JP3075420B2 - IC lead floating inspection apparatus and method - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for inspecting the floating of leads of an IC such as a flat package IC at a predetermined position on a substrate by using an electronic component mounting machine.
The present invention relates to a C-lead floating inspection apparatus and method .

[0002]

2. Description of the Related Art When an IC is mounted at a predetermined position on a substrate by an electronic component mounting machine, a float of a lead projecting from an outer periphery of the IC is detected before mounting, and the float is within a reference value. Only run the implementation as pass. This is because if the leads are floating above a certain reference value, soldering failure will occur.

[0003] As a method of detecting this lead floating,
Using a laser displacement meter, irradiate the tip of the lead with laser light,
There are known a method of detecting lead floating based on displacement of reflected light, and a method of detecting lead floating by imaging a lead with a camera and processing the image.

In any of the above methods, it is necessary to position the IC at a predetermined position before detecting lead floating. Conventionally, this positioning is performed by manually or mechanically pressing the leads of the IC.

[0005]

However, according to the conventional positioning method described above, in any case, an external force is applied to the IC lead, so that the lead may be slightly deformed, or may be bent at worst. .

SUMMARY OF THE INVENTION The present invention has been made in view of such a situation, and it is possible to perform positioning of an IC before detecting the floating of a lead without applying an external force to the lead and prevent deformation of the lead. IC that can lower the defect rate of
It is an object of the present invention to provide a lead floating inspection apparatus and method .

[0007]

SUMMARY OF THE INVENTION In accordance with the present invention, an IC lead floater is provided.
Inspection apparatus, the reference holding means for holding by suction the IC by the nozzle, means for detecting by image processing coordinates of the slope and lead tip with respect to a reference position of the IC, the IC
As the position correction to a position, moving the nozzle, rotary, or causes the lift is, the laser head <br/> laser displacement meter, in a direction parallel to the two orthogonal sides of the position corrected IC to the reference position Drive nozzles to move relatively
Driving means, setting means for setting a predetermined distance reference value,
The detection signal of the reflected light from the laser light lead emitted in a certain direction relative to the IC leads from a laser head, a measuring means for measuring the distance between the lead and the laser head, the distance measured by the measuring means And setting means
By comparing the constant distance reference value, characterized in that it comprises a judging means for judging acceptance of the lead float. The setting
The determining means and the determining means are configured by a computer.
It is characterized by being performed. IC lead floating inspection of the present invention
The method includes a holding step of holding the IC by sucking it with a nozzle.
And the inclination of the IC with respect to the reference position and the tip of the lead.
A detection step of detecting coordinates by image processing;
Move, rotate, and move the nozzle to correct the position to the reference position.
Alternatively, raise and lower the laser
Two orthogonal sides of the IC whose position has been corrected to the reference position
Drives the nozzle to move relatively in the direction parallel to
Drive step and setting to set a predetermined distance reference value
Step and the laser head
Of the reflected light from the lead of the laser light
Measures the distance between the lead and laser head based on the detection signal
Measurement step and the measurement step
Distance and the distance base set by the processing of the setting step
The reference value is compared with the reference value to determine whether or not the lead is lifted.
And a step.

[0008]

In the apparatus and method for floating inspection of an IC lead having the above structure, the IC is sucked and held by the nozzle.
As C is located corrected to the reference position, moving the nozzle, rotary, or causes the lift is, the laser displacement meter Leh
The nozzle is driven so that the head relatively moves in a direction parallel to two orthogonal sides of the IC whose position is corrected to the reference position, a predetermined distance reference value is set, and the distance between the lead and the laser head is set. Is measured, measured distance and set
Pass / Fail of lead floating is judged by comparing with the distance reference value
Is done . In this manner, the positioning of the IC and the detection of the floating of the lead can be inspected in a non-contact manner, and the deformation of the IC lead in the inspection process can be prevented.

[0009]

An embodiment of the present invention will be described below with reference to the drawings.

FIGS. 1 to 6 show an embodiment of the present invention.
FIG. 1 shows an apparatus configuration of the embodiment. In FIG. 1, IC1
Are vacuum-sucked on a nozzle 2 as a holding means. The nozzle 2 is given movements of rotation, rotation, and elevation in the XY axis directions by a driving device 3 such as a robot. A laser head 6 having a laser light source for irradiating the lead 4 of the IC 1 with laser light 5 and a sensor for receiving the laser light 5 reflected by the lead 4 is provided below the nozzle 2. The distance between the lead 4 and the laser head 6 is usually set to 10 mm to 20 mm, and a signal received by the laser head 6 is sent to a laser displacement meter 7. Then, each lead 4 and laser head 6 are measured by a laser displacement meter 7.
Is measured.

The laser displacement meter 7 is connected to a detection computer 9 which takes in the measured distance data L and compares it with a predetermined distance reference value sent from a control computer 8 to judge whether or not the lead floats. I have. The pass / fail signal detected by the detection computer 9 is transmitted to the control computer 8.
When the control computer 8 receives the pass signal,
The mount signal is sent to the driving device 3 via the servo amplifier 10. The driving device 3 mounts the IC 1 at a predetermined position on a substrate (not shown).

On the other hand, a camera 11 is provided below the nozzle 2 so as to face the lower surface of the IC 1. The camera 11 includes a high-magnification camera 11a and a low-magnification camera 11b, and is fixed at a fixed position with respect to the substrate. The camera 11 is connected to the display unit 13 via an image processing circuit 12 (detection means).

Next, the operation of the apparatus of this embodiment will be described. First, as shown in FIG. 2, the IC 1 is suction-held by the nozzle 2. Reference numeral 15 shown in FIG. 2 is a tray for supplying IC1. The IC 1 in this state is imaged from below by the camera 11. At this time, the camera 11a for high magnification is used when the IC 1 is small, and the camera 11b for low magnification is used when the IC 1 is large. The image captured by the camera 11 is displayed on the display unit 13 via the image processing circuit 12. As shown in FIG. 3, this image is shifted with respect to the reference lines in the X and Y directions of the substrate 14, the coordinates of the tip of the lead 4a to be at the origin are at the position (x, y), and When the reference side is at an angle of θ with respect to the Y axis, the drive unit 3 is driven by the control computer 8 to rotate and move the IC 1 together with the nozzle 2 to make θ, x, y zero. . This position correction is performed in a non-contact manner based on the calculation result by the image processing circuit 12.

After the IC 1 is positioned at the correct position as described above, the driving device 3 is driven by a command from the control computer 8, and the IC 1 fixed to the nozzle 2 is moved to A, B, C as shown in FIG. , D in the order of X and Y. Then, a laser beam 5 for irradiating a certain direction is sequentially applied to the lead 4, and a detection signal corresponding to the reflected light is sent to a laser displacement meter 7 via a laser head 6.

This detection signal becomes a pulse wave as shown in FIG. This pulse wave is input to the laser displacement meter 7 and the encoder 1 attached to the XY-axis motor of the driving device 3
The distance L between the lead 4 and the laser head 6 at a predetermined timing synchronized with the pulse output from the laser head 5 is measured. The measured data is compared with the reference value sent from the control computer 8 and the detection computer 9 as described above.
6 is mounted at a predetermined position on the substrate 14 as shown in FIG.

According to the present embodiment, the position correction of the IC 1 is performed by using image processing.
In without adding unnecessary external force, it has rows of floating detection of IC lead 4, it is possible to mount the IC to the substrate, reducing the failure rate of the components to prevent deformation of the IC lead 4 be able to.

