JPH01205456A - Multi-pin case for lsi - Google Patents

Multi-pin case for lsi

Info

Publication number
JPH01205456A
JPH01205456A JP2939088A JP2939088A JPH01205456A JP H01205456 A JPH01205456 A JP H01205456A JP 2939088 A JP2939088 A JP 2939088A JP 2939088 A JP2939088 A JP 2939088A JP H01205456 A JPH01205456 A JP H01205456A
Authority
JP
Grant status
Application
Patent type
Prior art keywords
terminals
main body
case main
side surface
lsi
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2939088A
Inventor
Katsumi Fujinami
Original Assignee
Nec Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date

Links

Abstract

PURPOSE: To reduce the mounting area on a printed circuit board mounting, by arranging terminals with different protrusion lengths, in an upper row and a lower row on the side surface of a case main body of a multi-pin case for LSI, wherein the terminals connecting with an LSI chip protrude from each side surface of the case main body.
CONSTITUTION: A case main body 1a is constituted in the form of a thin cube, and an LIS chip 4 is mounted therein. Terminals 2, 3 are arranged in such a manner as to protrude from the side surface of the case main body 1a. The terminals 2, 3 are arranged in an upper row and a lower row, interposing a constant interval so as not to come into contact with each other. The terminals 2 and the terminals 3 are arranged in the upper row and in the lower row, respectively. The protrusion length of the terminals 2 from the side surface of the case main body 1a is longer than that of the terminals 3. Thereby the terminals 2 and 3 can be connected with a printed circuit board without coming into contact with each other.
COPYRIGHT: (C)1989,JPO&Japio
JP2939088A 1988-02-10 1988-02-10 Multi-pin case for lsi Pending JPH01205456A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2939088A JPH01205456A (en) 1988-02-10 1988-02-10 Multi-pin case for lsi

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2939088A JPH01205456A (en) 1988-02-10 1988-02-10 Multi-pin case for lsi

Publications (1)

Publication Number Publication Date
JPH01205456A true true JPH01205456A (en) 1989-08-17

Family

ID=12274815

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2939088A Pending JPH01205456A (en) 1988-02-10 1988-02-10 Multi-pin case for lsi

Country Status (1)

Country Link
JP (1) JPH01205456A (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5819403A (en) * 1994-03-11 1998-10-13 The Panda Project Method of manufacturing a semiconductor chip carrier
US5821457A (en) * 1994-03-11 1998-10-13 The Panda Project Semiconductor die carrier having a dielectric epoxy between adjacent leads
US5824950A (en) * 1994-03-11 1998-10-20 The Panda Project Low profile semiconductor die carrier
US6008530A (en) * 1997-05-29 1999-12-28 Nec Corporation Polyhedral IC package for making three dimensionally expandable assemblies
US6141869A (en) * 1998-10-26 2000-11-07 Silicon Bandwidth, Inc. Apparatus for and method of manufacturing a semiconductor die carrier

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60103652A (en) * 1983-11-11 1985-06-07 Hitachi Ltd Semiconductor device and lead frame used therefor
JPS6113654A (en) * 1984-06-29 1986-01-21 Toshiba Corp Electronic parts

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60103652A (en) * 1983-11-11 1985-06-07 Hitachi Ltd Semiconductor device and lead frame used therefor
JPS6113654A (en) * 1984-06-29 1986-01-21 Toshiba Corp Electronic parts

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5819403A (en) * 1994-03-11 1998-10-13 The Panda Project Method of manufacturing a semiconductor chip carrier
US5821457A (en) * 1994-03-11 1998-10-13 The Panda Project Semiconductor die carrier having a dielectric epoxy between adjacent leads
US5824950A (en) * 1994-03-11 1998-10-20 The Panda Project Low profile semiconductor die carrier
US6339191B1 (en) * 1994-03-11 2002-01-15 Silicon Bandwidth Inc. Prefabricated semiconductor chip carrier
US6977432B2 (en) 1994-03-11 2005-12-20 Quantum Leap Packaging, Inc. Prefabricated semiconductor chip carrier
US6008530A (en) * 1997-05-29 1999-12-28 Nec Corporation Polyhedral IC package for making three dimensionally expandable assemblies
US6141869A (en) * 1998-10-26 2000-11-07 Silicon Bandwidth, Inc. Apparatus for and method of manufacturing a semiconductor die carrier
US6857173B1 (en) 1998-10-26 2005-02-22 Silicon Bandwidth, Inc. Apparatus for and method of manufacturing a semiconductor die carrier

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