JPH0277189A - Electronic circuit package - Google Patents

Electronic circuit package

Info

Publication number
JPH0277189A
JPH0277189A JP23032188A JP23032188A JPH0277189A JP H0277189 A JPH0277189 A JP H0277189A JP 23032188 A JP23032188 A JP 23032188A JP 23032188 A JP23032188 A JP 23032188A JP H0277189 A JPH0277189 A JP H0277189A
Authority
JP
Japan
Prior art keywords
package
connector
electronic circuit
packages
fixing sections
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP23032188A
Other languages
Japanese (ja)
Inventor
Tsuneaki Tajima
田島 恒明
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Priority to JP23032188A priority Critical patent/JPH0277189A/en
Publication of JPH0277189A publication Critical patent/JPH0277189A/en
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/14Structural association of two or more printed circuits
    • H05K1/141One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/36Assembling printed circuits with other printed circuits
    • H05K3/368Assembling printed circuits with other printed circuits parallel to each other

Landscapes

  • Combinations Of Printed Boards (AREA)

Abstract

PURPOSE:To obtain a package having high reliability by electrically connecting a first package with a second package mounted thereon by means of a connector while fixing these packages at a plurality of fixing sections. CONSTITUTION:A second package 2 is mounted on a first package 1 while a connector 2 provided at the center of the second package 2 is interposed therebetween. A plurality of fixing sections 4 are arranged at positions different from the position where the connector 3 is mounted, so that the packages 1 and 2 are connected with each other by the connector 3 and fixed to each other at the fixing sections 4. In this manner, the connector 3 is not affected adversely by the fixing sections 4 and can keep its reliability. According to such arrangement, length of a line for electrical signals is at maximum equivalent to the total length of one side of the package orthogonal to the connector 3. Therefore, electrical effects of noise can be minimized.

Description

【発明の詳細な説明】 〔産業上の利用分野〕 本発明は印刷配線板上に電子回路素子を搭載して接続し
た2枚の電子回路パッケージを上下に積重ねて固定し、
その間をコネクタで接続した電子回路パッケージに関す
る。
[Detailed Description of the Invention] [Industrial Application Field] The present invention provides a method for stacking and fixing two electronic circuit packages in which electronic circuit elements are mounted on a printed wiring board and connected together.
This invention relates to an electronic circuit package that is connected with a connector.

〔従来の技術〕[Conventional technology]

印刷配線板(プリン1〜基板)上に混M回路(IC)等
の電子回路素子を搭載して接続した2枚の電子回路パッ
ケージ(パッケージ)を、所定の間隔を保って上下に積
重ねて固定し、その間に設けたコネクタによって2枚の
パッケージの間を接続するようにした従来のパッケージ
の構成は、第2図および第3図に例示するように、上側
の第二パッケージ12まなは22の下面の一方の端部ま
たは両方の端部にコネクタ】−3または23を取付け、
このコネクタ13まなは23によって下側の第一パッケ
ージと上側の第二パッケージとを電気的に接続し、コネ
クタ13または23以外の位置に設けた複数個の固定部
1.4 、tた24で第一パ・ンケージ11または21
と第二パッケージ12または22とを固定する構成とな
っている。
Two electronic circuit packages (packages) in which electronic circuit elements such as mixed M circuits (ICs) are mounted and connected on a printed wiring board (Print 1 to board) are stacked one on top of the other with a predetermined distance maintained and fixed. However, in a conventional package configuration in which two packages are connected by a connector provided between them, as illustrated in FIGS. 2 and 3, the upper second package 12 or 22 Attach connector 】-3 or 23 to one end or both ends of the bottom surface,
This connector 13 pin 23 electrically connects the lower first package and the upper second package, and a plurality of fixing parts 1.4 and 24 provided at positions other than the connector 13 or 23 First package 11 or 21
and the second package 12 or 22 are fixed.

