JPH06129815A - Detecting method for inter-heads offset and nozzle eccentricity offset - Google Patents

Abstract

PURPOSE:To enable the input of an inter-heads offset and a nozzle eccentricity offset with neither jigs nor instruments, as well as with conformity to the condition of a machine irrespective of any secular change. CONSTITUTION:A laser beam 148 is radiated on tips of nozzles 144a and 144b, followed by the calculation of medians of the reflected light beam peaks for respective nozzles. The inner-heads offset is detected from the calculated central positions for respective nozzles. In addition, a laser beam is radiated on the tip of a nozzle, so that the median of the reflected light peak, when the nozzle being rotated, is detected from the calculated discrepancy between the 180 deg. rotational positions of the nozzle center position for overy 90 deg. turn of the nozzle.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for detecting a head-to-head offset and a nozzle eccentricity offset for detecting a head-to-head offset and a nozzle eccentricity offset for a chip mounter using a laser beam. The present invention relates to a method for detecting a head-to-head offset and a nozzle eccentric offset that can detect the head-to-head offset and the nozzle eccentric offset according to the state of the machine.

[0002]

2. Description of the Related Art As a component mounting apparatus (so-called chip mounter) for mounting a predetermined electronic component on a circuit board, a component supplier 12 such as a matrix tray holding an electronic component 10 as shown in FIG. A component supplier supporting device (not shown) on which the component supplier 12 is placed and replaced when necessary, and the electronic component 10 is sucked at a predetermined suction position on the component supplier supporting device. A device having a suction nozzle 16 mounted on a predetermined position on the circuit board 14 is known (for example, Japanese Patent Application No. 1-34849).
And Japanese Patent Application No. 3-97793).

The suction nozzle 16 is attached to a head 18 movable in the XY directions, and the head itself stores a component mounting position information on the circuit board 14 and a component suction position information on the component supply body 12. Driven based on information from. In addition, the circuit board 14 is the substrate transfer device 2
0 is mounted on a guide provided above.

In the figure, 22 is an XY robot for moving the head 18 in the XY directions, and 24 is a non-contact centering unit (TLC) which is an image device for accurately recognizing and correcting the position of a component in an image. ), 26 is the T
It is an image processing device of LC24.

In the case of such a conventional chip mounter,
At the time of factory shipment, the nozzles of jigs are attached to the left and right heads of the chip mounter, these heads are moved, and the nozzles are dropped into the holes with good accuracy and inserted,
The offset between the left and right heads was input from the coordinates at that time.

Further, the eccentricity offset of the nozzle is also measured by attaching the jig nozzle to the chip mounter head and measuring the eccentricity of the nozzle when the jig nozzle rotates by a peak tester or the like.

[0007]

Since the chip mounter is mechanically constructed, the offset between the left and right heads and the eccentric offset of the nozzles may change over time due to displacement due to vibration, rattling and wear. However, conventionally,
The offset value cannot be entered without a special jig or measuring instrument, so the customer cannot deal with it, and in particular, there is a problem that it is completely ignored for aging. Further, when the head is replaced due to a failure, it is necessary to bring a jig or a measuring instrument to the delivery destination, measure these offset values again, and input them.

In view of the above situation, the present invention has been made to solve the above-mentioned problems of the conventional example, and does not require a jig or a measuring instrument, and also changes over time, temperature and humidity. It is an object of the present invention to provide a method for detecting a head-to-head offset and a nozzle eccentricity offset that can detect the head-to-head offset and the nozzle eccentricity offset according to the state of the machine even with respect to the change due to

[0009]

SUMMARY OF THE INVENTION According to the present invention, when detecting an offset between heads on which nozzles are mounted, the tip surface of the nozzle is irradiated with laser light, and the midpoint of the peak of the reflected light is set to each nozzle. The above problem is solved by detecting the offset between the heads on which the nozzles are mounted, from the calculated center position of each nozzle.

According to the present invention, when detecting the eccentricity offset when the nozzle is rotated, the nozzle is irradiated with laser light on the tip end surface of the nozzle, and when the nozzle is rotated, the center point of the reflected light is 90 °. The above problem is solved by calculating each time the nozzle rotates, and detecting the eccentric offset when the nozzle rotates from the difference between the 180 ° rotational positions of the calculated nozzle center position.

[0011]

In the present invention, the tip surface of the nozzle is irradiated with laser light, the midpoint of the peak of the reflected light is calculated for each nozzle, and each nozzle is mounted from the calculated center position of each nozzle. The offset between the heads is detected.

Similarly, the midpoint of the peak of reflected light when the nozzle tip is irradiated with laser light and the nozzle is rotated is calculated every time the nozzle is rotated by 90 °, and the calculated nozzle center position is calculated. The eccentric offset at the time of nozzle rotation is detected from the difference between the 180 ° rotation positions.

Therefore, it is possible to detect the head-to-head offset and the nozzle eccentric offset with respect to aging and changes due to temperature and humidity without using a special jig or a measuring instrument such as a peak tester.

[0014]

Embodiments of the present invention will now be described in detail with reference to the drawings.

FIG. 2 is a block diagram for explaining the present embodiment. In the figure, 110 is a head on which nozzles, which will be described later, are mounted, and one rotating θ motor 112 and two rotating θ motors 112. Z motors 114a and 114b are provided.
The head 110 can move in the X direction and the Y direction according to the X axis 116a and the Y axis 116b, and scans the fixed sensor head 118 in the X direction and the Y direction.

On the other hand, the control system for driving the servomotors such as the Z motors 114a and 114b is the CPU 124 → pulse generators 126 and 136 → servo driver 12
8,138 → Z motor 114a, 1 which is a servo motor
14b and X-axis and Y-axis motors 120a, 120b ← → encoders 122a, 122b. A coordinate, light amount, or height data measurement system is composed of a sensor head 118, a laser sensor controller 130, an input / output port (I / O) 132, a CPU 124, and a memory 134.

FIG. 3 is a perspective view showing the construction of the head portion A including the head 110 of FIG. 2 in detail.
The same symbols as those in FIG. 2 are used with the same meanings, and duplicate explanations are omitted here. Further, 140a and 140b are rack and pinion, 142 is a belt for rotating the nozzle, 144
Reference numerals a and 144b denote nozzles that can move in the directions of the thin arrows, that is, up and down directions on the paper surface of FIG. 3, 146 denotes a lens, and 148 denotes laser light.

FIGS. 4A and 4B are enlarged explanatory views for explaining the nozzles 144a and 144b in detail. FIG. 4A is a perspective view showing the structure and FIG. 4B is a bottom view. Further, FIG. 5 is a further enlarged view for explaining the tip end portions of the nozzles 144a, 144b in detail, (A) showing a configuration perspective view, and (B) showing a bottom view.

4 and 5, reference numeral 150 is a nozzle body, 152 is a collar portion, 154 is a step portion, 156 is a tip portion, 1
Reference numeral 58 denotes a hollow provided so as to penetrate the nozzle body 150, and 160 denotes a tip bottom portion. In addition, the nozzle (14
4a, 144b) has a tip portion 156, as shown in FIG.
It has a donut-shaped cross section.

FIG. 6 is a diagram showing each data of coordinate, light quantity, and height created by scanning the head 110 on the laser sensor using this embodiment, where X is the X coordinate of the nozzle. X-axis for indicating, Y is Y-axis for indicating Y coordinate of the nozzle, M, M ′ are centers of peaks in X direction, N, N ′
Is the center of the Y-direction peak, C is the peak M in the X-direction,
The midpoint of M'and D indicate the midpoints of the peaks N and N'in the Y direction, respectively. In addition, both m and n have shown the length.

The operation of this embodiment will be described in detail below with reference to FIGS.

First, the Z motors 114a and 114b are driven to lower the Z axis (not shown) to the position of the laser spot. Next, the X-axis motor 120a and the Y-axis motor 12
0b is driven to move the X axis 116a and the Y axis 116b, and the tip of the nozzle (144a, 144b in FIG. 3) is passed in the X direction on the laser spot.

Further, the coordinate head, the light quantity, and the height data are converted from the sensor head 118 to the laser sensor controller 1.
30 → input / output port (I / O) 132 → CPU124 →
Data is sampled by measuring with the measuring system of the memory 134.

Similarly, the X-axis motor 120a and the Y-axis motor 120b are driven to drive the X-axis 116a and the Y-axis 116b.
By moving the nozzle (144a, 1 in FIG. 3).
44b) passes the tip of the laser spot in the Y direction on the laser spot, and each data of the coordinate, the light amount, and the height is transferred to the sensor head 118 → laser sensor controller 130 → input / output port (I / O) 132 → CPU124 → memory. Thirteen
Data is sampled by measuring with the measurement system of No. 4.

In other words, the above operation is as follows.
That is, the head 110 moves according to the X axis 114a and the Y axis 114b, and operates so as to scan the laser intersection on the fixed sensor head 118 in the X and Y directions. In the meantime, from the sensor head 118, for example, CO
₂ Laser irradiation, nozzles 144a, 144 of FIG.
After being reflected at the tip of b, it is received by the lens 146, detected, and sent out from the sensor head 118 as a detection signal.

The detection signal is converted into height data and light amount data of the object to be measured by trigonometry utilizing the displacement of the center of gravity of the CCD (not shown), and then the input / output port (I / O) 132 of FIG. It is taken in by the CPU 124 via. Further, since the encoder feedback signals are input from the encoders 122a and 122b to the laser sensor controller 130, coordinate data described later is also input at the same time.

The data shown in FIG. 6 is obtained by the data sampling as described above, and the offsets between the heads on which the nozzles (144a and 144b in FIG. 3) are mounted are obtained as in the following (1) to (3).

In the data shown in FIG. 6, the center of the peak in the X direction is calculated. In this case, since there are two peaks in the X direction as shown by the solid line in FIG. 6, the centers M and M'of the respective peaks are obtained.

In the data of FIG. 6, the midpoint C of the peak in the X direction is calculated from the values of the centers M and M '.

In the data of FIG. 6, the center of the Y-direction peak is calculated. Also in this case, since there are two peaks in the Y direction as shown by the solid line in FIG. 6, the centers N and N ′ of the respective peaks are obtained.

The midpoint D of the peak in the Y direction is calculated from the values of the centers N and N'in the data of FIG.

Coordinates (C, D) consisting of the values of the midpoints C, D
Is the center coordinate of the nozzle. That is, the center coordinates (CR, DR) of the nozzle in the right head and the center coordinates (CL, DL) of the nozzle in the left head are obtained from the midpoint of the peak of the reflected light for each of the left and right nozzles.

The offset S between the heads is obtained as S = (CR, DR)-(CL, DL).

On the other hand, the nozzle eccentricity offset when the nozzle is rotated is similarly obtained as in the following (1) to (3).

The rotation angle of the nozzles (144a, 144b in FIG. 3) is set to 0 °, and the center coordinates (CR0, DR0) of the nozzle in the right head and the center coordinates (CL0, DL0) of the nozzle in the left head are set as described above. ).

The rotation angle of the nozzles (144a and 144b in FIG. 3) is 90 °, and the center coordinates (CR90, DR90) of the nozzles in the right head and the center coordinates (CL90, DL90) of the nozzles in the left head are set as described above. ).

The rotation angle of the nozzles (144a, 144b in FIG. 3) is 180 °, and the center coordinates (CR180, DR180) of the nozzle in the right head and the center coordinates (CL180, DL180) of the nozzle in the left head are set as described above.
).

The rotation angle of the nozzles (144a, 144b in FIG. 3) is 270 °, and the center coordinates of the nozzles (CR270, DR270) in the right head and the center coordinates (CL270, DL270) of the nozzles in the left head are set as described above.
).

The nozzle eccentricity offsets (CRs, DRs) at the time of nozzle rotation in the right head are calculated as (CR270-CR).
90, DR270-DR90), and the nozzle eccentric offset (CLs, DL) at the time of nozzle rotation in the left head
s) is calculated as (CL270-CL90, DL270-DL90).

Incidentally, the detection of the offset between the heads and the detection of the nozzle eccentricity offset when the nozzle is rotated as described above are usually automatically performed and processed by a key operation on the operation panel.

The present invention is not limited to the above-described embodiment, and various modifications can be made. For example, the nozzle drive mechanism may be a drive mechanism other than the mechanism disclosed in FIG.

[0042]

As described in detail above, according to the present invention, the operation / processing is automatically performed by the key operation on the operation panel, and the offset between the heads and the nozzle eccentric offset during the nozzle rotation are detected. Therefore, there is an advantage that a jig and a measuring instrument are unnecessary.

The offset between the left and right heads and the nozzle eccentric offset during nozzle rotation can be detected with one touch by operating the keys on the operation panel. Therefore, it is possible to input the head-to-head offset and the nozzle eccentricity offset according to the mechanical state at that time even on a daily basis against secular changes including mechanical changes due to temperature and humidity as well as simple mechanical wear. There is an advantage that the problem of aging like the example is solved.

By the way, in the above-mentioned conventional example, since the mounting coordinates of the components on the chip mounter are based on 0 ° of the right head, the offset is applied when mounting with the left head or when rotating and mounting. However, there was a problem that the accuracy of the chip mounter would be deteriorated if it was not accurate. However, in the present invention, the offset between the left and right heads and the nozzle eccentric offset when the nozzle is rotated can be accurately detected, so that there is also an advantage that the accuracy of the chip mounter can be maintained high.

Therefore, according to the present invention, a jig and a measuring instrument are not required, and a head offset and a nozzle eccentric offset which can detect a head offset and a nozzle eccentric offset according to the state of the machine with respect to secular change can be obtained. The detection method is realized.

[Brief description of drawings]

FIG. 1 is a perspective view showing an overall configuration of a chip mounter to which the present invention is applied.

FIG. 2 is a block diagram for explaining an embodiment of the present invention.

FIG. 3 is a configuration perspective view for explaining a head unit including a head in detail.

FIG. 4 is an enlarged explanatory view for explaining the nozzle in detail.

FIG. 5 is also an enlarged explanatory diagram for explaining the nozzle tip in detail.

FIG. 6 is a diagram showing coordinates, light amount, and height data created by scanning a head on a laser sensor using an embodiment of the present invention.

[Explanation of symbols]

 110 ... Head 112 ... θ motor 114a, 114b ... Z motor 118 ... Sensor head 124 ... CPU 126, 136 ... Pulse generator 128, 138 ... Servo driver 130 ... Laser sensor controller 132 ... Input / output port 134 ... Memory 142 ... Belt 144a, 144b ... Nozzle 146 ... Lens 148 ... Laser light 156 ... Tip part 158 ... Hollow

Claims (2)

[Claims] 1. When detecting an offset between heads in which nozzles are mounted, a laser beam is applied to the tip surface of the nozzle, and the midpoint of the peak of the reflected light is calculated for each nozzle. A method for detecting an offset between heads, wherein an offset between the heads on which the nozzles are mounted is detected from the center position of each nozzle. 2. When detecting an eccentric offset when the nozzle is rotated, the tip surface of the nozzle is irradiated with laser light, and the nozzle is rotated by 90 ° about the midpoint of the peak of the reflected light when the nozzle is rotated. A method for detecting an eccentric offset when the nozzle is rotated, the eccentric offset being detected when the nozzle is rotated from the difference between the 180 ° rotational positions of the calculated nozzle center position.