JP2002042926A - Layered electronic circuit package structure - Google Patents

Abstract

PROBLEM TO BE SOLVED: To solve the problem on a parallel-orthogonal rearrangement structure for a mother board and a daughter board in a conventional layered electronic circuit package that circuit connection in a parallel condition should be the same as that in an orthogonal condition and so duplex connection in a printed pattern is required between a parallel arrangement connector of a surface mounting type mounted on the daughter board and an orthogonal arrangement connector, causing crowding of patterns in a limited area between both connectors, producing the channel neck of the patterns and requiring more layers of the printed board. SOLUTION: This layered electronic circuit package structure comprises connectors 14, 15 of a through-hole passing type for parallel arrangement and orthogonal arrangement of both a mother board 1 and a daughter board 2 and a housing 13. This construction eliminates the need for the pattern for connecting the parallel arrangement connector and the orthogonal arrangement connector mounted on the daughter board in the conventional rearrangement structure.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a laminated electronic circuit package structure, and more particularly to a laminated electronic circuit package structure suitable for a high-speed signal handling electronic circuit package requiring a component mounting area exceeding a standard manufacturing size. The present invention relates to a mounting structure of a type electronic circuit package.

[0002]

2. Description of the Related Art In general, electronic devices such as electronic exchanges and computers are designed by dividing functional circuits according to the standard size of electronic circuit package manufacturing, and are handled by using a large number of electronic circuit packages of the same size. We adopt a method of manufacturing in an easy size.

However, when a standard manufacturing size is applied, new development of an LSI is required, and the development period is lengthened, resulting in an increase in cost and the occurrence of circuit division that cannot be handled even in an LSI design.

[0004] In the case of such a circuit division requiring a component mounting area exceeding the production standard size, Japanese Patent No. 3017 is disclosed.
The stacked electronic circuit package structure (shown in FIGS. 5A and 5B) described in the specification of Japanese Patent No. 194 is adopted.

In FIGS. 5 (A) and 5 (B) disclosed in the specification of Japanese Patent No. 3017194, an electronic circuit package having a circuit scale to which a manufacturing standard size cannot be applied is divided into a motherboard 1 and a daughter board 2, and a daughter board is provided. By providing the motherboard 1 with a common connector 3 that can be shared and connected at a right angle to the parallel arrangement of the board 2, and by providing the daughter board 2 with the parallel arrangement connector 4 and the right angle arrangement connector 5, 1 shows a mounting structure of an electronic circuit package that enables switching between a parallel arrangement and a right-angled arrangement.

To respond to the switching of the arrangement, FIG.
As shown in (A) and (B), it is necessary to connect the parallel arrangement connector 4 mounted on the daughter board 2 and the signal terminal 6 of the right-angle arrangement connector 5 in a duplex manner with a print pattern 7.

FIGS. 7A and 7B similarly show FIGS.
7 shows an example of a printed pattern formation of a daughter board 2 in which mounting arrangements of connectors and connectors are different.

The extension package 8 shown in FIG. 8 is connected to an electronic circuit package slot of a unit (not shown), and the laminated electronic circuit package to be debugged is fitted into the extension connector 9 so that the motherboard 1 and the daughter board 2 are arranged at right angles. By doing so, the debugging and the operation of identifying the malfunctioning part are being advanced.

[0009]

However, the above-mentioned prior art has the following drawbacks.

In order to realize the parallel arrangement and the right-angled arrangement between the motherboard 1 and the daughterboard 2 of the laminated electronic circuit package, the circuit connection in the parallel state and the right-angled state must be the same. It is necessary to connect the connector 4 for parallel mounting and the connector 5 for right-angled mounting of the surface mounting type in a double pattern by a print pattern.

However, at this time, since a high-speed signal is transmitted, the patterns must be connected at the shortest distance.

Therefore, the patterns are densely packed in a limited area between the connector 4 for parallel arrangement and the connector 5 for right-angled arrangement mounted on the daughter board 2, thereby causing a channel neck of the pattern and the number of layers of the printed circuit board. May have to be increased.