〔発明が解決しようとする課題〕[Problem to be solved by the invention]

上述したような従来の二段式のパッケージは、コネクタ
を上側のパッケージの端部に取付けているなめ、多数の
ピン数を有するコネクタで2枚のパッケージの位置決め
が行なわれる。このなめ、パッケージ上のコネクタの位
置誤差がそのままコネクタの接触部に影響を与え、高精
度な部品であるコネクタの信頼性を低下させるという欠
点を有している。また、コネクタを第二パッケージの一
方の端部のみ設けたものは、第3図に示すように、電気
信号が第一パッケージ21から第二パッケージ22に入
り、第二パッケージのコネクタの位置と反対側の位置に
実装されている電子部品25を通って再び第二パッケー
ジ21に戻る場合、線路長が長くなるためノイズの影響
を受けやすいという欠点も有している。
In the conventional two-stage package as described above, the connector is attached to the end of the upper package, so the two packages are positioned using a connector having a large number of pins. This has the disadvantage that positional errors of the connector on the package directly affect the contact portion of the connector, reducing the reliability of the connector, which is a highly precise component. In addition, in the case where the connector is provided only at one end of the second package, as shown in FIG. When returning to the second package 21 through the electronic component 25 mounted on the side, the line length becomes long, which also has the disadvantage of being susceptible to noise.

〔課題を解決するための手段〕[Means to solve the problem]

本発明の電子回路パッケージは、下側の第一パッケージ
と、その上に搭載した第二パッケージと、第二パッケー
ジの下面の中央部に設けてこれらのパッケージを電気的
に接続するコネクタと、これら2枚のパッケージを固定
するためこのコネクタの搭載位置以外の位置に設けた複
数個の固定部とを備えたものである。
The electronic circuit package of the present invention includes a first package on the lower side, a second package mounted on the first package, a connector provided at the center of the bottom surface of the second package to electrically connect these packages, and a connector for electrically connecting these packages. In order to fix the two packages, a plurality of fixing parts are provided at positions other than the mounting position of the connector.

すなわち、本発明の電子回路パッケージは、印刷配線基
板上に電子部品を搭載して接続した第一のパッケージと
、印刷配線板上に電子部品を搭載して接続し前記第一の
パッケージの上に搭載され下面の中央部にコネクタを有
する第二のパッケージとを備え、前記第一のパッケージ
と前記第二のパッケージとを前記コネクタを設けた位置
以外の位置に設けた複数個の固定部で固定し、前記コネ
クタによって前記第一のパッケージと前記第二のパッケ
ージとを電気的に接続したものである。
That is, the electronic circuit package of the present invention includes a first package in which electronic components are mounted on a printed wiring board and connected, and a first package in which electronic components are mounted on a printed wiring board and connected to the first package. a second package that is mounted and has a connector at the center of the lower surface, and fixes the first package and the second package with a plurality of fixing parts provided at positions other than the position where the connector is provided. The first package and the second package are electrically connected by the connector.

〔実施例〕〔Example〕

次に本発明の実施例について図面を参照して説明する。 Next, embodiments of the present invention will be described with reference to the drawings.

第1図(a)および(b)は本発明の一実施例を示す斜
視図および側面図である。
FIGS. 1(a) and 1(b) are a perspective view and a side view showing an embodiment of the present invention.

第1図において、第一パッケージ1の上に第二パッケー
ジ2がその間にコネクタ3を挟んで搭載されている。コ
ネクタ3は、第二パッケージ2の下面の中央部に設けら
れている。固定部4は、コネクタ3を搭載した位置と異
なる位置に複数個設けられており、パッケージ1と第二
パッケージ2とをコネクタ3によって接続したあと第一
パッケージ1と第二パッケージ2とを固定する。
In FIG. 1, a second package 2 is mounted on a first package 1 with a connector 3 interposed therebetween. The connector 3 is provided at the center of the lower surface of the second package 2. A plurality of fixing parts 4 are provided at positions different from the positions where the connectors 3 are mounted, and fix the first package 1 and the second package 2 after the package 1 and the second package 2 are connected by the connector 3. .

上述のように構成することにより、コネクタ3の接続に
悪影響を与えないため、充分にコネクタ3の信頼性を保
つことができる。また、第一パッケージ1から第二パッ
ケージ2の端部に搭載した電子部品5を通って再び第一
パッケージ1に戻る電気信号の線路は、長くてもコネク
タ3と直角をなす第二パッケージの一辺の全長と同じ程
度であり、従ってノイズによる電気的影響を小さく抑制
することが可能である。
By configuring as described above, the connection of the connector 3 is not adversely affected, so that the reliability of the connector 3 can be maintained sufficiently. Furthermore, the electrical signal path from the first package 1 to the end of the second package 2 through the electronic component 5 and back to the first package 1 is at most one side of the second package that is perpendicular to the connector 3. Therefore, it is possible to suppress the electrical influence due to noise to a small level.

〔発明の効果〕〔Effect of the invention〕

以上説明したように、本発明の電子回路パッケージは、
上下に積載した第一パッケージと第二パッケージを電気
的に接続するコネクタを、第二パッケージの中央部に設
けることにより、信頼性の高いパッケージが得られてい
るという効果がある。
As explained above, the electronic circuit package of the present invention has
By providing a connector that electrically connects the first package and second package stacked one above the other in the center of the second package, a highly reliable package is obtained.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図(a)および(b)は本発明の一実施例を示す斜
視図および側面図、第2図および第3図は従来の電子回
路パッケージの異った二つの例を示す側面図である。
FIGS. 1(a) and (b) are perspective views and side views showing one embodiment of the present invention, and FIGS. 2 and 3 are side views showing two different examples of conventional electronic circuit packages. be.

Claims (1)

【特許請求の範囲】[Claims]  印刷配線基板上に電子部品を搭載して接続した第一の
パッケージと、印刷配線板上に電子部品を搭載して接続
し前記第一のパッケージの上に搭載され下面の中央部に
コネクタを有する第二のパッケージとを備え、前記第一
のパッケージと前記第二のパッケージとを前記コネクタ
を設けた位置以外の位置に設けた複数個の固定部で固定
し、前記コネクタによって前記第一のパッケージと前記
第二のパッケージとを電気的に接続したことを特徴とす
る電子回路パッケージ。
A first package in which electronic components are mounted and connected on a printed wiring board; and a first package in which electronic components are mounted on and connected to the printed wiring board, which is mounted on the first package and has a connector in the center of the lower surface. a second package, the first package and the second package are fixed by a plurality of fixing parts provided at positions other than the position where the connector is provided, and the first package is fixed by the connector. and the second package are electrically connected.
JP23032188A 1988-09-13 1988-09-13 Electronic circuit package Pending JPH0277189A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP23032188A JPH0277189A (en) 1988-09-13 1988-09-13 Electronic circuit package

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP23032188A JPH0277189A (en) 1988-09-13 1988-09-13 Electronic circuit package

Publications (1)

Publication Number Publication Date
JPH0277189A true JPH0277189A (en) 1990-03-16

Family

ID=16906002

Family Applications (1)

Application Number Title Priority Date Filing Date
JP23032188A Pending JPH0277189A (en) 1988-09-13 1988-09-13 Electronic circuit package

Country Status (1)

Country Link
JP (1) JPH0277189A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9878747B2 (en) 2013-12-20 2018-01-30 Renault S.A.S. Fastener for fastening a spare wheel cradle to an underbody

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9878747B2 (en) 2013-12-20 2018-01-30 Renault S.A.S. Fastener for fastening a spare wheel cradle to an underbody

Similar Documents

Publication Publication Date Title
US6717825B2 (en) Electrical connection system for two printed circuit boards mounted on opposite sides of a mid-plane printed circuit board at angles to each other
JPH0679990A (en) Ic memory card
JPH04167457A (en) Semiconductor device
JPH0277189A (en) Electronic circuit package
JP2921708B2 (en) Electronic components for surface mounting
JPH06310827A (en) Surface mounting component arrangement structure
JPH04335561A (en) Semiconductor device
JPS59163842A (en) Integrated circuit socket stackedly mounting construction
JP2000195586A (en) Circuit board for card connector
JP2002042926A (en) Layered electronic circuit package structure
JP2723514B2 (en) Semiconductor device
JPH0410559A (en) Semiconductor package
JPH08172147A (en) Lsi socket for three-dimensional connection
JP2857823B2 (en) Electronic component mounting structure on circuit board
JP2765384B2 (en) Memory socket
JPS5926613Y2 (en) Electronic component mounting structure
JPS5913350A (en) Socket for integrated circuit
JPH0250464A (en) Lattice array type semiconductor element package
JPS6236300Y2 (en)
JPS582091A (en) Printed circuit board
JP2000068443A (en) Stacking structure for stacked semiconductor device
JPH034471A (en) Ic socket to which electronic parts can be mounted
JPH05326092A (en) Socket for ic package
JPS60218864A (en) Mounting method of electronic-parts package and structure of electronic-parts package
JPH06302933A (en) Mounting structure for chip component