JP3055864B2 - Electronic component mounting method and device - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention is applied to a method and an apparatus for mounting electronic parts, and more particularly to a work for performing non-contact centering of electronic parts and mounting the parts at an accurate position on a mounting board such as a printed circuit board. The present invention relates to a suitable electronic component mounting method and apparatus.

[0002]

2. Description of the Related Art Conventionally, when an electronic component is mounted at a predetermined position on a mounting substrate such as a printed circuit board, the electronic component is once positioned with respect to a reference point (position) set separately from the substrate. After defining the center and inclination of the component, the component is symmetrically moved on the substrate and assembled at a predetermined position.

In order to align such electronic components, for example, as disclosed in Japanese Patent Application Laid-Open No. Sho 60-1900, the positioning is performed using so-called regulating claws that regulate four sides around a rectangular component. Although a centering method is known, such a mechanical centering method may damage electronic components, and thus a method called non-contact centering is also employed.

FIG. 3 is a perspective view showing a main part of an electronic component mounting apparatus adopting such a non-contact centering method.

[0005] In the figure, reference numeral 1 denotes a mounting head (transporting means) for transporting and mounting electronic components to a predetermined position on a mounting substrate. The mounting head 1 is supplied to the predetermined position by a component supply device 2. A suction nozzle 4 for sucking and holding the picked-up electronic component 3, a motor 5 for moving the suction nozzle 4 up and down, and rotating about a vertical axis, and a suction nozzle 4
And a laser sensor (optical sensor) 6 for measuring the position of the electronic component 3 after raising the electronic component 3 sucked and held to a predetermined height.

As shown in FIG. 4, the laser sensor 6 has two walls 6A and 6B which are opposed to each other, and a laser beam is parallel to a predetermined width on one wall 6A. A light-emitting portion for emitting light is built in, and the other wall portion 6B has
A light receiving unit for receiving the parallel light incident from 6A is built in.

Accordingly, in the above mounting apparatus, the suction nozzle 4
After the electronic component 3 held by the above is raised to the position of the laser sensor 6, as shown in FIG. 4, the electronic component 3 is positioned between the wall portions 6A and 6B, and the parallel light (hatched line) 6B), the light-shielding length at that time is detected, and the suction nozzle 4 is rotated by an angle θ at which the light-shielding length is minimized.
Positioning in the direction and rotation direction is performed, and thereafter, as shown in FIG. 5, the electronic component 3 is mounted on the mounting substrate 7 at the designated position.

As a non-contact centering method, there is a method of aligning electronic components using an image recognition camera (imaging means). This is installed and fixed at a predetermined position of the mounting apparatus, as shown in FIG.
For example, the electronic component 3 sucked and held by the suction nozzle by a mounting head (not shown) having the same suction nozzle 4 as that shown in FIG. 1 in a visual field range of an image recognition camera 8 such as a CCD camera. The electronic component 3 is moved to be directly captured by the camera 8 as an image, and the image data is used to determine the position in the XY direction and the inclination (rotation direction) from the target.
Are calculated and calculated by an arithmetic processing unit (not shown), and thereafter, the position of the electronic component 3 is corrected using the obtained shift amount, and the position of the mounting board 7 is corrected in the same manner as in FIG. This is a method of mounting the electronic component 3 at a specified position.

[0009]

However, in the positioning of the electronic parts employing the conventional laser sensor method, the position can be detected inside the mounting head 1 and thus the positioning can be performed efficiently in a short time. Although there is an advantage that the detection can be performed, the detection accuracy is not always high, so that there is a problem that the detection accuracy may be different or changed for each type of component or lot or over time.

The method of directly registering a part as an image by the camera and aligning the part has an advantage that the amount of displacement of the part can be detected with high accuracy. At the same time, since the image data captured by the camera must be processed, the detection time required for each component is lengthened, and as a result, the efficiency of component mounting work is reduced.

SUMMARY OF THE INVENTION The present invention has been made to solve the above-mentioned conventional problems. When an electronic component is mounted on a mounting board, the position of the electronic component can be detected quickly and accurately. It is an object of the present invention to provide an electronic component mounting method and apparatus capable of greatly improving the efficiency of a mounting operation.

[0012]

According to the present invention, a supplied electronic component is conveyed onto a mounting substrate while being held by holding means, and a displacement of the held electronic component is detected by an optical sensor. In an electronic component mounting method of performing position correction based on a detection result and mounting the electronic component at a specified position on a substrate, a position shift of the electronic component is detected by an optical sensor and an imaging unit, and the detection result by the optical sensor is The above problem has been solved by performing correction based on the detection result by the imaging means.

The present invention also conveys a supplied electronic component onto a mounting board while holding the supplied electronic component by a holding means, and detects a displacement of the held electronic component by an optical sensor.
In an electronic component mounting method of performing position correction based on the detection result and mounting the electronic component at a specified position on a substrate, a position shift of the electronic component is detected by an optical sensor and an imaging unit, and the detection result by the optical sensor and By comparing the detection result by the imaging means, calculating the correction of the detection result by the optical sensor based on the detection result by the imaging means, and correcting the detection result by the subsequent optical sensor using the calculation result, the same applies. The above-mentioned problem has been solved.

