JPH04326785A - Optical semiconductor device - Google Patents

Abstract

PURPOSE:To constitute the mount block to mount the optical semiconductor of a light semiconductor device so that the manufacture cost may be low. CONSTITUTION:For the aforementioned purpose, a stem 1 is so processed as to have an oblong projection 20 at the position in which to form a mount base block, and an oblong block is laid on the projection 20 and is junctioned with it to form a mount base block 21.

Description

[Detailed description of the invention]

0001

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to the structure of a mount base block in an optical semiconductor device.

0002

2. Description of the Related Art An example of the configuration of a stem mount base block in a conventional optical semiconductor device is shown in a top view (a),
Shown as front view (b). The stem 1 is provided with a mount base block 2 and glass-sealed lead terminals 4 and 9, and the mount base block 2 is made of a good conductor such as copper. Furthermore, the entire structure is coated with gold vapor deposition, etc., except for the glass-sealed parts. Further, the bonding base block of the mount base block 2 is asymmetrical with respect to the center line of the stem 1 that intersects at right angles to the surface having the bonding portion 3, and has a wide shape toward the lead terminal 9 side. A hole 10 for glass sealing of the lead terminal 9 is provided in a part of the part near the stem 1 on the lead terminal 9 side.
A notch is provided to avoid interference with the lead terminal 9. The shape of this notch is various, such as a tapered shape or an arc shape.

First, a monitoring photodiode 13 is bonded to the stem 1, and the photodiode 13 and the lead terminal 9 are connected by a wire 14. Next, the semiconductor laser chip 5 is bonded to a predetermined position of a heat sink 6 made of semi-insulating silicon coated with gold vapor deposition, and this is bonded to a predetermined position of the mount base block 2 using lead-tin solder or the like. . Thereafter, the semiconductor laser chip 5 and the bonding portion 3 of the mount base block 2 are connected by a wire, and the bonding portion 12 of the heat sink 6 and the lead terminal 4 are connected by the aforementioned wire. When reversing the electrical polarity of the semiconductor laser chip 5, connect the semiconductor laser chip 5 and the lead terminals 4 to the bonding portion 12 of the heat sink 6 and the bonding portion 3 of the mount base block 2 using the aforementioned wires, respectively. This allows changes to be made easily without changing the polarity of the leads.

Here, the stem 1 and the mount base block 2 are machined as a single mount base block as shown in FIG. After that, the stem 1 is integrally molded by bonding by brazing or the like with the stem 1 which has been driven by a metal mold.

[0005]

[Problems to be Solved by the Invention] However, in the stem structure described above, since the shape of the mount base block is complicated in the stem manufacturing process, it is necessary to machine the mount block alone, and then the mount block and stem Since they are connected by brazing or the like, an increase in cost due to machining cannot be avoided.

[0006] As described above, in order to eliminate the problem of high manufacturing costs for optical semiconductor devices due to the need for molding by machining of the mount base block, the shape of the stem and the shape of the mount base block are improved. The purpose of this invention is to provide an optical semiconductor device that requires no machining and requires no manufacturing cost.

[0007]

[Means for Solving the Problems] In order to solve the above-mentioned problems, the present invention provides an optical semiconductor device in which the shape of the mount base block is a simple rectangular parallelepiped, the mount base block is joined to the opposing stem, and A projection smaller than that of the mount base block is provided, and both are joined by brazing or the like.

[0008]

[Function] As described above, the present invention allows the mount base block to have a simple shape, eliminates the machining process, and can be made into the same shape as the conventional one, thereby reducing the manufacturing cost of the optical semiconductor device.

[0009]

Embodiment FIG. 1 shows the configuration of an embodiment of the present invention. When the stem 1 is processed by cold forging or the like using a die, a rectangular protrusion 20 smaller than a mount base block 21 (described later) is simultaneously formed at a position where a mount base block is formed. This protrusion processing 20 has a simple shape and has no steps, so it can be formed relatively easily in the same process. One of the mount base blocks 21 is a block formed into a simple rectangular parallelepiped, and is integrally molded onto the upper surface of the projection 20 of the stem 1 formed in the above-described process by adhesion such as brazing.

[0010] With the above structure, a mount base block having a notch in a part can be formed using any material without requiring a machining process as in the conventional method.

[0011]

As explained above, according to the present invention, the shape of the mount base block can be simplified, the machining process can be eliminated, and the shape can be made into the same shape as the conventional one, thereby reducing the manufacturing cost of optical semiconductor devices. can be reduced. Furthermore, since the mount base block and the stem are joined and integrally molded, the mount base block can be applied even when the stem is made of different materials.

[Brief explanation of drawings]

FIG. 1: Configuration diagram of an embodiment of the present invention

[Figure 2] Configuration diagram of optical semiconductor device

[Figure 3] Configuration diagram of conventional example

[Explanation of symbols]

1 Stem 20 Protrusion

Claims (1)

[Claims] 1. An optical semiconductor device in which an optical semiconductor is mounted on a mount base block formed on a stem via a heat sink, wherein the stem has a rectangular protrusion at a position where the mount base block is formed, An optical semiconductor device characterized in that a rectangular block is stacked and bonded to the protrusion to form a mount base block.