WO2021117319A1

WO2021117319A1 - Component-imaging device and component-mounting device

Info

Publication number: WO2021117319A1
Application number: PCT/JP2020/036798
Authority: WO
Inventors: 康一岡田; 森　秀雄; 鷹則松田
Original assignee: パナソニックＩｐマネジメント株式会社
Priority date: 2019-12-11
Filing date: 2020-09-29
Publication date: 2021-06-17
Also published as: CN114747308A; JPWO2021117319A1

Abstract

A component-imaging device, having a component-imaging unit, a mark, a mark-imaging unit, and a positional displacement amount calculation unit. The component-imaging unit is provided to an imaging element and images a component. The mark is provided outside of the field-of-view of the component-imaging unit. The mark-imaging unit is provided to the imaging element and images the mark. The positional displacement amount calculation unit calculates, on the basis of the result of imaging of the mark by the mark-imaging unit, the positional displacement amount of the field-of-view of the component-imaging unit.

Description

Component imaging device and component mounting device

The present disclosure relates to a component imaging device that images a component and a component mounting device that mounts the component on a substrate.

The component mounting device has a component supply unit, a mounting head that horizontally moves the components supplied by the component supply unit, and a substrate transfer conveyor that holds the substrate. The mounting head has a nozzle, and the nozzle takes out a component and mounts it on a substrate. In order to improve the mounting accuracy of parts, for example, the parts mounting device described in Patent Document 1 includes a parts recognition camera (parts imaging device) and a substrate recognition camera (board imaging device). The component recognition camera captures the position of the component held by the nozzle. The board recognition camera moves integrally with the mounting head and captures a mark formed on the board.

The mounting head is removable from the main body of the component mounting device. In order to correct the positional relationship between the nozzle of the mounting head and the substrate recognition camera to ensure the mounting accuracy of the component, Patent Document 1 sets as follows. That is, a glass plate on which a reference mark is formed is placed on the upper surface of the component recognition camera. The glass plate is arranged so that the reference mark is within the field of view of the component recognition camera. Further, the mounting head moves so that the nozzle is within this field of view. In this state, the component recognition camera detects the nozzle and the position of the reference mark. The substrate recognition camera calculates the positional relationship between the nozzle and the substrate recognition camera from the captured reference mark and the position of the optical axis of the substrate recognition camera.

Japanese Unexamined Patent Publication No. 2004-179636

The component imaging device of the present disclosure includes a component imaging unit, a mark, a mark imaging unit, and a misalignment amount calculation unit. The component image pickup unit is provided on the image pickup device and images the component. The mark is provided outside the field of view of the component imaging unit. The mark image pickup unit is provided on the image pickup device and images the mark. The misalignment amount calculation unit calculates the misalignment amount of the visual field of the component imaging unit based on the image imaging result of the mark by the mark imaging unit.

The component mounting device of the present disclosure includes a nozzle, a component image pickup device, a substrate image pickup device, and an offset amount calculation unit. The nozzle holds the component and mounts it on the board. The component imaging device images the component held by the nozzle. The substrate imaging device moves integrally with the nozzle to image the substrate. The component imaging device includes a component imaging unit, a mark, and a mark imaging unit. The component image pickup unit is provided on the image pickup device and images the component. The mark is provided outside the field of view of the component imaging unit. The mark image pickup unit is provided on the image pickup device and images the mark. The offset amount calculation unit calculates the offset amount between the nozzle and the substrate imaging device based on the mark imaging result by the mark imaging unit of the component imaging device and the mark imaging result by the substrate imaging device.

According to the present disclosure, it is possible to calculate the deviation of the optical axis of the camera that images the component over time and correct the deviation of the mounting position of the component due to this deviation. In addition, the offset amount between the nozzle and the substrate imaging device can be calculated accurately during the production of the mounting substrate.

Top view of the component mounting apparatus according to the embodiment of the present disclosure. A perspective side view showing the configuration of the component mounting device shown in FIG. Top view of the transparent member of the component recognition camera included in the component mounting device shown in FIGS. 1 and 2. Configuration explanatory view of the component recognition camera included in the component mounting device shown in FIG. Top view of the sensor board of the component recognition camera included in the component mounting device shown in FIGS. 1 and 2. FIG. 3 is a diagram illustrating a state in which a component held by a nozzle is imaged by the component recognition camera shown in FIG. 3B. Configuration explanatory view of the board recognition camera included in the component mounting device shown in FIGS. 1 and 2. Functional block diagram showing the configuration of the control system of the component mounting device shown in FIGS. 1 and 2. The figure explaining the deviation of the optical axis caused by the heat generation of the component recognition camera shown in FIG. 3B. The figure which shows the example of the captured image of the mark imaged by the mark imaging unit of the component recognition camera shown in FIG. 3B. FIG. 3B is a diagram showing an example of an captured image of a component held by a nozzle captured by a component imaging unit of the component recognition camera shown in FIG. 3B. FIG. 5 is a diagram illustrating a state in which a mark provided on the component recognition camera shown in FIG. 3B is imaged by the substrate recognition camera shown in FIG. The figure which shows the example of the captured image of the mark provided in the component recognition camera which was taken by the substrate recognition camera shown in FIG.