The present invention also provides a means for supplying an electronic component, a holding means for holding the supplied electronic component, a transfer means for transferring the held electronic component onto a mounting board and mounting the electronic component at a designated position, An electronic component mounting apparatus comprising: an optical sensor that detects a displacement of an electronic component held by a holding unit; and an imaging unit that detects a displacement of the electronic component held by the holding unit. The above-mentioned problem is also solved by providing calculation means for correcting the detection accuracy of the optical sensor based on the detection result of the displacement of the electronic component by the means and the detection result of the displacement of the same electronic component by the optical sensor. It was done.

[0015]

According to the present invention, misregistration of the same electronic component is detected by an imaging means (camera) which requires a long time but has high accuracy, and can be detected in a short time. Since the detection is performed by an optical sensor such as a laser sensor or the like which may vary in accuracy or change with time, the detection result by the optical sensor is corrected based on the high-precision detection result by the imaging unit. To switch to a different type or a different lot
For example, after the above correction work is first performed and the detection result by the optical sensor is corrected to increase the detection accuracy, only the position detection by the optical sensor is performed, so that the positional deviation of the component can always be accurately detected. In addition, the detection can be performed quickly. Further, by executing the above-mentioned correction work periodically, for example, even if the detection accuracy changes over time, it is possible to maintain the accuracy over a long period of time.

The correction of the detection result is performed by comparing the detection result by the optical sensor with the detection result by the imaging means, calculating the correction of the detection result by the optical sensor based on the detection result by the imaging means, and calculating the calculation result. This can be performed by correcting the detection result by the optical sensor thereafter.

[0017]

Embodiments of the present invention will be described below in detail with reference to the drawings.

FIG. 1 is a perspective view showing an outline of a main part of an electronic component mounting apparatus according to an embodiment of the present invention and its operation.

The mounting apparatus according to the present embodiment has the same mounting head as that shown in FIG.
The same laser sensor 6 as that shown in FIG.
At the predetermined position, the same image recognition camera 8 as that shown in FIG. 6 is installed, and the same transporting and mounting operation as shown in FIG. 5 is enabled.

As the laser sensor 6, for example, a laser beam emitted from a laser diode proposed by the present applicant in Japanese Patent Application Laid-Open No. Hei 6-55417 is converted into a parallel light by a collimator lens, and then all the light is perpendicularly reflected by a mirror. It is possible to use a device that irradiates the electronic component by reflecting it, detects laser light that is not blocked by the component, and detects a position shift and a tilt of the component. As the image recognition camera 8, for example, a CCD camera can be used.

In this embodiment, the following operation is performed at the time of the first component mounting according to the time chart shown on the left side of FIG. This will be described with reference to FIG. 3 as well. In FIG. 2, the mounting head 1 is connected to the component supply device 2 at the stage A1, which is the first stage of the first mounting component time chart.
, The suction nozzle 4 is moved down in the Z direction by the motor 8 in B1 to suck and hold the electronic component 3 by vacuum suction.
At A2, the mounting head 1 is moved to the camera 8 while holding the component 3 by the suction nozzle 4, and the recognition operation is performed at A3 to detect a shift in the XY directions, and similarly at C1, a shift in the rotational direction θ is detected. Thereafter, the mounting head 1 is moved in the direction of the mounting board at A4, and the same component 3 held by the laser sensor as described with reference to FIG. In the same manner as described above, the shift in the XY directions and the angular direction θ is detected. Next, the difference between the camera 8 and the laser sensor 6 is calculated for the shift correction.
In addition to correcting the detection accuracy of the laser sensor 6, the position of the mounting head 1 in the X and Y directions is corrected at the stage of A5 based on the correct displacement amount, and the position of the mounting head 1 is corrected in the θ direction at C3. It is mounted at the specified position on the board.

As described above, in the first component mounting operation,
By correcting the detection accuracy by the laser sensor 6 based on the detection result by the camera 8, the second and subsequent mounting operations can be omitted from the time-consuming detection operation by the camera 8, as shown in the right part of FIG. Is possible,
After the mounting head 1 is moved to the position of the supply device 2 in the preceding stage A1, the suction operation in B1 and the movement of the mounting head 1 in A4, and the detection by the laser sensor in C2 performed during the movement, Position correction at A5 and C3 based on the detection result, and B
2 only requires the mounting operation.

Therefore, the second and subsequent component mounting can be performed efficiently in a short time with high accuracy.

The above-described second and subsequent operations are performed until parts of the same kind or the same lot supplied from the parts supply device 2 are exhausted, or until the work of mounting a fixed number of parts is completed. At the time of mounting a certain number of components, the displacement by the image recognition camera 8 is detected again, and the detection accuracy of the laser sensor 6 is corrected using the detected data.

Next, an example of a correction calculation method will be specifically described. That is, the correction amount of the electronic component with respect to the reference point obtained by the camera (imaging means) 8 is stored in a memory of an arithmetic processing unit (not shown) including a CPU, a memory, and the like as ΔX1, ΔY1, and Δθ1.

Also, the same electronic component is measured by an optical sensor,
Similarly, the detected corrections are stored in the memory as ΔX2, ΔY2, and Δθ2.

Next, ΔX, ΔY,
In order to obtain Δθ, the correction values stored in the memory are sequentially read, and the values of ΔX, ΔY, and Δθ are calculated by the following equations (1) to (3), and stored in the memory.

ΔX = ΔX 1 −ΔX 2 (1) ΔY = ΔY 1 −ΔY 2 (2) Δθ = Δθ 1 −Δθ 2 (3)

Thereafter, until the optical sensor is re-corrected by the next image pickup means, the corrected mounting coordinate targets are set to X, Y, and θ using these correction values, and the specified mounting coordinates are set. Assuming that the targets are X1, Y1, and θ1, the following (4) to
By calculating equation (6), X, Y, and θ are obtained,
The electronic component is mounted on the corrected mounting coordinates.

X = X1 + ΔX (4) Y = Y1 + ΔY (5) θ = θ1 + Δθ (6)

According to the present embodiment described above, the time required to correct the positional deviation when mounting the electronic component on the mounting board is 1 / one of the time required to detect and correct by the image recognition camera 8. As a result, the mounting efficiency of components can be greatly improved.

Also, since the detection accuracy can be made almost the same as when an image recognition camera is used, the mounting accuracy can be greatly improved as compared with the case where the detection and correction are performed by the laser sensor 6 alone. Was completed.

Although the present invention has been specifically described above, the present invention is not limited to the above-described embodiment, and can be variously modified without departing from the gist thereof.

For example, the optical sensor is not limited to the laser sensor described above, and is not particularly limited as long as it detects a displacement based on the light blocking length of the component.

Further, the imaging means is not limited to the image recognition camera such as the CCD camera, and is not particularly limited as long as its position can be detected by inputting an image of an electronic component.

[0036]

As described above, according to the present invention,
When mounting the electronic component on the mounting board, the position of the electronic component can be detected quickly and with high accuracy, so that the efficiency of the mounting operation can be greatly improved.

[Brief description of the drawings]

FIG. 1 is a perspective view schematically showing a main part of an electronic component mounting apparatus according to an embodiment of the present invention.

FIG. 2 is a time chart for explaining the operation of the embodiment.

FIG. 3 is a perspective view schematically showing a mounting head and a component supply device.

FIG. 4 is a perspective view showing the principle of detecting the position of a component using a laser sensor.

FIG. 5 is a perspective view showing a state in which electronic components are mounted on a mounting board.

FIG. 6 is a perspective view showing a method of detecting the position of a part by the image recognition camera.

[Explanation of symbols]

 REFERENCE SIGNS LIST 1 mounting head 2 component supply device 3 electronic component 4 suction nozzle 5 motor 6 laser sensor 7 mounting board 8 image recognition camera

──────────────────────────────────────────────────続 き Continuation of the front page (56) References JP-A-5-48295 (JP, A) JP-A-1-236700 (JP, A) JP-A-4-322924 (JP, A) 15299 (JP, U) (58) Fields investigated (Int. Cl. ⁷ , DB name) H05K 13/04 H05K 13/08

Claims (3)

(57) [Claims] An electronic component is transported onto a mounting substrate while holding the supplied electronic component by a holding means, and a positional shift of the held electronic component is detected by an optical sensor, and position correction is performed based on the detection result. In the electronic component mounting method for mounting the electronic component at a specified position on a substrate, the displacement of the electronic component is detected by the optical sensor and the imaging unit, and the detection result by the optical sensor is determined based on the detection result by the imaging unit. An electronic component mounting method characterized by correcting. 2. A method according to claim 1, further comprising: transporting the supplied electronic component onto a mounting substrate while holding the electronic component by a holding unit; detecting a positional shift of the held electronic component by an optical sensor; and performing position correction based on the detection result. In the electronic component mounting method for mounting the electronic component at a designated position on a substrate, the displacement of the electronic component is detected by the optical sensor and the imaging unit, and the detection result by the optical sensor and the detection result by the imaging unit are compared. An electronic component mounting method, comprising: calculating a correction amount of a detection result by an optical sensor based on a detection result by an imaging unit; and correcting a subsequent detection result by an optical sensor using the calculation result. 3. A means for supplying an electronic component, a holding means for holding the supplied electronic component, a transfer means for transferring the held electronic component onto a mounting board and mounting it at a designated position, and a holding means for holding the electronic component. An electronic component mounting apparatus comprising: an optical sensor that detects a displacement of the electronic component in a state where the electronic component is held by the holding unit; and an imaging unit that detects a displacement of the electronic component held by the holding unit. An electronic component mounting apparatus, comprising: an arithmetic unit for correcting the detection accuracy of the optical sensor based on the detection result of the positional deviation of the electronic component and the detection result of the positional deviation of the same electronic component by the optical sensor.