[0017]

As described above, according to the present invention, I
C is sucked and held by the nozzle , and the IC is positioned at the reference position.
As location corrected, moving the nozzle, rotary, or causes the lift is, as the laser head of the laser displacement meter, relatively moved in a direction parallel to two sides perpendicular position corrected IC to the reference position Next , the nozzle is driven, a predetermined distance reference value is set, the distance between the lead and the laser head is measured, and the measured distance is compared with the set distance reference value.
Then, it was determined whether the lead was lifted or not.
The entire process of C-lead floating inspection can be performed without contacting the IC leads, and the defect rate of the component on which this IC is mounted can be reduced.

[Brief description of the drawings]

FIG. 1 is a block diagram showing a configuration of an embodiment of an IC lead floating detection device according to the present invention.

FIG. 2 is an explanatory diagram showing a state where an IC is attracted to a nozzle in the embodiment of FIG. 1;

FIG. 3 is an explanatory diagram showing displacement of an IC in the embodiment of FIG. 1;

FIG. 4 is an explanatory diagram showing a movement path of an IC with respect to a laser beam in the embodiment of FIG.

FIG. 5 is a timing chart showing measured waveforms in the embodiment of FIG.

FIG. 6 is an explanatory diagram showing an operation of mounting an IC on a substrate in the embodiment of FIG. 1;

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 IC 2 Nozzle (holding means) 3 Drive 4 Lead 5 Laser beam 7 Laser displacement meter 11 Camera 12 Image processing circuit (detection means) 13 Display part 14 Substrate 15 Tray

──────────────────────────────────────────────────続 き Continuation of the front page (56) References JP-A-63-161635 (JP, A) JP-A-64-21937 (JP, A) JP-A-2-231513 (JP, A) JP-A-1- 129111 (JP, A) JP-A-63-5243 (JP, A) JP-A-1-272126 (JP, A) JP-A-1-129110 (JP, A) (58) Fields investigated (Int. Cl. ⁷ , DB name) H01L 21/66 G01B 11/00 H05K 3/34 512 H05K 13/08

Claims (3)

(57) [Claims] 1. A method for floating a lead of an IC using a laser displacement meter.
In the IC lead height detection device for judging Kino acceptance, holding means for holding by suction the IC by the nozzle,
Detecting means for detecting the coordinates of image processing slope and lead tip with respect to a reference position of the IC, the IC so as to position correction to the reference position, moving the nozzle, rotary, or causes the lift is, the laser Driving means for driving the nozzle so that the laser head of the displacement meter relatively moves in a direction parallel to two orthogonal sides of the IC whose position has been corrected to the reference position; and a predetermined distance reference value. A distance between the laser head and the laser head is measured by setting means for setting and a detection signal of reflected light of the laser light emitted from the laser head to the IC lead in a fixed direction from the lead. Measuring means, the distance measured by the measuring means and the setting means
Ri is compared with the set the distance reference value, IC lead height detection apparatus characterized by comprising determination means for determining acceptability of the lead float. (2) The setting means and the determination means may include
Composed of computers 2. The method according to claim 1, wherein
4. The IC lead floating inspection device according to 1. (3) Floating of IC lead using laser displacement meter
IC lead floating inspection device that determines pass / fail
In the floating test method, A holding step of holding the IC by sucking it with a nozzle
When, The inclination of the IC with respect to the reference position and the tip of the lead
A detecting step of detecting the coordinates of the image by image processing; In order to correct the position of the IC to the reference position,
Move, rotate, or raise and lower the chil
The laser head of the laser displacement meter compensates the position to the reference position.
Relative to a direction parallel to two orthogonal sides of the corrected IC.
Driving the nozzle to move the nozzle
When, A setting step of setting a predetermined distance reference value; Constant from the laser head to the leads of the IC
Of the reflected light from the lead of the laser light emitted in the direction
The distance between the lead and the laser head is determined by the detection signal.
A measuring step for measuring separation; The distance measured by the processing of the measuring step and the setting
And the distance reference value set by the process of the fixed step.
A comparison step is performed to judge whether the lead is lifted or not.
And An IC lead floating inspection method comprising: