JPS6381837A - Socket for integrated circuit element and manufacture thereof - Google Patents
Socket for integrated circuit element and manufacture thereofInfo
- Publication number
- JPS6381837A JPS6381837A JP22481886A JP22481886A JPS6381837A JP S6381837 A JPS6381837 A JP S6381837A JP 22481886 A JP22481886 A JP 22481886A JP 22481886 A JP22481886 A JP 22481886A JP S6381837 A JPS6381837 A JP S6381837A
- Authority
- JP
- Japan
- Prior art keywords
- terminal
- housing
- printed wiring
- wiring board
- connecting portion
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 3
- 238000005452 bending Methods 0.000 claims description 3
- 238000005476 soldering Methods 0.000 abstract description 8
- 238000000034 method Methods 0.000 abstract description 6
- 230000002265 prevention Effects 0.000 abstract 1
- 239000004020 conductor Substances 0.000 description 8
- 239000011295 pitch Substances 0.000 description 8
- 230000000694 effects Effects 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- 230000009977 dual effect Effects 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 229920003002 synthetic resin Polymers 0.000 description 2
- 239000000057 synthetic resin Substances 0.000 description 2
- 229910000906 Bronze Inorganic materials 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 239000010974 bronze Substances 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
Abstract
Description
【発明の詳細な説明】
（産業上の利用分野）
本発明は、集積回路素子、特にチップキャリア形パッケ
ージによる集積回路素子用ソケットに関する。DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to an integrated circuit device, and in particular to a socket for an integrated circuit device in a chip carrier type package.
（従来の技術）
半導体技術の進歩に伴い、当初個別部品としてその利用
が始まったダイオード、トランジスタ等の半導体素子は
、電子機器を始めとする広い分野でその利用範囲を拡げ
ると共に次第に複数種または／および複数個の半導体素
子を同一チップ上に形成して、小型、軽足、高信頼度の
回路機能を低コストに実現する集積回路素子として市場
に提供されるようになった。(Prior art) With the advancement of semiconductor technology, semiconductor elements such as diodes and transistors, which were initially used as individual components, have expanded their range of use in a wide range of fields including electronic equipment, and have gradually become available in multiple types or/and. By forming a plurality of semiconductor elements on the same chip, integrated circuit elements are now available on the market that are small, lightweight, and realize highly reliable circuit functions at low cost.
初期におｔプるｉＪ積回路素子は、デュアルインライン
形パッケージによる集積回路素子として提供され、その
接続は、エポキシ樹脂又はセラミックのケースによる本
体から突出する２、５４順ピツチで２列の入出力端子を
、印刷配線基板に直接又は着脱に便利なソケットを介し
て接続することにより行なうことは周知である。The initial IJ integrated circuit device was provided as an integrated circuit device in a dual in-line package, and its connections were made using two rows of inputs and outputs with a 2.54 sequential pitch protruding from the main body through an epoxy resin or ceramic case. It is well known to connect terminals to printed wiring boards either directly or via convenient removable sockets.
近年、多くの機能を単一のパッケージに収容して実現づ
る高集積度回路が提供されるに従い、従来のデュアルイ
ンライン形より増加する入出力端子数をより効率的に配
列する小型のパッケージとして、チップキャリヤ形パッ
ケージ等による集積回路索子（高集積度回路素子）が提
供されるようになった。In recent years, as highly integrated circuits have been provided that can accommodate many functions in a single package, small packages that more efficiently arrange the increasing number of input and output terminals than the conventional dual in-line type have become available. Integrated circuit elements (highly integrated circuit elements) have become available in chip carrier type packages and the like.
第７図はリードレスチップキャリヤ形集積回路素子、第
８図はプラスチックリーデツドチップキャリヤ形集積回
路素子をそれぞれ示しており、正方形本体ａの四辺に入
出力端子すが１．２７Ｍのピッチ寸法の下に配設されて
いる。Fig. 7 shows a leadless chip carrier type integrated circuit device, and Fig. 8 shows a plastic leaded chip carrier type integrated circuit device. It is located below.