Further, in the prior art, a daughter board 2 is provided with a surface-mount type right-angled connector 5 and a parallel-shaped connector 4, and the motherboard 1 can be commonly connected to both the parallel-type and the right-angled layout. The connector 3 is mounted, and three connectors are required for the arrangement switching structure between the motherboard 1 and the daughter board 2.

SUMMARY OF THE INVENTION The present invention has been made in view of the above-mentioned conventional circumstances, and an object of the present invention is to provide a connector for a right-angled through-hole type connector and a housing on a daughter board, and a parallel layout of a through-hole type. The motherboard is equipped with a connector and a housing, and the daughter board can be switched between the parallel and right-angled configurations with respect to the motherboard. It is an object of the present invention to provide a structure of a novel multilayer electronic circuit package that enables a reduction in the number of layers and a cost of a connector.

[0015]

In order to achieve the above object, a laminated electronic circuit package structure according to the present invention comprises a connector for parallel arrangement for connecting a motherboard and a daughterboard in parallel, and the motherboard and a daughter. The daughter board provided with a right-angle through-hole connector terminal sharing a right-angle connector for connecting the boards at a right angle; a parallel connector and a right-angle connector for connecting between the motherboard and the daughter board; And a motherboard provided with a straight type through-hole through-connector terminal sharing the same connector.

The right-angled connector arranged on the daughter board is mounted on a through hole formed in the daughter board from the component side of the daughter board.
A first housing is fixed to the right-angle through-hole through-connector terminal from the solder surface side, and the parallel arrangement connector arranged on the motherboard is provided with a through-hole formed in the motherboard. And the second housing is fixed to the straight through-hole through connector terminal from the solder surface.

When the daughter board and the motherboard are arranged in parallel, a connector in the first housing mounted on the solder surface side of the daughter board is fitted to the connector for parallel arrangement mounted on a component surface of the motherboard. Be combined.

When the daughter board and the motherboard are arranged at right angles, the right-angled connector mounted on the component surface of the daughter board is fitted to the connector in the second housing mounted on the solder side of the motherboard. Let me do.

The stacked electronic circuit package structure according to the present invention includes a through-hole type connector and a housing that are commonly used for both the motherboard and the daughterboard in a parallel arrangement and a right-angled arrangement. There is no need for a pattern for connecting between the parallel arrangement connector and the right-angle arrangement connector mounted on the board.

The connector mounted on the daughter board has a simple structure in which a through-hole right-angled connector having a sufficiently long terminal is press-fitted from the component side and a housing is press-fitted into the through-hole terminal from the solder side. Structure.

The structure of the connector mounted on the motherboard is also simple in that a through-hole parallel-type connector whose terminals are sufficiently long is press-fitted from the component side, and the housing is press-fitted into the through-hole terminal from the solder side. Therefore, the number of connectors can be reduced and the cost can be reduced as compared with the conventional connector structure.

[0022]

According to the present invention, both the daughter board and the mother board have through-hole type connectors 14, 15 respectively.
By attaching the housing to the terminal that penetrated the through hole, the front and back surfaces of both boards were configured to be connectable to connectors, so regardless of the parallel arrangement and right-angled arrangement of the daughter board and motherboard, Signal transmission can be realized only with a simple connector structure.

[0023]

Next, a preferred embodiment of the present invention will be described in detail with reference to the drawings.

FIGS. 1 and 2 show an embodiment of a stacked electronic circuit package structure according to the present invention. FIG. 1 shows a case where a daughter board 2 having a stacked electronic circuit package structure according to the present invention is connected horizontally. FIG. 2 is a side view showing FIG.
7 is a side view showing a case where the daughter board 2 of the multilayer electronic circuit package of FIG.

[0025]

FIG. 3A and FIG. 3B show the connector structure of the daughter board 2. FIG.

Referring to FIGS. 3A and 3B, the right-angled connector 11 is press-fitted from the component side into the through-hole 10 for mounting the connector provided on the daughter board 2, and the solder side. Then, the housing 13 is press-fitted into the terminal (right angle type through-hole through connector) 14 of the connector.

FIG. 4 shows the connector structure of the motherboard 1.
(A) and (B) show.

Referring to FIGS. 4A and 4B, a parallel mounting connector 12 is press-fitted into the connector mounting through hole 10 of the motherboard 1 from the component surface side.
The housing 13 is pressed into the terminal (straight through-hole through connector) 15 of the connector from the solder side.

