JP3128207B2 - Semiconductor laser unit - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor laser unit which is incorporated in an optical disk or other various optical devices to constitute a pickup. More specifically, the present invention relates to a laser diode chip for a light source in a hologram type pickup. The present invention relates to an improvement of a semiconductor laser unit in which a light receiving element for reading a signal and a light receiving element for reading a signal are arranged in one package.

[0002]

2. Description of the Related Art Recently, music CDs and other CD-ROs have been developed.
In various optical disk systems such as M and MD, a hologram type pickup employing a hologram element (HOE) having functions such as beam generation, light branching, and error signal generation in an optical system has been proposed. This pickup has a semiconductor laser unit A 'in which an LD chip 100 for a light source and a light receiving element 200 for signal reading are arranged in one package.
And a hologram element B bonded and fixed to the upper surface of the semiconductor laser unit A ′ (FIG. 8). Such a hologram type pickup can achieve various advantages such as reduction in the number of parts, improvement in environmental resistance, reduction in size and weight, reduction in price, and high-speed access. When examined in detail, the following points left room for improvement.

That is, as shown in FIG. 8, a conventional semiconductor laser unit has a base (island) 1 'having a stem made of metal such as Kovar, and an LD chip 100 and a light receiving element 200 mounted on the base 1'. The terminal pins 2 are inserted and set in a plurality of holes 80 formed in the base 1 ′, and the LD chip 100 and the light receiving element 200 are electrically connected to predetermined pins 2 by wire bonding 3. 4 is a metal cover for sealing the upper surface of the base 1 '. For optical reasons, the light receiving element 200 is the base 1 '
While the LD chip 100
Is fixed to the side of the mounting surface 82 erected on the base 1 ′ so that the laser emission point is higher than the light receiving element 200 and the laser emission point is directed upward, and the LD chip 100 is almost perpendicular to the upper surface of the base 1 ′. The light receiving elements 200 are each kept substantially horizontal. In this prior art, after the pin 2 is inserted into the hole 80 of the base 1 ′, the hole 80 is filled with a glass sealant 83 or the like to fix and insulate the pin 2. Is naturally limited, and it is difficult to further reduce the size of the base 1 '.
-There was a problem that it was not possible to immediately respond to the need for further miniaturization and lightening of optical applied devices such as ROM drives, music CDs, MDs, and other portable and in-car players.

[0004]

In order to meet such a need, the present applicant has already proposed a semiconductor laser unit shown in FIG. 9 (Japanese Patent Application No. 9-8486). In this prior art, an island 1, which is a base on which an LD chip 100 and a light receiving element 200 are mounted, a lead frame 2 'having lead pins 2 in a multi-finger arrangement, and fixing and insulation of the lead pins 2 to the island 1 are performed. .. Having a resin mold portion 90, the lead pins 2 forming the periphery of the island 1 are used as electrical connection terminals, and the pins 2 are inserted into a plurality of holes 80 formed in the base 1 ', respectively. Compared with the above-described conventional technology in which the pin 2 is fixed and insulated by filling with resin or the like, the island 1 serving as the base can be made as small as possible, and the lead frame 2 can be further downsized. 'Means that multiple products can be molded on one strip-shaped metal plate as a substrate. There is ensured a reduction in the number of components can be mass-produced with high precision products no variation. By the way, in the prior art in which the inner lead portions 2 ″ of the respective lead pins 2 arranged substantially horizontally around the island 1 are drawn into the resin mold portion 90 to fix and insulate the respective lead pins 2. 2 ”results in the LD chip 100 and the light receiving element in the island 1
The layout will take up 200 mounting space. For this reason, the island 1 must be slightly enlarged to secure the necessary space for mounting the LD chip 100 and the light receiving element 200, and there is still room for improvement in miniaturization to a minimum. there were.

SUMMARY OF THE INVENTION The present invention has been made in view of the above-mentioned circumstances, and a technical problem of the present invention is to provide a semiconductor laser unit in which an LD chip for a light source and a light receiving element for signal reading are arranged in one package. It is to realize further miniaturization.

