JP3310752B2 - Electronic component recognition device - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic component recognizing apparatus for automatically setting a measurement site of an electronic component and automatically generating measurement reference data.

[0002]

2. Description of the Related Art Conventionally, ICs, resistors,
There is a component mounting apparatus for mounting a large number of chip-shaped electronic components such as capacitors. An electronic component mounted on a printed circuit board (hereinafter simply referred to as a substrate) by this component mounting apparatus is composed of a plurality of lead pins (electrodes) protruding outside from a side surface of a mold (a protective shell member covering an internal circuit). Many are equipped with. In this case, if the plurality of lead pins are not properly aligned as specified, even if the electronic component is mounted, the lead pins of the electronic component will not be correctly connected to the wiring of the board, and the entire board unit will be defective. For this reason, before mounting the electronic component, usually, the arrangement state of the lead pins of the electronic component to be mounted is measured by an imaging device or a sensor or the like, and compared with the data of the electronic component standard table stored in a memory or the like in advance. To judge the quality.

FIG. 11 shows a state where an electronic component is measured using a laser sensor. The transfer head 1 shown in FIG. 1 is located above the main body device and is freely movable up and down and forward and backward and left and right.
The electronic component 3 is sucked from the component mounting table on the base of the main body device, and the electronic component 3 is automatically mounted at a predetermined position on a substrate that is automatically loaded into the main body device. At this time, a laser sensor 5 is provided on the movement path of the transfer head 1 that sucks and transfers the electronic component 3, and the state of the electronic component 3 is measured by the laser sensor 5. The above-mentioned laser sensor 5 has a scanning unit composed of an emission port 6 and a light receiving unit 7, and is used when the transfer head 1 holding the electronic component 3 moves in the X-axis direction indicated by an arrow A in FIG. The laser beam is emitted from the emission port 6 to the lead pin 4 passing through the measurement point B 'as shown by the folding arrow B in FIG. Then, the arrangement of the lead pins 4 is recognized by the input of the reflected light, and the light receiving section 7 of the input light is recognized.
The distance of the lead pin 4 from the laser sensor 5 is recognized on the basis of the position of the light receiving portion in. Based on these measurement (recognition) results, the control unit of the main unit detects a defect such as lifting, bending, or missing of the lead pin.

[0004] The above laser sensor 5 is fixed to the main body device. Therefore, to measure the electronic component 3, the electronic component 3 is moved. FIG. 12 is a diagram illustrating an example of a method of moving the electronic component 3 to be measured. As shown in the figure, the suction nozzle 2 moves in a square around the fixed measurement point B '. That is, at first, the suction nozzle 2 is moved to the position 2-1.
Then, when it moves to the upward position 2-2 indicated by the arrow C in the same figure, the tip portions S1 of the plurality of lead pins 4 arranged on one side of the sucked electronic component 3 (portion surrounded by a dotted line) Also moves in the direction of arrow C ', passes through the measurement point B', and scans the array position. Next, when the suction nozzle 2 is moved from the position 2-2 to a leftward position 2-3 shown by an arrow D in the same figure, this time, the tips of a plurality of lead pins 4 arranged on the other side of the electronic component 3 The portion S2 (the portion surrounded by the dotted line) is the arrow D '
And passes through the measurement point B '. Similarly, the suction nozzle 2 sequentially moves from the position 2-3 to the downward position 2-4 shown by the arrow E, and further from the position 2-4 to the first right position 2-1 shown by the arrow F. As a result, the tips S3 and S4 of the plurality of lead pins 4 disposed on the remaining two sides of the electronic component 3 move in the directions of the arrows E 'and F', respectively, and sequentially pass through the measurement point B '. The array position is scanned. In this way, the control system can know the arrangement state of the lead pins 4 on all four sides of the electronic component 3,
As a result, the degree of displacement of each lead pin 4 from the correct position where it should be located up and down (displacement amount, that is, lifting of the lead pin), bending, missing, and the like are detected.

As shown in FIG. 13, the lead pins 4 of the above-mentioned electronic component project laterally from the middle of the side surface of the mold. Is bent further (horizontally). The foremost part of the horizontally bent lead pin 4 projects 0.01 to 0.1 mm (millimeter) below the bottom surface of the mold. Therefore, the thickness Ict of the electronic component 3 is equal to the thickness of the mold. Instead, it is the distance between the upper surface of the mold and the lower surface of the tip of the lead pin. Laser sensor 5
Is located at a distance Ha of about 8 mm from the suction surface of the suction nozzle 2 of the transfer head 1 at the reference position, and scans the horizontally bent foremost portion of the lead pin 4. The control unit is located at a distance Hb from the scanning unit of the laser sensor 5.
It is determined that the lead pin 4 at the position (= Ha-Ict) is normal. The measurable range of the laser sensor 5 is the above distance H
The range from b to the plus / minus distance Hc, which is approximately 500 μm (micron).

As described above, the measurement distance is limited to an extremely narrow range, and the very limited length of the leading end of the lead pin 4 to be measured is accurately moved to the measurement position of the limited distance. I have to do it.

[0007]

However, the distance Ha between the suction nozzle 2 and the laser sensor 5 at the reference position of the transfer head 1 depends on various factors such as an error in assembling the transfer head 1 and an error in designing the main unit. Is more likely to be out of order. Even if a plurality of distance correction values are prepared in advance to correct the deviation, a problem often occurs that the distance cannot be corrected.

On the other hand, in order to measure the very tip of the lead pin 4 having a very limited length, the position information of the measurement site B 'is required. In order to judge the quality of the measurement result, For each type of electronic component, pin information such as the number of lead pins, arrangement pitch, and mounting position (height) is required.
Then, external dimension information of the electronic component is also required as a position reference for such information. Conventionally, this information (data)
The operator manually inputs the data into the main unit while looking at the parts table to create a component recognition master.

Usually, there are various types of electronic components mounted on a substrate, and there are many types of electronic components, such as 20 to 50 types. Therefore,
The amount of data input prior to the board mounting operation is extremely large. By the way, since this data input is manual and the data amount is large as described above, an input error easily occurs. If the mounting operation of the electronic component is performed without the input error being found, there is a possibility that a non-defective product is determined to be defective and causes great damage. Therefore, the above-mentioned data input requires skill and meticulous attention, which is not only troublesome and troublesome, but also requires a great deal of time to reduce the work efficiency. Was.

[0010] The object of the present invention is to solve the above-mentioned conventional problems.
It is an object of the present invention to provide an electronic component recognition device that automatically sets a measurement site of an electronic component, performs measurement, and automatically generates measurement reference data to determine a measurement result.

[0011]

Next, the configuration of the present invention will be described. INDUSTRIAL APPLICABILITY The present invention is applied to an electronic component recognition device that recognizes the state of a lead pin of an electronic component sucked by a suction nozzle of a transfer head using a laser sensor.

According to a first aspect of the present invention, there is provided an electronic component recognizing apparatus for temporarily moving an electronic component upward to measure a temporary thickness of the electronic component, and measuring a displacement of a lead pin of the electronic component. The distance of the measurement focal point of the laser sensor is corrected by the thickness obtained by adding the respective thickness data obtained by the displacement measuring means and the thickness measuring means obtained by the displacement measuring means and the provisional thickness measuring means. An outer shape measuring means for measuring an outer dimension of the electronic component by a measurement focus; and a measuring portion of a lead pin of the electronic component is calculated based on the outer size data obtained by the outer measuring device. And a lead pin measuring means for measuring the state of the lead pins of the electronic component.

The provisional thickness measuring means pre-stores the mold bottom of the electronic component while measuring the mold bottom of the electronic component sucked by the suction nozzle of the transfer head. The electronic component is moved upward until it reaches a reference position to measure the temporary thickness of the electronic component. The state of the lead pin of the electronic component measured by the lead pin measuring means is, for example, as described in claim 3. The distance of the lower surface from the laser sensor, and, for example, the arrangement pitch of the lead pin tip, as described in claim 4, wherein the lead pin measuring means measures the arrangement of the lead pin tip to be measured. If a detection error occurs in the pitch, the measurement position is moved by a predetermined amount and the measurement is performed again. A number, this time, the lead pins measuring means, when the detection error in the sequence number of the lead pin tip to be measured occurs, again measured by moving the measurement position by a predetermined amount.