Prior to the explanation of the embodiment of the present disclosure, the background to the idea of the present disclosure will be briefly explained. The component recognition camera in the conventional component mounting device detects the position of the component held by the nozzle from the position of the optical axis of the camera. However, in the process of continuously producing the mounting substrate, the optical axis of the camera may be deviated (distorted) due to a change over time due to heat generation of the image sensor included in the component recognition camera. Therefore, in order to maintain the mounting accuracy of the component, it is necessary to periodically detect the deviation of the optical axis of the component recognition camera and appropriately correct the mounting position of the component. In the prior art including Patent Document 1, a method of detecting the deviation of the optical axis of the component recognition camera during the production of the mounting substrate is not disclosed, and there is room for further improvement in order to improve the mounting accuracy of the component. ..

The present disclosure provides a component imaging device capable of detecting a deviation of the optical axis of a camera that images a component and correcting the mounting position of the component based on the deviation. That is, this component imaging device calculates the amount of positional deviation of the field of view of the component imaging unit, which is a camera that images components. The present disclosure also provides a component mounting device capable of accurately calculating the offset amount between the nozzle and the board imaging device during the production of the mounting board.

The embodiments of the present disclosure will be described in detail with reference to the drawings below. The configuration, shape, and the like described below are examples for explanation, and can be appropriately changed according to the specifications of the component mounting device, the board recognition camera, and the component recognition camera. In the following, the corresponding elements will be designated by the same reference numerals in all the drawings, and duplicate description will be omitted. In each drawing, the substrate is conveyed along the X-axis. The Y-axis is orthogonal to the X-axis in the horizontal plane. The Z-axis is orthogonal to the horizontal plane and extends from bottom to top.

First, the configuration of the component mounting device 1 will be described with reference to FIGS. 1 and 2. Note that FIG. 2 schematically shows a part of the component mounting device 1 in FIG. The component mounting device 1 executes a component mounting operation for mounting the component D supplied from the component supply unit 4 on the substrate 3. As shown in FIG. 1, a substrate transport mechanism (hereinafter, transport mechanism) 2 is arranged along the X axis in the center of the base 1a. The transport mechanism 2 carries, positions, and holds the substrate 3 transported from the upstream to the mounting work position. Further, the transport mechanism 2 carries out the substrate 3 for which the component mounting work has been completed downstream.

Parts supply units 4 are arranged on both sides of the Y-axis of the transport mechanism 2. A plurality of tape feeders 5 are mounted in parallel on each component supply unit 4. The tape feeder 5 pitch-feeds the tape 11 having the pocket for storing the component D in the direction from the outside of the component supply unit 4 toward the transport mechanism 2 (tape feed direction). As a result, the tape feeder 5 supplies the component D to the component supply position 5a (see FIG. 2) from which the component D is taken out by the mounting head 8, as described below.

The Y-axis table 6 is arranged so as to extend along the Y-axis at both ends of the upper surface of the base 1a on the X-axis. Each Y-axis table 6 has a linear drive mechanism. Beams 7 are coupled to the pair of Y-axis tables 6 so as to connect the Y-axis tables 6 to each other. The beam 7 extends along the X axis. The beam 7 can be moved along the Y-axis by the linear drive mechanism of the Y-axis table 6. Further, the beam 7 has a linear drive mechanism like the Y-axis table 6. A mounting head 8 is mounted on the beam 7. The mounting head 8 can be moved along the X axis by the linear drive mechanism included in the beam 7. As shown in FIG. 2, the mounting head 8 has a suction unit 8a. The suction unit 8a can be raised and lowered, and holds the component D by sucking it. A nozzle 8b that sucks and holds the component D is mounted on the lower end of the suction unit 8a.

In FIG. 1, the Y-axis table 6 and the beam 7 constitute a head moving mechanism (hereinafter, moving mechanism) 9 that moves the mounting head 8 along the X-axis and the Y-axis. The moving mechanism 9 and the mounting head 8 attract and take out the component D from the component supply position 5a of the tape feeder 5 arranged in the component supply unit 4 by the nozzle 8b, and take out the component D from the component supply position 5a. Perform a mounting turn to attach to. That is, the Y-axis table 6, the beam 7, and the mounting head 8 hold the component D supplied to the component supply position 5a of the tape feeder 5 by the nozzle 8b and mount it on the substrate 3.

A parts recognition camera (hereinafter, first camera) 20 is arranged between the parts supply unit 4 and the transport mechanism 2. When the mounting head 8 from which the component D is taken out from the component supply unit 4 moves above the first camera 20, the first camera 20 takes an image of the component D held by the mounting head 8 and recognizes the posture of the component D. To do. A substrate recognition camera 30 (hereinafter referred to as a second camera) is attached to the plate 7a to which the mounting head 8 is attached. The second camera 30 moves integrally with the mounting head 8.

When the mounting head 8 moves, the second camera 30 moves above the substrate 3 positioned on the transport mechanism 2, images the substrate mark 3a provided on the substrate 3, and recognizes the position of the substrate 3. In the component mounting operation on the substrate 3 by the mounting head 8, the mounting position is corrected in consideration of the recognition result of the component D by the first camera 20 and the recognition result of the position of the board 3 by the second camera 30.

In FIG. 2, a dolly 10 is set in the parts supply unit 4. The carriage 10 has a feeder base 10a, and a plurality of tape feeders 5 are attached to the feeder base 10a in advance. The dolly 10 holds the tape reel 12. The tape reel 12 stores the tape 11 holding the component D in a wound state. The tape 11 drawn from the tape reel 12 is pitch-fed to the component supply position 5a by the tape feeder 5.

In FIG. 1, a touch panel 13 operated by the operator is installed at a position where the operator works on the front surface of the component mounting device 1. The touch panel 13 displays various information on the display unit thereof. Further, the operator inputs data from the touch panel 13 or operates the component mounting device 1 by using the operation buttons displayed on the display unit.

Next, the configuration of the first camera 20 will be described with reference to FIGS. 3A to 3C. As shown in FIG. 3B, the first camera 20 includes a housing 21, a sensor substrate 23, a lens 24, a component lighting unit 25, and a transparent member 26. The sensor board 23 is installed on the bottom 21a inside the housing 21. An image sensor 22 such as a two-dimensional CMOS (complementary metal oxide semiconductor) sensor is mounted on the sensor substrate 23. The lens 24 is installed above the sensor substrate 23 in the housing 21, and the component illumination unit 25 is installed above the lens 24. The transparent member 26 is installed at a portion of the upper portion 21b of the housing 21 in which a part of the housing 21 is cut out.

The transparent member 26 is made of a plate-shaped glass or the like that transmits light. A mark 27 for detecting the deviation of the optical axis of the image pickup device 22 is provided on a part of the upper surface 26c of the transparent member 26. As shown in FIG. 3A, the mark 27 is outside the component imaging field of view 26a when the image sensor 22 images the component D held by the nozzle 8b, and the mark 27 is a mark when the image sensor 22 images the mark 27. It is arranged in the imaging field of view 26b. In this example, in the mark imaging field of view 26b, as marks 27, five disks formed of a metal thin film that does not transmit light are arranged at equal intervals along the Y axis. The shape, number, and arrangement of the marks 27 shown in FIG. 3A are examples, and are not limited to this example. As shown in FIG. 3B, the transparent member 26 is on the first optical path Pa where the component imaging unit 22a images the component D, and on the second optical path Pb where the mark imaging unit 22b images the mark 27. It is provided.

As shown in FIG. 3C, the image pickup device 22 has a component image pickup unit 22a and a mark image pickup unit 22b arranged side by side along the X axis. The component imaging unit 22a and the mark imaging unit 22b extend along the Y axis. That is, the length along the Y-axis is shorter than the length along the X-axis. The component imaging unit 22a images the component D held by the nozzle 8b. The mark imaging unit 22b images the mark 27 provided on the transparent member 26. As shown in FIGS. 3B and 4, the component imaging unit 22a images the component D whose lower surface Da is located at the component recognition height Ha set above the mark recognition height Hb of the upper surface 26c of the transparent member 26. To do. As described above, the image sensor 22 is provided with a component image pickup unit 22a for imaging the component D and a mark image pickup unit 22b for imaging the mark 27. As shown in FIG. 3A, the mark 27 is provided in the mark imaging field of view 26b, which is outside the component imaging field of view 26a, which is the field of view of the component imaging unit 22a.

The component image pickup unit 22a is provided in a part of the image pickup element 22, and the mark image pickup section 22b is provided in a portion different from the component image pickup section 22a of the image pickup element 22. As described above, since the component image pickup unit 22a and the mark image pickup unit 22b are provided on the same image pickup element 22, the detection accuracy of the amount of displacement of the visual field of the component image pickup unit 22a is improved, as will be described later.

As shown in FIG. 3B, the lens 24 arranged above the image pickup element 22 causes an image pickup object (part D or the like) located above the transparent member 26 and at the component recognition height Ha to the component image pickup unit 22a. Make an image. Further, the lens 24 forms a mark 27 formed on the transparent member 26 on the mark imaging unit 22b. The mark 27 is located at the mark recognition height Hb. The physical distance Lpa of the first optical path Pa from the component imaging unit 22a to the imaging object located at the component recognition height Ha is the physical distance Lpb of the second optical path Pb from the mark imaging unit 22b to the mark 27. It's different.

As shown in FIGS. 3B and 3C, a correction member 28 having a refractive index different from that of air and made of glass or the like that transmits light is installed on the component imaging unit 22a. The refractive index and the thickness T of the correction member 28 are set so as to correct the optical path length Loa (optical distance) of the first optical path Pa and form an image in each of the component imaging unit 22a and the mark imaging unit 22b. ing. As a result, the lens 24 can simultaneously focus on the image of the imaging object to be imaged on the component imaging unit 22a and the image of the mark 27 to be imaged on the mark imaging unit 22b.

In the present embodiment, the correction member 28 is installed on the component imaging unit 22a, but the correction member 28 is installed in the middle of either the first optical path Pa or the second optical path Pb. Just do it. That is, in the first camera 20, the optical path length Loa is set in either the first optical path Pa in which the component imaging unit 22a images the component D or the second optical path Pb in which the mark imaging unit 22b images the mark 27. It has a correction member 28 that corrects either one of the optical path length lobs. Correction members 28 having different refractive indexes and / or thicknesses T may be installed in both the first optical path Pa and the second optical path Pb. Further, if the depth of field of the lens 24 is deep and the two images of the imaging object and the mark 27 can be focused at the same time without the correction member 28, the correction member 28 can be omitted.

As shown in FIG. 3B, the component illumination unit 25 includes a side illumination unit 25a, a coaxial illumination unit 25b, and a half mirror 25c. The side-illuminating unit 25a has a plurality of light emitting diode (LED) chips and the like, and emits light that illuminates an imaging object (part D, etc.) located at a component recognition height Ha from diagonally below and a mark 27. Irradiate. The coaxial illumination unit 25b has a plurality of LED chips and the like, and is arranged below the side-illuminated illumination unit 25a.

The half mirror 25c is arranged in the middle of the first optical path Pa and the second optical path Pb. The half mirror 25c reflects the light emitted from the coaxial illumination unit 25b toward the image pickup object (part D or the like) located above the half mirror 25c at the component recognition height Ha and the mark 27. That is, the coaxial illumination unit 25b and the half mirror 25c illuminate the image pickup object and the mark 27 coaxially with the first optical path Pa and the second optical path Pb.

The component illumination unit 25 illuminates by switching or combining the illumination by the side-illuminated illumination unit 25a and the illumination by the coaxial illumination unit 25b according to the material or the like of the object to be imaged. As described above, the first camera 20 has an illumination unit (parts illumination unit 25) that illuminates the mark 27.

Next, with reference to FIG. 4, the imaging of the component D by the first camera 20 will be described. The mounting head 8 holding the component D by the nozzle 8b positions the lower surface Da of the component D at the component recognition height Ha so that the component D passes over the first optical path Pa of the first camera 20. It moves along the X-axis as indicated by the arrow a. During this time, the component lighting unit 25 illuminates the component D. The first camera 20 transmits the image pickup result imaged by the image pickup element 22 (component image pickup unit 22a, mark image pickup unit 22b) to the control unit 40 shown in FIG.

Next, the configuration of the second camera 30 will be described with reference to FIG. The second camera 30 has a housing 31, a window member 34, a camera unit 32 installed inside the housing 31, and a substrate lighting unit 33. The window member 34 is made of glass or the like that transmits light, and is installed in a portion of the lower portion of the housing 31 that is cut out. The camera unit 32 is composed of an image sensor such as a two-dimensional CMOS sensor whose optical axis is directed downward, a lens, and the like.

The substrate illumination unit 33 includes a side-illuminated illumination unit 33a that illuminates the substrate 3 to be imaged from diagonally above to below, a coaxial illumination unit 33b, and a half mirror 33c. The half mirror 33c reflects the light emitted from the coaxial illumination unit 33b toward the lower image pickup target. The substrate illumination unit 33 illuminates by switching or combining the illumination by the side-illuminated illumination unit 33a and the illumination by the coaxial illumination unit 33b according to the material or the like of the object to be imaged by the camera unit 32.

The second camera 30 images an imaging target such as a substrate mark 3a formed on the substrate 3 and a mark 27 provided on the transparent member 26 of the first camera 20. At that time, the second camera 30 moves above the image pickup target together with the mounting head 8, and the camera unit 32 images the image pickup target while the substrate illumination unit 33 illuminates the image pickup target. In this way, the second camera 30 has a substrate illumination unit 33 that illuminates the substrate mark 3a and the mark 27 formed on the substrate 3, and moves integrally with the nozzle 8b to image the substrate 3 and the mark 27. It is a substrate imaging device. The second camera 30 transmits the image pickup result imaged by the camera unit 32 to the control unit 40.

Next, the configuration of the control system of the component mounting device 1 will be described with reference to FIG. The component mounting device 1 includes a control unit 40, a transport mechanism 2, a tape feeder 5, a mounting head 8, a moving mechanism 9, a first camera 20, a second camera 30, and a touch panel 13. There is. The control unit 40 includes an imaging processing unit (hereinafter, first processing unit) 41, a misalignment amount calculation unit (hereinafter, first calculation unit) 42, an offset amount calculation unit (hereinafter, second calculation unit) 43, and the like. It has a mounting operation processing unit (hereinafter, second processing unit) 44 and a mounting storage unit (hereinafter, storage unit) 45. The storage unit 45 includes mounting data 46, imaging data 47, mark visual field misalignment amount (hereinafter, first position misalignment amount) 48, component visual field misalignment amount (hereinafter, second misalignment amount) 49, and substrate visual field misalignment amount. (Hereinafter, the third position shift amount) 50, the offset amount 51, and the like are stored.

The first processing unit 41, the first calculation unit 42, the second calculation unit 43, and the second processing unit 44 that constitute the control unit 40 are CPUs (central processing units) or LSIs (large-scale integrated circuits), respectively. It is configured. Memory may be included, if desired. These may be configured by a dedicated circuit, or may be realized by controlling general-purpose hardware with software read from a transient or non-transient storage device or recording medium. Further, two or more of these may be integrally configured. The storage unit 58 is composed of a rewritable RAM, a flash memory, a hard disk, and the like. The storage unit 58 may be configured by a plurality of memories to individually store the mounting data 46 to the offset amount 51, or may be integrally configured to store these data collectively.

The mounting data 46 includes information necessary for component mounting work, such as the size of the board 3, the type of component D to be mounted, and the mounting position (XY coordinates) for each type of board 3. The first processing unit 41 controls the mark imaging unit 22b and the component lighting unit 25 of the first camera 20 when detecting (calculating) the positional deviation of the imaging field of view of the first camera 20. Specifically, the first processing unit 41 causes the mark imaging unit 22b to image the mark 27 while illuminating the mark 27 provided on the transparent member 26 with the component lighting unit 25. The first processing unit 41 stores the imaging result as imaging data 47 in the storage unit 45.

Here, with reference to FIGS. 7 and 8, the imaging result of the mark 27 imaged by the first camera 20 will be described. The first camera 20 repeatedly executes imaging of the component D held by the nozzle 8b in the component mounting work. In this process, the sensor substrate 23 and the housing 21 may be distorted over time due to the heat generated by the image sensor 22 and the component lighting unit 25. In FIG. 7, the sensor substrate 23 is distorted due to such a change over time, the image sensor 22 is displaced in the XY plane, and the first optical path Pa (optical axis) of the component image pickup unit 22a and the mark image pickup unit 22b are shown. It shows a state in which the second optical path Pb (optical axis) deviates from the initial state. On the X-axis, the first optical path Pa is deviated by the amount of misalignment ΔXd, and the second optical path Pb is deviated by the amount of misalignment ΔXm.

In FIG. 7, in the initial state where the first camera 20 is not distorted, the position of the first optical path Pa at the component recognition height Ha is defined as the initial component visual field center position Cd0, and the second at the mark recognition height Hb. The position of the optical path Pb is defined as the initial mark visual field center position Cm0. Further, in a state where the image sensor 22 is displaced in the XY plane, the position of the first optical path Pa at the component recognition height Ha is defined as the component visual field center position Cd, and the second optical path at the mark recognition height Hb is defined. The position of the optical path Pb is defined as the mark visual field center position Cm.

FIG. 8 shows a mark image 60, which is an image of the mark 27 captured by the first camera 20 in a state where the image sensor 22 is displaced in the XY plane as shown in FIG. 7. In the mark image 60, five marks 27 imaged by the mark imaging unit 22b are shown side by side. The center of the third mark 27 (hereinafter, the center mark 27A) of the five marks 27 arranged side by side is the initial mark visual field center position Cm0. Further, the center 60c of the mark image 60 is the mark visual field center position Cm.

In the initial state where the first camera 20 is not distorted, in the image captured by the first camera 20, the initial mark field of view center position Cm0 is located at the center 60c of the mark image 60, and the five marks 27 are the positions indicated by the dotted lines. It is in. In FIG. 8, the position of the second optical path Pb at the mark recognition height Hb is displaced from the center of the central mark 27A due to the displacement of the image sensor 22.

The first calculation unit 42 shown in FIG. 6 calculates the first misalignment amount 48, which is the amount of misalignment from the initial state of the visual field of the mark imaging unit 22b, based on the mark image 60, and stores it in the storage unit 45. Let me. Specifically, the first calculation unit 42 calculates the deviation amount ΔXm on the X-axis and the deviation amount ΔYm on the Y-axis from the position of the central mark 27A with respect to the center 60c of the mark image 60 shown in FIG. Further, the deviation amount Δθm in the θ direction, which is the direction of rotation with the Z axis as the rotation axis, is calculated from the inclination of the straight line connecting the centers of the five marks 27.

FIG. 9 shows a component image pickup image (hereinafter, first image) 61 which is an image of the component D imaged by the first camera 20 in a state where the image pickup element 22 shown in FIG. 7 is displaced in the XY plane. .. The nozzle 8b holds the center of the component D. The center of the component D shown in the first image 61 is the initial component visual field center position Cd0. Further, the center 61c of the first image 61 is the component field of view center position Cd. In the initial state where the first camera 20 is not distorted, in the first image 61, the initial component visual field center position Cd0 is located at the center 61c of the first image 61, and the component D and the nozzle 8b holding the component D are dotted lines. It is in the indicated position.

The second displacement amount 49, which is the displacement amount from the initial state of the field of view of the component imaging unit 22a based on the first image 61, is represented by the displacement amount ΔXd on the X-axis and the displacement amount ΔYd on the Y-axis. That is, the deviation of the position of the center of the component D with respect to the center 61c of the first image 61 is the deviation amount ΔXd and the deviation amount ΔYd. Further, the degree of rotation of the component D (inclination of each side of the component D, etc.) is a deviation amount Δθd in the θ direction, which is the direction of rotation with the Z axis as the rotation axis.

In the first camera 20, the component image pickup unit 22a and the mark image pickup unit 22b are formed on a single image pickup element 22. Therefore, due to changes over time in the first camera 20, the deviation of the first optical path Pa of the component imaging unit 22a and the deviation of the second optical path Pb of the mark imaging unit 22b are interlocked with each other. Therefore, the first misalignment amount 48 and the second misalignment amount 49 have a predetermined relationship (for example, a proportional relationship) determined by the configuration of the first camera 20. That is, the second misalignment amount 49 can be calculated from the first misalignment amount 48.

The first calculation unit 42 executes a predetermined calculation on the first position shift amount 48 calculated from the mark image 60 to calculate the second position shift amount 49 and stores it in the storage unit 45. The predetermined operation is, for example, an operation in which the X-axis component and the Y-axis component are multiplied by a predetermined coefficient and the θ direction is left as it is. That is, the first calculation unit 42 calculates the amount of misalignment of the visual field of the component imaging unit 22a (second amount of misalignment 49) based on the mark image 60 which is the result of imaging the mark 27 by the mark imaging unit 22b. Then, the component imaging unit 22a, the mark imaging unit 22b, the mark 27, and the first calculation unit 42 constitute a component imaging device that images the component D held by the nozzle 8b and calculates the second misalignment amount 49.

The second processing unit 44 shown in FIG. 6 controls each unit of the component mounting device 1 based on the mounting data 46. Specifically, the nozzle 8b of the mounting head 8 is controlled to hold the component D supplied by the tape feeder 5. Then, the first camera 20 is made to detect the misalignment of the component D held by the nozzle 8b. Further, the nozzle 8b is controlled to mount the component D on the substrate 3 held at the mounting work position. The second processing unit 44 controls such a series of component mounting operations. At that time, the second processing unit 44 corrects the position of the component D with respect to the nozzle 8b detected by the first camera 20 based on the second misalignment amount 49 stored in the storage unit 45.

The mark imaging unit 22b can image the mark 27 while the mounting head 8 takes out the component D from the tape feeder 5 and mounts the component on the substrate 3. That is, the mark imaging unit 22b can image the mark 27 independently of the operation of the mounting head 8 and the like in the spare time when the mounting head 8 is not above the first camera 20. Therefore, the mark imaging unit 22b can image the mark 27 in the spare time and update the second misalignment amount 49 to the latest value. As a result, the position where the component D is mounted is corrected by detecting the deviation of the optical axis (second position deviation amount 49) of the component imaging camera 20 that images the component D without reducing the efficiency of the component mounting work, and the component. D can be mounted in the regular mounting position with high accuracy.

The first processing unit 41 shown in FIG. 6 detects (calculates) the misalignment of the mounting head 8, the nozzle 8b, and the second camera 30 due to the temporal distortion of the moving mechanism 9. Specifically, the first processing unit 41 controls the moving mechanism 9, the second camera 30, and the first camera 20 to cause the camera unit 32 to image the mark 27 formed on the transparent member 26. The first processing unit 41 stores the imaging result as imaging data 47 in the storage unit 45.

Next, with reference to FIGS. 10 and 11, details of imaging of the mark 27 by the second camera 30 and imaging results will be described. When the mark 27 is imaged by the second camera 30, the first processing unit 41 shown in FIG. 6 first controls the moving mechanism 9, and the second camera 30 is located at a position where the mark 27 provided on the first camera 20 is imaged. To move. Next, the first processing unit 41 controls the component lighting unit 25 of the first camera 20 to illuminate the mark 27 provided on the transparent member 26 from below, and controls the camera unit 32 shown in FIG. The mark 27 is imaged.

That is, when the second camera 30 as the substrate imaging device images the mark 27, the component illumination unit 25 illuminates the mark 27 with transmitted illumination. As a result, for example, even if the transparent member 26 is dirty, the second camera 30 can clearly image the mark 27. The camera unit 32 may take an image of the mark 27 while the substrate illumination unit 33 illuminates the mark 27. Further, although the component illumination unit 25 is a transmission illumination, the transmission illumination is an example of an illumination type and is not limited to this example.

By the way, the moving mechanism 9 repeatedly moves the mounting head 8 in the component mounting work. In this process, the moving mechanism 9 may be distorted over time due to heat generated by the linear drive mechanism of the moving mechanism 9. The control unit 40 controls the positions of the mounting head 8 and the nozzle 8b by assuming an initial state in which the moving mechanism 9 is not distorted, with the base point (not shown) set in the component mounting device 1 as the origin. Various control parameters are set. If the moving mechanism 9 is distorted, the mounting head 8 and the nozzle 8b deviate from the initial positions, so that correction is required.

In FIG. 10, although the first processing unit 41 controls the moving mechanism 9 and the third optical path Ph of the camera unit 32 coincides with the center of the mark 27, the first processing unit 41 is caused by the distortion of the moving mechanism 9. 2 Indicates a state in which the camera 30 is misaligned and stopped. As described above, the second camera 30 including the camera unit 32 moves integrally with the mounting head 8 by the moving mechanism 9. In the initial state where the moving mechanism 9 is not distorted, the position on the mark 27 of the third optical path Ph is defined as the initial substrate visual field center position Ch0. Further, the position of the third optical path Ph on the transparent member 26 when the moving mechanism 9 is distorted is defined as the substrate visual field center position Ch.

FIG. 11 shows a substrate recognition camera image (hereinafter, second image) 62 of the mark 27 captured by the camera unit 32 of the second camera 30 in a state where the moving mechanism 9 is distorted as shown in FIG. There is. The center 62c of the second image 62 is the substrate field of view center position Ch. Further, the center of the third center mark 27A out of the five marks 27 shown in the second image 62 is the initial substrate visual field center position Ch0. In the initial state where the moving mechanism 9 is not distorted, in the second image 62, the initial substrate field of view center position Ch0 is located at the center 62c, and the five marks 27 are at the positions indicated by the dotted lines.

The second calculation unit 43 shown in FIG. 6 calculates and stores a third position deviation amount 50, which is a position deviation amount from the initial state of the field of view of the camera unit 32, based on the second image 62 shown in FIG. It is stored in the part 45. Specifically, the second calculation unit 43 calculates the deviation amount ΔXh on the X-axis and the deviation amount ΔYh on the Y-axis from the position of the center mark 27A with respect to the center 62c of the second image 62. Further, from the inclination of the straight line connecting the centers of the five marks 27, the deviation amount Δθh in the θ direction, which is the direction of rotation with the Z axis as the rotation axis, is calculated.

The second processing unit 44 controls the second camera 30 to image the substrate mark 3a of the substrate 3 held at the mounting work position and recognizes the position of the substrate 3. At that time, the second processing unit 44 corrects the stop position of the substrate 3 based on the third position deviation amount 50 stored in the storage unit 45. Further, in the component mounting work, it is necessary to correct the position of the nozzle 8b with respect to the base point set in the component mounting device 1 and mount the component D held by the nozzle 8b at a predetermined mounting position on the substrate 3. In order to correct the position of the nozzle 8b, in addition to the distortion of the moving mechanism 9, it is necessary to consider the distortion of the first camera 20 that captures the component D held by the nozzle 8b described above.

In FIG. 10, the second calculation unit 43 sets the third position shift amount 50 and the first position shift amount 48 in addition to the positional relationship (Xn, Yn) between the second camera 30 and the nozzle 8b in the mounting head 8. Based on this, the offset amount 51 between the nozzle 8b and the second camera 30 is calculated. Then, the second calculation unit 43 stores the offset amount 51 in the storage unit 45. As described above, the first misalignment amount 48 is the misalignment amount of the field of view of the first camera 20 that represents the distortion of the first camera 20. The second processing unit 44 corrects the position of the nozzle 8b based on the mounting data 46 stored in the storage unit 45 and the offset amount 51, controls the nozzle 8b, and holds the component D held by the nozzle 8b on the substrate 3. Mount it at the mounting position above.

As described above, the amount of misalignment of the field of view of the first camera 20 is calculated by the first calculation unit 42 based on the result of capturing the mark by the mark imaging unit 22b of the first camera 20. That is, the first calculation unit 42 calculates the first misalignment amount 48 based on the mark image 60 shown in FIG. When the first camera 20 images the mark 27, the first processing unit 41 controls the substrate illumination unit 33 of the second camera 30 to illuminate the mark 27 provided on the transparent member 26 from above. , The mark imaging unit 22b is controlled to image the mark 27. That is, when the first camera 20 images the mark 27, the substrate illumination unit 33 illuminates the mark 27 with transmitted illumination. Thereby, for example, even when the transparent member 26 is dirty, the mark 27 can be clearly imaged.

As described above, the second calculation unit 43 obtains the image pickup result of the mark 27 by the mark image pickup unit 22b of the first camera 20 which is the component image pickup device and the image pickup result of the mark 27 by the second camera 30 which is the substrate image pickup device. Based on this, the offset amount 51 between the nozzle 8b and the second camera 30 is calculated. That is, the second calculation unit 43 calculates the offset amount 51 based on the mark image 60 and the substrate recognition camera image 62.

As described above, the component mounting device 1 moves integrally with the component imaging device (first camera 20, first calculation unit 42) that images the component D held by the nozzle 8b, and the substrate 3 It has a substrate imaging device (second camera 30) for imaging the image, and an offset amount calculation unit (second calculation unit) 43 for calculating the offset amount 51. As a result, the offset amount 51 between the nozzle 8b and the substrate recognition device can be calculated with high accuracy.