[0006]

According to a first aspect of the present invention, a laser diode for a light source is provided at a predetermined position on a side surface of an island formed in an arbitrary three-dimensional shape. The chip, a light-receiving element for signal reading is fixed to a predetermined portion of the upper surface portion, respectively, and a plurality of lead pins electrically connected to the laser diode chip or the light-receiving element, the resin molded portion of the island,
A semiconductor laser unit held in parallel in a vertical direction, wherein each of the lead pins has an inner lead portion positioned below a light receiving element fixed to an upper surface portion of the island so as to be inside the resin molded portion. And the inner lead part is
Has an exposed surface that is partially exposed on the side surface of the resin molded part
The exposed surface and the laser are embedded in the resin molding portion.
Wire bond with diode chip or light receiving element
The main point is that they are electrically connected by a ring. According to claim 2, of the island formed in an arbitrary three-dimensional shape,
A laser diode chip for the light source at a specified location on the side
And a light-receiving element for signal reading at a predetermined location on the top surface.
And fixed, the laser diode chip or
A plurality of lead pins electrically connected to the light receiving element,
Vertically parallel to the resin molded part of the island
The semiconductor laser unit being held, wherein
Each lead pin has an inner lead
Located below the light receiving element fixed to the top of the island
Embedded in the resin molding part,
Are the respective electrodes that are electrically connected to the lead pins.
Part is provided on the lower surface side, and the inner lead part is
Make the tree so that the upper end face in the vertical direction faces the electrode part.
The electrode part and the inner lead are embedded in the resin molding part.
Direct pressure contact with the upper end surface or bonding via bumps
And electrically connect the lead pins to the respective electrode portions.
The inner lead part is partially covered with the resin
An exposed surface that is exposed on the side surface of the molded portion is provided inside the resin molded portion.
Embedded in the exposed surface and the laser diode chip
Is electrically connected by wire bonding . According to claim 3, according to claim 1 or 2,
There are, the resin molded portion, parallel in the lead frame
The gist of the present invention is that the lead pin is formed by molding with a resin mold . According to claim 4, in claim 3,
The island has a pair of front and rear resin molding parts,
Metal parts fixed in a sandwiched manner by both resin moldings
Consisting of an Irland substrate, the laser diode chip
The gist is that it is attached to the side surface of the island base .

According to the above technical means, the following effects are obtained. (Claim 1) In the present semiconductor laser unit, the inner lead portions of the respective lead pins are embedded in parallel in the vertical direction below the light receiving element fixed to the upper surface of the island. Therefore, it is not necessary to secure a margin for fixing or bending the inner lead portion in the width direction of the island, so that the island is small in its width dimension to a minimum that can mount the LD chip and the light receiving element. Can be Further, the fixing for holding the respective lead pins in the vertical direction and in parallel with the island and the insulation between the respective lead pins can be performed simultaneously with the molding of the resin molded portion. In addition, the inner
While the structure is embedded in the lower part of the light receiving element,
Electricity between the inner lead, LD chip and light receiving element
Ensure reliable connection by wire bonding
Can be. (Claim 2) The semiconductor laser unit is provided with each lead pin.
The inner lead part of the
It is embedded in parallel in the vertical direction below the optical element.
Become so. Therefore, in the width direction of the island
To secure the fixing allowance and bending allowance for the inner lead part.
Eliminates the need for the island so its width
Small enough to mount LD chip and light receiving element
Can be In addition, connect each lead pin to an iron
To be held vertically and side by side
Fixing and insulation between the lead pins
Can be performed simultaneously with molding. In addition, the inner
While the structure is embedded in the lower part of the light receiving element,
The electrical connection between the inner lead and LD chip
This can be reliably achieved by wire bonding.
And it is the connection part with the lead pin in the light receiving element.
An electrode is formed on the lower surface of the light receiving element, and the electrode and inner
-Wire bonding with the upper end surface (tip surface) of the lead
Direct or direct connection without any intervening
Because it does not require wire bonding,
Can be modeled. Also, the electrode part is located on the lower surface side of the light receiving element.
As a result, the size of the light receiving element itself can be reduced.
As a result, the width of the island (the width for mounting the light receiving element)
Dimensions) can be further reduced, and significant miniaturization is realized. (Claim 3) The semiconductor laser unit according to claim 1 or
In addition to the second working, vertical each Lee Dopin the resin molding part
Fixing for holding in parallel with
Insulation between lead pins, with lead frame as core
And therefore lead pins can be inserted one by one into the mold.
Eliminating the complexity of molding by inserting and positioning
Can be. (Claim 4) The semiconductor laser unit according to the third aspect of the present invention has an island made of a minimum necessary metal material.
Laser diode with high precision flatness and squareness of substrate
Form the mounting surface (horizontal surface or vertical surface) for the chip and light receiving element
You.

