JPS63128654A - Semiconductor device mounting body - Google Patents

Abstract

PURPOSE:To prevent a semiconductor device from breaking down due to erroneous fixation by a method wherein the interval between two adjoining leads among multiple leads is differentiated from the arrayal intervals of other leads while engaging grooves to be engaged with said leads are provided on a socket. CONSTITUTION:Two leads 4a, 4b among other leads 4 are arranged at different interval from that of other leads 4 in a semiconductor device main body 3 while engaging grooves 6 corresponding to the leads 4 are provided in a socket 5 to fix the main body 3. The main body 3 is oriented in the specific direction not to be fixed in the erroneous direction. On the other hand, the socket 5 is provided with socket leads 7 corresponding to the leads 4 while a substrate 8 whereon the socket 5 is fixed is provided with engaging holes 9 in arrayal corresponding to the socket leads 7 so that the socket 5 may be fixed on the substrate 8 to orient the socket 5 and the substrate 8 in the specific direction.

Description

DETAILED DESCRIPTION OF THE INVENTION Field of Industrial Application The present invention relates to a semiconductor device package used in an electronic circuit.

BACKGROUND ART In general, the structure of a semiconductor device in this type of semiconductor device package is known, for example, as shown in Japanese Patent Application Laid-Open No. 69-22352, and the structure is as shown in FIG. Ta. In FIG. 2, reference numeral 1 denotes a semiconductor device main body (hereinafter referred to as main body), and inside this main body 1, semiconductor elements were arranged. Leads 2 are led out from the side surfaces of the main body 1, and among these leads 2, the interval between the leads 2 at the center of the opposing sides is wider than the intervals between the other leads. That is, the lead interval between the lead 2a and the lead 2b was wider than the other lead intervals.

Problems to be Solved by the Invention However, in the above conventional configuration, when the semiconductor device main body 1 is directly attached to a semiconductor substrate and soldered, the distance between the leads 2a and the leads is different from the distance between the other leads. However, since the fitting hole on the semiconductor substrate side is provided in a corresponding shape, the two can be fitted together without losing the orientation of the semiconductor device body 1. When mounting the semiconductor device main body 1 on a semiconductor substrate through a socket, the fitting grooves of commercially available sockets are provided at equal intervals, so the semiconductor device main body 1 cannot be mounted on the socket.

The present invention solves the above-mentioned conventional problems, and aims to provide a semiconductor device package that is free from erroneous mounting and has excellent product reliability.

Means for Solving the Problems In order to achieve the above object, the semiconductor device package of the present invention includes a semiconductor device in which a plurality of leads are arranged at both longitudinal ends of the semiconductor device body, and a semiconductor device including the semiconductor device. a removably mounted socket, the spacing between two adjacent leads of the plurality of leads is different from the arrangement spacing of the other leads, and a fitting groove into which these leads fit is provided. This is provided in the socket.

According to the above configuration, since the arrangement spacing of two of the leads is set to be different from the arrangement spacing of the other leads, the semiconductor device can be given a specific orientation, and furthermore, the leads of this semiconductor device can be given a specific orientation. Since the socket is provided with a fitting groove corresponding to the above, it is possible to mount the semiconductor device in the socket without losing the orientation of the semiconductor device.

EXAMPLE Hereinafter, an example of the present invention will be described with reference to FIG.

In the figure, 3 is a semiconductor device main body (hereinafter referred to as main body), and a plurality of leads 4 are arranged on both sides of this main body 3 in the longitudinal direction. The arrangement interval L1 between the lead 4a and the lead 4b among the leads 4 is different from the arrangement interval L2 between the other leads 4, for example, the lead 4b and the lead 4C, and L=KxL2(K is a positive number). The main body 3 is
The socket 5 is detachably attached to the socket 6, and a fitting groove 6 into which the lead 4 is fitted is provided in the upper part of the socket 5.
are arranged accordingly. A socket lead 7 is attached to each of the fitting grooves 6, and contacts the lead 4 in the fitting groove 6, and protrudes downward from the lower surface of the socket 6. The socket 6 is attached to the board 8. This board 8 is provided with a fitting hole 9 into which the socket lead 7 is fitted.
It has an arrangement corresponding to a J-door.

According to the configuration of the above embodiment, the semiconductor device main body 3 is arranged such that the arrangement interval between the two leads 4a and 4b of the leads 4 is different from the arrangement interval between the other leads 4.
Since the socket 6 into which the lead 4 is mounted is provided with a fitting groove 6 corresponding to the lead 4, and the main body 3 is installed in the socket 6, the main body 3 is oriented in a specific direction, and even when mounted in the socket 6, Never lose that orientation. The socket 5 has socket leads 7 provided corresponding to the leads 4, and the board 8 to which the socket 6 is attached is provided with fitting holes 9 having an arrangement corresponding to the socket leads 7. Since the socket 5 and the substrate 8 are configured to be attached to the substrate 8, the socket 5 and the substrate 8 are also oriented in a specific manner, and therefore the semiconductor device main body 3, the socket 6, and the substrate 8 are oriented in a series of common directions. Furthermore, since the arrangement interval L1 of the leads 4a and 4b is different from the arrangement interval L2 of the other leads 4 and does not satisfy the relationship L1=KXL2, incorrect mounting such as reverse mounting is prevented, and as a result, Since the semiconductor device can be prevented from being destroyed due to incorrect mounting, the reliability of the product can be improved.

Effects of the Invention As is clear from the description of the above embodiments, according to the present invention,
The spacing between two of the leads arranged on both sides of the semiconductor device body is different from that of the other leads, and the socket is provided with a fitting groove having an arrangement corresponding to the arrangement of the leads. Therefore, the orientation of the semiconductor device body is determined by the arrangement of the leads, and even if the semiconductor device body is mounted in a socket, the orientation will not be lost. In addition, since the arrangement spacing of two of the leads is the same as the arrangement spacing of the other leads, and the fitting grooves of the socket into which these leads are fitted are arranged in a manner corresponding to the leads, it is possible to prevent incorrect mounting such as reverse mounting. As a result, it is possible to prevent the semiconductor device from being destroyed due to incorrect mounting, thereby increasing the reliability of the product.

[Brief explanation of the drawing]

FIG. 1 is an exploded perspective view of a semiconductor device package showing an embodiment of the present invention, and FIG. 2 is a perspective view of a conventional semiconductor device. 3...Semiconductor device main body, 4.4a, 4b,
4c...Lead, 6...Socket, 6
・・・・・・Fitting groove.

Claims (1)

[Claims] The semiconductor device has a semiconductor device in which a plurality of leads are arranged on both sides in the longitudinal direction of the semiconductor device body, and a socket into which the semiconductor device is detachably mounted, and the two adjacent leads of the plurality of leads are connected to each other. A semiconductor device packaged body, wherein the socket is provided with a fitting groove in which the spacing is different from the arrangement spacing of other leads and into which these leads fit.