JP2501588Y2 - Semiconductor laser equipment - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION [Industrial field of application] The present invention relates to a semiconductor laser device used as a light source for consumer / industrial and communication purposes.

[Conventional technology]

FIG. 2 is a side view showing a conventional semiconductor laser device.
In the figure, (1) is a stem, (2) is a block assembled to the stem (1), (4) is a submount II,
(5) is an insulating groove provided on the upper surface of the submount II (4), (6) is a laser chip die-bonded on the submount II (4), (7) is a pole, and (8) is a gold wire. .

Next, the operation will be described. When a voltage is applied between the stem (1) and the pole (7), laser light is emitted from the laser chip (6). 2 (a) shows the case of the pin arrangement with the pole on the left side, and FIGS. 2 (b) and 2 (c) show the case with the pole on the right side.

[Problems to be solved by the device]

Since the conventional semiconductor laser device is configured as described above, when the pin arrangement is reversed, the gold wire has to be bonded to the circuit as shown in FIG. 2 (b).
Further, as shown in FIG. 2 (c), since a laser chip in which the submount is turned in the opposite direction must be die-bonded, the versatility is deteriorated.

The present invention has been made in order to solve the above problems, and an object thereof is to obtain a semiconductor laser device which can be shared by the same die bond assembling method even when the pin arrangement is different.

[Means for solving the problem]

In the semiconductor laser device according to the present invention, a submount for die-bonding a laser chip is provided with an insulating groove so as to surround three surfaces of the laser chip excluding the front end surface.

[Action]

In the semiconductor laser device according to the present invention, the insulating groove of the submount is provided so as to surround the three surfaces except the front end surface of the laser chip, so that the die bond assembling method can be shared even when the pin arrangement is different.

〔Example〕

 An embodiment of the present invention will be described below with reference to the drawings.

In FIG. 1, (1) is a stem, (2) is a block assembled to the stem (1), (3) is a submount I, and (5) is provided on the upper surface of the submount I (3). Insulation grooves, (6) are laser chips die-bonded onto the submount I (3), (7) is a pole, and (8) is a gold wire.

Next, the operation will be described. When a voltage is applied between the stem (1) and the pole (7), laser light is emitted from the laser chip (6). FIG. 1 (a) shows the case of the pin arrangement with the pole on the left side, and FIG. 1 (b) shows the case of the pole on the right side.

[Effect of device]

As described above, according to this invention, since the insulating groove is provided on the submount so as to surround the three surfaces excluding the laser front end surface, the die bonding assembling method of the laser chip can be shared regardless of the pin arrangement, and the semiconductor laser device can be used. It can be made inexpensive and
This has the effect of unifying the assembly process.

[Brief description of drawings]

1A and 1B are side views showing a semiconductor laser device according to an embodiment of the present invention, and FIGS. 2A to 2C are side views showing a conventional semiconductor laser device. In the figure, (1) is a stem, (2) is a block,
(3) is a submount I, (5) is an insulating groove, (6) is a laser chip, (7) is a pole, and (8) is a gold wire. In the drawings, the same reference numerals indicate the same or corresponding parts.

Claims (1)

(57) [Scope of utility model registration request] 1. A semiconductor laser device comprising a submount for die-bonding a semiconductor laser chip, wherein insulating grooves are provided so as to surround three surfaces of the laser chip excluding the front end surface.