[0008]

Next, an embodiment of the present invention will be described with reference to the drawings. 1 to 3 show a half according to claim 1 .
4 to 7 of the semiconductor laser unit according to claim 2
Example of each embodiment of semiconductor laser unit
The shows.

First, an example shown in FIGS. 1 to 3 will be described. Reference numeral A denotes a semiconductor laser unit of the present invention. This semiconductor laser unit A includes an LD chip 100 for a light source and a light receiving element 200 for signal reading. The LD chip 100 and the light receiving element 200 are arranged in an island 1 together with a hologram element (not shown) arranged in one package and fixed to the upper surface of the package. Mounted on the LD chip
The light receiving element 100 and the light receiving element 200 are electrically connected by wire bonding 3 to a plurality of lead pins 2 held in parallel on the island 1 in the vertical direction. In this embodiment, each of the lead pins 2 is connected to the resin molded portion 1 of the island 1.
1 and 12 are held in parallel in the vertical direction,
The resin molded portions 11 and 12 and the metal island base 13 are fixed to each other by fixing the connecting portions 14 to form the island 1.

The resin molding portions 11 and 12 use a pair of front and rear two pieces.

Both of the resin molded portions 11 and 12 are resin molded products, and the front resin molded portion 11 and the rear resin molded portion 12 are substantially flat as shown in FIG. It is formed to have a three-stage shape of a lower stage 11a, 12a, a middle stage 11b, 12b, and an upper stage 11c, 12c, each of which has a slender rectangular shape and a gradually decreasing area from below to above, and middle portions 11b, 12b thereof.
An opening 15 for securing a space for mounting the LD chip 100 is formed in the central portion in the longitudinal direction of the upper and lower portions 11c and 12c, and when the two are combined (when matched)
In the first embodiment, a relationship is created in which there is a gap in the center where the island base 13 is accommodated.

The island base 13 is formed by cold casting or the like using a desired metal material. This island substrate
As shown in FIG. 3, the left and right ear portions 13a, 13a formed to fit into gaps formed when the above-mentioned resin molded portions 11, 12 are combined, and the rear resin molded portion 12 as shown in FIG. It has a shape in which a recess 13b formed to fit into the central opening 15 is provided continuously.

Thus, the pair of front and rear resin molded portions 11, 1
The two mounting portions (joining surfaces) 14 of the three members 11, 12, and 13 are joined together so that the island substrate 13 is sandwiched by the two, and a mounting portion for the LD chip 100 and the light receiving element 200 is provided. Assemble Island 1.

As is apparent from the figure, the mounting portion of the LD chip 100 has a vertical upright surface 16 serving as a bottom surface in the recess direction of the recess portion 13b.
The LD chip 100 is fixed to the vertical upright surface 16 via a monitoring photodiode 300 by bonding or the like. Also, the horizontal upper surface 17a on the right side of the vertical standing surface 16 is
It becomes the mounting part of the light receiving element 200.

The lead pins 2 are connected to the front resin molding portion 11,
When each of the resin molding portions 12 on the rear side is molded by a resin mold, the resin molding portions 12 are dispersed and integrated with the resin molding portions 11 and 12.

The lead pins 2 are formed on a lead frame (not shown).
A strip-shaped ultra-thin metal plate serving as a base material, for example, a 42 alloy plate or a copper plate, which is formed by applying known means such as press molding or etching to have a plurality of lead pins 2 in a desired pitch at a large number in parallel. With the lead frame set in a predetermined molding die (a mold for molding the front and rear resin portions 11, 12), the resin molding portions 11, 12 are set.
By molding, the required number of lead pins 2 are held in parallel in the vertical direction with respect to the resin molded portions 11 and 12 to be molded.

