JPH05190765A - Semiconductor device - Google Patents

Abstract

PURPOSE:To make a motherboard small-sized by a method wherein an electronic component other than a semiconductor element such as a QFP or the like is mounted integrally. CONSTITUTION:A semiconductor element 3 such as a QFP or the like is mounted on the other face of a board 1 which is provided with external terminals 2 on one face; other electronic components 5 are mounted on spaces other than its mounting part; and the semiconductor element, the electronic components and the external terminals are connected by conductor wires.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a substrate structure of a semiconductor device, particularly a pin grid array (hereinafter referred to as PGA).

[0002]

2. Description of the Related Art FIGS. 4 and 5 are views showing the external shape of a conventional semiconductor device of this type. In the figures, 1 is a laminated plate, 2 is an external terminal soldered to the laminated plate 1 in a grid pattern, and 3 is an external terminal. This is a quadrilateral semiconductor integrated device (hereinafter referred to as QFP) in which terminals 4 are provided on four sides soldered to the laminated plate 1. Here, the terminal 4 of the "QFP 3" and the external terminal 2 are connected by a conductor (not shown) pre-wired on the laminated plate 1.

[0003]

The conventional semiconductor device is configured as described above, and it is necessary to configure the circuit in the semiconductor device due to the complexity of the circuit, but there is not much mounting space. There was a problem.

The present invention has been made to solve such a problem, and an object thereof is to obtain a semiconductor device having a complicated circuit by connecting a semiconductor element and another electronic component on a substrate. And

[0005]

In a semiconductor device according to the present invention, a QFP is mounted on the other surface of a substrate having a plurality of external terminals on one surface, and the other surface of the substrate other than the mounting portion of the QFP is mounted. Attaching different electronic components, these QFP,
The electronic components and the external terminals are electrically connected to each other by wiring.

A semiconductor element is mounted on the other surface of the substrate having a plurality of external terminals provided on one surface thereof, a recess is formed in the substrate below the semiconductor element, and another electronic component is attached to the recess. The semiconductor element, the electronic component, and the external terminal are electrically connected to each other by wiring.

A first device having a plurality of external terminals on one surface
The semiconductor element is mounted on the other surface of the board, the second board is arranged above the mounting portion of the semiconductor element, and the second board is mounted on the first board. Connected to each other.

[0008]

Since the other electronic component according to the present invention is arranged at the outer peripheral portion, the upper portion and the lower portion of the mounting portion of the semiconductor element such as QFP, it is possible to form a complicated circuit and reduce the size of the mother board. It will be possible.

[0009]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT Embodiment 1 FIG. 1 is an embodiment of the present invention.
I will explain based on. That is, in FIG. 1, reference numeral 5 is another electronic component mounted in an empty space other than the mounting portion of the QFP 3 mounted on the laminated plate 1. Since the other structure is the same as the conventional structure shown in FIGS. 4 and 5, description thereof will be omitted. Here, conductor wiring (not shown) is provided on the laminated plate 1 to connect the QFP 3, the electronic component 5, and the external terminal 2 to each other.

In Example 2, the electronic component was mounted in the empty space other than the mounting portion of the QFP 3 in Example 1, as shown in FIG.
As shown in FIG. 3, a recess 11 is formed in the laminated plate 1 by counterboring, the electronic component 5 is mounted in the recess 11, and the QFP is mounted thereon.
3 may be implemented.

As shown in Example 3 and FIG. 3, the laminated plate 1 has a two-stage structure, and the QFP 3 is mounted on one of the laminated plates.
The electronic component 4 may be mounted on another laminated plate.

[0012]

As described above, in the semiconductor device according to the present invention, since another electronic component is mounted on the substrate other than the mounting portion of the semiconductor element such as QFP, a complicated circuit can be formed and the motherboard can be miniaturized. it can.

[Brief description of drawings]

FIG. 1 is a side view showing an embodiment of the present invention.

FIG. 2 is a sectional view showing another embodiment of the present invention.

FIG. 3 is a side view showing still another embodiment of the present invention.

FIG. 4 is a plan view showing a conventional semiconductor device of this type.

FIG. 5 is a side view showing a conventional semiconductor device.

[Explanation of symbols]

 1 Laminated board 2 External terminal 3 QFP 4 QFP terminal 5 Electronic component

 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Yutaka Kawai, 3-13-21, Kushiro, Kawanishi-shi, Hyogo Stock company Kediel (72) Inventor Seiji Takemura 4-chome, Mizuhara Itami-shi Mitsubishi Electric Corporation Company Kita Itami Works

Claims (3)

[Claims] 1. A substrate having a plurality of external terminals provided on one surface, a QFP attached to the other surface of the substrate, and the QFP.
Another electronic component attached to the other surface of the substrate other than the mounting part of the semiconductor, the semiconductor element formed on the other surface of the substrate, a semiconductor including wiring for electrically connecting the electronic component and the external terminals to each other. apparatus. 2. A substrate having a plurality of external terminals provided on one surface, a semiconductor element mounted on the other surface of the substrate, and a recess formed on the other surface of the substrate below the semiconductor element. A semiconductor device comprising another electronic component, a wiring formed on the other surface of the substrate to electrically connect the semiconductor element, the electronic component, and the external terminal to each other. 3. A first substrate having a plurality of external terminals provided on one surface thereof, a semiconductor element attached to the other surface of the first substrate, and a semiconductor substrate disposed above the semiconductor element and arranged on the first substrate. A semiconductor device comprising a mounted second substrate and another electronic component mounted on the second substrate, wherein the semiconductor element, the electronic component and the external terminal are electrically connected to each other.