JPH0410599A - Device and method for mounting chip component - Google Patents

Abstract

PURPOSE:To enable a chip component mounting device to mount a chip component on a circuit board at a prescribed position independent of the part of the component which a nozzle sucks by a method wherein the nozzle is corrected in movement corresponding to the positional deviation between the centers of the nozzle and the chip component sucked by the nozzle basing on the distance data obtained from a distance measuring sensor. CONSTITUTION:A head is made to move to a component sucking position by a chip suction control section 22 and sucks a chip component 1. A nozzle 2 is made to ascend so as to enable a laser beam emitted from a distance measuring sensor 10 to impinge on the enter of the side face of the chip component 1. In succession, The head is moved to a component mounting position. While the head is made to move, a nozzle revolving motor 4 is driven by a rotation control 25 through tie intermediary of a driver 31, the nozzle 2 is made to rotate, and at the same time distance data are measured by the distance measuring sensor 10 and stored in a memory 14. The amount of deviation is computed through a correction computing section 27 basing on the data stored in the memory 14. After the head is moved to a component mounting position, the chip component 1 is corrected in deviation or angular deviation. Then, a nozzle up-down motor 6 is driven to mount the chip component.

Description

DETAILED DESCRIPTION OF THE INVENTION [Industrial Field of Application 1] The present invention relates to a chip component mounting apparatus and method, and more particularly, a chip component mounting method in which a nozzle that has sucked a chip component is moved to a predetermined position on a substrate to mount the chip component. Apparatus and method.

[Prior Art] Conventionally, such a chip component mounting apparatus is used to mount a minute circuit element formed as a chip component at a predetermined position on a circuit board. In this case, the chip components are mainly packaged and supplied in chip rims. Such a tape reel is attached to a component supply mechanism called a feeder, and the chip component mounting device picks up chip components one by one from the feeder using a vacuum nozzle, and swages the chips into a predetermined position on a given circuit board. Parts are installed. This chip component is stored in a tape reel with enough space to prevent the direction from reversing or turning over. , there are considerable deviations in the lateral and angular directions.

When mounting this chip component on a circuit board, the distance between the specified position of the circuit board and the vertical and horizontal directions is plus or minus 0.1m.
m ~ plus or minus 0.2 mm, and the angle must be mounted within an error of about plus or minus 1 degree. Therefore, in the past, while the chip components are sucked from a feeder and mounted on the substrate, the chip components are moved to the center position of the nozzle using a claw provided horizontally to the nozzle tip or two pairs of components called centering chucks. It's been moved to. FIG. 9 shows the state of such a pair of centering chucks. In the figure, 1 is a chip component, 2 is a suction nozzle, and 3 is a centering chuck. The centering chuck 3 moves simultaneously in the directions of arrows A and B in the figure to move the tip 1 to the center of the nozzle body.

Although not shown, another pair of centering chucks are normally provided in the direction perpendicular to the plane of the drawing, and the chip component l is moved and centered simultaneously from all four directions.

[Problems to be Solved by the Invention] However, there are the following problems in moving the chip components to the nozzle center using such a method.

b) Since the chip parts are sandwiched by the centering chuck, an impact is applied to the chip parts, which causes cracks or cracks in the chip parts and reduces the reliability of the chip parts.

Mouth) Chip parts are often made of ceramic.
If the depth part moves over the nozzle tip with the centering chuck, the nozzle will wear out.

c) The chip component mounting device needs to have a short mounting time, and it is necessary to move the head part as fast as possible. However, a mechanism in which four moving parts such as four centering chucks move simultaneously is complicated and increases weight, making high-speed movement difficult. Furthermore, since the mechanism is complicated, the failure rate of the head mechanism increases.

Therefore, the present invention has been made to solve these problems, and provides a chip component mounting device and method that can mount a chip component at a predetermined position on a circuit board regardless of the position at which the nozzle picks up the chip component. The task is to provide.