The lead pins 2 provided on the side of the horizontal upper surface 17a serving as the mounting portion of the light receiving element 200 have a part of the side surface near the upper end surface (projection end surface) 18 of the inner lead portion 2 ". It is held by the resin molding portions 11 and 12 so as to become an exposed surface 19 exposed on the side surfaces of the upper portions 11c and 12c of the molding portions 11 and 12. On the other hand, on the horizontal upper surface 17b side on the left side of the vertical standing surface 16 Of the inner lead portions 2 "are exposed surfaces 18 'which are exposed on the horizontal upper surface 17b, and one of the side surfaces near the upper end surface of the inner lead portion 2". The lead pins 2 are held by the resin molding portions 11 and 12 such that the portions become exposed surfaces 19 exposed on the side surfaces of the upper steps 11c and 12c in the resin molding portions 11 and 12. The lead pins 2 are connected to the front and rear resin portions, respectively. After the molded parts 11 and 12 are released from the mold, they are cut from the lead frame.

A front resin molding portion 11 and a rear resin molding portion having the lead pins 2 in parallel in the vertical direction.
12, bonding of the island base 13 is performed, as described above, with the island base 13 disposed in the middle,
The recess 13b of the island base 13 fits into the opening 15 of
The joining surfaces of the three members 11, 12, and 13 to be the joining portions 14 are fixed to each other by ultrasonic bonding or the like so that the opening 15 of the rear resin molding portion 12 communicates with the opening 13b. Done.

After the island 1 is assembled from the island base 13, the front resin molding portion 11, and the rear resin molding portion 12, the LD chip 100 is placed on the vertical upright surface 16 and the light receiving element is mounted.
200 are adhered to the horizontal upper surface 17a, and thereafter, the above-mentioned exposed surfaces 18 ', 19 of the inner lead portion 2 "and LD
The chip 100 and the light receiving element 200 are electrically connected by the wire bonding 3, and the cover 4 is covered from above so as to cover the entire upper surface of the assembly, thereby completing the semiconductor laser unit A. Since the exposed surface 18 'is a cut surface, it is preferable that the exposed surface 18' be wrapped in order to improve the conductivity and connection reliability with the bonding wire 3.

A window hole 21 covered with a transparent plate 20 is formed in the cover 4, and a hologram element (not shown) is mounted on the window hole 21 to complete a hologram type pickup.

For fixing the cover 4, high-frequency bonding, bonding,
Appropriate fixing means such as welding, fitting, and engagement can be employed. In addition, the resin molded portions 11 and 12 and the island substrate
These appropriate fixing means can also be used for the bonding of the thirteenth embodiment.

Incidentally, the LD chip 100 and the light receiving element 200 are well known in this kind of technical field,
0 is a photodiode so that the laser emission point faces upward
The light receiving element 200 has a light detecting portion 201 at the center on the upper surface side, and has electrode portions 202 electrically connected to the respective lead pins 2 on both left and right sides thereof.
It has.

Thus, in the semiconductor laser unit A of the present embodiment configured as described above, the inner lead portion 2 ″ of each of the lead pins 2... Is located below the light receiving element 200 fixed to the horizontal upper surface 17a of the island 1. Therefore, it is not necessary to secure a margin for fixing or bending the inner lead portion 2 ″ in the width direction of the island 1. In the width dimension, the size can be reduced to the minimum size where the LD chip 100 and the light receiving element 200 can be mounted. Further, a fixing for holding the respective lead pins 2... In a vertical direction and in parallel with the island 1 and the respective lead pins 1.
The insulation between them can be performed simultaneously with the molding of the resin molded portions 11 and 12. Also, while the inner lead portion 2 "is embedded in the resin molded portions 11 and 12, the electrical connection between the inner lead portion 2" and the LD chip 100 and the light receiving element 200 is ensured by the wire bonding 3. be able to. Furthermore, each of the lead pins 2.
The lead frame can be fixed as a core body to fix the lead pins 11 and 12 in the vertical direction and in parallel and to insulate the lead pins 2 from each other. Therefore, the lead pins 2 are inserted one by one into the mold. This eliminates the complexity of molding during positioning. In addition, since the lead pins 2 can be formed at a higher density due to the manufacturing accuracy of the lead frame, and since the lead frames can be formed once or continuously for a plurality of products on a strip-shaped metal plate, the lead pins 2 can be specially bonded or fixed. This makes it possible to hold the island 1 with high integration and high precision without using any means or the like. This makes it possible to form the inner lead portion 2 ″ on the tip end side of the lead pin 2 by bending as in the above-described prior art. In addition to simplifying the molding operation and process, it is possible to provide a highly reliable semiconductor laser unit A without being affected by bending accuracy or the like at all. The LD chip 100 and the light receiving element 200 can be mounted at an accurate flatness and squareness, and high mounting accuracy is required. Thus, excellent advantages such as stable and accurate mounting of parts can be achieved.

