JPH043117B2 - - Google Patents
Info
- Publication number
- JPH043117B2 JPH043117B2 JP24921484A JP24921484A JPH043117B2 JP H043117 B2 JPH043117 B2 JP H043117B2 JP 24921484 A JP24921484 A JP 24921484A JP 24921484 A JP24921484 A JP 24921484A JP H043117 B2 JPH043117 B2 JP H043117B2
- Authority
- JP
- Japan
- Prior art keywords
- circuit
- dummy
- printed circuit
- printed
- printed wiring
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000000034 method Methods 0.000 claims description 11
- 238000007646 gravure printing Methods 0.000 claims description 7
- 238000004519 manufacturing process Methods 0.000 claims description 6
- 238000007639 printing Methods 0.000 claims description 4
- 239000000463 material Substances 0.000 claims description 3
- 230000007547 defect Effects 0.000 description 8
- 239000000853 adhesive Substances 0.000 description 6
- 230000001070 adhesive effect Effects 0.000 description 6
- 239000011888 foil Substances 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- 239000003973 paint Substances 0.000 description 4
- 238000005530 etching Methods 0.000 description 3
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000004952 Polyamide Substances 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 239000012790 adhesive layer Substances 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 239000006229 carbon black Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000002788 crimping Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 229920006289 polycarbonate film Polymers 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920006267 polyester film Polymers 0.000 description 1
- -1 polyethylene Polymers 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
- 229910052718 tin Inorganic materials 0.000 description 1
Landscapes
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Structure Of Printed Boards (AREA)
- Manufacturing Of Printed Wiring (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP24921484A JPS61127193A (ja) | 1984-11-26 | 1984-11-26 | 印刷配線シ−トおよびその製法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP24921484A JPS61127193A (ja) | 1984-11-26 | 1984-11-26 | 印刷配線シ−トおよびその製法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS61127193A JPS61127193A (ja) | 1986-06-14 |
| JPH043117B2 true JPH043117B2 (enrdf_load_html_response) | 1992-01-22 |
Family
ID=17189611
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP24921484A Granted JPS61127193A (ja) | 1984-11-26 | 1984-11-26 | 印刷配線シ−トおよびその製法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61127193A (enrdf_load_html_response) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0530372Y2 (enrdf_load_html_response) * | 1985-03-18 | 1993-08-03 | ||
| JP4624387B2 (ja) * | 2005-06-24 | 2011-02-02 | 株式会社都ローラー工業 | レジスト塗布基板製造方法と、その製造方法で製造されたレジスト塗布基板 |
| JP2013115237A (ja) * | 2011-11-29 | 2013-06-10 | Toppan Printing Co Ltd | グラビアオフセット印刷用凹版およびそれを用いた印刷配線基材の製造方法ならびに印刷配線基材 |
-
1984
- 1984-11-26 JP JP24921484A patent/JPS61127193A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS61127193A (ja) | 1986-06-14 |
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