[Means for Solving the Problem] In order to solve this problem, the present invention provides a chip component mounting apparatus that moves and mounts a nozzle that has sucked a chip component to a predetermined position on a substrate, and a means for rotating the nozzle. a distance measuring sensor disposed at a predetermined distance from the nozzle and determining the distance to the side surface of the chip component adsorbed by the nozzle; and a chip obtained from the ranging sensor by rotating the nozzle. Means for calculating the positional deviation between the center of the nozzle and the center of the chip component mounted on the nozzle from the distance data of the component is provided, and the movement amount of the nozzle is corrected according to the calculated positional deviation to mount the chip component. Adopted:.

Further, according to the present invention, in a chip component mounting method in which a nozzle that has sucked a chip component is moved to a predetermined position on a substrate and mounted, the nozzle is rotated when moving the chip component, and the nozzle is placed at a predetermined distance from the nozzle. The distance to the side surface of the chip component adsorbed by the nozzle is measured by the distance sensor, and the positional deviation between the center of the nozzle and the center of the chip component attached to the nozzle is calculated from the measured distance data. A configuration is also adopted in which the amount of nozzle movement is corrected according to the positional deviation caused by the chip component.

[Operation] In such a configuration, the nozzle is rotated when the nozzle sucks the chip component and moves the chip component. A distance measuring sensor is disposed at a predetermined distance from the nozzle, and the distance measuring sensor measures the distance to the side surface of the chip component adsorbed by the nozzle. In this case, since the nozzle is rotated, distance data from all sides of the chip component to the distance measurement sensor can be obtained. If there is a misalignment between the center of the nozzle and the center of the chip component installed in the nozzle,
Since there is no uniformity in the distance data, the positional shift is determined by calculating this amount. The amount of movement of the nozzle is corrected in accordance with this calculated positional deviation, and the chip component is mounted at a predetermined position on the circuit board.

[Examples] The present invention will be described in detail below according to examples shown in the drawings.

FIG. 1 shows a head mechanism of a chip component mounting apparatus. This head mechanism uses a nozzle 2 to adsorb a chip component 1 supplied from a feeder, and mounts the chip component at a predetermined position on a circuit board using an XY moving mechanism (not shown).

In Fig. 1, 4 is a motor for rotating the nozzle 2, 5 is a timing belt that transmits the rotational movement of the motor 4 to the nozzle, 6 is a motor that moves the nozzle 2 downward, and 7 is a rack that transmits the rotational movement of the motor 6. 8 is a pinion for transmitting linear motion, and 9 is a linear guide that supports this downward motion.

4 to 9 are also necessary mechanisms in the head mechanism that supports the centering chuck mechanism.

10 is a distance measuring sensor for measuring the distance data of the side surface of the chip component when the 7 nozzle 2 is raised; 11 is the above-mentioned member 2;
It is a support member that supports ~10.

The distance measuring sensor 10 is composed of a laser beam and a linear line sensor, detects distance based on the principle of trigonometry, and has a resolution of several tenths of microns to several microns. Laser emitting surface for distance measurement as shown in Figure 2]
The distance sensor is positioned so that the laser beam emitted from Oa hits the side surface of the chip component 1. The laser beam reflected by the end face of the chip component 1 is transmitted to the light receiving surface 10 of the distance measuring sensor 10.
The light is received at point b, and the distance to the side surface of the chip component 1 is measured.

The signal from the ranging sensor 10 is input to the CPU II via the I10 port 13 as shown in FIG. The chip component mounting apparatus performs various controls via this CPLJll, and controls the motor 4.6 and the X- and Y-direction drive motors via the motor driver 12. Also,
It has a memory 14 that holds data for picking up and mounting parts.

FIG. 4 shows a configuration in which the functions performed by the CPU II are illustrated as blocks. The CPU II is a control unit 2 that controls adsorption of the chip component 1 to the nozzle 2.
2. It has a setting unit 23 that sets the chip component attracted to the nozzle at the height position of the distance measuring sensor IO, and a control unit 24 that controls moving the chip component to a predetermined position on the circuit board,
Furthermore, it has a rotation control section 25 that rotates the nozzle.

The rotation control unit 25 drives the motor 4 that rotates the nozzle via a θ driver 31 (corresponding to the driver 12 in FIG. 3). The X and Y drivers 32 and 33 are drivers for driving motors that move the entire head mechanism shown in FIG. 1 in the X and Y directions, and the Z driver 34 is for moving the head mechanism in the Z direction, that is, in the vertical direction. This is a driver that drives the motor 6.

Data from the chip component height data setting section 21, distance data to the side surface of the chip component obtained from the distance measuring sensor 10, etc. are input to the memory 14 in FIG. The head movement position discriminator 28 compares the target position obtained from the memory 14 and the actual movement amount obtained from the control unit 24,
Move the chip component to the target position. In this case, as will be described later, the deviation between the center positions of the nozzle 2 and the chip component l is calculated by the correction amount calculation unit 27, and the correction setting unit 29
Settings are made according to the amount of correction. With this correction setting, the chip component is mounted on the circuit board at the corrected target position via each of the drivers 32 to 34 and the mounting control section 30. Note that the functions of each block 25.27 to 30 in FIG. 4 are also realized by CFull.

Next, the operation of the chip component mounting apparatus configured as described above will be explained.

First, as shown in step Sl, the height data setting section 2
1 and stores the height data of the chip component l to be sucked into the memory 14. In step S2, the chip suction control unit 22 moves the head to the component suction position to suction the chip component l. Next, the nozzle vertical movement motor 6 is driven by the correction height position setting unit 23, and the nozzle 2 is raised so that the laser beam from the distance measuring sensor 10 almost hits the center of the chip side of the chip component (step S3).

Subsequently, the head is moved to the component mounting position as shown in step S4. This movement is controlled by the movement control unit 24.
, Y drivers 32, 33 to drive the X and Y motors.

In this case, the chip component is moved to the target position output from the memory 14 by determining the actual amount of movement by the position discriminator 28. While the head is moving, the nozzle rotation motor 4 is driven by the rotation control unit 25 via the driver 31, the nozzle 2 is rotated, and at the same time distance data is measured by the distance measurement sensor 10 and stored in the memory 14 (step S5, S6).

FIG. 6 shows the output state of the distance measuring sensor IO when the nozzle 2 that has picked up the chip component 1 is rotated 360 times in step S5 described above. In FIG. 6, the x-axis is the rotation angle and the y-axis is the measured distance. If the longitudinal direction of the chip component substantially coincides with the light emitting axis of the distance measuring sensor lO during suction, two peaks (point A, point B) appear before and after rotation starts. This means measuring the corners of the chip component in the longitudinal direction (FIG. 7(A)).

As the rotation continues, the distance gradually increases until it reaches a peak R.
It approaches again and records two peak CDs. Here, CD is located at the remaining two points, and R is located at the center of the longitudinal side of the chip component (Figure 7 (B)).As the rotation continues, peak S is recorded, and point A is remeasured at around 360°. do.

In Fig. 6, the difference xO in distance between a point P between the valleys between points A and B and a point Q between the valleys between points 0 and D is the difference between the nozzle center, which is the center of rotation, and the tip center, as shown in Fig. 8. This is twice the amount of deviation in the X direction. Further, the difference yO in distance between point R and point 8 represents twice the amount of deviation in the X direction in FIG. Furthermore, (
P point -0°), (R point -90°), (0 point -180°)
, (8 points -270°) are almost equal, and this represents the deviation of the nozzle reference angle of the chip component (θ0 in FIG. 8). By rotating and measuring the side surface of the chip component l with the distance measuring sensor 10 in this way, it is possible to know at once the deviations in the X direction, Y direction, and angle of the center 1a of the chip component with respect to the nozzle center 2a, which is the center of rotation. can.

According to this principle, in step S7, the correction amount calculation unit 2
7 is the deviation amount xO1 from the blur stored in the memory 14
Calculate yO1θ0. When the head completes moving to the component mounting position (step S8), the correction setting section 29 correctly corrects the deviation amount (xO/2, y/2) of the chip component (step S9), and the nozzle rotation motor 4 corrects the angular deviation (step S9). θ
0) (step 510). Next, the nozzle up and down motor 6 is driven to mount the chip components (step 5l).
1).

With this method, even if the center position of the chip component and the nozzle that picks it up are misaligned, the positional misalignment can be easily determined by calculation using the measurement data from the ranging sensor. It becomes possible to correct the target position and mount the chip component at a predetermined position on the circuit board.

Furthermore, with the method described above, it becomes possible to detect chip suction errors using a distance sensor, which was conventionally done using a sensor that detects negative pressure.

Further, when the chip component is rotated 360 times, the detection ability for each deviation appears as twice the amount of actual deviation, so the detection accuracy can be increased.

In the above embodiment, one distance measuring sensor is used, but by arranging two distance measuring sensors facing each other, data can be obtained at a rotation angle of 180 degrees.

[Effects of the Invention] As explained above, in the present invention, #! Since no mechanical impact is applied, the reliability of the chip components can be improved without causing cracks or cracks in the chip components. Furthermore, since the mechanism for centering the chip components can be omitted, the valve structure can be simplified, the head can be made lighter, the head can move faster, and the failure rate can be reduced.

[Brief explanation of drawings]

FIG. 1 is a perspective view showing the configuration of the head mechanism of the chip component mounting device, FIG. 2 is a perspective view showing distance measurement using a distance measuring sensor for chip components, and FIG. 3 is a perspective view showing the configuration of the head mechanism of the chip component mounting device. FIG. 4 is a block diagram of the driving mechanism, FIG. 4 is a control block diagram of the chip component mounting device, FIG. 5 is a flowchart showing the flow of control when mounting chip components, and FIG.
Characteristic diagram of distance data when rotated by 60°, Figure 7 (
A) and (B) are explanatory diagrams illustrating the positions of the chip components relative to the distance measurement sensor, FIG. 8 is an explanatory diagram illustrating the positions of the chip components and nozzles for calculating the correction amount, and FIG. ,
FIG. 2 is a side view showing a mechanism for centering chip components of a conventional device. ■...Chip parts 2--Nozzle 10--Distance sensor 11...CPU 14-To memory 7) Sea of tower traces □□□ Fig. 1 Fig. 5 Fig. 3 Fig. 10 n ° ξ hechido 5 fr both 2 I s 1 shi / ii f- han ffri; ri tree & moon 1 and 3.4 i ρlae 9th
figure

Claims (1)

[Scope of Claims] 1) A chip component mounting device for moving and mounting a nozzle that has sucked a chip component to a predetermined position on a substrate, comprising means for rotating the nozzle; A distance measurement sensor measures the distance to the side surface of the picked chip component, and distance data of the chip component obtained from the distance measurement sensor by rotating the nozzle is used to determine the center of the nozzle and the distance between the chip components attached to the nozzle. What is claimed is: 1. A chip component mounting apparatus, comprising: means for calculating a center positional deviation; and a chip component mounting apparatus comprising: means for calculating a center positional deviation; and a nozzle movement amount is corrected in accordance with the calculated positional deviation, and a chip component is mounted. 2) In a chip component mounting method in which a nozzle that has picked up a chip component is moved to a predetermined position on a board and mounted, the nozzle is rotated when the chip component is moved, and a distance sensor placed a predetermined distance from the nozzle is used to detect the nozzle. measure the distance to the side surface of the chip component that is attracted to the surface, calculate the positional deviation between the center of the nozzle and the center of the chip component attached to the nozzle from the measured distance data, and adjust the position of the nozzle according to the calculated positional deviation. A chip component mounting method characterized by correcting the amount of movement and mounting the chip component.