring board, comprising: 8. An insulating base material, a first wiring layer and a second wiring layer respectively provided on both surfaces of the insulating base material, and penetrating in a thickness direction of the insulating base material. A first group of conductive bumps formed and connecting the first wiring layer and the second wiring layer; and between the insulating base material and the first wiring layer or the second wiring layer. A passive element member buried and made of a dielectric composition or a resistive composition, formed so as to penetrate in a thickness direction of the insulating base material, and connected to the first wiring layer or the second wiring layer, A second conductive bump group forming a passive element with the element member. 9. The printed wiring board according to claim 8, wherein said passive element member is located between a tip side of said second conductive bump group and said first wiring layer or said second wiring layer. A printed wiring board characterized by being interposed. 10. The printed wiring board according to claim 8, wherein said passive element member is provided between a bottom surface of said second conductive bump group and said first wiring layer or said second wiring layer. A printed wiring board characterized by being interposed. 11. A step of forming a group of substantially conical conductive bumps on a first conductive plate; a step of placing an insulating base material on the group of conductive bumps; Pressing an insulating base material to penetrate the conductive bump group through the insulating base material; and pressing a part of the conductive bump group on the second conductive plate where a part of the conductive bumps abut. A step of applying a dielectric composition or a resistive composition to form a passive element member; and forming the first conductor plate and the second conductor plate by using the conductor bump group and the passive element member. Placing in a facing direction, pressing the first conductor plate and the second conductor plate to bring the conductor bump group into contact with the second conductor plate; Forming a passive element between a conductive bump and the passive element member; Forming a first wiring layer and a second wiring layer by patterning the first wiring layer and the second conductor plate, respectively. 12. A step of applying a dielectric composition or a resistive composition to a part of the first conductor plate to form a passive element member, and on the first conductor plate and the passive element member Forming a substantially conical conductive bump group on the conductive bump group; an insulating base material on the conductive bump group;
Placing the first conductive plate and the second conductive plate to press the first conductive plate and the second conductive plate so that the conductive bump group penetrates through the insulating base material, and at the same time, the first conductive plate Forming a passive element between the passive element member and a part of the conductive bump group; patterning the first conductive plate and the second conductive plate to form a first wiring layer, Forming a second wiring layer. A method for manufacturing a printed wiring board, comprising: 13. An insulating base material, a first wiring layer and a second wiring layer respectively disposed on both surfaces of the insulating base material, and a dielectric composition or a resistive composition, A bump for interconnecting the first wiring layer and the second wiring layer in the thickness direction of the insulating base material and forming a passive element between the first wiring layer and the second wiring layer; A printed wiring board comprising: