JPH0310628Y2 - - Google Patents

Description

[Detailed Description of the Invention] Industrial Application Field The present invention relates to a connection structure for measuring electronic components, which is used, for example, to measure the characteristics of electronic components in which ICs, LSI chips, etc. are incorporated.

Prior Art A conventional example of such a socket is shown in FIG. 6 and will be described. The illustrated socket 5 is an electronic component 6.
It consists of a single conductive plate having a female pin holding part 51A into which leads (hereinafter referred to as pins) 61 and the like are inserted and removed, and a male pin 51B protruding outside from the resin body 52 indicated by a two-dot chain line. Contactors 51, 51 are provided.

An example of the use of this socket 5 will be explained with reference to FIG. In the illustrated socket 5, the pin 51B of the contact 51 of the socket 5 is inserted into the terminal insertion hole of the measurement board 4 where a circuit (not shown) for sending a signal is formed to measure the characteristics of the electronic component 6. The figure shows soldering on the back side. The pin 61 of the electronic component 6 is inserted into the pin holding portion 51A of the contact 51 of the socket 5, and the electronic component 6
Signals are exchanged between the measurement board 4 and the measurement board 4. Usually, a large number of measurement items are set for one electronic component 6, and a different measurement board is prepared for each measurement item. The characteristics of the electronic component 6 are measured by inserting the electronic component 6 into the socket 5 attached to the measurement board. In other words, the number of times the electronic component 6 is inserted into and removed from the socket 5 is the same as the number of measurement items. Therefore, the pin 6 of the electronic component 6 may be damaged during insertion and removal many times.
1 may break, so the following method is adopted.

A socket 5 identical to the socket 5 described above is prepared. The electronic component 6 to be measured is handled with the electronic component 6 attached to the socket 5. That is, as shown in FIG. 8, the socket 5 protects the pin 61 of the electronic component 6, and the pin 51B of the contact 51 of the socket 5 is connected to the measurement board 4.
The pin holding portion 51A of the contact 51 of the socket 5 attached to the socket 5 is inserted into and removed from the pin holding portion 51A.

Problems to be Solved by the Invention In this method, when the pin 51B of the socket 5 on which the electronic component 6 is attached is inserted and removed approximately 20,000 to 30,000 times into and out of the socket 5 attached to the measurement board 4, the measurement There is a risk that the pin holding portion 51A of the contactor 51 of the socket 5 attached to the board 4 may be deformed due to elastic fatigue, and it is necessary to replace the socket 5 attached to the measurement board 4 based on the number of insertions and removals mentioned above. . However, as mentioned above, since the socket 5 is fixed to the measurement board 4 by soldering, there is a problem that replacement work is extremely troublesome.

Furthermore, an electronic component 6 using two sockets 5
In the characteristic measuring method, the electronic component 6 only needs to be inserted and removed once into the socket 5, regardless of the number of measurement items.
The disadvantage that the pin 61 of the electronic component 6 breaks during repeated measurements is eliminated. However, the distance from the measurement board 4 to the electronic component 6 increases,
This also causes a problem in that the conditions for high frequency measurement of the electronic component 6 in particular deteriorate.

The present invention was devised to solve the above-mentioned problems, and its purpose is to provide a connection structure for measuring electronic components that allows easy periodic replacement and improves the conditions for high-frequency measurements of electronic components. do.

Means for Solving the Problems The connection structure for measuring electronic components according to the present invention includes a socket in which a contact is fitted into a pin insertion portion penetrated in accordance with the arrangement of lead pins of an electronic component to be measured; A measuring board is connected to an electronic circuit for measuring an electronic component and has a pin implanted corresponding to the pin insertion part, and the contact is a first part into which the lead pin is inserted and elastically clamped. 1
The holding part and the second holding part into which the pin is inserted and elastically clamped are integrally formed and have a substantially S-shape, and the first holding part and the second holding part are respectively connected to the pin insertion part. facing both ends of the department.

Function When using such a connection structure for measuring electronic components when measuring the characteristics of an electronic component, a pin of the electronic component is inserted into one pin insertion part. A pin embedded in a measurement board on which a circuit for measuring characteristics of an electronic component is formed is inserted into the other pin insertion portion. The inserted pins are electrically connected to each other by contacts.

Embodiment An embodiment of the present invention will be described below with reference to the drawings.

Figure 1 is a perspective view of a connection structure for measuring electronic components according to an embodiment of the present invention, and Figure 2 is II in Figure 1.
Figure 3 is an enlarged cross-sectional view taken along line II, Figure 3 is a cross-sectional view of the electronic component mounted in the socket, Figure 4 is a cross-sectional view showing the state of connection between the electronic component and the measurement board, and Figure 5 is a cross-sectional view of the present invention. FIG. 3 is an enlarged sectional view showing another example of the connection structure for measuring electronic components.

In the following description, a DIP type IC will be used as an example of the electronic component 10.

The socket 20 is molded from an insulating resin, and is used to hold the lead pins 11 of the electronic component 10 to be measured.
Two rows of pin insertion portions 21 corresponding to the above are penetrated. A protruding stopper 212 is formed on the peripheral wall 211 of the pin insertion portion 21 .

Contactor 22 fitted into the pin insertion part 21
The conductive plate is formed by bending a single conductive plate into a substantially S-shape. Such a contactor 22 has a linear base 2
21, which extends upward from the lower end of the base 221 in an arcuate manner, and whose upper end is connected to the base 22.
The first holding part 222 is in constant elastic contact with one side of the upper end of the base 221, and the first holding part 222 extends downward from the upper end of the base 221 in an arcuate manner, and the upper end thereof is connected to the base 2.
21, which is in constant elastic contact with one side of the lower end
The holding portion 223 is integrally formed.

When the contact 22 is fitted into the pin insertion part 22, the first holding part 222 and the second holding part 223 are locked to the stopper 212, so that the contact 22 is fitted into the pin insertion part 22.
will not fall off from the pin insertion part 22.

Next, a case will be described in which the characteristics of the electronic component 10 are measured using the electronic component measurement connection structure configured as described above.

First, as shown in FIG. 3, the lead pin 11 of the electronic component 10 is inserted into one pin insertion part 21 of the socket 20, and then the first holding part 222 of the contact 22 is inserted.
hold it.

The pin 31 implanted in the measurement board 30 is inserted into the vacant pin insertion part 21 of the socket 20 and held by the second holding part 223 of the contactor 22 (see FIG. 4). Then, the electronic component 10 and the electronic circuit (not shown) formed on the measurement board 30 are electrically connected via the pins 31 and the contacts 22. In this state, electrical signals are exchanged between the electronic circuit and the electronic component 10.

When the measurement using the electronic circuit formed on the measurement board 30 is completed, the electronic component 10 is removed from the pin 31 together with the socket 20.

With the electronic component 10 mounted in the socket 20 in this manner, various characteristics of the electronic component 10 are sequentially measured using other measurement boards (not shown).

In addition, in the above embodiment, the base 22 of the contactor 22
1 has been described as being linear, but it may be curved into a substantially S-shape as shown in FIG. In this case, elasticity is also imparted to the base portion 221, so that the clamping pressure between the first and second holding portions 222, 223 is greater than that of the contactor 22 of the above embodiment.

Effects of the invention According to the invention, only one socket is required, so
Compared to the conventional example where it is necessary to use two sockets, the fourth socket from the measurement board to the electronic components is
The distance H shown in the figure can be shortened, and the measurement conditions for high frequency measurement of electronic components can be improved.

On the other hand, compared to the conventional method in which the electronic component is repeatedly inserted into and removed from a socket on the measurement board for measurement, the number of insertion and removal of the pins of the electronic component can be extremely reduced, and breakage of the pins can be prevented. Furthermore, since there is no need to solder the socket to the measurement board, there is no need for the complicated replacement work of removing the solder when replacing the socket.

[Scope of Claim for Utility Model Registration] (1) A socket in which a contact is fitted into a pin insertion portion penetrated in correspondence with the arrangement of lead pins of an electronic component to be measured, and an electronic circuit for measuring the electronic component. and a measurement board having pins connected thereto and implanted in correspondence with the pin insertion portions, and the contact includes a first holding portion into which the lead pins are inserted and elastically clamped, and the pins. The first holding part is formed integrally with the second holding part into which the second holding part is inserted and elastically clamped, and has a substantially S-shape.
A connection structure for measuring electronic components, characterized in that the holding part and the second holding part face both ends of the pin insertion part, respectively. (2) Electronic component measurement according to claim 1 of the utility model registration claim, characterized in that a stopper for locking the contact to the pin insertion part is formed on the peripheral wall of the pin insertion part. Connection structure for.

[Brief explanation of the drawing]

Figure 1 is a perspective view of a connection structure for measuring electronic components according to an embodiment of the present invention, and Figure 2 is II in Figure 1.
Figure 3 is an enlarged cross-sectional view taken along line II, Figure 3 is a cross-sectional view of the electronic component mounted in the socket, Figure 4 is a cross-sectional view showing the state of connection between the electronic component and the measurement board, and Figure 5 is a cross-sectional view of the present invention. FIG. 3 is an enlarged sectional view showing another example of the connection structure for measuring electronic components. FIG. 6 is a schematic explanatory diagram of a conventional socket, FIG. 7 is an explanatory diagram showing a state in which an electronic component is attached to the socket, and FIG. 8 is a schematic explanatory diagram of an example of the use of the socket. 10...Electronic component, 11...Lead pin, 20
...Socket, 21...Pin insertion part, 211...
Circumferential surface, 212... Stopper, 22... Contact, 2
22...first holding part, 232...second holding part, 3
0...Measurement board, 31...pin.