As another example of the present embodiment, although not shown, the entire island 1 may be formed as an integrally molded product made of resin.

Next, an example of the embodiment shown in FIGS. 4 to 7 will be described. In the semiconductor laser unit A of this embodiment, the light receiving element 210 mounted on the island 5 and the island 5 are arranged in parallel in the vertical direction. Are connected directly without the wire bonding 3. Hereinafter, components similar to those in the above-described example are denoted by reference numerals in the drawings, and description thereof will be omitted. Only the features of this example will be described.

As shown in FIG. 7, the light receiving element 210 of this embodiment has a light detecting portion 201 at the center on the upper surface side, and has an electrode portion 202 electrically connected to each lead pin 2. New on both sides of the
The size of the light receiving element 200 is reduced as compared with the well-known light receiving element 200 described above by the arrangement of the element 202 on the lower surface side.

The island 5 of this example is provided with a light receiving element 21
A resin molded portion 30 having a horizontal upper surface 31 which is a mounting portion of
It is formed by bonding a metal island base 40 having a vertical upright surface 41 as a mounting portion of the LD chip 100.

The resin molded portion 30 is a resin molded product, and as shown in FIG. 6, an appropriately sized mounting surface portion 32 having a horizontally long rectangular shape in plan view, and bulging to one side in the longitudinal direction of the mounting surface portion 32. A substantially rectangular parallelepiped pedestal portion 33 is integrally formed, and the mounting surface portion 32 is formed with a positioning opening 34 into which the convex portion 42 provided on the island base 40 is inserted.

The island substrate 40 is formed by cold casting or the like using a desired metal material. This island substrate
As shown in FIG. 6, the board 40 integrally includes a board portion 43 of an appropriate size that matches the above-described mounting surface portion 32 and a bulge portion 44 that bulges out on the board portion 43. The protrusion 44 has a substantially rectangular parallelepiped shape, and a recess 45 is formed in a part of a side surface thereof.

Then, the substrate portion 43 is placed on the surface portion 32 so that the convex portion 42 is inserted into the opening 34, and the two are joined to provide a mounting portion for the LD chip 100 and the light receiving element 210. Island 5 is assembled.

As is clear from the figure, the mounting portion of the LD chip 100 is composed of a vertical upright surface 41 serving as a bottom surface of the recess 45 in the direction of the depression.
The LD chip 100 is fixed by adhesive or the like via 300.
The horizontal upper surface 31 located on the right side of the vertical standing surface 41 is a mounting portion for the light receiving element 210. The horizontal upper surface 31 is formed with a minimum area in which the miniaturized light receiving element 210 can be mounted as described above.

The lead pins 2 are dispersed and integrated on both left and right sides of the resin molded portion 30 when the resin molded portion 30 is molded by a resin mold.

The lead pins 2 are formed on a lead frame in the same manner as in the above-described embodiment.
A predetermined number is arranged side by side, and are formed so as to be distributed to the left and right such that the protruding end faces face each other.
The required number of lead pins 2 are held in parallel in the vertical direction with respect to the molded resin portion 30 by molding the resin molded portion 30 in a state of being set in the molding die). . The inner lead portions 2 "of the lead pins 2 ... stand on the left and right sides inside the pedestal portion 33, and the inner lead portions 2" are formed.
Is exposed on the horizontal upper surface 31 and the inner lead portion 2 ″ near the vertical upright surface 41 becomes an exposed surface 19 with a part of the side surface exposed on the side surface of the pedestal portion 33. In this manner, each of the inner leads 2 "is embedded in the pedestal 33.
The electrode portions 202 are formed so as to stand up at a pitch facing each of the electrode portions 202 formed on the lower surface side of 210. Each of the lead pins 2 is cut from the lead frame after the resin molded portion 30 is released from the mold.

The resin molded portion 30 having the inner lead portions 2 ″ of the lead pins 2... Arranged in parallel in the vertical direction and the island base 40 are joined together as described above by joining the joining surfaces of the substrate portion 43 and the mounting surface portion 32 together. The bonding is performed by ultrasonic bonding, etc. Prior to the bonding, the LD chip 100 is bonded to the vertical upright surface 41 in advance.

After joining the resin molded portion 30 and the island base 40, the light receiving element 210 is bonded to the horizontal upper surface 31. At this time, each of the inner lead portions 2 ″ is placed on the horizontal upper surface 31.
The upper end surface 18 is exposed at a pitch facing each of the electrode portions 202 on the lower surface side of the light receiving element 210, and the facing electrode portion 202 and the upper end surface 18 of the inner lead portion are electrically connected via the bump 50. Thereafter, the above-described exposed surface 19 of the inner lead portion 2 ″ and the LD chip 100 are electrically connected by wire bonding 3, and the cover 4 is placed from above to cover the entire upper surface of the assembly. This completes the semiconductor laser unit A. Since the upper end surface 18 of the inner lead portion 2 "is a cut surface, the bump 50
It is preferable to perform a lapping process in order to improve conductivity and connection reliability.

For the bonding between the resin molded portion 30 and the island substrate 40, appropriate fixing means such as high-frequency bonding, adhesion, welding, fitting, and engagement can be employed. If the pedestal portion 33 is formed so as to hold the light receiving element 210 and each electrode portion 202 is always pressed against the upper end surface 18 of the inner lead portion, the electrode portion 202 can be formed without the bump 50 interposed therebetween. And the inner lead portion upper end surface 18 can be directly connected.

The semiconductor laser unit A of this embodiment configured as described above has, in addition to the advantages of the embodiment shown in FIGS. 1 to 3, an electrode portion which is a connection portion with the lead pin 2.
202 is formed on the lower surface side of the light receiving element 210, and the electrode portion 202 and the upper end surface 18 of the inner lead portion are connected by wire bonding 3
The structure is such that the connection is made directly or directly without any intervening wires, so that the size can be further reduced because the wire bonding 3 is not required. Further, the electrode section 202 is connected to the light receiving element 210.
Since the light receiving element 210 is formed on the lower surface side, the size of the light receiving element 210 itself can be reduced. As a result, the width dimension of the island 5 (the width dimension for mounting the light receiving element 210) can be further reduced, and a significant downsizing is realized. Even better advantages can be achieved.

As another example of this embodiment, although not shown, the entire island 5 may be formed as an integral molded product of resin.

[0039]

As described above, the present invention has the following advantages. In claims 1 and 2, as described above, L
A plurality of parallel lead pins electrically connected to the D chip and the light receiving element are vertically held in the resin molded portion of the island, and the inner lead portion of the lead pin is fixed to the upper surface of the island. And embedded in the resin molded part, it is possible to significantly reduce the size of the island, and to provide a semiconductor laser unit that can respond to future needs where ultra-miniaturization is required. Can be provided. Moreover,
There is no need to open a hole in the island and insert the lead pin, then close the hole with the filling resin or bend the inner lead portion of the lead pin. Since there is no need to perform processing, the molding process and the molding operation can be simplified, and the yield can be improved and the product can be provided at low cost. According to the first aspect, in addition to the above effects, the electrical connection between the lead pins, the LD chip, and the light receiving element can be reliably achieved while the inner lead portion is embedded under the light receiving element. Can be made more effective. According to claim 2 in addition to the above effects, while the embedded structure of the inner lead portion on the lower side of the light receiving element, Ru can be achieved with certainty electrical connection between the lead pin and the LD chip. Further, since the electrode formed on the lower surface of the light receiving element is directly or directly connected to the upper end surface of the inner lead, the size of the light receiving element itself can be further reduced because wire bonding is not required. Can be achieved, and by the synergistic effect,
Further, a significant size reduction is realized. According to the third aspect, the fixing for holding the respective lead pins on the resin molded portion and the insulation between the respective lead pins can be performed by using the lead frame as a core body. It is possible to eliminate the complication of molding at the same time, and to further improve the advantages such as the molding process, the simplification of the molding operation, the improvement of the yield, and the provision at low cost, which are obtained in claim 1 or 2. According to the fourth aspect, the island made of a metal material can provide a higher degree of flatness and squareness than a resin island. Therefore, L
Parts that require high mounting accuracy, such as D chips, can be mounted stably and accurately, and the LD chips that generate heat by emitting laser light also excel in heat dissipation and respond to dimensional changes due to thermal deformation. Therefore, the dimensional stability is improved, the error occurrence rate during operation is reduced, and a highly reliable semiconductor laser unit can be provided. Needless to say, it can respond to a wide range of demands because it can support high-output LD chips.

[Brief description of the drawings]

FIG. 1 is a perspective view of a semiconductor laser unit with a cover removed.

FIG. 2 is a sectional view taken along line (X)-(X) of FIG.

FIG. 3 is a perspective view for explaining assembly of the semiconductor laser unit.

FIG. 4 is a perspective view of a semiconductor laser unit according to another embodiment, with a cover removed.

FIG. 5 is a sectional view taken along line (Y)-(Y) of FIG. 4;

FIG. 6 is a perspective view for explaining the assembly of the semiconductor laser unit.

FIG. 7 is a perspective view for explaining the assembly of the semiconductor laser unit.

FIG. 8 is a sectional view of a conventional semiconductor laser unit.

FIG. 9 is a perspective view of a conventional semiconductor laser unit,
The state in which the fixing of the lead pins to the island and the insulation are performed by a resin mold is shown.

[Explanation of symbols]

A: Semiconductor laser unit 100: Laser diode chip (LD chip) 200, 210: Light receiving element 202: Electrode part 1, 5: Island 2: Lead pin 2 ": Inner lead part 3: Wire bonding 11, 12, 30: Resin molding part 13 , 40: Island substrate 14: Joint 50: Bump 18: Upper end of inner lead (tip) 19: Exposed surface of inner lead

────────────────────────────────────────────────── ─── Continuation of the front page (56) References JP-A-4-137580 (JP, A) JP-A-4-29077 (JP, A) JP-A-4-96390 (JP, A) JP-A-3-3 8385 (JP, A) JP-A-3-76185 (JP, A) JP-A-4-4772 (JP, U) JP-A-6-17255 (JP, U) JP-A-63-167766 (JP, U) (1) Field surveyed (Int. Cl. ⁷ , DB name) H01S 5/00-5/50 H01L 33/00 H01L 31/02-31/0224

Claims (4)

(57) [Claims] 1. A laser diode chip for a light source is fixed to a predetermined position on a side surface of an island formed in an arbitrary three-dimensional shape, and a light-receiving element for signal reading is fixed to a predetermined position on an upper surface of the island. A semiconductor laser unit in which a plurality of lead pins electrically connected to a diode chip or a light receiving element are held in parallel in a vertical direction on a resin molded portion of the island, wherein each of the lead pins has an inner lead. Part is embedded in the resin molding part located below the light receiving element fixed to the upper surface part of the island , and
The inner lead part forms part of the side surface with the resin
With an exposed surface exposed on the side surface of the shape part
Embedded, the exposed surface and the laser diode chip
Or electrically connect to the light receiving element by wire bonding
A semiconductor laser unit connected . 2. An island formed in an arbitrary three-dimensional shape.
A laser diode chip for the light source
A light-receiving element for signal reading at a predetermined location on the top
While fixing each, the laser diode chip or
Indicates a plurality of lead pins electrically connected to the light receiving element,
Vertically parallel to the resin molded part of the island
A semiconductor laser device that is held in, the respective lead pins, the inner lead portions
Is the lower side of the light receiving element fixed to the upper surface of the island.
And the light receiving element is embedded in the resin molded part, and the light receiving element is electrically connected to the lead pin.
Each electrode part is provided on the lower surface side, and the inner
The vertical end face of the gate section faces the electrode section.
Embedded in the resin molded part as described above,
Direct pressure contact with the upper end of the inner lead or via a bump
And electrically connect the lead pin and each electrode part.
Connect the inner lead part,
The resin molding has an exposed surface exposed on a side surface of the resin molding portion.
The exposed surface and the laser diode chip.
A semiconductor laser unit that is electrically connected to a chip by wire bonding . 3. The resin molded part is mounted on a lead frame.
Molded with resin mold on parallel lead pins
The semiconductor laser unit according to claim 1, wherein: 4. The resin molding method according to claim 1, wherein the island is a pair of front and rear resin moldings.
Part and are fixed in a pinched state by both resin molding parts
The laser diode is made of a metal island substrate.
Chip is attached to the side of the island substrate.
4. The semiconductor laser unit according to claim 3, wherein: