JPH04305174A - Burn-in substrate - Google Patents

Abstract

PURPOSE:To enhance the commonality of a burn-in substrate in the burn-in of ICs having different functions and different packages. CONSTITUTION:A substrate A1 wherein an IC socket 3 and a connector A5 are wired in 1:1 correspondence and a substrate B2 constituted of a mounting part 8 and a connector B9 are used. Wiring for supplying a signal to the substrate A1 is applied to the substrate B2. In the case of the use as a burn-in substrate, the substrates A1, B2 are connected by the connectors A5, B9. The substrate A1 is obtained by preparing only a substrate at every IC package and the substrate B2 is obtained by preparing only the substrate by function of an IC.

Description

[Detailed description of the invention]

0001

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to the structure of a burn-in board for burning-in an IC.

0002

2. Description of the Related Art FIG. 4 is a sectional view of a conventional burn-in board, and FIG. 5 is a perspective view thereof. In the figure, 3 is an IC socket, 4 is a pin inside the IC socket 3, 8 is a mounted component, 12 is an edge connector, 13 is a board C, and 14 is a wire from the edge connector 12 to pin 4 inside the IC socket 3. This is wiring C. The wiring C14 may also pass through the mounted component 7.

Next, the operation will be explained. In the burn-in board shown in FIG. 4, the IC socket 3 and the mounted components 7 are mounted on one board 13, and the signals necessary for burn-in are routed from the edge connector 12 to pin 4 in the IC socket 3 using the wiring C14. ing. The wiring C14 may be wired via the mounted component 7 depending on burn-in conditions.

0004

[Problems to be Solved by the Invention] Conventional burn-in boards are constructed as described above, so when burning in ICs having the same function but different numbers of packages,
There was a problem in that a burn-in board had to be manufactured for each package. Furthermore, in the case of ICs with different functions, there is a problem in that even if the packages are the same, it is impossible to share a burn-in board due to differences in burn-in conditions.

The present invention was made in order to solve the above-mentioned problems, and an object of the present invention is to improve the commonality of burn-in boards for ICs having different functions and different types of packages.

[0006]

[Means for Solving the Problems] A burn-in board according to the present invention is composed of two types of boards: a socket board corresponding to each IC package, and a mother board corresponding to each IC function.

[0007]

[Operation] The burn-in board of the present invention is composed of a socket board and a mother board, so that the socket board can be used in common even for ICs with different functions as long as the IC packages are the same. be. or,
In the case of ICs with the same function but different types of packages,
This is possible by manufacturing only a common motherboard.

[0008]

[Example] Example 1. An embodiment of the present invention will be described below with reference to the drawings. FIG. 1 is a sectional view of a burn-in board according to an embodiment of the present invention, FIG. 2 is a perspective view of a socket board of the burn-in board, and FIG. 3 is a perspective view of a mother board of the burn-in board.

In the figure, 1 is the board A of the main body of the socket board (hereinafter referred to as board A), 2 is the board B of the main body of the mother board (hereinafter referred to as board B), and 3 is the IC socket mounted on the board A1. , 4 is a pin in IC socket 3, 5 is connector A mounted on board A1, 6 is connector pin A in connector A5, 7 is wiring A wired between pin 4 and connector pin A6, 8 is board Mounted components mounted on B2, 9
is connector B mounted on board B2, 10 is connector B
9 is a connector pin B, 12 is an edge connector in the board B2, and 11 is a wiring B routed from the edge connector 12 to the connector pin B. The wiring B11 is the mounted component 8
It may also go through.

Next, the operation will be explained. The burn-in board in FIG. 1 is composed of a socket board on the board A1 side and a mother board on the board B2 side.

[0011] An IC socket 3 and a connector A5 are mounted on the board A1, and wires A7 are wired in one-to-one correspondence from the pin in the IC socket 3 to the connector pin A6 in the connector A5.

[0012] On the board B2, there are mounted components 8 and a connector B9.
is mounted, and connector pin B1 in connector B9
A wiring B11 for supplying signals to the socket board is wired between the edge connector 12 and the edge connector 12. Wiring B12
may pass through the mounted component 8 depending on burn-in conditions.

When used as a burn-in board, the socket board on the board A1 side and the motherboard on the board B2 side are connected by connectors A5 and B9.

[0014]

[Effects of the Invention] As described above, according to the present invention, the burn-in board is composed of two types of boards, the socket board and the mother board, so if the socket board has the same IC package, it can be used as an IC with different functions. It can also be shared.

Furthermore, in the case of ICs having the same function but different types of packages, it is possible to manufacture only a common motherboard.

[Brief explanation of drawings]

FIG. 1 is a cross-sectional view of a burn-in board showing an embodiment of the present invention.

[Figure 2] Perspective view of the socket board of the burn-in board

[Figure 3
] Perspective view of the motherboard of the burn-in board

[Figure 4] Cross-sectional view of a conventional burn-in board

[Figure 5] Perspective view of burn-in board

[Explanation of symbols]

1 Socket board (board A) 2 Mother board (board B) 3 IC socket 4 Pin 5 Connector A 6 Connector pin A 7 Wiring A 8 Mounted parts 9 Connector B 10 Connector pin B 11 Wiring B 12 Edge connector 13　Substrate C 14 Wiring C

Claims (1)

[Claims] [Claim 1] An IC socket and a connector A are mounted,
It has a socket board with all pins wired one-to-one between the IC socket and connector A, and an edge connector that can input signals from the outside. A burn-in board comprising a mother board provided with necessary wiring, and a connector A and a connector B connecting the socket board and the mother board.