第７図及び第８図示の集積回路素子を第９図示のような
１．２７ Ｍのピッチの導体パターンＣを有する印刷配
線基板ｄに接続する場合、保守や試験に際して該素子の
着脱を容易にするために、従来から第１０図乃至第１２
図示のような集積回路素子用ソケッ１へが提供されてい
る。該ソケッｔ−ｅは合成樹脂製ハウジングｆと複数個
のばね材料から成る端子０とから成っている。When connecting the integrated circuit device shown in FIGS. 7 and 8 to a printed wiring board d having a conductor pattern C with a pitch of 1.27 M as shown in FIG. 9, the device can be easily attached and removed during maintenance and testing. In order to
A socket 1 for an integrated circuit device as shown is provided. The socket te consists of a synthetic resin housing f and a plurality of terminals 0 made of spring material.
該ハウジングｆの枠形部の内周面から１．２７ｍｍピッ
チで多数個のリブｈが突出形成され、端子９はハウジン
グｆの底部の孔ｉからリブｈ間の凹部に挿入され絶縁分
離保持されている。端子Ｑはその１端に、ハウジングｆ
の枠型部内に挿入される集積回路索子の入出力端子すと
接触する接触部ｍをその他端にリフロー接続片ｊをそれ
ぞれ有する。該リフロー接続片ｊに端子ｑどほず平行に
連結された嵌合片にはハウジングｆの底部の孔ｉ′から
圧入することにより端子ｑをハウジングｆに保持するも
のである。A large number of ribs h are formed protruding from the inner circumferential surface of the frame-shaped portion of the housing f at a pitch of 1.27 mm, and the terminal 9 is inserted from the hole i at the bottom of the housing f into the recess between the ribs h and is held insulated and separated. ing. The terminal Q has one end connected to the housing f.
Each has a contact portion m that comes into contact with the input/output terminal of the integrated circuit cord inserted into the frame portion of the frame, and a reflow connection piece j at the other end. A fitting piece connected to the reflow connection piece j in parallel with the terminal q is press-fitted through a hole i' at the bottom of the housing f to hold the terminal q in the housing f.
（発明が解決しようどする問題点）
上述の従来のソケットによれば、単一のハウジングｆと
打後き加■により作成された端子（ンだけで構成される
ので、簡単であるが、端子９はその下端で固定される片
持梁構造であるため、ハウジングｆの高さ寸法が大きく
、例えば印刷配線基板上に搭載する電子部品の許容高さ
７．６２Ｍを超える欠点があった。また端子ｑのリフロ
ー接続片Ｊの下面のりフロー接続面悲で構成される平面
度が直接ハウジングｆの底面にＪ３ける平面度に依存す
るため、印刷配線基板の反りに追従し難く、印刷配線基
板の導体パターンＣとの間に接続不良が起る欠点を有し
ていた。更に践端子ｑ及びフロー接続片ｊの幅は広幅で
あるので、これ等の複数個を帯状体で連結したものをプ
レスにより打抜き形成した場合、端子９間のピッチは集
積回路素子の入出力端子のピッチ１．２７ ｍの複数倍
例えば３倍になる。したがって帯状体で連結された端子
ｑをハウジングｆに圧入する作業はその一辺につき３回
、計１２回行なわれなければならず、コスト高となる欠
点があった。(Problems to be Solved by the Invention) According to the above-mentioned conventional socket, it is simple because it is composed of only a single housing f and a terminal made by post-stamping. Since 9 has a cantilever structure fixed at its lower end, the height of the housing f is large, which has the drawback of exceeding the permissible height of 7.62 m for electronic components mounted on a printed wiring board, for example. Since the flatness of the bottom surface of the reflow connection piece J of the terminal q directly depends on the flatness of the bottom surface of the housing f, it is difficult to follow the warpage of the printed wiring board, and the flatness of the printed wiring board This had the disadvantage of causing a poor connection with the conductor pattern C.Furthermore, since the width of the connecting terminal q and the flow connecting piece j was wide, a plurality of these connected with a strip was pressed. If the terminals 9 are formed by punching, the pitch between the terminals 9 will be multiple times, for example, 3 times, the pitch of the input/output terminals of the integrated circuit element (1.27 m).Therefore, the work of press-fitting the terminals q connected by the strip-shaped body into the housing f is required. This process has to be performed 3 times for each side, 12 times in total, which has the disadvantage of increasing costs.