[0014]

[0015]

[0016]

The thickness measuring means, the outer shape measuring means, and the lead pin measuring means comprise, for example, a laser sensor, a transfer head, a transfer head drive pulse motor, and the like. The pin information generation unit and the determination unit are, for example, a CPU (Central
ProcessingUnit).

The storage means is, for example, a RAM (Random Ac
cess Memory).

[0019]

According to the present invention, the thickness measuring means measures the thickness of the electronic component, and the distance of the measurement focal point of the laser sensor is corrected by the thickness obtained by the measurement. The outer dimensions of the electronic component are measured by the measured measurement focus. The measurement site of the lead pin of the electronic component is calculated based on the external dimension data. The arrangement pitch, the number of arrangement of the lead pin tip, and the like are measured.

The pin information generating means generates lead pin information of the electronic component based on the lead pin state data obtained by the lead pin measuring means, the storage means stores the lead pin information as measurement reference data, The quality of the electronic component is determined by comparing the measurement reference data with the lead data of the electronic component obtained by the lead pin measuring means.

[0021]

Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 is a configuration block diagram of an electronic component recognition device according to one embodiment. In FIG. 1, the electronic component recognition device includes a main body control unit 10, a laser displacement meter 20, and a laser I / O control unit 30.

The main body control section 10 has a main CPU (central processing unit) 11 for controlling the entire apparatus. The CPU 11 has a built-in memory 11 'and an external I / O.
The F control unit 12 and the drive system control unit 13 are connected. An input / output port 14 is connected to the drive system controller 13, and an X-axis servomotor 15 and a Y-axis servomotor 16 are connected to the input / output port 14. The CPU 11 outputs to the drive system control unit 13 a drive signal for moving the transfer head 21 that transfers the electronic component.
The drive signal is decoded and output to the input / output port 14. The input / output port 14 allocates the input drive signal to the X-axis servo motor 15 and the Y-axis servo motor 16. The X-axis servo motor 15 rotates in both forward and reverse directions to move the transfer head 21 forward and backward in the X-axis direction (substrate transfer direction), and the Y-axis servo motor 16 also rotates in both forward and reverse directions to move the transfer head 21. The substrate is moved forward and backward in the Y-axis direction (a direction perpendicular to and horizontal to the substrate transfer direction). At this time, the servomotor encoder X15 'and the servomotor encoder Y16' attached to the rotation axes of the X-axis servomotor 15 and the Y-axis servomotor 16, respectively, input and output a pulse signal indicating the rotation speed of each servomotor. Output to the main CPU 11 via the port 14 and the drive control unit 13. The main CPU 11 controls the driving of the X-axis servomotor 15 and the Y-axis servomotor 16 by counting those pulse signals. Although not particularly shown, a pulse motor for rotating and driving the transfer head 21 and a pulse motor for driving the transfer head 21 up and down are connected to the input / output port 14, respectively. The drive is controlled by the main CPU 11. Further, a vacuum pump for sucking / releasing the electronic component 23 by the suction nozzle 22 of the transfer head 21 is also connected, and is similarly driven and controlled by the main CPU 11. Then, the I / F control unit 12 of the main body control unit 10 converts the control signal input from the main CPU 11 from a parallel signal to a serial signal, and
Output to the laser I / O control unit 30 via C.

The laser displacement meter 20 includes a laser sensor 25 and a displacement meter controller 28. The laser sensor 25 measures the electronic component 23 sucked by the transfer head 21 for reference recognition, and scans the arrangement position of the lead pins 24 of the electronic component 23 being transferred in the mounting operation. The displacement meter controller 28 controls the output of the laser sensor 25, displays and reports the measurement or scanning result of the laser sensor 25, and outputs the result data to the laser I / O control unit 30.

The laser I / O control unit 30 has a built-in sub C
The sub CPU controls the control signal input from the main CPU 11 via the interface RS232C and the servo motor encoder X15 'and the servo motor encoder Y16' input via the drive system control unit 13. The operation timing of the laser displacement meter 20 is controlled based on the pulse signal count value and the laser displacement meter 2 is controlled.
An operation is performed on the measurement or scanning result data input from 0 based on an algorithm described later, and the lead pin information of the electronic component 23 is generated by the operation, or the displacement amount of each lead pin 24 is calculated. Output to the main CPU 11 via the interface RS232C.

Next, FIG. 2 shows the structure of the lead pin information generated as described above. These are used to determine whether the measured lead pin information obtained by the subsequent lead pin measurement is correct. These are stored in the electronic component recognition master stored in the memory 11 'of the main body control unit 10.

The electronic component recognition master 11a shown in FIG.
Is composed of an image recognition master 11b and a laser sensor master 11c. Image recognition master 11b
Is composed of data of “recognition code”, “ALGO”, “direction”, “binary level”, “gaikake”, “foot”, “offset”, and “op”. The above "recognition code"
Is a number indicating the recognition master corresponding to the electronic component. “ALGO” is data indicating the scanning direction of the laser sensor, that is, the moving direction and distance of the transfer head, set according to the shape of the electronic component. The “direction” is data indicating whether the XY axis of the electronic component stored in a tray or a cassette (not shown) for supplying the electronic component is forward or reverse along the XY axis of the substrate. "2
The “value level” is threshold data when binarizing image data obtained by imaging the electronic component with an imaging camera (not shown). “Gaikake” is data representing the outer dimensions of the mold of the electronic component in the X-axis direction and the Y-axis direction in units of 0.1 mm. "Foot" means that the outer dimensions of the electronic component including the lead pin tip in the X-axis direction and the Y-axis direction are each 0.1
This is data expressed in millimeters. “Offset” is data representing an error tolerance of a measured dimension. “Op” is other data stored as needed.

Next, the laser sensor master 11c
“Op1”, “op2”, “execution sw”, “BENT”
Z "," BENT XY "," average PITCH "," error "," op3 ", and" op4 ".

The above "op1" is measured external dimension data by a laser sensor. These are calculated based on the number of encoder pulses indicating the moving amount of the transfer head, and store three types of external dimensions of the electronic component thickness t, the horizontal axis direction X, and the vertical axis direction Y.

"Op2" is the actual measured lead pin information by the laser sensor. The lead pin pitch PITCH and the lead pin number PIN are stored for each side (1 to 4). The measurement position PS-DELT is set in advance, and is then determined by actual measurement. Note that the pitch PITCH is calculated from the encoder pulse, and the number of lead pins PIN is obtained from on / off data of the laser sensor. The number of lead pins PINV imagined by the outer shape is obtained by calculation. "0" of the lead pin information in the same figure indicates that there is no pin, and "1" indicates that there is a pin. In addition, the lead pin information in the drawing indicates that a maximum of 100 lead pins may be provided on one side of the electronic component.

"1" of "execution sw" is a lead pin floating detection mode flag, "2" is a lead pin bending detection mode flag, and "3" is an electronic component positioning mode flag by a laser sensor. In both cases, “0” is not executed,
“1” is execution.

"BENT Z" is data representing the allowable range of the lift of the lead pin, and is expressed, for example, in mm.
“BENT XY” is data representing a permissible range of lead pin bending, and is represented by, for example, a 100-minute ratio (%).

"Average PITCH" is a simple average of the measured lead pin pitches of the four sides. "HOL" of "Error"
"D" stores "1" when the electronic component is held when an error is detected by actual measurement by the laser sensor, and stores "0" when the electronic component is discarded.

"Retry" stores the number of re-measurements upon detection of the above error. "Op3" and "op4"
Stores other appropriate data as needed. continue,
The operation of the embodiment having the above configuration will be described below.

First, FIG. 3 shows an operation procedure for mounting an electronic component on a substrate. As shown in the figure, each part of the main body device (electronic component mounting device) is adjusted (step SS).
1) Adjust the position of the laser sensor (Step SS)
2) After performing the laser teaching for generating the lead pin reference information of the electronic component which is the main part of the present invention (procedure SS
3), an actual electronic component mounting process using this laser sensor is performed (step SS4).

Next, FIG. 4 is a flowchart of a laser teaching processing operation of the electronic component. This process is executed by control of each unit by the main CPU 11 of the main body control unit 10 shown in FIG.

In the figure, first, the thickness t of the electronic component is measured (step TS1). In this process, first, the suction surface of the suction nozzle 22 of the transfer head 21 is measured at a reference position (height), and this position is stored as a measurement position. Thereafter, as shown in FIG. 5A, the electronic component 23 is sucked by the suction nozzle 22 and moved to the reference position, and the transfer head 21 is moved while the laser sensor 25 scans the mold bottom surface of the electronic component 23. Move upward. This movement has a distance of about 4 mm, and moves by one pulse of the encoder output of the pulse motor that drives the transfer head 21. During this time, the laser sensor 25 measures the bottom surface of the mold, calculates the thickness t of the electronic component 23 based on the amount of movement of the position closest to the stored measurement position, and stores the thickness t in the memory 1.
The information is temporarily stored in the electronic component recognition master 11a at 1 '(see FIG. 2). Electronic component 23 calculated from this mold bottom surface
Is not the actual thickness of the electronic component as described with reference to FIG. 13, but the actual thickness is obtained by adding a distance of 0.01 to 0.1 mm to the lower surface of the tip of the lead pin. . Therefore, the thickness calculated here is a temporary thickness.

Next, the process proceeds to the measurement of the outer shape of the electronic component 23.
First, the dimension X in the horizontal axis direction is measured (Step TS2).
In this process, the measurement reference position of the transfer head 21 is corrected based on the measured thickness t of the electronic component 23 so that the bottom surface of the mold of the electronic component 23 is located at a substantially correct measurement position, and then FIG. As shown in (2), the electronic component 23 moves in the vertical axis direction at a pitch of 30 μm while reciprocating in the horizontal axis direction at a width of 50 mm from the center of the electronic component 23. Thereby, the position of the tip of the lead pin protruding in the horizontal axis direction is detected. Even if the lead pins are arranged at a pitch of, for example, 0.3 mm, 30 μm
By moving the m pitches, three measurement values are obtained for each pin. The longest three data of these measured values are averaged to calculate a horizontal dimension X of the electronic component 23, and this dimension X is stored in the electronic component recognition master 11a.

Next, the vertical dimension Y is measured (step TS3). This processing is also the same as the case of the dimension X.
While reciprocating in the width of mm, it moves in the horizontal axis direction at a pitch of 30 μm, thereby detecting the position of the tip of the lead pin in the vertical axis direction and calculating the dimension Y of the electronic component 23 in the vertical axis direction. Then, the dimension Y is stored in the electronic component recognition master 11a.

Then, as shown in FIG. 6, the inner side corresponding to the measurement position PS-DELT is set as the scan (measurement) position by the laser sensor 25 from the external dimensions detected by the above measurement.

Subsequently, the pin information of the lead pins 24 on the four sides of the electronic component 23 is measured based on the set scan (measurement) position (step TS4). In this process,
The number and pitch of the lead pins 24 are measured. If there is a detection error in this measurement, as shown in FIG. 5C, the measurement position is moved by a predetermined amount and the measurement is performed again. If there is no detection error, the moved measurement position is replaced with a new measurement position P.
-Set as S.DELT. If the detection error is not eliminated after the re-measurement is performed a predetermined number of times, the electronic component is discarded and measurement is performed on a new electronic component of the same type.

Following the above, setting processing of the thickness t is performed (TS5). This process is a process for determining a correct lead pin position (measurement reference position) as a reference for the lead pin actual measurement process in the subsequent electronic component mounting process. In this processing, one of the two processing procedures shown in FIGS. 7A and 7B is executed.

FIG. 3A shows the above-described steps TS2 and T2.
In S3, when detecting the length of the lead pin 24, the displacement (height position) of the lead pin is also measured, and based on this height position (the position of the lower surface of the lead pin tip), the electronic component 2 is detected.
3 (step TS3 '), and the thickness t
After generating the lead pin information by performing the four-side measurement in step TS4 at the correct measurement reference position based on the above, the information is set in a predetermined area of the component recognition master together with the thickness t obtained by the above calculation. is there.

On the other hand, FIG. 4B shows the step TS4 in FIG.
When measuring the number and pitch of the lead pins 24, the displacement (height position) of the lead pins is also measured here, and the thickness t of the electronic component 23 is calculated based on the height position (step TS4). '), The thickness t is set in a predetermined area of the component recognition master.

As shown in FIG. 8, the first step TS1
The thickness t (temporary t) of the electronic component obtained by measuring the bottom surface of the mold is the thickness of the mold only, not the true thickness including the lower surface of the tip of the lead pin projecting laterally downward. . The error between the provisional t and the true thickness (actual t) calculated in step TS3 'or TS4' is about 0.01 mm for a small electronic component, but as large as 0.1 mm for a large electronic component. May exceed the allowable limit. Therefore, in order to detect the state of the lead pin in the electronic component mounting work, in particular, the amount of displacement directly connected to the floating defect, it is necessary to measure the lead pin based on the accurate measurement position based on the thickness of the electronic component. . The above thickness t
The setting process of (actual t) is performed to satisfy this need. In addition, this eliminates the need for an operator to perform an input operation, thereby improving work efficiency.

Next, the operation of this embodiment for detecting lead pin defects in the electronic component mounting process in the work procedure SS4 shown in FIG. 3 will be described with reference to the flowcharts shown in FIGS. In this process, the process shown in the flowchart of FIG. 9 is performed by the main CPU 11 of the main body control unit 10, and the process shown in the flowchart of FIG. 10 is performed by the laser I / O control unit 30.

In the flowchart shown in FIG. 9, the main CPU 11 first performs an origin operation (step M1). In this process, at the start of operation when the power is turned on, the respective drive systems in the X-axis direction, the Y-axis direction, the rotation direction, the vertical direction, and the like are driven to set and stop the transfer head 21 at the reference position. It is.

Subsequently, the laser I / O control unit 30 sends the I / O
A laser I / O initialization command A is output via the F control unit 12 (step M2). Thereby, the laser I
The / O control unit 30 performs an initial mode setting process, which will be described later, and determines the end of the initial mode setting in the main C / O mode.
Notify PU11.

After confirming the end of the initial mode setting (step M3), the main CPU 11 moves the transfer head 21 to the component mounting table (not shown), and
2, a predetermined electronic component 23 is sucked, and the electronic component 2
Image recognition processing for rough centering 3 is performed (step M4).

In this process, the transfer head 21 is moved above the image recognition camera disposed near the guide rail for guiding the substrate on the main unit base, and the suction of the sucked electronic components 23 is performed. The state is imaged by the image recognition camera, and the image of the electronic component 23 obtained by the imaging is recognized, and the transfer head 21 is rotated so that each side of the electronic component 23 faces the X-axis direction and the Y-axis direction, respectively. This is a process of correcting and further correcting the position of the center of the electronic component 23 deviated from the center of the reference visual field. Thus, the preparation for scanning the lead pins 24 of the electronic component 23 is completed.

Next, a servo motor encoder X1 for moving the transfer head 21 is provided to the laser I / O control unit 30.
The displacement amount measurement command B of the arrangement position of the lead pin 24 is output together with the pulse number data of 5 '(step M5). As a result, the laser I / O control unit 30 notifies the main CPU 11 of the start of a lead pin displacement measurement process, which will be described later, and then executes the lead pin displacement measurement process, and then terminates the lead pin displacement measurement. Notify.

After confirming the start of the lead pin displacement measurement by the laser I / O control unit 30 (step M6), the main CPU 11 drives the X-axis servo motor 15 (or Y-axis servo motor 16) by a predetermined number of pulses. Then, the transfer head 21 is moved (Step M7). As a result, FIG.
When the lead pin shown in FIG.
Similarly to the case of moving from -1 to the position 2-2, the suction nozzle 22 of the transfer head 21 moves, and the lead pin 24 on one side of the electronic component 23 sucked by the suction nozzle 22 Scanning is performed by the laser sensor 25.

Subsequently, it is confirmed that the measurement of the lead pin displacement amount by the laser I / O control unit 30 has been completed (step M).
8) It is determined whether or not the scanning of the lead pins 24 on the four sides of the electronic component 23 has been completed (step M9). This process is, for example, a process of setting “4” in a subtraction register built in the main CPU 11, subtracting “1” each time scanning processing of one side is completed, and determining whether the subtraction register has become “0”. is there.

If the scanning of the lead pins 24 on the four sides has not been completed yet, the process returns to step M5, and steps M5 to M9 are repeated. In step M5, the pulse number data for the movement of the transfer head 21 output together with the displacement amount measurement command B includes the pulse number data of the servo motor encoder X15 'and the pulse number data of the servo motor encoder Y16' for each scanning process of one side. The pulse number data, the reverse rotation pulse number data of the servo motor encoder X15 ', and the reverse rotation pulse number data of the servo motor encoder Y16' sequentially change again.

In this manner, the scanning of the lead pins 24 on the four sides is performed. After confirming the completion of the scanning on the four sides in step M9, the laser I / O control unit 30 sends the measured (scanned) data A lead pin measurement data determination command C is output so as to output a determination result (step M10).
Thus, the laser I / O control unit 30 performs a read measurement data determination process described later, and notifies the main CPU 11 of the result of the process.

The main CPU 11 confirms that the read measurement data judgment result has been input from the laser I / O control unit 30 (step M11), and executes a process based on the input result (step M12). In this process, if the lead floating determined by the laser I / O control unit 30, that is, the displacement amount of the lead pin arrangement position is within the allowable value,
The process of mounting the electronic component 23 on the board is executed. On the other hand, if the displacement of the lead pin arrangement position exceeds the allowable value, the process is executed to discard the electronic component 23.

Next, the processing performed by the laser I / O control unit 30 based on the command from the main CPU 11 will be described. In the flowchart shown in FIG.
It waits for an initialization command A input from the CPU 11 (step S1).

When the initialization command A is inputted, the initial mode is set (step S).
2). This process is a process of clearing a built-in counter, memory, and the like, and setting the laser sensor 25 to a read scanning mode.

After the above processing is completed, a read displacement measurement command B input from the main CPU 11 is awaited (step S3). Then, when the lead pin displacement amount measurement command B is input, the lead pin displacement amount measurement is executed (step S4). In this process, the pulse number data of the servo motor encoder input together with the lead pin displacement amount measurement command B is set in a register, and the main CPU 11 is notified of the start of the lead pin displacement amount measurement. The controller 28 outputs a control signal to cause the laser sensor 25 to start laser irradiation to start scanning of the lead pin 24, to capture the reflected light, and to measure the lead position based on the reflected light data. ,
The lead arrangement position data based on the measurement is stored in the memory, and the processing is performed by the drive system control unit 1 of the main body control unit 10.
3 is input via the servo motor encoder X15 '.
Or, it repeats until the pulse number data of Y16 'matches the pulse number data stored in the register, and when the both pulse number data match, the measurement is terminated,
This is a process of turning off the laser irradiation and notifying the main CPU 11 of the end of the measurement process.

After the above processing is completed, the process waits for a read measurement data determination command C input from the main CPU 11 (step S5). Then, when the lead measurement data determination command C is input, a determination process of the lead measurement data is performed (step S6). In this process, read measurement data (positioning data of the lead pins 24) obtained by scanning is read from the memory, and the read measurement data is analyzed for each side. After reading out the lead pin information of the electronic component 23 set in the predetermined area and determining whether there is a lead pin error such as loss or breakage, next, a process of calculating a displacement amount of the arrangement position data of the lead pin 24 is performed. is there.

The displacement thus measured is transmitted from the laser I / O control unit 30 to the interface RS232C.
The data is output to the main CPU 11 of the main body control unit 10 via the I / F control unit 12. The main CPU 11 determines the quality of the electronic component 23 based on the displacement amount in step M12 of FIG.

[0061]

As described in detail above, according to the present invention,
Since the accurate thickness and external dimensions of the electronic component required for measuring the lead pin of the electronic component can be automatically scanned and set, it is possible to automatically generate the lead pin information serving as measurement reference data, and therefore, the operator This eliminates the need for prior input of measurement reference data, thereby improving the efficiency of mounting electronic components on a board.

[Brief description of the drawings]

FIG. 1 is a configuration block diagram of an electronic component recognition device according to one embodiment.

FIG. 2 is a diagram illustrating a data configuration of automatically generated lead pin information.

FIG. 3 is a diagram illustrating an operation procedure for mounting an electronic component on a substrate according to the embodiment.

FIG. 4 is a flowchart of a laser teaching processing operation.

5A is a diagram illustrating a method of measuring the thickness of an electronic component, FIG. 5B is a diagram illustrating a method of measuring the external dimensions of the electronic component, and FIG. It is a figure explaining a method.

FIG. 6 is a diagram illustrating a relationship between an external dimension of an electronic component and a measurement position.

FIGS. 7A and 7B are diagrams showing two processing procedures for determining a measurement reference position of a lead pin.

FIG. 8 is a diagram illustrating a relationship between a provisional thickness (provisional t) and a real thickness (actual t) of an electronic component.

FIG. 9 is a flowchart illustrating an operation of a main CPU of the main body control unit.

FIG. 10 is a flowchart illustrating an operation of a laser I / O control unit.

FIG. 11 is a diagram illustrating a state in which an electronic component is measured by a conventional laser sensor.

FIG. 12 is a diagram illustrating an example of a method of moving an electronic component measured by a laser sensor.

FIG. 13 is a diagram illustrating a measurement position of a lead pin of an electronic component.

[Explanation of symbols]

1, 21 Transfer head 2, 22 Suction nozzle 2-1 2-2, 2-3, 2-4 Movement position of suction nozzle 3, 23 Electronic component 4, 24 Lead pin 4-1 4-2, 4- 3, 4-4, 4-5, 4-6 Lead pin measurement position 5, 25 Laser sensor 6 Emission port 7 Light receiving section 10 Main body control section 11 Main CPU 11 'Memory 11a Electronic component recognition master 11b Image recognition master 11c Laser Sensor master 12 I / F controller 13 Drive system controller 14 I / O port 15 X-axis servo motor 15 'Servo motor encoder X 16 Y-axis servo motor 16' Servo motor encoder Y 20 Laser displacement meter 28 Displacement meter controller 30 Laser I / O control unit S1, S2, S2, S3 Scanning part of lead

Claims (5)

(57) [Claims] An electronic component recognizing device for recognizing a state of a lead pin of an electronic component sucked by a suction nozzle of a transfer head using a laser sensor, wherein the electronic component is moved upward to temporarily store the temporary thickness of the electronic component. A temporary thickness measuring means for measuring the thickness, and a displacement measuring means for measuring a displacement of a lead pin of the electronic component.
And the step , obtained by the displacement measuring means and the temporary thickness measuring means
Outer shape measuring means for correcting the distance of the measurement focal point of the laser sensor by an amount corresponding to the thickness obtained by adding the respective thickness data , and measuring the outer dimensions of the electronic component with the distance corrected measuring focus; A lead pin measuring unit for calculating a lead pin measurement site of the electronic component based on the external dimension data obtained by the means, and measuring a state of the lead pin of the electronic component based on the calculated measurement site. Electronic component recognition device characterized by the above-mentioned. 2. The method according to claim 1, wherein the provisional thickness measuring unit measures a mold bottom of the electronic component sucked by a suction nozzle of the transfer head and stores a mold bottom of the electronic component in advance.
The electronic component is moved upward until a reference position
2. The electronic component recognition device according to claim 1 , wherein the provisional thickness of the electronic component is measured . 3. The electronic component recognizing device according to claim 1, wherein the lead pin state of the electronic component measured by the lead pin measuring means is a distance from a lower surface of the tip of the lead pin to the laser sensor. 4. A lead pin state of the electronic component measured by said lead pin measuring means, Ri arrangement pitch der of the lead pin tip, the lead pin measuring means, the measured lead pin
When the detection error occurs in the arrangement pitch of the distal end portion's predetermined amount
Only measuring position the electronic component recognizing apparatus according to claim 1, wherein that you measured again by moving the. 5. The lead pin state of the electronic component measured by said lead pin measuring means, Ri sequence number der of the lead pin tip, the lead pin measuring means, the measured lead pin
If a detection error occurs in the number of arrays at the tip , only a predetermined amount
Electronic component recognition device according to claim 1 wherein moving characterized that you again measured measurement position.