JPH11251797A - Method and apparatus for component recognizing - Google Patents

Abstract

PROBLEM TO BE SOLVED: To obtain the positional information at a joint of an electronic component accurately while ensuring mounting thereof by deviating a noise object existing closely to the joint of a lead or an electrode on the electronic component mounting surface from the measuring region of reflected light detected at a height detecting section. SOLUTION: An electronic component having the joint of a lead, or the like, is sucked to a heat section 7 and moved onto a height sensor 8 provided with two systems of semiconductor position detecting elements PSD 17a, 17b. Light from a laser 10 is condensed and focused through a lens 11, deflected by a polygon mirror 12, and projected to the component 2 by converting the optical path through an F-θlens 15. Reflected light is passed through lenses 16a, 16b to be focused on PSDs 17a, 17b and output signal 18a, 18b for measuring the height of laser reflecting surface are generated therefrom. Since a height region is preset in a height measurable region and the height is detected only in that range, a noise object is deviated therefrom and not detected.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for automatically mounting an electronic component on a printed circuit board, a liquid crystal display, a plasma display panel substrate, or the like. A component recognition method and device for detecting the position of a joint, and the electronic component based on positional information of a joint such as a lead or an electrode present on the mounting surface of the electronic component, detected by the component recognition method. Electronic component mounting method to be mounted on a substrate, and detected by the component recognition device,
The present invention relates to an electronic component mounting apparatus that mounts the electronic component on a substrate based on positional information of a joint such as a lead or an electrode present on a mounting surface of the electronic component.

[0002]

2. Description of the Related Art Conventionally, various types of component recognition methods have been known. For example, an electronic component is irradiated with visible light, and the reflected light reflected from the
There has been proposed a device that detects a position of a joint, such as a lead or an electrode, existing on a mounting surface of an electronic component by receiving the image with a camera.

[0003]

However, in the above-described structure, when visible light is reflected by the projections near the leads or electrodes existing on the mounting surface of the electronic component, the leads are not provided. In addition to the reflected light from the electrodes and the electrodes, the reflected light from the projections etc. also enters the CCD camera, and the projections and the like become noise at the joints to be recognized such as the leads and electrodes, and the projections are erroneously recognized as the leads or electrodes There was a problem that would be done. Therefore, an object of the present invention is to solve the above-described problems, and it is not necessary to erroneously recognize a protrusion or the like near a joint such as a lead or an electrode present on a mounting surface of an electronic component as the joint without mistakenly. A component recognition method and apparatus that can accurately obtain positional information of a joint of an electronic component, and an electronic component that can more accurately mount the electronic component based on the accurately obtained position information of the joint It is to provide a mounting method and an apparatus.

[0004]

In order to achieve the above object, the present invention is configured as follows. According to the first aspect of the present invention, light is emitted to a joint such as a lead or an electrode present on a mounting surface of an electronic component, and a height detector detects the joint of the joint based on light reflected from the joint. A component recognition method for performing position detection, wherein a noise object that exists behind or near the joint and reflects the light is outside the height measurement area of the reflected light detected by the height detector. In addition, the present invention provides a component recognition method characterized in that the height measurement area of the height detection unit is limited to remove the noise object. According to a second aspect of the present invention, the height detecting section includes:
The component recognition method according to the first aspect, wherein a height of the joint is detected by a semiconductor position detection element as a height detection sensor. According to the third aspect of the present invention, in the noise removal, the height measurement area in which the height position of the joint portion can be detected around the height measurement reference plane in the height measurable area is set in advance. In addition, there is provided the component recognition method according to the first or second aspect, wherein the height of the joint is detected only within the range of the height measurement region. According to a fourth aspect of the present invention, the noise elimination is performed by converting the height measurement area capable of detecting the height position of the joint portion around a height measurement reference plane in the measurable area to a height conversion table. Is set in advance, and the height conversion table treats, as invalid height data, height data outside the height measurement area among the height data of the joints, and Component recognition according to any one of the first to third aspects, wherein the height data within the range is treated as valid height data, and the height of the joint is detected based on the valid height data. Provide a way. According to the fifth aspect of the present invention, the processing area is determined from the size of the electronic component with respect to the image of the electronic component detected only within the range of the height measurement area, and the processing area is determined in the image of the electronic component. Sampling the window of the determined processing area and roughly detecting the center and inclination of the electronic component, and based on the size of the component and the approximate position of the electronic component, all the images in the electronic component are displayed. The component recognition method according to any one of the first to fourth aspects, wherein a position of the joint is detected, and an accurate position of the electronic component in an image of the electronic component is detected from all positions of the joint. I will provide a. According to a sixth aspect of the present invention, the electronic component is mounted on a substrate based on positional information of the joint of the electronic component detected by the component recognition method according to any one of the first to fifth aspects. An electronic component mounting method is provided. According to the seventh aspect of the present invention, the electronic component is held by the component holding member of the head unit, it is determined whether or not the height measurement area needs to be adjusted, and the height measurement area needs to be adjusted. In this case, the height measurement area is adjusted, the height of the component holding member is adjusted based on the height measurement area, the height data of the component is fetched, and the height detection unit detects the electronic component. Detecting a position, based on the height position information recognized by the height detection unit, driving the head unit and mounting the electronic component at a predetermined position on the board by the component holding member; An electronic component mounting method according to a sixth aspect is provided. According to the eighth aspect of the present invention, an irradiation device for irradiating light to a joint such as a lead or an electrode present on a mounting surface of an electronic component, and a reflection of light emitted from the irradiation device reflected at the joint A height detector for detecting the position of the joint based on light, and measurement of reflected light that is detected by the height detector when a noise object that exists behind or near the joint and reflects the light is detected by the height detector; Provided is a component recognition device, characterized in that a measurement region of the height detection unit is limited to be outside the region, and a noise removal unit that removes the noise object is provided. According to a ninth aspect of the present invention, the height detecting section detects a position of the joint section by a semiconductor position detecting element as a height detecting sensor.
A component recognition device according to an aspect is provided. Tenth aspect of the present invention
According to the aspect, the noise elimination unit sets in advance a height measurement area in which the height position of the joint can be detected around the height measurement reference plane in the height measurable area, The component recognition device according to the eighth or ninth aspect, wherein the height of the joint is detected only within the range of the measurement area. According to an eleventh aspect of the present invention, the noise elimination unit converts the height measurement area capable of detecting the height position of the joint portion around a height measurement reference plane in the measurable area into a height. The table is set in advance, and the height conversion table treats the height data outside the height measurement area among the height data of the joints as invalid height data, and the height measurement area The component according to any one of the eighth to tenth aspects, wherein the height data within the range is treated as effective height data, and the height of the joint is detected based on the effective height data. A recognition device is provided. According to a twelfth aspect of the present invention, a processing area determining means for determining a processing area from the size of the electronic component with respect to the image of the electronic component detected only within the range of the height measurement area, A center of gravity and inclination detecting means for roughly detecting the center and inclination of the electronic component by sampling the window of the determined processing area in the image of the component, and determining the size of the component and the approximate position of the electronic component. A joint position detecting means for detecting the positions of all the joints in the image of the electronic component, and detecting an accurate position of the electronic component in the image of the electronic component from the positions of all the joints The component recognition device according to any one of the eighth to eleventh aspects, wherein the component recognition device includes a joint center and inclination detecting unit. According to a thirteenth aspect of the present invention, the electronic component is mounted on a board based on positional information of the joint of the electronic component detected by the component recognition device according to any one of the eighth to twelfth aspects. An electronic component mounting apparatus is provided. According to the fourteenth aspect of the present invention, the electronic component is held by the component holding member, and the height of the component holding member is adjusted based on the height measurement area, and the head is recognized by the height detection unit. The electronic component according to a thirteenth aspect, further comprising: a control unit that drives the head unit based on the height position information and mounts the electronic component at a predetermined position on the substrate by the component holding member. Provide a mounting device.

[0005]

Embodiments of the present invention will be described below in detail with reference to the drawings. The component recognition method according to the first embodiment of the present invention provides a height measurement area that can be detected by a height detection sensor in order to accurately obtain positional information of a joint such as a lead or an electrode on a mounting surface of an electronic component. Is limited so that only the above-mentioned joints are detected and other noise objects are not detected. That is, according to the first embodiment, when a measurement area to be height-detected with respect to the joint is known in advance, when inputting height data, height data outside the measurement area is converted into a height conversion table. Is converted to a specific value that is not recognized as normal height data. Specifically, as an example, the present invention is applied to a case where a noise measurement object is included in the height measurement area represented by 8 bits. It is preferable to calculate the height positional relationship in advance and limit the height measurement area.

FIG. 1 is an overall schematic view of an electronic component mounting apparatus provided with a component recognition device capable of implementing a component recognition method according to a first embodiment of the present invention. The head 7 sucked by the nozzle 7a
The electronic component 2 is moved at a constant speed in the X-axis direction on the height detection sensor 8 of the height detection unit 602 for detecting the height of the joints such as the leads 2 a and the electrodes existing on the mounting surface of the electronic component 2. 3 shows a state in which height data is obtained. That is,
1 and 14, reference numeral 1 denotes a mounting device main body of an electronic component mounting device, 2 denotes an electronic component (hereinafter abbreviated as a component) mounted by the present device, 3 denotes a tray on which the component 2 is placed, and 4 denotes a tray 3. A tray supply unit as a component supply unit for automatically supplying the component 2 placed on the unit 7 is a servo motor 7m for vertically moving the nozzle height axis supporting the nozzle 7a after sucking the component 2 with the nozzle 7a during mounting. A head unit for mounting the sucked component 2 on a substrate by driving the
Is for moving the head unit 7 in the x-axis direction.
A robot on the x-axis (hereinafter abbreviated as x-axis robot) which constitutes a part of the Y robot 600, 6a and 6b are parts of the XY robot 600 for moving the head unit 7 in the y-axis direction together with the x-axis robot 5. The robot 8 on the y-axis side (hereinafter abbreviated as the y-axis robot), 8 is a three-dimensional (hereinafter abbreviated as 3D) sensor as an example of a height detection sensor of the height detection unit 602 in FIG. Yes, a height image of the component 2 is captured. 9 is a printed circuit board on which the component 2 is mounted.

[0007] The component 2 placed on the tray 3 is
When moving along the x-axis robot 5 on the 3D sensor 8 sucked by the 3D sensor 8, the 3D sensor 8
The (height) image is captured. The (height) image obtained by the 3D sensor 8 is software-processed to
The height (position) of the lead or the like is inspected, and the component 2 is mounted at a predetermined position on the printed circuit board 9 according to the positioning information.

Next, the configuration and operation of the 3D sensor 8 will be described in detail below. FIG. 2 shows the 3D sensor 8
Semiconductor position detection element (Position Sens
negative Detector) (hereinafter abbreviated as PSD) 17
FIGS. 3A and 3B show that the 3D sensor 8 is installed in two systems, and is a configuration diagram (cross-sectional view) of the 3D sensor 8 viewed in the x-axis direction. FIG. 3 shows the reflection of the polygon mirror 12 that reflects laser light. FIG. 7 is a configuration diagram (cross-sectional view) of the 3D sensor 8 viewed in the y-axis direction, showing a state in which a laser beam is incident on the light receiving element 19 every time the surface changes and a polygon surface origin signal 20 is generated. 2 and 3, 5 is an x-axis robot, 7 is a head unit, 2 is a sucked component, 1
Reference numeral 0 denotes a semiconductor laser that emits laser light, 11 denotes a condensing / shaping lens that condenses / shapes the laser light, 12 denotes a polygon mirror that scans the laser light hitting a mirror surface by mechanical rotation, and 13 denotes a laser light. A half mirror 14 that passes through the part and partially reflects the light, and 14 is a mirror that reflects light.

Reference numeral 15 denotes an F-.theta. Lens for converting the optical path so that the laser light mechanically shaken by the polygon mirror 12 is projected perpendicularly onto the component 2, which is a subject.
16b is the reflection (scattered light) of the laser light hitting the part 2
The imaging lenses 17a and 17b reflect reflected light of the laser light hitting the component 2 into the imaging lenses 16a and 16b.
Is a PSD as a position detecting element that is imaged through the device, and has a function of generating an electric signal correlated with the position of the imaged light. 18a and 18b are PSDs 17a and 17b
Is the output signal.

Here, the laser light emitted by the semiconductor laser 10 is condensed and shaped by a condensing and shaping lens 11, passes through a half mirror 13,
And strikes the polygon mirror 12. The polygon mirror 12 is rotating at a constant speed, and the laser light hitting the mirror surface is swung. Further, the laser light whose optical path has been converted by the F-θ lens 15 is applied to the component 2 vertically, and the reflected light is imaged on the PSDs 17a and 17b via the imaging lenses 16a and 16b to form an image.
7b generates output signals 18a and 18b which can measure the height of the laser reflecting surface of the component 2.

Reference numeral 19 denotes a light-receiving element (optical sensor) for detecting that light has been input, and reference numeral 20 denotes a signal for notifying that light has been input to the optical sensor 19 to the outside. It changes when each mirror surface comes to a predetermined angle, so to say, it corresponds to the origin signal (surface origin) of each surface of the polygon mirror 12. Further, for example, 18
In the case of the surface polygon mirror 12, signals are output 18 times per rotation when they are rotated by an angle of equal intervals (every 20 degrees for 18 surfaces). This is called a rotation amount signal of the polygon mirror 12.

3D sensor 8 in the first embodiment
Has two systems of PSD circuits, but one system has a structure in which when a laser beam hits a component, the angle of the PS circuit is increased.
Since the reflected light may not return to D in some cases, the main purpose is to compensate for this. In some cases, it is more effective to provide three or more systems, but it is technically the same, and here, two systems will be described. Here, an example of a method of measuring the height on the component 2 which is the measurement target by the semiconductor position detecting elements (PSDs) 17a and 17b will be described with reference to FIG. Will be explained. In FIG. 5, a laser beam that is scanned from the F-θ lens 15 in the direction perpendicular to the paper and projected onto the component 2 is irregularly reflected from the component 2. In this case, the projected points are a point A ₁ at a height 0 on the bottom surface of the component 2 and a point B _{1 at a} height H from the bottom surface.
When it is a point, the laser beam irregularly reflected is condensed by the imaging lens 16a, each of which forms an image on the _two-point and B ₂ points A on the semiconductor position sensitive device 17a. As a result, electromotive force is generated at points A ₂ and B _2, and currents I ₁ and I ₂ are extracted from point C, and currents I ₃ and I ₄ are extracted from point D, respectively. The currents I ₁ and I ₃ are determined by the distances x _A and A between the points A ₂ and C, respectively.
_The current I ₂ , I ₄ is determined by the resistance component proportional to the distance between the _two points and the point D, and the current I ₂ , I ₄ is the distance x _B between the points B ₂ and C and the distance between the points B ₂ and D. since determined by resistance components in proportion to the distance, and the length of the semiconductor position sensitive device 17a and L, x _a in FIG. 5, x _B is determined as follows. _{x A = LI 3 / (I} 1 + I 3) x B = LI 4 / (I 2 + I 4) Therefore, the distance H between the _two points and the B ₂ points A on the semiconductor position sensitive device 17a of Fig. 5 'Is determined by the following equation. H ′ = x _A −x _B The height H is determined based on the height H ′ on the PSD thus obtained.

Next, a mechanism for capturing a 3D image in the electronic component recognition device of the first embodiment will be described with reference to FIG. FIG. 4 is an explanatory diagram of an output signal from the 3D sensor 8 of the electronic component recognition device of the first embodiment. In FIG. 4, 2 is a component, 5 is an x-axis robot, 7 is a head, 8 is a 3D sensor, and 18a and 18b are PSDs.
Output, 20 is polygon surface origin signal (rotation amount signal), 21
Denotes a reference position sensor for notifying the image processing control unit 21 of a reference position for capturing a 3D image on the x-axis robot 5, and 23 denotes a position when the head unit 7 passes through the reference position sensor 22. A reference position signal for notifying the image processing controller 21 of this, a servo motor 24 for moving the x-axis robot 5, and a servo motor 24a
4 is an encoder, 601 is a servo controller for controlling the servo motor 24, 25 is an encoder 24a
Is the encoder signal that is output. In FIG. 14, reference numeral 200 denotes a main control unit of the electronic component recognition device. The y-axis robots 6a and 6b have basically the same structure as the x-axis robot 5, respectively, and drive the servo motor for driving the y-axis robot to drive the x-axis robot 5 instead of the head unit 7. The servo motor is moved and its operation is controlled by a servo controller 601. As is well known, the servo controller 60 also rotates the nozzle 7a of the head unit 7 in the θ direction around its central axis.
In step 1, the operation of the θ-direction rotation servomotor is controlled. Also, as is well known, when the nozzle height axis supporting the nozzle 7a is moved up and down to adjust the height of the nozzle 7a of the head unit 7, the servo controller 601 controls the operation of the servomotor 7m for up and down movement.

When the component 2 picked up from the tray 3 moves on the x-axis robot 5, the encoder 24a
Always supplies an encoder signal (AB-phase, Z-phase or a signal equivalent thereto) 25 to the image processing controller 21. When the component 2 passes through the reference position sensor 22, the reference position signal 23 is 21
The image processing control unit 21 can calculate the relative position of the component 2 from the reference position on the x-axis robot 5 using these two signals.

On the other hand, the rotation amount of the polygon mirror 12 in the 3D sensor 8 is always given to the image processing controller 21 as a polygon surface origin signal (rotation amount signal) 20 while the polygon mirror 12 is rotating. The rotation amount of the polygon mirror 12 after passing the reference position can be calculated from the reference position signal 23 and the reference position signal 23.

Here, the amount of rotation of the polygon mirror 12 increases in proportion to its speed, and the same applies to the amount of movement of the x-axis robot 5. On the other hand, 3 in the first embodiment.
The D sensor 8 is based on the premise that the polygon mirror 12 and the x-axis robot 5 at the time of capturing a 3D image rotate and move straight at a constant speed. If this condition is disturbed,
The resolution (pixel size) per pixel in the horizontal and vertical directions of the captured 3D image varies depending on the speed unevenness. This is an error factor in measurement accuracy. Therefore, in the electronic component recognition device of the first embodiment, the 3D sensor 8 having the above configuration takes in the 3D image into the image memory (see FIG. 14) in the image processing control section 21 and basically rotates at a constant speed. In order to monitor and control the consistency of operation between the polygon mirror 12 and the head unit 7 driven by a motor such as a servo motor 24, a polygon surface origin signal (rotation amount signal) 20 of the polygon mirror 12 is used.
And the encoder signal 25 of the motor.

FIG. 6 is a perspective view of an electronic component in which position detection using the three-dimensional sensor 8 is effective in the electronic component recognition method according to the first embodiment. The electronic component 2 includes four left and right leads 2a projecting laterally from the body 2p and bending downward and extending downward. Between the second lead 2a and the second and third leads 2
a, each of the projections 2c projects laterally, and
A large projection 2b projects laterally above the rear end lead 2a so as to vertically overlap. Such an electronic component 2 can be considered as a special component that is mounted very rarely in a normal assembly of electronic components.
However, the problem is how quickly it can be implemented when such electronic components 2 have to be mounted. For example, in the case of a board used for a product having a short life of about 3 to 6 months as typified by a mobile phone or a personal computer, usually, a new image processing program is created for special parts. It is not permissible to use the device that requires more than one week to use it. Therefore, it has been required to accurately detect the position of the lead 2a even in such a component 2 as shown in FIG.

FIG. 7 is a view for explaining the relationship between the positions of the leads 2a and the projections 2b and 2c which become noise of the electronic component 2 of FIG. 6 and the height measurement area in the electronic component recognition method according to the first embodiment. FIG. In the first embodiment, since 8-bit image processing is employed, 256 numerical values from 0 to 255 can be handled as height data. In the first embodiment, for the sake of convenience, the reference plane for height measurement, which is the position where the beam diameter of the laser beam is minimized, is set to the position of the numerical value of 128, and the coordinate axis of the height is moved up and down with reference to the numerical value of 128. Electronic components 2 to 3 in the direction
Take the direction of the D sensor 8 and pass the numerical value of 128 through the reference plane of height measurement from 0 at the upper end to 255 at the lower end to give a height measurable area of 25 from 0 to 255.
Expressed as six numerical positions, the height measurement center position is 1
28. In addition, 0 or 2 as height data
A value such as 55 is used to express an error such as "height data could not be obtained correctly". still,
The height measurable area of the 3D sensor and its center position are
It is physically determined by the optical system design of the 3D sensor. Normally, when recognizing an electronic component, the electronic component is positioned in the height direction such that the mounting surface of the electronic component is located at the height measurement center position of the 3D sensor, and a height image of the electronic component is captured. . In this embodiment, if the resolution in the height direction is set to 10 μm, the height measurable area is about ± 1.2 mm. Therefore, when the noise lead of the electronic component is outside this area, it is not necessary to adjust the range of the height measurement area. On the other hand, it is necessary to adjust the range of the height measurement area as described later when the noise object enters within about ± 1.2 mm and has a height different from the joint.

FIG. 9 is a flowchart showing a procedure for mounting an electronic component using the electronic component recognition method according to the first embodiment. First, in step S1, the electronic component 2 is sucked from the tray 3 by the nozzle 7a of the head unit 7 under the control of the main control unit 200. Then, step S
In 2, the operator determines whether or not the height measurement area needs to be adjusted by looking at the part shape and the like. If the height measurement area to be detected is known in advance and the height measurement area needs to be adjusted, the process proceeds to step S3. If the adjustment of the height measurement area is unnecessary, the process proceeds to step S4. Step S3 is performed only when the height measurement area to be detected is known in advance, and the height measurement area is adjusted. The adjustment of the height measurement area is performed, for example, by checking the distance between the lead 2a of the electronic component 2 and the projections 2b and 2c that can be a noise object, and checking the distance between the projections 2b and 2c within the height measurement area of the lead 2a.
If it is determined in step S2 that c has entered, the protrusion 2
This is performed by narrowing the height measurement area so that b and 2c are outside the height measurement area of the lead 2a.

Next, in step S4, the main controller 200 controls the servo controller 601 to adjust the height of the nozzle 7a based on the height measurement area. The height of the nozzle 7a to be adjusted is determined by the operator based on the shape of the electronic component 2 and is stored in the component shape information storage unit 620 of the main control unit 200 and is necessary for the mounting program. Should be incorporated in advance in the component shape information in the detailed mounting information.
See the description of FIG. ). In the case of the normal component 2, the control of the servo controller 601 via the main control unit 200 is performed such that the adjustment amount is zero, that is, the height measurement reference plane of the height measurement area matches the mounting surface of the electronic component 2. Drives the nozzle height axis servo motor 7m by means of the nozzle 7a.
The height measurement is preferably performed by moving the nozzle height axis supporting the vertical direction to adjust the height of the lower end of the nozzle 7a to position the component mounting surface on the height measurement reference plane of the height measurement area. . In general, it is considered that the height adjustment is required only for special components as shown in FIG. Then
In step S5, under the control of the main control unit 200,
The height data of the component 2 is taken into the image memory 305 shown in FIG. 14 from the component shape information of the mounting information necessary for the mounting program. The image memory 305 stores 8-bit height data. By separately specifying addresses on the X-axis side and the Y-axis side, the height data at a specific position is stored in the image memory 305. The data can be read from the memory 305.

Next, in step S6, the position of the component 2 is detected by the 3D sensor 8. The details are shown in steps S6A to S6E in FIG. 10 described below. Next, in step S7, under the control of the main controller 200, the component 2 is mounted at a predetermined position on the printed circuit board 9 based on the height position information recognized by the 3D sensor 8.

FIG. 10 shows in detail the procedure for detecting the position of the component 2 from the height data in step S6 of FIG. First, in step S6A, a processing area is determined from the size of the component 2 stored in the component shape information. For example, the size of the processing area in the X and Y directions is set to twice the size of the component 2 on the screen. FIG.
1A, a processing area determined from the size of the component 2 is shown by a rectangular window 500 as an example. FIG.
According to (A), a rectangular window 5 which is a processing area
00 indicates that the image 202a of the lead 2a of the component 2 can be sufficiently inserted into the window 500 by setting the size of the image 202 of the component 2 to approximately twice the size of the image 202.

Next, in step S6B, FIG.
18 is sampled in the processing area as shown in FIG. 18 and a luminance histogram is created as shown in FIG. 18 on the basis of the luminance indicating the height data at each position. In order to separate the height data of a certain joint, for example, the lead 2a from the height data of the noise object, a threshold value is calculated and set using the histogram method. Here, the ratio of the area of the bar graph portion on the left side of the threshold value of the histogram and the area ratio of the bar graph portion on the right side of the threshold value is equal to the ratio of the area of the background area of the processing area to the area of the object in FIG. Therefore, the calculation of the threshold value by the histogram method is performed as follows. First, an area including an object is determined in the image memory.
Next, image data is read out by sampling at equal intervals in the X direction and the Y direction, respectively, and a histogram of the image data is created. The appearance rate of the image data having a relatively high value, such as the joint of the object, is determined by the joint (here, this area is assumed to be area A) in the predetermined sampling region (here, this area is the area A). The area is defined as area B.)
It is equal to the area ratio (S% = 100 * B / A). Therefore, the brightness histogram is added in order from the rightmost frequency, and the image data corresponding to the lead is represented by the area up to S% of the area of the histogram. Therefore, the value of the image data indicating S% is set as the threshold.

Next, in step S6C, the inside of the window 500 of the processing area is sampled, and the center of the component 2 and the center of the part 2 are determined based on the valid height data detected in the height measurement area using the above threshold value. The tilt (the tilt angle of the horizontal axis of the window in the processing area with respect to the X axis and the vertical axis of the window) is roughly detected. For example, the center and the inclination of the component 2 can be obtained by following the calculation formulas of (Equation 1) and (Equation 2) below. FIG. 11B is a diagram illustrating that the processing area 500 is sampled and the approximate center and inclination of the component 2 are obtained. As an example of sampling, if height data is sampled every other pixel in the X-axis direction and taken in to the height data of the last pixel in the X-axis direction, then one pixel is skipped in the Y-axis direction and the second pixel is skipped. Then, the height data is sampled at every other pixel in the X-axis direction and the height data of the last pixel in the X-axis direction is taken in all areas in the window 500 in the same manner as described above.

Here, first, in order to roughly determine the center of the component 2, the processing area 500 is sampled and the height data H (x, y) is read from the image memory 305. As described above, 8-bit height data is stored in the image memory 305, and the height data at a specific position can be read from the image memory 305 by separately specifying the X and Y addresses. it can. Then, the center position (Xc, Yc) is calculated by the following (Equation 1).

(Equation 1) However, when H (x, y)> THL, ρ (x, y) =
Let it be 1. When H (x, y) ≦ THL, ρ
(X, y) = 0. Here, THL is obtained by creating a luminance histogram by the threshold value calculation means 408 stored in the program memory 301 in FIG. 15 based on the luminance indicating the height data at each position, and then calculating the high Threshold value calculating means 40 for separating a joint to be detected, for example, the lead 2a from a noise object.
The threshold value is set in 8 and the sampling is performed within the window 500, which is the processing area, to estimate the height of the lead 2a considered to be a recognition target, and set it to a value slightly lower than that. Alternatively, a fixed value may be set. For example, in the first embodiment, the height measurement reference plane 128
Corresponds to the mounting surface of the component 2, the threshold value TH
L is a numerical value of 80 (a position 0.48 mm above the mounting surface).

The detection of the inclination θ ₁ is obtained by the following (Equation 2).

(Equation 2) However, when H (x, y)> THL, ρ (x, y) =
Let it be 1. When H (x, y) ≦ THL, ρ
(X, y) = 0.

Next, in step S6D, the position of the lead 2a is detected based on the component shape information and the approximate position of the component 2. That is, as shown in FIG.
Using the rough center and inclination of the component 2 obtained in step S6C and the width and depth of the body 2p in the component shape information sent from the main controller 200, the position where each lead 2a exists. Is estimated, and a small small window 501 including each lead 2a is set. This small window 501 is set to, for example, approximately twice the size of the image 202a of the lead 2a. The inside of the small window 501 is sampled to detect the center position 502 of each lead 2a. As an example of sampling, if height data is sampled every other pixel in the X-axis direction and taken in to the height data of the last pixel in the X-axis direction, then one pixel is skipped in the Y-axis direction and the second pixel is skipped. Then, the height data is sampled every other pixel in the X-axis direction and the height data of the last pixel in the X-axis direction is taken in all areas in the small window 501 in the same manner as described above. The part shape information includes a part 2
The information necessary for calculating the position where each lead 2a exists, such as the 2p size (body height, body width, body depth), the number of leads, the lead length, the lead width, and the lead pitch, is stored in advance. Keep it.

Next, in step S6E, the correct position of the component 2 is detected from all the lead positions (coordinates of the lead center position). FIG. 12B is a diagram for explaining a state in which the accurate center and inclination of the component 2 are calculated from all the lead positions. For example, the center position is obtained by the averaging of all the lead positions, the slope is calculated by calculating the midpoint between the respective lead center positions of the leads 2a facing each other across the body 2p, and a cross straight line approximating the four midpoints 503. FIG. 13 shows an example of a calculation result of the accurate center and inclination of the component 2 obtained in this manner. In FIG. 13, a straight line 504 indicates the inclination of the component 2, and an intersection 506 between four straight lines 505 orthogonal to the straight line 504 and the center line of the image 202 a of each of the four left and right leads 2 a corresponds to the center position coordinates of the lead 2 a. Become.

Here, for comparison between the first embodiment and the prior art, the electronic component 2 shown in FIG.
FIG. 8A schematically shows an image 102 captured by a camera. Since the noise 102c corresponding to the protrusion 2c exists between the images 102a of the two leads 2a, the noise 102c is detected when the image 102a of the lead 2a is detected.
It is necessary to perform a "noise lead removal process" for removing the noise 102c so as not to be affected by the noise. Further, since the image 102a of the rearmost lead 2a is completely included in the noise 102b corresponding to the protrusion 2b,
In order to detect the position a, "low contrast read detection processing" (image enhancement processing) is required. Also, depending on the capabilities of the "noise lead removal processing" and the "low contrast lead detection processing", a situation such as a recognition position shift or a recognition failure is expected, and there is a problem that reliability is reduced. However, here, the noise 102c is also the noise 102c.
b is assumed to be an object as bright as the image 102a of the lead 2a.

On the other hand, in the first embodiment, the height measurement reference plane 128 in the height measurable area is used.
Since a height measurement area in which the height position of the lead 2a can be detected is set in advance around the numerical value of, and the height is detected only within the range of the height measurement area, the height measurement area is set. Since only the height of the lead 2a located inside the lead 2a can be detected and the height of the protrusions 2b and 2c outside the height measurement area is not detected, as shown in FIG.
An image 202 of the electronic component 2 having only 02a can be captured. In other words, the noise 102c and the noise 102b detected by the conventional technique are outside the height measurement area of the 3D sensor 8 in the component recognition method of the first embodiment, and thus the noise 102c and the noise 102b are detected by the 3D sensor 8. Is not detected at all. In other words, there is no need for the "noise lead removal processing" or the "low contrast lead detection processing" required in the prior art. Therefore,
Compared with the conventional method, according to the first embodiment, not only the image processing time can be reduced, but also the reliability of recognition is greatly improved.

Therefore, according to the component recognition method according to the first embodiment, the height measurement area in which the height position of the lead 2a can be detected around the height measurement reference plane in the height measurement possible area is set in advance. Since the height is set and the height is detected only within the range of the height measurement area, only the height of the lead 2a located within the height measurement area can be detected, and the height outside the height measurement area can be detected. The heights of the projections 2b and 2c are not detected. Therefore, the protrusions 2b and 2c that become noise near the leads 2a and electrodes existing on the mounting surface of the electronic component 2
Even when the electronic component 2 exists, the protrusions 2b and 2c can be accurately recognized without being erroneously recognized as the lead 2a or the electrode. The position information of the joint can be obtained accurately. Therefore, if the mounting of the electronic component 2 is performed based on the position information of the bonding portion obtained accurately, the electronic component 2 can be mounted more accurately.

FIG. 14 is a detailed block diagram of a component recognition apparatus for implementing the component recognition method of the first embodiment. 14, a main control unit 200 controls the operation of the entire electronic component mounting apparatus shown in FIG. For example, the position of the head unit 7 of the electronic component mounting apparatus is controlled via the servo controller 601, and the suction of the electronic component 2
Movement and mounting on the printed circuit board 9 are performed. The main control unit 200 also stores the component shape information (the size (body height, body width, body depth) of the component body 2p, the number of leads, the lead length, the lead width, the lead pitch, etc.) of the electronic component 2 to be mounted. From the component shape information storage unit 620 via the system bus 201 and the two-port memory 306 to the work memory 302 of the component recognition device, and the height image of the electronic component 2 is input and the position of the electronic component 2 is detected. The position detection result of the electronic component 2 is input from the image processing control unit 21 to the main control unit 200 via the two-port memory 306, and the main control unit 200 controls the operation of the entire electronic component mounting apparatus. It is used for the position correction calculation in the X, Y, and θ directions when the electronic component 2 is mounted on the printed circuit board 9. Then, based on the position (X, Y, θ) correction calculation result, the main control unit 2
00, the nozzle 7a is rotated in the θ direction to correct the rotational position of the electronic component 2, and in the XY direction, the head unit 7 is moved in the XY direction by adding the correction calculation result to the mounting position of the electronic component 2. Then, the electronic component 2 is mounted at a predetermined position on the printed circuit board 9.

On the other hand, as described above, in the x-axis robot 5, the head 7 that has sucked the electronic component 2 moves on the X-axis 5 by the rotation of the servomotor 24. The input of the height data of the electronic component 2 is performed by moving the head unit 7 sucking the electronic component 2 from the left side to the right side of the reference position sensor 22 on the 3D sensor 8 at a constant speed. When the head section 7 passes through the reference position sensor 22, a reference position signal 23 is output and notified to the image processing control section 21. XY robot 6 including this x-axis robot 5
In 00, the servo controller 601 controls the X axis, the Y axis,
Controls the position of the θ axis and the nozzle height axis. In particular, the motor encoder signal of the X axis indicates the position of the head unit 7 on the X axis, and the reference position signal from the X axis indicates that the head unit 7 has reached the height measurement start position. Therefore, each is input to the timing control unit 307 of the image processing control unit 21, and is used by the timing control unit 307 to measure the start timing of loading the height data into the image memory 305.

As described above, in the height detection sensor 8 of the height detection unit 602, the light receiving system that measures the laser light reflected from the object has two systems (channels) in consideration of the reflection variation of the laser light. A and channel B) are provided to ensure reliability. In each light receiving system, the PSD 17a, 1
The weak signal detected by the preamplifier 310a, 3a
The signal is amplified by 10b and converted into 12-bit digital data by AD converters (analog to digital converter) 311a and 311b (in order to secure the accuracy of height calculation, converted to 12-bit digital data). Height calculation units 312a and 31 of image processing control unit 21
2b. Further, the polygon mirror 12 is constantly rotating, and a polygon surface origin signal is input to the clock generator 309 by the mechanism shown in FIG. The clock generator 309 generates a reference clock (CLK) required when writing height data to the memory, and generates a horizontal synchronization signal (HCLR) necessary for capturing height data based on the polygon surface origin signal 20. ), And the timing control unit 3 of the image processing control unit 21
07.

From the 3D sensor 8 of the height detecting section 602, the preamplifiers 310a and 310b and the AD converter 31
The PSD signals digitized by 1a and 311b are:
The data is converted into 8-bit height data by the height calculation units 312a and 312b. The channel selector 303 compares height data of two systems (channel A and channel B) in real time, and selects the more likely height data at each timing. For example, if a division by zero occurs during the calculation of the height of channel A, 255 indicating an abnormality is given to the height data of channel A. In such a case, the value of channel B is selected. If both channels show an outlier of 255, 25 as height data
5 is output. If the height data of both channels is a normal value, an average value of the height data of both channels is output. The height data output from the channel selection unit 303 is converted into an invalid value (for example, zero) by the height conversion unit 304 from the height data outside the height measurement area, and the image memory 3
05 is stored. The storage of the height data in the image memory 305 is controlled by the timing control unit 307.
After receiving the reference position signal from the controller, the encoder signal 25 is counted as a predetermined head moving distance, a vertical synchronization signal (VCLR) is generated, and the vertical synchronization signal (VCLR) is input to the image memory 305 as a height data capture start signal. I have.
In order to generate the vertical synchronization signal (VCLR), after receiving the reference position signal, the predetermined moving distance of the head unit is counted by the encoder signal. This is because it is impossible to attach it accurately. The height data stored in the image memory 305 is stored in a CPU that operates according to a program.
Image processing is performed by 300, and the position detection and the like of the electronic component 2 that is the recognition target are performed. The program is stored in the program memory 301. Component shape information (body size (body height, body width, body depth) of the component, number of leads, lead length, lead width, etc.) in the component shape information storage unit 620 storing the geometric features of the electronic component 2 ) Is a 2-port memory 3 prior to height image input.
It is sent in advance from the main control unit 200 side via 06. The position detection of the recognition target is performed based on the component shape information as described above. The work memory 302
Is used as a location for storing an intermediate result in detecting the position of the recognition target. As described above, when the height conversion table is used in the height conversion unit 304 as an example of the noise removal unit, the conversion speed is high, and the component recognition speed can be improved.

FIG. 15 shows the program memory 301 of FIG.
The processing means includes a processing area determining means 401, a center of gravity detecting means 402, and a tilt detecting means 4.
03, lead position detecting means 404 functioning as joint position detecting means, object center / tilt detecting means 405 functioning as joint center and tilt detecting means, height data clipping means 406, height conversion table Setting means 4
07 and a threshold value calculation means 408. These are usually each constituted by software. The processing area determining means 401 performs the operation of step S6A in FIG. 10, and determines the processing area in the image memory 305 from the size of the component 2. Center of gravity detection means 402
Performs the center calculation of step S6C in FIG. The inclination detection means 403 performs the inclination calculation formula in step S6C in FIG. The lead position detecting means 404 performs the operation of step S6D in FIG. 10, and calculates the position where the lead 2a exists from the given center and inclination and the component shape information of the object, and calculates the center of the lead 2a. Detect the position.

The object center / inclination detecting means 405 is provided in FIG.
In step S6E of step S6E, the center / inclination of the target object is accurately calculated from all the lead positions. The height data clipping unit 406 is a unit that calculates a height level at which a certain area is searched and clipped.
For example, in the small window 501 including the lead 2a shown in FIG. 12A, a clip value is obtained by the height data clipping unit 406 before the lead 2a is detected. Then, the lead position can be accurately detected by removing the noise height using the clip value. Here, since the calculation of the clipping height level is performed for each lead, the clip level has a different value for each lead. Therefore, it is possible to perform optimal noise height removal according to each lead 2a. The height conversion table setting means 407 receives the height conversion unit 30 based on an instruction from an operator.
4 is to rewrite the height conversion table. As described above, the threshold value calculating unit 408 creates a luminance histogram based on the luminance indicating the height data at each position, and then, in the luminance histogram, determines a joint to be detected in height, for example, the lead 2a and the noise object. Set a threshold to separate.

FIG. 16 is a height conversion table showing an example of setting the detection range of the height conversion unit 304 in FIG. Here, in the component shape information, detected height data relating to the adjustment of the height detection area is stored. From the viewpoint of the CPU 300 that can rewrite the height conversion table based on this information, the CPU 300 can view the height conversion table in the same way as a memory, and the CPU 300 writes 8-bit data while specifying an address. Thus, a height conversion table can be set. Therefore, the height conversion unit 304 can set in advance a height measurement area in which the height position of the lead 2a can be detected around the height measurement reference plane in the height measurable area. Only the height data that passes through the range of the height measurement area is output to the subsequent processing, and the height is detected only within the range of the height measurement area. Here, since 8-bit image processing is performed, the height data is 0 to 0.
256 numerical values up to 255 can be handled. In the first embodiment, for convenience, the numerical value of the reference plane for height measurement is 128 and the height coordinate axis is taken from the object in the direction of the 3D sensor, and the resolution in the height direction is 10 μm.
The measurable area is about ± 1.2 mm. In FIG.
The setting of the height conversion unit 304 that limits the height measurement area to, for example, ± 0.5 mm under this condition is shown. That is, in FIG. 16, when a numerical value (digital value) between 78 and 178 as height data is input to the height conversion unit 304, it is converted into the same value as the input value and Numerical values (digital values) are output. However, when a numerical value (digital value) of 0 or more and less than 78 and a numerical value (digital value) of more than 178 and 255 or less as height data are input to the height conversion unit 304, the value is converted to a numerical value of 0. This indicates that each is output. Therefore, in step S3 in FIG. 9, when the height measurement area to be detected is known in advance and the height measurement area is adjusted, the height conversion table may be changed. Specifically, for example, step S2 in FIG.
When the operator determines that the noise object enters the height measurement area in step S3, it is necessary to adjust the height measurement area so as to narrow the height measurement area so that the noise object moves out of the height measurement area in step S3. Become. Therefore, the operator issues an instruction to change the output value corresponding to the input value of the height conversion table in the height conversion unit 304 from the operation panel 650 to the component shape information storage unit 620 so as to narrow the height measurement area. The height conversion table setting means 407 in the program memory 301 shown in FIG. 15 is stored on the basis of the adjustment instruction in the part shape information storage unit 620 via the main control unit 200 and the two-port memory 306. What is necessary is just to rewrite the height conversion table in the conversion part 304.

Therefore, according to the component recognition apparatus of the first embodiment, the height conversion unit 304 detects the height position of the lead 2a around the height measurement reference plane in the height measurement possible area. Since the height measurement area is set in advance and the height is detected only within the height measurement area, it is possible to detect only the height of the lead 2a located in the height measurement area. Protrusion 2 outside the height measurement area
The heights of b and 2c are not detected. Therefore, even if there are protrusions 2b and 2c which become noise near the lead 2a, the electrode and the like existing on the mounting surface of the electronic component 2, the protrusion 2
b, 2c, etc., can be accurately recognized without being erroneously recognized as the leads 2a, electrodes, etc., and the positional information of the joints, such as the leads 2a and electrodes, existing on the mounting surface of the electronic component 2 can be accurately obtained. Obtainable. Therefore, if the mounting of the electronic component 2 is performed based on the position information of the bonding portion obtained accurately, the electronic component 2 can be mounted more accurately.

The present invention is not limited to the above embodiment, but can be implemented in other various modes. For example, in the first embodiment, instead of implementing the height conversion unit 304 with software, the height conversion unit may be configured with a circuit configuration, for example, with two types of comparators. In this case, one of the two types of comparators invalidates all the height data on the noise object side from the threshold value for separating the lead 2a and the noise object, while the other comparator does not. The same function may be exhibited by treating all the height data on the lead side below the threshold value as valid. Also, instead of the first embodiment, as a second embodiment of the present invention, when it is not possible to determine in advance a measurement area to be detected, height data is temporarily stored in an image memory, There is a method of analyzing height data, setting a height measurement area, and replacing the height data outside the measurement area with a specific value. Specifically, as an example, an object that becomes noise is included in the height measurement area represented by 8 bits, but this is applied to the case where the first embodiment is not adopted because the height of the noise is not stable. . Also, as a third embodiment of the present invention, instead of including the height conversion unit 304, the light receiving system lenses 16a, 16b that form images on the PSDs 17a, 17b so that no noise-causing object enters the measurable range. Is changed so as to narrow the width of the height measurement area so that only the reflected light from the lead 2a is formed into an image, and the reflected light from the projections 2b and 2c, which is noise, is not formed. However, in the third embodiment, a special adjustment mechanism is required to flexibly set the height measurement area according to the target object.

[0041]

According to the component recognition method of the present invention, a height measurement area in which the height position of the joint can be detected centering on the height measurement reference plane in the height measurement possible area is set in advance. Since the height of the joint is detected only within the height measurement area, only the height of the joint located within the height measurement area can be detected. The height of a noise object such as a projection is not detected. Therefore, even if there is a projection or the like that is a noise object near a joint such as a lead or an electrode on the mounting surface of the electronic component, the joint can be accurately recognized without erroneously recognizing the projection as a joint. This makes it possible to accurately obtain positional information of the joint on the mounting surface of the electronic component. Therefore,
If the electronic component is mounted on the basis of the position information of the joint obtained accurately, the electronic component can be mounted more accurately. Further, according to the component recognition device of the present invention, the noise measurement unit sets in advance a height measurement area in which the height position of the joint can be detected around the height measurement reference plane in the height measurement possible area. In addition, since the height of the joint is detected only in the range of the height measurement area, only the height of the joint located in the height measurement area can be detected. It does not detect the height of noise objects such as external projections. Therefore, even if there is a noise object or the like near a joint such as a lead or an electrode on the mounting surface of the electronic component, the noise object can be accurately recognized without being erroneously recognized as the joint. In addition, it is possible to accurately obtain positional information of a joint such as a lead or an electrode existing on a mounting surface of the electronic component. Therefore, if the electronic component is mounted on the basis of the position information of the joint obtained accurately, the electronic component can be mounted more accurately.

[Brief description of the drawings]

FIG. 1 is an external view of an electronic component mounter that can execute an electronic component recognition method according to the first embodiment of the present invention.

FIG. 2 is a side view of a height detection sensor used in the electronic component recognition method according to the first embodiment as viewed in a Y-axis direction.

FIG. 3 is a side view of the height detection sensor of FIG. 2 as viewed in the X-axis direction.

FIG. 4 is an explanatory diagram of an output signal from a 3D sensor according to the first embodiment.

FIG. 5 is an explanatory diagram showing an example of a height measuring method in the first embodiment.

FIG. 6 is a perspective view of an electronic component in which position detection using a three-dimensional sensor is effective in the electronic component recognition method according to the first embodiment.

FIG. 7 is a diagram for explaining the relationship between the position of a lead and the position of a projection serving as noise of the electronic component of FIG. 6 and a height measurement area in the electronic component recognition method according to the first embodiment.

FIGS. 8A and 8B are schematic explanatory views of an image obtained by photographing the electronic component of FIG. 6 with a conventional CCD camera, and an electronic component recognition method according to the first embodiment. FIG. 4 is a schematic explanatory diagram of an image of an electronic component when recognized by the method of FIG.

FIG. 9 is a flowchart showing a procedure for mounting an electronic component using the electronic component recognition method according to the first embodiment.

FIG. 10 is a flowchart showing details of a procedure for detecting the position of a component from height data in step S6 of FIG. 9;

11A and 11B are a schematic explanatory view showing a processing area determined from the size of a component in a window in the position detection procedure of FIG. 10 and a sampling of the processing area. FIG. 9 is a schematic explanatory view showing that a rough center and a tilt of a part are obtained.

FIGS. 12A and 12B respectively show the case where individual leads are used in the position detection procedure of FIG. 10 by using the approximate center and inclination of the component and the component shape information sent from the main controller. Estimate the existing position, set a small window containing the lead, sample the window, and detect the center position of the lead. FIG. 4 is a schematic explanatory view showing a state in which a center and a tilt are calculated.

13 is a schematic explanatory view showing an example of a calculation result of an accurate center and a tilt of a component in the position detection procedure of FIG. 10;

FIG. 14 is a block diagram of a component recognition device for performing the component recognition method of the first embodiment.

15 is a block diagram of functional means of software included in a program memory of the component recognition device of FIG. 14;

FIG. 16 is a table showing an example of setting a detection range of the height conversion unit in FIG. 15;

FIG. 17 is a diagram showing a processing area for which a luminance histogram is created.

18 is a diagram of a luminance histogram of the processing area in FIG.

[Explanation of symbols]

1. Mounting device body of electronic component mounting device 2. Electronic components,
2a: lead, 2b: protrusion, 2c: protrusion, 3: tray,
4: tray supply unit, 5: robot on x-axis side, 6a, 6b
... Y-axis side robot, 7 ... Head part, 7a ... Nozzle, 7
m: Servo motor for vertical movement of nozzle height axis, 8: Three-dimensional (3D) sensor, 9: Printed circuit board, 10: Semiconductor laser, 11: Condensing and shaping lens, 12: Polygon mirror, 13: Half mirror, 14: Mirror , 15 ... F-θ
Lens, 16a, 16b ... imaging lens, 17a, 17b
... Semiconductor position detection element (PSD), 18a, 18b ... P
Output signals of SDs 17a and 17b, 19: light receiving element (optical sensor), 20: polygon surface origin signal, 21: image processing control unit of electronic component recognition device, 22: reference position sensor,
23: Reference position signal, 24: Servo motor, 24a: Encoder, 25: Encoder signal, 102, 202
... images of parts, 102a, 202a ... images of lead portions, 102b, 102c ... images of projections that become noise, 1
28: height measurement reference plane, 200: main control unit, 201:
System bus, 300 CPU, 301 program memory, 302 work memory, 303 channel selection unit, 304 height conversion unit, 305 image memory, 306
... two-port memory, 307 ... timing control unit, 309
... Clock generator, 310a, 310b ... Preamplifier,
311a, 311b ... AD converter, 312a, 3
12b: height calculation unit, 401: processing area determination means, 4
02: center of gravity detection means, 403: inclination detection means, 404 ...
Lead position detecting means, 405: Object center / inclination detecting means, 406: Height data clipping means, 407: Height conversion table setting means, 408: Threshold value calculating means, 50
0: processing area window, 501: small window,
502: center position, 503, 504, 505: straight line, 5
06: intersection, 600: XY robot, 601: servo controller, 602: height detector, 620: component shape information storage unit.

 ────────────────────────────────────────────────── ─── Continued on the front page (72) Inventor Akira Nato 1006 Kazuma Kadoma, Osaka Pref. Matsushita Electric Industrial Co., Ltd.

Claims (14)

[Claims] 1. A light is irradiated to a joint such as a lead (2a) or an electrode present on a mounting surface of an electronic component (2), and a height detector (8) detects the reflected light from the joint. A component recognition method for detecting the position of the joint, wherein a reflected light detected by the height detector is a noise object (2b, 2c) located behind or near the joint and reflecting the light. A height measurement area of the height detection unit is limited so as to be outside of the height measurement area of the above, and the noise object is removed. 2. The component recognizing method according to claim 1, wherein the height detecting section detects the height of the joint by a semiconductor position detecting element as a height detecting sensor. 3. The method according to claim 1, wherein the noise measurement is performed in advance by setting the height measurement area in which the height position of the joint can be detected around a height measurement reference plane in the height measurement possible area. The component recognition method according to claim 1, wherein the height of the joint is detected only within a range of the measurement area. 4. The method according to claim 1, wherein the height measurement area in which the height position of the joint is detected around a height measurement reference plane in the measurable area is set in advance as a height conversion table. In advance, according to the height conversion table,
Among the height data of the joint, the height data outside the height measurement area is treated as invalid height data, and the height data within the range of the height measurement area is treated as valid height data. The component recognition method according to any one of claims 1 to 3, wherein the height of the joint is detected based on the effective height data. 5. A processing area is determined from the size of the electronic component for the image of the electronic component detected only within the range of the height measurement area (S6A), and the processing area is determined in the image of the electronic component. The center and the inclination of the electronic component are roughly detected by sampling the window (500) of the processed area (S6B, S6).
C) detecting the positions of all the joints in the image of the electronic component based on the size of the component and the approximate position of the electronic component (S6D); The component recognition method according to any one of claims 1 to 4, wherein an accurate position of the electronic component in a component image is detected (S6E). 6. An electronic device, comprising: mounting an electronic component on a substrate based on positional information of the joint of the electronic component detected by the component recognition method according to claim 1. Component mounting method. 7. A component holding member (7a) for a head part (7).
The electronic component is held at (S1), and it is determined whether or not the height measurement area needs to be adjusted. If the height measurement area needs to be adjusted, the height measurement area is adjusted ( S2, S3), adjusting the height of the component holding member based on the height measurement area (S4), capturing the height data of the component (S5), and determining the position of the electronic component by the height detection unit. Detect (S
6) Based on the height position information recognized by the height detection unit, the head unit is driven to mount the electronic component at a predetermined position on the board by the component holding member (S7).
7. The electronic component mounting method according to claim 6, wherein: 8. An irradiation device (10) for irradiating light to a joint (2a) such as a lead or an electrode present on a mounting surface of an electronic component (2), and light emitted from the irradiation device is applied to the joint. A height detector (602) for detecting the position of the joint based on the reflected light reflected by the light source; and a noise object (2b, 2c) located behind or near the joint and reflecting the light. A noise elimination unit (304) for limiting the measurement area of the height detection unit so as to be outside the measurement area of the reflected light detected by the height detection unit and removing the noise object; A component recognition device characterized by the following. 9. The component recognition device according to claim 8, wherein the height detecting section detects the position of the joint by a semiconductor position detecting element as a height detecting sensor. 10. The noise elimination unit sets a height measurement area in which a height position of the joint can be detected around a height measurement reference plane in a height measurable area in advance. The component recognition device according to claim 8, wherein the height of the joint is detected only within a range of the height measurement area. 11. The height measurement area in which the height position of the joint can be detected around a height measurement reference plane in the measurable area as a height conversion table. In addition, the height conversion table treats height data outside the height measurement area as invalid height data among the height data of the joints,
The height data within the range of the height measurement area is treated as valid height data, and the height of the joint is detected based on the valid height data.
The component recognition device according to any one of the above. 12. A processing area determining means (401) for determining a processing area based on the size of the electronic component with respect to the image of the electronic component detected only within the height measurement area.
A center of gravity and inclination detecting means (402, 403) for sampling the determined processing area window (500) in the image of the electronic component to roughly detect the center and inclination of the electronic component; Joint position detecting means (404) for detecting the positions of all the joints in the image of the electronic component based on the size of the electronic component and the approximate position of the electronic component; 9. A joint center and inclination detecting means (405) for detecting an accurate position of the electronic component in an image of the electronic component.
12. The component recognition device according to any one of claims 11 to 11. 13. An electronic component mounted on a board based on positional information of the joint of the electronic component detected by the component recognition device according to claim 8. Component mounting equipment. 14. A head unit (7) for holding the electronic component with a component holding member (7a) and adjusting the height of the component holding member based on the height measurement area, and the height detecting unit. 14. A control unit (200) for driving the head unit based on the recognized height position information and mounting the electronic component at a predetermined position on the substrate by the component holding member. Electronic component mounting apparatus according to the above.