本発明は、従来のこのような欠点の無い集積回路用ソケ
ット及びその製造方法を提供することをその目的とする
ものである。SUMMARY OF THE INVENTION An object of the present invention is to provide a socket for an integrated circuit and a method for manufacturing the same that does not have these conventional drawbacks.
（問題点を解決するための手段）
本願の第１発明は、枠形部と底壁部とから成るハウジン
グと、該枠形部の内周面に配列された端子とを具備する
ソケットにおいて、１端に集積回路素子の入出力端子と
接触する折返し形状のばね状接触部が形成された端子の
他端をハウジングの底壁部の透孔に嵌合して該端子を保
持し、該他端の延長部分を横Ｕ字状に屈曲して可撓性を
有する接続部を形成し、該接続部をハウジングの底壁部
の下面より突出させたことを特徴とし、第２発明は、同
一間隔で並列配冒された複数個の端子がその１端におい
て帯状連結片により互いに連結され、該端子の１端の折
返し形状のばね状接触部と他端の横Ｕ字状に屈曲された
接続部とが帯状連結片と直角な同一面内になるように逐
一曲げ加工により成形された端子群を用い、該各端子を
枠形部と底壁部とから成るハウジングの底壁部の透孔か
ら挿入して該枠形部の内周面に配列し、その後帯状連結
片を端子から切折して分子１１ｔすることを特徴とする
。(Means for Solving the Problems) The first invention of the present application provides a socket comprising a housing including a frame portion and a bottom wall portion, and terminals arranged on the inner circumferential surface of the frame portion. The other end of the terminal, which has a folded spring-like contact portion that contacts the input/output terminal of the integrated circuit element at one end, is fitted into a through hole in the bottom wall of the housing to hold the terminal, and the other The second invention is characterized in that the extended portion of the end is bent into a horizontal U-shape to form a flexible connecting portion, and the connecting portion is made to protrude from the lower surface of the bottom wall portion of the housing. A plurality of terminals arranged in parallel at intervals are connected to each other at one end by a band-shaped connecting piece, and the terminal has a folded spring-like contact portion at one end and a connection bent in a horizontal U-shape at the other end. Using a group of terminals formed by bending each part so that the part and the part are in the same plane perpendicular to the strip-shaped connecting piece, each terminal is inserted into a through-hole in the bottom wall of a housing consisting of a frame-shaped part and a bottom wall part. It is characterized in that it is inserted from the terminal and arranged on the inner circumferential surface of the frame-shaped part, and then the strip-like connecting pieces are cut off from the terminals to form the molecules 11t.
（実施例） 本発明の実施例を添付図面につき説明する。(Example) Embodiments of the invention will be described with reference to the accompanying drawings.
第１図乃至第６図において、（１）は合成樹脂材料で成
形されたハウジング、（２）は例えばりん青銅板に錫メ
ッキされた端子である。該ハウジング（１）は第７図及
び第８図示の集積回路素子を内装しうる枠形部（３）と
底壁部（４）とから成り、該枠形部（３）の内周面には
集積回路素子の入出力端子のピッチ寸法１．２７ ｍと
周じピッチ寸法でリブ（５）が各辺につき例えば１０個
突出成形されている。In FIGS. 1 to 6, (1) is a housing molded from a synthetic resin material, and (2) is a terminal made of, for example, a phosphor bronze plate plated with tin. The housing (1) consists of a frame part (3) and a bottom wall part (4) in which the integrated circuit elements shown in FIGS. 7 and 8 can be housed, and the inner peripheral surface of the frame part (3) The integrated circuit element has input/output terminal pitches of 1.27 m and circumference pitches of 1.27 m, and for example, ten ribs (5) are formed on each side to protrude.
該端子（りの１端には折返し形状のばね状接触部（６）
が形成され、他端の延長部分には横Ｕ字状に屈曲されて
可撓性を有する接続部（７）が形成されている。該ばね
性接触部（６）はリブ（５） （５）間の間隔より幅が
狭く形成され該接触部（６）に連なる他端部（８）は広
幅に形成され、圧入用突起（９）を有する。One end of the terminal has a folded spring-like contact portion (6).
is formed, and a connecting portion (7) which is bent into a horizontal U-shape and has flexibility is formed at the extension portion of the other end. The spring contact portion (6) is formed to have a width narrower than the interval between the ribs (5), and the other end (8) connected to the contact portion (6) is formed wide, and has a press-fitting protrusion (9). ).
ハウジング（１）のリブ（５）と枠形部（３）との境界
部分には端子（２）の板厚とほぼ同じ幅のｍ溝ｅが成形
され、その深さは対向する両線１ ａｏ ｔｔｏの底面
間の長さが端子（２）の他端部（８）の幅の寸法とほず
同じになるように形成されている。かくて該端子（２）
の接触部（６）をハウジング（１）の底壁部（４）に形
成された透孔ａｔ＋よりリブ（５） （５）間に挿入し
、他端部（８）を細溝（ＩＯ中を滑動させながら挿入し
、突起（９）を透孔ａ１内に圧入することにより端子（
２）をハウジング（５） （５）間に固定する。この状
態で接続部（７）の上片はハウジング（１）の底壁部（
４）の下面に接触する。該接続部（７）の下片の外面（
ｌｚは印刷配線基板の導体パターンと例えばリフロー半
田付は法により接続する接続面となるもので、該下片の
端部は半円弧状に屈曲形成され、該半円弧状部ｑ３の頂
部は上片に微小間隙を介して対向している。An m-groove e having a width almost the same as the thickness of the terminal (2) is formed at the boundary between the rib (5) and the frame-shaped part (3) of the housing (1), and its depth is equal to that of both opposing lines 1. The length between the bottom surfaces of the terminal (2) is approximately the same as the width of the other end (8) of the terminal (2). Thus, the terminal (2)
The contact part (6) of the housing (1) is inserted between the ribs (5) (5) through the through hole at+ formed in the bottom wall part (4), and the other end (8) is inserted into the thin groove (in the IO). The terminal (
2) is fixed between the housings (5) (5). In this state, the upper piece of the connection part (7) is attached to the bottom wall part (1) of the housing (1).
4) Contact the bottom surface of The outer surface of the lower piece of the connecting part (7) (
lz is a connection surface that is connected to the conductor pattern of the printed wiring board by, for example, reflow soldering, and the end of the lower piece is bent into a semicircular arc shape, and the top of the semicircular arc part q3 is It faces the other piece with a small gap in between.
尚、ハウジング（１〉の底面の４隅に設けられたボス０
＠は、接続部（７）を印刷配線基板の導体パターンにリ
フロー半田付けするとき、底壁部（４）下面の印刷配線
基板からの距離を規制する役目を有し、接続部（υの接
続面の底壁部（４）下面からの自由高さより僅かに低く
、上記微小間隙が零になるハウジング（１）の下方への
押付は時における接続部（７）の接続面の高さより僅か
に高く設定されている。In addition, the bosses 0 provided at the four corners of the bottom of the housing (1)
@ has the role of regulating the distance from the printed wiring board on the lower surface of the bottom wall part (4) when reflow soldering the connection part (7) to the conductor pattern of the printed wiring board, and The bottom wall portion (4) of the surface is slightly lower than the free height from the lower surface, and the downward pressing of the housing (1) at which the minute gap becomes zero is slightly lower than the height of the connecting surface of the connecting portion (7). It is set high.
かくて本案ソケットを印刷配線基板上に載置して端子（
２）の接続部と導体パターンとをリフロー半田“付けす
る時、印刷配線基板に反りがあっても、ハウジング（１
）を下方に押圧すればその反りに対応して接続部（７）
のＵ字状の湾曲の度合が変化し、端子の接続部（１）の
接続面が印刷配線基板の導体パターンと密着する。In this way, the proposed socket was placed on the printed wiring board and the terminals (
2) When reflow soldering the connection part and the conductor pattern, even if the printed wiring board is warped, the housing (1)
) is pressed downward, the connection part (7) will correspond to the warp.
The degree of curvature of the U-shape changes, and the connection surface of the connection portion (1) of the terminal comes into close contact with the conductor pattern of the printed wiring board.
第５図は、少なくともハウジング（１）の１辺に装着さ
れる数例えば１１個の端子（２）（図面では３個のみを
示す）が集積回路素子の入出力端子のピッチ寸法と等し
い間隔で並列し、各接続部（７）の半円弧状部（１３が
細片ａ９を介して帯状連結片（ｌＧに連なる端子群（１
７１を示している。FIG. 5 shows that the number of terminals (2), for example, 11 (only three are shown in the drawing) mounted on at least one side of the housing (1) is spaced at intervals equal to the pitch dimension of the input/output terminals of the integrated circuit element. The terminal group (1
71 is shown.
該端子群（１７１の各端子（２）における折返し形状の
ばね接触部（６）及び横Ｕ字状の接続部（７）は帯状連
結片（ＩＯに対して直角な同一面内になるように逐一曲
げ加工により成形される。同図において、（ｌｅはプレ
ス加工により両面に■形溝が形成され薄肉になった切断
部を示しており、該切断部（Ｉ３は接続部（７）の下片
の外面ａｂより上片側で、外面０を印刷配線基板の導体
パターンにリフロー半田付けするとぎ障害にならない位
置に形成される。The folded spring contact part (6) and the horizontal U-shaped connection part (7) in each terminal (2) of the terminal group (171) are connected to a strip-shaped connecting piece (in the same plane perpendicular to the IO). It is formed by bending each step. In the same figure, (le indicates a thin cut section where ■-shaped grooves are formed on both sides by press processing, and the cut section (I3 is a section below the connecting section (7). It is formed on one side above the outer surface ab of the piece at a position where the outer surface 0 will not become an obstacle when reflow soldering is performed to the conductor pattern of the printed wiring board.
該端子群ａ７）は、第６図示のように、ハウジング（１
）の底壁部（４）の各透孔（１１）に各端子（２）が臨
むように支持し、接触部（６）を各透孔（Ｉｎに挿入し
、次いで他端部（８）を細溝１１０に係合させ、該細溝
（ＩＯ内を滑動させながら各端子（２）の接触部（６）
をリブ（５）間に挿入し、他端部（８）の突起（９）を
各透孔りＤ内に圧入する。接続部（６）の上片が底壁部
（４）の下面に宵接した後切断部ＱＩＩＤにおいてり折
して帯状連結片（６）を分離する。この端子（２）のハ
ウジング（１）への装着作業はハウジング（１）の各辺
について行われる。The terminal group a7) is connected to the housing (1) as shown in the sixth figure.
) is supported so that each terminal (2) faces each through hole (11) of the bottom wall (4), and the contact portion (6) is inserted into each through hole (In), and then the other end (8) the contact portion (6) of each terminal (2) while sliding in the narrow groove (IO).
is inserted between the ribs (5), and the protrusion (9) of the other end (8) is press-fitted into each through hole D. After the upper piece of the connecting part (6) comes into contact with the lower surface of the bottom wall part (4), it is folded at the cutting part QIID to separate the strip-shaped connecting piece (6). This work of attaching the terminal (2) to the housing (1) is performed on each side of the housing (1).
（発明の効果）
以上説明したように、本願の第１発明によるときは、端
子の接触部が折返し形状に形成されるから、ハウジング
の高さ寸法が低いソケットが得られ、端子の接続部が横
Ｕ字状に屈曲して再撓性を有するように形成されるから
、印刷配線基板が反った場合においても端子の接続部と
印刷配線基板の導体パターンはハウジングの抑圧により
密着されることができ、例えばリフロー半田付けににる
接続に不良が生じないようにづることができる効果があ
る。また本願の第２発明によれば、端子のハウジングへ
の装着の工数が従来のものより少なくすることができ、
コスト安となる効果を有する。(Effects of the Invention) As explained above, according to the first invention of the present application, since the contact portion of the terminal is formed in a folded shape, a socket with a low height dimension of the housing can be obtained, and the connection portion of the terminal can be formed in a folded shape. Since it is bent into a horizontal U-shape and has reflexibility, even if the printed wiring board is warped, the connection portion of the terminal and the conductor pattern of the printed wiring board can be kept in close contact with each other by being suppressed by the housing. This has the effect of making it possible to prevent defects in connections during reflow soldering, for example. Further, according to the second invention of the present application, the number of steps for attaching the terminal to the housing can be reduced compared to the conventional method,
This has the effect of reducing costs.
第１図は本発明の１実施例の斜視図、第２図は、その１
部の底面斜視図、第３図は第１図の△−Ａ線截線面断面
図４図は端子を取外した状態の底面斜視図、第５図はそ
の端子群の一部の斜視図、第６図は装着前の端子群とハ
ウジングの位置関係を示す要部の斜視図、第７図及び第
８図は、それぞれ異なる集積回路素子の斜視図、第９図
は印刷配線基板の斜視図、第１０図（ユ従来のソケット
の１例の斜視図、第１１図はその端子の配列状態を示す
斜視図、第１２図は第１０図のｌ３−ＢｒＡ截断面断面
図る。
（１）・・・ハウジング （２）・・・端子〈
３）・・・枠形部 （４）・・・底壁部（
５）・・・リブ （６）・・・ばね状接
触部（７〉・・・接続部 （８）・・・他
端部（１１）・・・透孔 （ｌＧ・・・
帯状連結片外２名
第５図
第７図
第８図
第９図
第１０図
第１１図Fig. 1 is a perspective view of one embodiment of the present invention, and Fig. 2 is the first embodiment.
3 is a cross-sectional view taken along the line Δ-A in FIG. 1; FIG. 4 is a bottom perspective view with terminals removed; FIG. 5 is a perspective view of a part of the terminal group; Fig. 6 is a perspective view of the main parts showing the positional relationship between the terminal group and the housing before installation, Figs. 7 and 8 are perspective views of different integrated circuit elements, and Fig. 9 is a perspective view of the printed wiring board. , FIG. 10 is a perspective view of an example of a conventional socket, FIG. 11 is a perspective view showing the arrangement of its terminals, and FIG. 12 is a cross-sectional view taken along line 13-BrA in FIG. 10. (1) ...Housing (2) ...Terminal
3)...Frame-shaped part (4)...Bottom wall part (
5)...Rib (6)...Spring-like contact part (7>...Connection part (8)...Other end (11)...Through hole (lG...
2 people outside the band-shaped connecting piece Fig. 5 Fig. 7 Fig. 8 Fig. 9 Fig. 10 Fig. 11
Claims (1)
の内周面に配列された端子とを具備するソケットにおい
て、１端に集積回路素子の入出力端子と接触する折返し
形状のばね状接触部が形成された端子の他端をハウジン
グの底壁部の透孔に嵌合して該端子を保持し、該他端の
延長部分を横Ｕ字状に屈曲して可撓性を有する接続部を
形成し、該接続部をハウジングの底壁部の下面より突出
させたことを特徴とする集積回路素子用ソケット。 ２、同一間隔で並列配置された複数個の端子がその１端
において帯状連結片により互いに連結され、該端子の１
端の折返し形状のばね状接触部と他端の横Ｕ字状に屈曲
された接続部とが帯状連結片と直角な同一面内になるよ
うに逐一曲げ加工により成形された端子群を用い、該各
端子を枠形部と底壁部とから成るハウジングの底壁部の
透孔から挿入して該枠形部の内周面に配列し、その後帯
状連結片を端子から切折して分離することを特徴とする
集積回路素子用ソケットの製造方法。[Claims] 1. A socket comprising a housing consisting of a frame-shaped part and a bottom wall part, and terminals arranged on the inner circumferential surface of the frame-shaped part, in which input/output of an integrated circuit element is connected at one end. The other end of the terminal, which has a folded spring-like contact portion that contacts the terminal, is fitted into a through hole in the bottom wall of the housing to hold the terminal, and the extension of the other end is shaped like a horizontal U-shape. 1. A socket for an integrated circuit element, characterized in that the socket is bent to form a flexible connection part, and the connection part is made to protrude from the lower surface of the bottom wall part of the housing. 2. A plurality of terminals arranged in parallel at the same interval are connected to each other by a strip-shaped connecting piece at one end, and one of the terminals is
Using a group of terminals formed by bending one by one so that the folded spring-like contact part at one end and the horizontal U-shaped connecting part at the other end are in the same plane perpendicular to the strip-shaped connecting piece, Each of the terminals is inserted through a through hole in the bottom wall of a housing consisting of a frame-shaped part and a bottom wall, and arranged on the inner circumferential surface of the frame-shaped part, and then the band-shaped connecting pieces are cut off from the terminals and separated. A method of manufacturing a socket for an integrated circuit device, characterized in that:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61224818A JPH0691173B2 (en) | 1986-09-25 | 1986-09-25 | Socket for integrated circuit device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61224818A JPH0691173B2 (en) | 1986-09-25 | 1986-09-25 | Socket for integrated circuit device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6381837A true JPS6381837A (en) | 1988-04-12 |
| JPH0691173B2 JPH0691173B2 (en) | 1994-11-14 |
Family
ID=16819678
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP61224818A Expired - Fee Related JPH0691173B2 (en) | 1986-09-25 | 1986-09-25 | Socket for integrated circuit device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0691173B2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0742682A3 (en) * | 1995-05-12 | 1997-07-30 | Sgs Thomson Microelectronics | Low-profile socketed integrated circuit packaging system |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5533653U (en) * | 1978-08-24 | 1980-03-04 |
-
1986
- 1986-09-25 JP JP61224818A patent/JPH0691173B2/en not_active Expired - Fee Related
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5533653U (en) * | 1978-08-24 | 1980-03-04 |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0742682A3 (en) * | 1995-05-12 | 1997-07-30 | Sgs Thomson Microelectronics | Low-profile socketed integrated circuit packaging system |
| US5805419A (en) * | 1995-05-12 | 1998-09-08 | Stmicroelectronics, Inc. | Low-profile socketed packaging system with land-grid array and thermally conductive slug |
| US6113399A (en) * | 1995-05-12 | 2000-09-05 | Stmicroelectronics, Inc. | Low-profile socketed packaging system with land-grid array and thermally conductive slug |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0691173B2 (en) | 1994-11-14 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US4593463A (en) | Method of making a contact assembly | |
| US4089575A (en) | Connector for connecting a circuit element to the surface of a substrate | |
| JP2555593Y2 (en) | Surface mount type connector | |
| JP3746106B2 (en) | Board electrical connector | |
| JPH0424612Y2 (en) | ||
| US4504887A (en) | Leadless integrated circuit package housing having means for contact replacement | |
| JPH10189079A (en) | Connector module | |
| US4332430A (en) | Printed circuit board connector | |
| US6116923A (en) | Electrical connector | |
| KR20010078106A (en) | Termination adaptor for pcb | |
| JPH06302347A (en) | Ic socket and contact therefor | |
| JPH0622111B2 (en) | Substrate mounting light bulb and manufacturing method thereof | |
| US3641401A (en) | Leadless ceramic package for integrated circuits | |
| KR19980071478A (en) | Semiconductor devices | |
| JP2000077120A (en) | Terminal structure of connector | |
| US4875862A (en) | Surface mountable connector | |
| JPS6313666Y2 (en) | ||
| JPS6381837A (en) | Socket for integrated circuit element and manufacture thereof | |
| KR20070012184A (en) | Socket for attaching electronic component and its contacting carrier | |
| US6109932A (en) | Three-dimensional electrical interconnection system | |
| JP2535766Y2 (en) | Board interconnection device | |
| JPS6013186Y2 (en) | electrical connectors | |
| JPH0432759Y2 (en) | ||
| JPH0215585A (en) | Ic socket | |
| JP2559104Y2 (en) | Surface mount connector |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |