JPH02162671A - Ic package converting socket - Google Patents

Abstract

PURPOSE:To enable selection of an SOP/QFP type IC by causing external shape to be that of a conventional DIP type IC package and utilizing a socket as an electrical selecting jig for the DIP type IC as it is. CONSTITUTION:A recess 2 for receiving an SOP type IC is provided at center of the upper surface of a socket insulator 1, and contacts 3 to be in contact with reed terminals of the SOP type IC 10 are arranged on the bottom surface of the recess 2. Socket pins 4 connected to these contacts 3 are drawn out from both side surfaces of the insulator 1 in the same way as the reed terminals of a DIP type IC to be converted. The external shape of the insulator 1 is nearly same as that of the package of the DIP type IC to be converted, and socket pins 5 have the same pitch and length as the reed terminals of the DIP type IC to be converted. Thus, an SOP/QFP type IC can be converted, in the package size, reed pitch, and reed length, to the DIP type IC.

Description

[Detailed Description of the Invention] [Field of Industrial Application] The present invention is directed to the electrical selection of small outline package (hereinafter referred to as SOP) type or quad flat package (hereinafter referred to as QFP) type ICs in the semiconductor device manufacturing process. The present invention relates to an IC package conversion socket for generalizing test jigs used in the process of selecting dual in-line package (hereinafter referred to as DIF) type ICs.

[Conventional technology]

Conventionally, SOP/QFP type I in the semiconductor device manufacturing process
The sockets for semiconductor devices in the electrical sorting jigs shown in C are individually prepared according to the package type, lead pitch spacing, and package size. Sockets for semiconductor devices as sorting jigs cannot be shared as sockets for semiconductor devices as electrical sorting jigs for SOP/QFP type ICs.

[Problem to be solved by the invention]

DIP type I in the conventional semiconductor device manufacturing process described above
IC sockets as electrical sorting jigs of C are D.
Since the lead terminals of IP type ICs are structured to contact the contacts in the socket, the length of the lead terminals is extremely short like SOP/QFP type ICs, and the lead shape is DIP.
It is impossible to use a socket for DIP type I type C as an OP/QFP type IC socket, and it is not possible to use it as an IC socket as an electrical sorting jig for SOP/QFP type IC. It becomes necessary to newly procure printed circuit boards, etc., and new expenses are incurred for new designs and manufacturing of sockets, printed circuit boards, etc.

[Means to solve the problem]

The IC package conversion socket of the present invention has a contactor arranged on the bottom surface of the central recess of the socket insulator so that the lead terminal of the SOP/QFP type IC comes into contact with it, and also has a lid for fixing the IC. Also, the DIP type I to be converted
The socket pin has a pitch interval of C and a lead terminal length. Therefore, since the IC package conversion socket of the present invention has the package form of an existing DIP type IC, the socket of the DIP type I type C electric sorting jig can be used as is, and the SOP /QFP type IC
can be sorted.

〔Example〕

Next, the present invention will be explained by examples.

FIG. 1 is a plan view of an embodiment of the present invention with the lid omitted, and FIG. 2 is a sectional view showing the conversion socket of FIG. 1 with an SOP type IC mounted thereon. In these figures, a recess 2 in which an SOP type IC is housed is provided in the center of the upper surface of a socket insulator 1. On the bottom of recess 2, S
A contact 3 that contacts the lead terminal of the OP type IC 10 (Fig. 2) is arranged, and a socket pin 4 connected to this contact 3 is inserted from both sides of the socket insulator in the same way as the lead terminal of the DIP type IC to be converted. It is pulled out to the outside. The outer shape of the socket insulator 1 is almost the same as the package outer shape of the DIP type IC to be converted, and the socket pins 5 have the same pitch and length as the lead terminals of the DIP type IC to be converted. For example, when converting a 28PINDIP type IC, the thickness of the socket insulator 1 is 5.21 mm.
Sir, the width is 13.2mm. In addition, the installed IC1O
In order to facilitate removal, the bottom of the recess has a push-out hole 5, and the ICl0 is fixed by a lid 6 that closes the upper part of the recess, and the lid 6 covers the recess on the side and the socket insulator 1.
It is securely fixed by fitting with the lid fixing protrusion 7.

FIG. 3 is a plan view of a second embodiment of the present invention with the lid portion omitted, and FIG. 4 is a sectional view of the embodiment of FIG. The difference between these figures is that in this example, contacts 13 are provided along the four sides of the rectangle so as to make contact with the lead terminals of the QFP IC on the bottom surface of the rectangular recess 12 of the socket insulator 11. For other points, please refer to Part 1.
It is the same as that for SOP type I type C shown in the figure.

〔Effect of the invention〕

As explained above, by using the socket of the present invention, it is possible to convert an SOP/QFP type IC to the package size, lead pitch, and lead length of a DIP type IC. It is possible to use a printed circuit board with a socket for the package (D
It is no longer necessary to change printed circuit boards and sockets for each IP (IP, SOP/QFP), resulting in significant savings in cost and man-hours. It also has a great effect on standardizing test jigs. Furthermore, it becomes possible to respond flexibly to the electrical sorting process, leading to a reduction in TAT. It goes without saying that by using the conversion socket of the present invention, it is possible to share not only conventional sockets but also sockets used for electrical sorting.

[Brief explanation of the drawing]

FIG. 1 is a plan view of the first embodiment of the present invention with the lid omitted, FIG. 2 is a sectional view showing the SOP type IC installed in the socket of FIG. 1, and FIG. A plan view without the lid of a second embodiment of the invention; FIG. 4 is a sectional view of the embodiment of FIG. 3; 1.11...Socket insulator, 2,12...
... recess, 3.13... contact, 4...
...Socket pin, 5...Extrusion hole, 6...Lid, 7...Lid fixing protrusion, 0...SOP type IC.

Claims (1)

[Claims] a socket insulator provided with a recess into which a small outline package type IC or a quad flat package type IC is housed; a contactor disposed on the bottom surface of the recess so as to be in contact with a lead terminal of the IC; and this contactor. and a lid for fixing the IC, the socket pin being connected to the socket insulator and having the same pitch as the lead terminal pitch of the dual in-line package IC to be converted and drawn out to the outside of the socket insulator. Package conversion socket.