JPH04330756A - Floating ic lead detection system - Google Patents

Abstract

PURPOSE:To detect a floating IC lead in no-contact therewith for avoiding the lead deformation and decreasing the fraction defective. CONSTITUTION:An IC 1 held by a nozzle 2 is driven by a driving means 3 to be shifted in the three directions rectangular to one another. Next, the slip of the surface 14 of IC from the mounting position is detected by the picture- image processing step so that the driving means 3 may be operated according to the detected results to align the IC 1 with the specified position by processors 11, 12, 13. Later, while shifting the IC 1 in the direction in parallel with the two sides perpendicular to each other, the floating lead 4 can be detected by a laser displacement meter 7.

Description

[Detailed description of the invention]

0001

[Industrial Application Field] The present invention provides an I/O device for detecting floating leads of an IC such as a flat package IC when mounting the IC at a predetermined position on a board using an electronic component mounting machine.
This invention relates to a C-lead floating detection system.

0002

[Prior Art] When an electronic component mounting machine mounts an IC at a predetermined position on a board, the floating of the leads protruding from the outer periphery of the IC is detected before mounting, and if the floating is within a reference value. The implementation is running only as a pass. This is because if the lead floats above a certain reference value, a soldering failure will occur.

[0003] A method for detecting this lead floating is as follows.
A laser displacement meter is used to irradiate the lead tip with laser light,
A method of detecting lead floating based on the displacement of reflected light, and a method of capturing an image of the lead with a camera and processing the image to detect lead floating are known.

In any of the above methods, it is necessary to position the IC at a predetermined position before detecting lead floating. Conventionally, this positioning was performed by pressing the IC leads manually or mechanically.

[0005]

[Problems to be Solved by the Invention] However, according to the conventional positioning methods described above, in any case, an external force is applied to the IC leads, which may cause the leads to be slightly deformed or, in the worst case, to be bent. .

The present invention has been developed in view of the above situation, and it is possible to position the IC before detecting lead floating without applying external force to the lead, thereby preventing deformation of the lead and maintaining the position of the component. I that can lower the defective rate of
The purpose of the present invention is to provide a C-lead floating detection system.

[0007]

[Means for Solving the Problems] The IC lead floating detection system of the present invention uses a laser displacement meter to detect floating IC leads to determine pass/fail. The holding means, the detecting means for detecting the inclination of the IC with respect to the reference position and the coordinates of the lead tip by image processing, and the holding means so that the laser displacement meter moves relatively in a direction parallel to two orthogonal sides of the IC. and a driving means for driving either the IC held by the IC or the laser displacement meter.

[0008]

[Operation] In the IC lead floating detection system configured as described above, the inclination of the IC held by the holding means with respect to the reference position of the substrate and the coordinates of the lead tip are detected by image processing,
While looking at this image, the holding means is moved by the driving means and set to a predetermined posture and position. Thereafter, a laser displacement meter is used to sequentially irradiate the tip of the IC lead with laser light, and the displacement of the reflected light is measured to detect lead floating. In this way, IC positioning and lead floating detection can be inspected in a non-contact manner, and deformation of the IC leads during the inspection process can be prevented.

[0009]

DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to the drawings.

An embodiment of the present invention is shown in FIGS. 1 to 6. FIG. 1 shows the system configuration of the embodiment. In Figure 1, I
C1 is vacuum-adsorbed by a nozzle 2, which is a holding means. The nozzle 2 is given movement in the XY-axis directions, rotation, and vertical movement by a driving device 3 such as a robot. A laser head 6 is provided below the nozzle 2 and has a laser light source that irradiates the lead 4 of the IC 1 with a laser light 5 and a sensor that receives the laser light 5 reflected by the lead 4. The distance between the lead 4 and the laser head 6 is normally set to 10 mm to 20 mm, and the signal received by the laser head 6 is sent to the laser displacement meter 7. Then, the distance L between each lead 4 and the laser head 6 is measured by the laser displacement meter 7.

A detection computer 9 is connected to the laser displacement meter 7, which takes in the measured distance data L and compares it with a predetermined distance reference value sent from the control computer 8 to determine whether the lead is floating. There is. In addition, the pass/fail signal detected by the detection computer 9 is transmitted to the control computer 8.
and when the control computer 8 receives the pass signal,
A mount signal is sent to the drive device 3 via the servo amplifier 10. The driving device 3 is configured to mount the IC 1 at a predetermined position on a substrate (not shown).

On the other hand, a camera 11 is provided at the bottom of the nozzle 2 so as to face the bottom surface of the IC 1. The camera 11 includes a high magnification camera 11a and a low magnification camera 11b, and is fixed at a fixed position with respect to the substrate. The camera 11 is connected to a display section 13 via an image processing circuit 12 (detection means).

Next, the operation of the system of this embodiment will be explained. First, as shown in FIG. 2, the IC 1 is sucked and held by the nozzle 2. Reference numeral 14 shown in FIG. 2 is a board on which the IC 1 is mounted. The IC 1 in this state is imaged from below by the camera 11. At this time, if the IC1 is small, the high magnification camera 11a is used, and if the IC1 is large, the low magnification camera 11b is used. The image captured by the camera 11 is displayed on the display section 13 via the image processing circuit 12. As shown in FIG. 3, this image is shifted from the reference line in the X and Y directions of the board 14, and the coordinates of the tip of the lead 4a, which should be at the origin, are at the (x, y) position, and the The reference side is Y
If it forms an angle of θ with respect to the axis, the control computer 8 drives the drive device 3 to rotate and move the IC 1 together with the nozzle 2 to make θ, x, and y zero. This position correction is performed non-contact while looking at the display section 13.

After the IC 1 is positioned at the correct position as described above, the drive device 3 is driven by the command from the control computer 8, and the IC 1 fixed to the nozzle 2 is moved to A, B, C as shown in FIG. , D in the X and Y directions. Then, a laser beam 5 emitted in a fixed direction is sequentially applied to the lead 4, and a detection signal corresponding to the reflected light is sent to a laser displacement meter 7 via a laser head 6.

This detection signal becomes a pulse wave as shown in FIG. This pulse wave is input to the laser displacement meter 7, and the encoder 1 attached to the XY axis motor of the drive device 3
The distance L between the lead 4 and the laser head 6 at a predetermined timing synchronized with the pulse outputted by the lead 4 is measured. As mentioned above, this measured data is compared with the reference value sent from the control computer 8 in the detection computer 9, and if it passes, the IC1 is transferred to the drive device 3.
As shown in FIG. 6, it is mounted at a predetermined position on the substrate 14.

According to this embodiment, since the position of IC1 is corrected using image processing, IC lead 4
Since the floating of the IC lead 4 can be detected without applying unnecessary external force to the IC lead 4, deformation of the IC lead 4 can be prevented and the defective rate of parts can be reduced.

[0017]

[Effects of the Invention] As explained above, according to the present invention, I
Since the position of C is corrected using image processing, the whole process of IC lead floating inspection can be done without touching the IC lead, which reduces the defective rate of the parts in which this IC is mounted. be able to.

[Brief explanation of drawings]

FIG. 1 is a block diagram showing the configuration of an embodiment of an IC lead floating detection system according to the present invention.

[Fig. 2] An explanatory diagram showing a state in which an IC is adsorbed to a nozzle in the embodiment of Fig. 1.

[Fig. 3] An explanatory diagram showing the displacement of the IC in the embodiment of Fig. 1.

FIG. 4 is an explanatory diagram showing the movement path of the IC with respect to the laser beam in the embodiment of FIG.

[Fig. 5] Timing chart showing measured waveforms in the embodiment of Fig. 1.

[Fig. 6] An explanatory diagram showing the operation of mounting an IC onto a board in the embodiment of Fig. 1.

[Explanation of symbols]

1 IC 2 Nozzle (holding means) 3 Drive device 4 Lead 5 Laser light 7 Laser displacement meter 11 Camera 12 Image processing circuit (detection means) 13 Display section 14 Board

Claims (1)

[Claims] 1. An IC lead floating detection system that detects the floating of an IC lead using a laser displacement meter to determine pass/fail, comprising a holding means for holding the IC, a tilt of the IC with respect to a reference position, and a lead detection system. a detecting means for detecting the coordinates of the tip by image processing; and the IC or the laser held by the holding means so that the laser displacement meter moves relatively in a direction parallel to two orthogonal sides of the IC. An IC lead floating detection system comprising a driving means for driving one side of the displacement meter.