JP6531278B2 - Electronic component mounting device - Google Patents

Description

  The present invention relates to an electronic component mounting apparatus for mounting an electronic component on a substrate.

  In the electronic component mounting apparatus which mounts an electronic component on a board | substrate, the component mounting operation | movement which takes out an electronic component from a component supply part by a mounting head, carries out transfer mounting on a board | substrate is performed repeatedly. In this component mounting operation, an error occurs in component mounting accuracy due to deformation of a component mounting mechanism such as a mounting head, a suction nozzle, or a moving beam for moving the mounting head due to thermal fluctuation over time. As a measure to correct the error of the mounting accuracy due to the temporal deformation of such a component mounting mechanism, the mounting head in a state of holding the electronic component taken out from the component supply unit is imaged by a component recognition camera fixedly arranged It is known to recognize and correct the temporally deformed state (see Patent Document 1). In the prior art shown in this patent document example, a recognition mark disposed so that the height position falls within the depth of focus of the component recognition camera is imaged at the same time as the electronic component held by the mounting head. The movement error of the mounting head and the error due to time-dependent deformation are corrected for each component mounting operation based on the positional shift of the recognition mark detected by performing the recognition process on the acquired image.

JP, 2006-024957, A

  However, the practical application of the above-mentioned prior art has the following problems due to the arrangement of recognition marks in the mounting head. That is, in order to improve component mounting efficiency, a multiple nozzle type mounting head having a plurality of nozzle rows in which a plurality of suction nozzles are mounted in a row has been widely adopted in recent years. In the case of such a multiple nozzle type mounting head, if the recognition marks are provided corresponding to all the suction nozzles, the size of the mounting head is significantly increased, which is contrary to the demand for downsizing of the apparatus. Furthermore, since the recognition mark needs to be placed within the depth of focus of the recognition camera, the recognition mark may interfere with the efficient operation of the mounting head. As described above, in the electronic component mounting apparatus according to the related art, the error in the mounting accuracy caused by the temporal deformation of the component mounting mechanism etc. is properly suppressed without causing the increase in the size of the mounting head or the inconvenience in the component mounting operation. There was a problem that it was difficult to do.

  Therefore, an object of the present invention is to provide an electronic component mounting apparatus capable of appropriately suppressing an error of mounting accuracy caused by temporal deformation of a component mounting mechanism or the like.

The electronic component mounting apparatus according to the present invention is an electronic component mounting apparatus for mounting an electronic component on a substrate, the substrate carrying mechanism for carrying and positioning the substrate in the substrate carrying direction, and a plurality of suctions for sucking the electronic component. A mounting head having a nozzle and mounting the electronic component sucked by the suction nozzle on the substrate; a component recognition camera for imaging the electronic component sucked by the suction nozzle at the mounting head; and the mounting head And a plurality of self-light emitting elements which can be imaged by the component recognition camera and capable of emitting straight- moving light, and each of the plurality of suction nozzles has a plurality of suction nozzles in the substrate transport direction. The first suction nozzle row and the second suction nozzle row, which are arranged in a parallel direction and are spaced apart from each other by a predetermined distance in a direction orthogonal to the substrate transfer direction Is configured, the plurality of self-luminous element is provided between the second suction nozzle column as the first suction nozzle rows. including.

  According to the present invention, it is possible to appropriately suppress an error in mounting accuracy caused by temporal deformation of a component mounting mechanism or the like.

Top view of electronic parts mounting apparatus according to one embodiment of the present invention Partial cross-sectional view of an electronic component mounting apparatus according to an embodiment of the present invention Structure explanatory drawing of the mounting head with which the electronic component mounting apparatus of one embodiment of this invention was mounted | worn Explanatory drawing of the components imaging operation by the mounting head in the electronic component mounting apparatus of one embodiment of this invention An explanatory view of component position recognition by a component recognition camera in an electronic component mounting apparatus according to an embodiment of the present invention Block diagram showing a configuration of a control system of an electronic component mounting apparatus according to an embodiment of the present invention Explanatory drawing which shows the relationship between the imaging visual field of the component recognition camera in the electronic component mounting apparatus of one embodiment of this invention, and arrangement | positioning of the self-light emitting element in a mounting head

Next, embodiments of the present invention will be described with reference to the drawings.
Next, embodiments of the present invention will be described with reference to the drawings. First, the configuration of the electronic component mounting apparatus 1 for mounting an electronic component on a substrate will be described with reference to FIGS. 1 and 2. The electronic component mounting apparatus 1 has a function of mounting an electronic component on a substrate, and FIG. 2 partially shows an AA cross section in FIG.