The component imaging device of the present disclosure can calculate the deviation of the optical axis of the camera that images the component. Further, the component mounting device of the present disclosure can accurately calculate the offset amount between the nozzle and the board imaging device during the production of the mounting board. Therefore, all of them are useful in the field of mounting components on a substrate.

1 Component mounting device 1a Base 2 Board transfer mechanism (transfer mechanism)
3 Board 3a Board mark 4 Parts supply part 5 Tape feeder 5a Parts supply position 6 Y-axis table 7 Beam 7a Plate 8 Mounting head 8a Suction unit 8b Nozzle 9 Head movement mechanism (movement mechanism)
10 Dolly 10a Feeder base 11 Tape 12 Tape reel 13 Touch panel 20 Parts recognition camera (1st camera)
21,31 Housing 21a Bottom 21b Top 22 Image sensor 22a Parts image sensor 22b Mark image pickup unit 23 Sensor board 24 Lens 25

Parts illumination

25a, 33a Side illumination 25b,

33b Coaxial illumination

25c, 33c Half mirror 26 Transparent member 26a Parts image pickup field 26b Mark image pickup field 26c Top surface 27 Mark 27A Center mark 28 Correction member 30 Board recognition camera (second camera)
32 Camera unit 33 Board lighting unit 34 Window member 40 Control unit 41 Imaging processing unit (first processing unit)
42 Misalignment amount calculation unit (first calculation unit)
43 Offset amount calculation unit (second calculation unit)
44 Mounting operation processing unit (second processing unit)
45 Mounting storage unit (storage unit)
46 Mounting data 47 Imaging data 48 Mark field of view misalignment amount (first misalignment amount)
49 Parts visual field misalignment amount (second misalignment amount)
50 Substrate visual field misalignment (third misalignment)
51 Offset amount 60

Mark image

60c, 61c, 62c Center 61 Part image (first image)
62 Board recognition camera image (second image)
D Part Pa 1st optical path Pb 2nd optical path Ph 3rd optical path

Claims

A component image sensor that is provided on the image sensor and captures components,
A mark provided outside the field of view of the component imaging unit and
A mark image pickup unit provided on the image pickup device to image the mark, and a mark image pickup unit.
A position deviation amount calculation unit for calculating the position deviation amount of the field of view of the component imaging unit based on the image pickup result of the mark by the mark imaging unit is provided.
Parts imaging device.
The component image pickup unit and the mark image pickup unit are provided at different portions of the image pickup device.
The component imaging device according to claim 1.
A correction member for correcting the optical path length is provided in at least one of a first optical path in which the component imaging unit images the component and a second optical path in which the mark imaging unit images the mark.
The component imaging device according to claim 1 or 2.
A lighting unit that illuminates the mark is further provided.
The component imaging device according to any one of claims 1 to 3.
The component imaging unit further includes a transparent member provided on the first optical path for imaging the component and the mark imaging unit on the second optical path for imaging the mark.
The mark is provided on the transparent member.
The component imaging device according to any one of claims 1 to 4.
Nozzles that hold parts and mount them on the board,
A component imaging device that images the component held by the nozzle, and
A substrate imaging device that moves integrally with the nozzle to image the substrate,
An offset amount calculation unit for calculating an offset amount between the nozzle and the substrate imaging device is provided.
The component imaging device is
A component image pickup unit provided on the image sensor to image the component, and a component image sensor.
A mark provided outside the field of view of the component imaging unit and
It has a mark image pickup unit provided on the image pickup device and images the mark.
The offset amount calculation unit calculates the offset amount based on the image pickup result of the mark by the mark imaging unit of the component imaging device and the image pickup result of the mark by the substrate imaging device.
Component mounting device.
The component image pickup unit and the mark image pickup unit are provided at different portions of the image pickup device.
The component mounting device according to claim 6.
A correction member for correcting the optical path length is provided in at least one of a first optical path in which the component imaging unit images the component and a second optical path in which the mark imaging unit images the mark.
The component mounting device according to claim 6 or 7.
The component imaging device has a position shift amount calculation unit that calculates the position shift amount of the visual field of the component imaging unit based on the image pickup result of the mark by the mark imaging unit.
The offset amount calculation unit calculates the offset amount based on the image pickup result of the mark by the substrate imaging device and the position deviation amount of the field of view of the component imaging device.
The component mounting device according to any one of claims 6 to 8.
The component imaging device has a component illumination unit that illuminates the mark when the component imaging device images the mark.
The substrate imaging device has a substrate illumination unit that illuminates the mark when the substrate imaging device images the mark.
The component mounting device according to any one of claims 6 to 9.
The component imaging unit further includes a transparent member provided on the first optical path for imaging the component and the mark imaging unit on the second optical path for imaging the mark.
The mark is provided on the transparent member.
The component mounting device according to any one of claims 6 to 10.