  In FIG. 1, a substrate transfer mechanism 2 is disposed at the center of the base 1a in the X direction (substrate transfer direction). The substrate transport mechanism 2 transports the substrate 3 carried in from the upstream side, and positions and holds the substrate 3 on the mounting stage set for performing the component mounting operation. Component supply units 4 are disposed on both sides of the substrate transfer mechanism 2, and a plurality of tape feeders 5 are mounted in parallel to each of the component supply units 4. The tape feeder 5 feeds electronic components to a component suction position by the mounting head 9 of the component mounting mechanism 10 described below by pitch-feeding a carrier tape containing the electronic components in the tape feeding direction.

  A Y-axis moving beam 7 provided with a linear drive mechanism is disposed in the Y direction orthogonal to the X direction at one end of the upper surface of the base 1 a in the X direction. Similarly, two X-axis moving beams 8 having a linear drive mechanism are movably coupled in the Y direction. The mounting heads 9 are attached to the two X-axis moving beams 8 so as to be movable in the X direction. The mounting head 9 is a multiple head having a plurality of nozzle units, and at the lower end of each nozzle unit, an adsorption component 19 capable of adsorbing and holding an electronic component and moving it up and down individually (FIGS. 2 and 3) See) is attached.

  By driving the Y-axis moving beam 7 and the X-axis moving beam 8, the mounting head 9 moves in the X direction and the Y direction. As a result, the two mounting heads 9 pick up electronic components from the component suction positions of the tape feeders 5 of the corresponding component supply units 4 by suction and hold the electronic components by the suction nozzles 19 and take them out. Transfer to the mounting point. That is, the mounting head 9 has a plurality of suction nozzles 19 for suctioning electronic components, and mounts the electronic components suctioned by the suction nozzles 19 on the substrate 3. The Y-axis moving beam 7, the X-axis moving beam 8 and the mounting head 9 move the mounting head 9 holding the electronic component to execute the component mounting operation for mounting the electronic component on the substrate 3 Configure.

  A component recognition camera 6 is disposed between the component supply unit 4 and the substrate transfer mechanism 2. The component recognition camera 6 picks up an electronic component in a state of being adsorbed by the suction nozzle 19 in the mounting head 9 by positioning the mounting head 9 taken out of the component supply unit 4 above the component recognition camera 6. A three-dimensional image of the electronic component is acquired. The mounting head 9 is mounted with a substrate recognition camera 11 positioned on the lower surface side of the X-axis moving beam 8 and moving integrally with the mounting head 9. As the mounting head 9 moves, the substrate recognition camera 11 moves above the substrate 3 positioned by the substrate transport mechanism 2. Then, the position recognition mark (not shown) of the substrate 3 is imaged.

  As shown in FIG. 2, the carriage 12 in a state in which the plurality of tape feeders 5 are attached to the feeder base 12 a in advance is set in the component supply unit 4. The carriage 12 mounted on the component supply unit 4 holds a supply reel 13 for storing the carrier tape 14 containing the electronic components in a wound state. The carrier tape 14 drawn out from the supply reel 13 is pitch-fed by the tape feeder 5 to a component suction position by the suction nozzle 19.

  Next, the configuration of the mounting head 9 will be described with reference to FIG. As shown in FIG. 3A (front view), the mounting head 9 has a plurality of nozzle units 9a. Each nozzle unit 9a includes a nozzle shaft 16 extending downward from a mechanism 15 incorporating a shaft elevating mechanism and a θ rotation mechanism, and each nozzle shaft 16 is arranged in a predetermined array on the horizontal array base 17. Is held by. A nozzle holding portion 18 is connected to a lower end portion of the nozzle shaft portion 16, and a suction nozzle 19 is detachably attached to each nozzle holding portion 18.

  Further, on the lower surface of the array base portion 17, a plurality of laser irradiation units 20 for irradiating the laser light downward are disposed in the middle of the respective suction nozzles 19 at the planar position. The laser irradiation unit 20 is a self light emitting element having a function of irradiating downward a light beam of laser light having straightness, and in the present embodiment, the irradiation light from the laser irradiation unit 20 can be imaged by the component recognition camera 6 It is provided. Note that the self light emitting element may be a device other than the laser irradiation unit 20 as long as it has a rectilinearity and can emit light of a property that can be imaged by the component recognition camera 6.

  Here, the arrangement of the suction nozzle 19 and the laser irradiation unit 20 in the mounting head 9 will be described with reference to FIG. FIG. 2 (b) shows the lower surface of the array base 17 in the mounting head 9. The plurality of suction nozzles 19 included in the mounting head 9 is a first suction nozzle row NL1 in which a plurality (four in this case) of suction nozzles 19 are arranged in series in a direction (X direction) parallel to the substrate transport direction. And a second suction nozzle row NL2. The first suction nozzle row NL1 and the second suction nozzle row NL2 are arranged at a predetermined interval D in the direction (Y direction) orthogonal to the substrate transfer direction. Each of the plurality of laser irradiation units 20 is provided at a position between each of the two suction nozzles 19 arranged to face each other in the Y direction orthogonal to the substrate transfer direction.

  FIG. 4 shows a state of imaging by the component recognition camera 6 at the time of performing position recognition of the electronic component P by the mounting head 9 having a configuration including such a laser irradiation unit 20. In FIG. 4, the component recognition camera 6 includes a lighting unit 21 and an imaging unit 22. The illumination unit 21 includes a plurality of light emitting units 21a, and the light emitting units 21a irradiate illumination light to the imaging target from diagonally below. The imaging unit 22 has a function of acquiring an image of an imaging target located in a focal range F above the component recognition camera 6.

  In position recognition of the electronic component P held by the mounting head 9, the mounting head 9 is moved so that the electronic component P sucked by the suction nozzle 19 is positioned at a predetermined imaging position above the component recognition camera 6. . At this time, the imaging height is set such that the electronic component P attracted by the suction nozzle 19 is positioned within the focus range F. And imaging of the electronic component P by the component recognition camera 6 is performed in the state which operated the laser irradiation part 20 and irradiated the beam line BL below. At this time, since the focal point at the time of image acquisition by the imaging unit 22 is set within the focal range F, the position of the beam line BL at the same focal height level FL as the electronic component P to be recognized is It can be acquired. In component position recognition in the electronic component mounting apparatus shown in the present embodiment, position recognition of the electronic component P is performed with reference to the position of the beam line BL acquired simultaneously with imaging of the electronic component P.

  Next, with reference to FIG. 5, a process performed upon position recognition of the electronic component P by the component recognition camera 6 will be described. First, a calibration process performed prior to position recognition of the electronic component P will be described. As described above, in the electronic component mounting apparatus according to the present embodiment, since the position recognition of the electronic component P is performed based on the position of the beam line BL acquired simultaneously with the imaging of the electronic component P, the component recognition camera It is important whether the position of the beam line BL acquired by 6 is appropriate as a reference.

  The straightness is always guaranteed for the beam line BL emitted from the laser irradiation unit 20, but depending on the attachment state of the laser irradiation unit 20, as shown in FIG. There is a case in which the vertical reference line AL does not necessarily coincide with the lower reference line AL and extends slightly to the vertical reference line AL. Therefore, at the focal height level FL for imaging the electronic component P, the beam line BL is displaced by the deviation d with respect to the vertical reference line AL.

  That is, as shown in FIG. 5B, in the imaging view field 6a for acquiring the recognition image by the part recognition camera 6, the optical origin C indicating the origin of the optical coordinate system coincides with the position of the beam line BL on the control data Position of the beam line BL detected in the imaging field of view 6a does not coincide with the optical origin C, and the position is deviated by the deviation components dx and dy corresponding to the deviation d described above Is detected.

  Therefore, in order to correctly recognize the position of the electronic component P on the basis of the position of the beam line BL irradiated from the laser irradiation unit 20 in the imaging field of view 6a, the position of the beam line BL as the reference is accurately grasped Is required. For this reason, deviation components dx and dy detected for each of the laser irradiation units 20 in advance are acquired and stored in the respective laser irradiation units 20 as unique calibration data.

  When actually performing position recognition of the electronic component P, as shown in FIG. 5C, the electronic component P (1), which is the recognition target acquired in the optical coordinate system having the optical origin C as the origin, A correction process is performed to shift the recognition position coordinates (x1, y1) and (x2, y2) of 2) by the deviation components dx and dy shown in FIG. 5B. Thus, the correct position of the electronic component P (1), (2) with respect to the optical origin C can be detected while using the position of the beam line BL detected on the imaging field of view 6a as a reference. Here, only the positions in the X direction and the Y direction of the electronic components P (1) and (2) are to be recognized, but the positions in the θ direction of the respective electronic components P may also be recognized.

  Next, the configuration of the control system will be described with reference to FIG. In FIG. 6, the control unit 30 is an arithmetic device having a CPU function, and controls the following units based on various programs and data stored in the storage unit 31. The data stored in the storage unit 31 includes mounting data 31 a and component recognition calibration data 31 b. The mounting data 31 a is data necessary to execute the component mounting operation, such as component data and mounting position coordinates of the electronic component to be mounted. The component recognition calibration data 31 b is calibration data in which the inherent deviation of the imaging visual field 6 a of the beam line BL irradiated from the laser irradiation unit 20 in the mounting head 9 with respect to the optical origin C is measured in advance and stored for calibration. . That is, the deviation components dx and dy shown in FIG. 5B are stored as calibration data for each of the laser irradiation units 20.

  The mechanism driving unit 32 drives the substrate transport mechanism 2 and the component mounting mechanism 10 by being controlled by the control unit 30 based on the data stored in the storage unit 31. Thereby, the component mounting operation for mounting the electronic component on the substrate 3 is performed. In component recognition in the component mounting operation, the laser irradiation unit 20 provided in the mounting head 9 is operated to irradiate the beam line BL, and is used as a reference position in position recognition by the component recognition camera 6.

  The recognition processing unit 33 recognizes the position of the recognition mark on the substrate 3 and recognizes the position of the electronic component P held by the mounting head 9 by performing recognition processing on the imaging result by the substrate recognition camera 11 and the component recognition camera 6. In the recognition process of the imaging result by the part recognition camera 6, the part recognition calibration data 31b stored in the storage unit 31 is referred to, and the inherent deviation of the position of each beam line BL in the recognition image is corrected.

  Next, with reference to FIG. 7, the relationship between the imaging visual field 6 a by the component recognition camera 6 and the arrangement of the laser irradiation unit 20 in the mounting head 9 will be described. FIG. 7 (a) shows the relationship with the imaging view field 6a in the arrangement of the laser irradiation unit 20 shown in FIG. 3 (c), and here, to the plurality of suction nozzles 19, the laser irradiation unit 20 and the imaging view field 6a. Numbering is done to identify each individual. In the example shown here, a plurality of (eight) suction nozzles 19 (1) to (8) constituting the first suction nozzle row NL1 and the second suction nozzle row NL2 are divided into four imaging visual fields 6a (1). The example which is recognized by dividing into (4) is shown.

  That is, the mounting head 9 is positioned with respect to the component recognition camera 6 so that the suction nozzles 19 (1), (2) and the laser irradiation unit 20 (1) fall within the imaging field of view 6a (1). Perform the first imaging. Next, by moving the mounting head 9 horizontally in the X direction, the component recognition camera so that the suction nozzles 19 (3), (4) and the laser irradiation unit 20 (2) fit within the imaging field of view 6 a (2). Position the mounting head 9 relative to 6 and perform the second imaging, and thereafter the suction nozzles 19 (5) and (6) and the laser irradiation unit 20 (3) The image is taken, and the suction nozzles 19 (7), (8) and the laser irradiation unit 20 (4) are imaged by the imaging field of view 6 a (4).

  That is, in the mounting head 9 of the electronic component mounting apparatus 1 shown in the present embodiment, each of the plurality of laser emitting units 20 which are self light emitting elements are provided at different positions, and the suction nozzle 19 and the imaging visual field 6a In the relationship, they are arranged to meet the following conditions. That is, one of the plurality of laser irradiation units 20 is disposed so as to fall within the range of the imaging field of view 6 a at the time of imaging one portion of the plurality of suction nozzles 19 by the component recognition camera 6. For example, when the laser irradiation unit 20 (1) corresponds to one of the plurality of laser irradiation units 20, the suction nozzles 19 (1) and (2) become one portion of the plurality of suction nozzles 19, These are designed to fall within the same imaging field of view 6a (1).

  The other one of the plurality of laser irradiation units 20 is disposed so as to fall within the range of the imaging field of view 6 a when the other part of the plurality of suction nozzles 19 is imaged by the component recognition camera 6. For example, in the case where the laser irradiation unit 20 (2) corresponds to another one of the plurality of laser irradiation units 20, the suction nozzles 19 (3) and (4) are other portions of the suction nozzles 19 And they fall within the same field of view 6a (2).

  In the above configuration, the number and arrangement of the laser irradiation units 20 depend on the size of the imaging field 6a of the component recognition camera 6 used even if the mounting head 9 having the same number of suction nozzles 19 is targeted. , Will be different. For example, as in the mounting head 9A shown in FIG. 7B, it is possible that the imaging visual field 6a * of the component recognition camera 6 used is large and the four suction nozzles 19 can be contained within the imaging visual field 6a *. For example, it is sufficient to arrange only two laser irradiation units 20 (1) and (2).

  That is, in this case, the laser irradiation unit 20 (1) which is one of the plurality of laser irradiation units 20 is a suction nozzle 19 (one of the plurality of suction nozzles 19 by the component recognition camera 6). ), (2), (3), and (4) are arranged so as to fall within the imaging field of view 6a * (1) at the time of imaging. The laser irradiation unit 20 (2), which is another one of the plurality of laser irradiation units 20, has a suction nozzle 19 (5), (6) which is another part of the suction nozzles 19 by the component recognition camera 6. ), (7), and (8) are arranged so as to fall within the imaging field of view 6a * (2) at the time of imaging. The arrangement of the laser irradiation unit 20 shown in FIG. 7 is an example, and various variations are possible according to the number of suction nozzles 19 and the size of the imaging field 6a.

  As described above, the electronic component mounting apparatus 1 shown in the present embodiment has the first suction nozzle row NL1 and the second suction nozzle row NL2 in which a plurality of suction nozzles 19 are arranged in a direction parallel to the substrate transport direction. In the configuration provided with the mounting head 9 having a plurality of laser irradiation units 20 which are a plurality of self-light emitting elements between the first suction nozzle row NL1 and the second suction nozzle row NL2, When imaging the electronic component P by the component recognition camera 6 for component recognition, the beam line BL emitted downward from the laser irradiation unit 20 is imaged by the component recognition camera 6 and used as a reference for position recognition It is

  Thus, in the multiple nozzle type mounting head 9 having a plurality of suction nozzle rows in which a plurality of suction nozzles 19 are mounted in a row, a recognition mark as a reference for position recognition is provided corresponding to all the suction nozzles. Rather, it is possible to set the position recognition reference in a compact configuration. As a result, it is possible to properly suppress the error in the mounting accuracy caused by the temporal deformation of the component mounting mechanism or the like without increasing the size of the mounting head or causing a disadvantage in the component mounting operation.

  The electronic component mounting apparatus of the present invention has an effect that the error of the mounting accuracy can be appropriately suppressed due to the time-dependent deformation of the component mounting mechanism or the like, and the electronic component is adsorbed by the mounting head having the suction nozzle. It is useful in the component mounting field mounted on a board | substrate.

DESCRIPTION OF SYMBOLS 1 electronic component mounting apparatus 2 board | substrate conveyance mechanism 3 board | substrate 6 component recognition camera 6a imaging view field 9 mounting head 19 suction nozzle 20 laser irradiation part P electronic component BL beam line

Claims (3)

An electronic component mounting apparatus for mounting an electronic component on a substrate, comprising:
A substrate transfer mechanism for transferring and positioning the substrate in the substrate transfer direction;
A mounting head having a plurality of suction nozzles for suctioning the electronic components and for mounting the electronic components suctioned by the suction nozzles on the substrate;
A component recognition camera that picks up an image of the electronic component sucked by the suction nozzle in the mounting head;
And a plurality of self-light emitting elements provided on the mounting head so as to be capable of imaging by the component recognition camera and capable of emitting light having straightness .
Each of the plurality of suction nozzles is formed by arranging a plurality of suction nozzles in a direction parallel to the substrate transport direction, and the first plurality of suction nozzles are arranged at predetermined intervals in a direction orthogonal to the substrate transport direction. It consists of a suction nozzle row and a second suction nozzle row,
The plurality of self light emitting elements are provided between the first suction nozzle row and the second suction nozzle row. Each of the plurality of self light emitting elements is provided at a different position,
One of the plurality of self-light emitting elements is disposed so as to fall within an imaging field of view when imaging one portion of the plurality of suction nozzles by the component recognition camera,
The other one of the plurality of self-light emitting elements is disposed so as to fall within an imaging field of view when imaging another portion of the plurality of suction nozzles by the component recognition camera. Electronic component mounting device. The electronic component mounting apparatus according to claim 1, wherein each of the plurality of self-light emitting elements is provided between each of the two suction nozzles arranged to face each other in a direction orthogonal to the substrate transfer direction.

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