[0029]

Next, the operation of the embodiment according to the present invention will be described.

When the daughter board 2 and the motherboard 1 are arranged in parallel, as shown in FIG. 1, a connector for mounting the housing 13 on the solder side of the daughter board 2 is mounted on the component surface of the motherboard 1. 12 is fitted. At this time, when the daughter board 2 is long, a stud 17 for maintaining a parallel relationship between the two boards can be provided between the mother board 1 and the daughter board 2.

When the daughter board 2 and the motherboard 1 are arranged at a right angle, as shown in FIG. Into the connector.

The extension package 8 shown in FIG. 8 is connected to an electronic circuit package slot of a unit (not shown), and the electronic circuit package is fitted to the extension connector 9 to arrange the motherboard 1 and the daughter board 2 at right angles. In addition, the efficiency of debugging and identification of malfunctioning points has been improved.

[0033]

The present invention is constructed and operates as described above, and according to the present invention, the following effects can be obtained.

According to the laminated electronic circuit package structure of the present invention, an electronic circuit package having a large circuit scale can be manufactured.
Divided into motherboard and daughter board, the daughter board has a long enough through-hole through-hole type connector for right-angled placement pressed into the component board side of the daughter board, and the housing pressed into the through-hole through terminal from the solder side of the daughter board The motherboard has a structure in which the through-hole parallel type connector with long enough terminals is pressed into the component side of the motherboard, and the housing is pressed into the through-hole through terminal from the solder side of the motherboard. Since the mounting structure allows the daughter board to be switched between the parallel arrangement and the right-angle arrangement, the following excellent effects can be obtained despite the simple structure.

In the mounting structure for switching the arrangement of the motherboard and the daughter board, the terminals of the connector can be shared independently of the parallel arrangement and the right-angled arrangement. Since double wiring between the connectors is not required, the wiring channel has a margin, and the number of signal layers of the daughter board can be reduced.

In addition, since the connector structure for switching between the parallel arrangement and the right-angled arrangement is simplified, when the connector for the right-angled arrangement and the housing and the connector for the parallel arrangement and the housing are respectively set as one set, the structure is compared with the conventional arrangement switching structure. Therefore, the number of connectors can be reduced, so that the cost can be reduced.

[Brief description of the drawings]

FIG. 1 is a side view showing one embodiment of a stacked electronic circuit package structure according to the present invention, in which a daughter board is horizontally arranged with respect to a motherboard.

FIG. 2 is a side view showing one embodiment of a stacked electronic circuit package structure according to the present invention, in which a daughter board is vertically arranged with respect to a motherboard.

3A and 3B show a connector structure of a daughter board having a laminated electronic circuit package structure according to the present invention, wherein FIG. 3A is a perspective view and FIG. 3B is a side view.

4A is a perspective view showing a connector structure of a motherboard having a multilayer electronic circuit package structure according to the present invention, FIG.
(B) is a side view.

FIG. 5 shows a conventional laminated electronic circuit package structure;
(A) Side view with parallel arrangement, (B) is a side view with vertical arrangement.

FIGS. 6A and 6B show a main part of a daughter board in the same surface mounting structure of a conventional multilayer electronic circuit package, wherein FIG. 6A is a plan view of a double pattern wiring and FIG. 6B is a sectional view of a connector.

FIGS. 7A and 7B show a main part of a daughter board in a conventional double-sided mounting structure of a laminated electronic circuit package, wherein FIG. 7A is a plan view of a double pattern wiring, and FIG. 7B is a sectional view of a connector.

FIG. 8 is a schematic perspective view showing an extension package.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 ... Motherboard 2 ... Daughter board 3 ... Shared connector 4 ... Connector for parallel arrangement (surface mount type) 5 ... Connector for right angle arrangement (surface mount type) 6 ... Signal terminal 7 ... Print pattern 8 ... Extension package 9 ... Extension connector 10 ... Through hole 11 ... Connector for right angle arrangement (Through hole penetration type) 12 ... Connector for parallel arrangement (Through hole penetration type) 13 ... Housing 14 ... Terminal ((Right angle arrangement connector) (Right angle type through hole through connector)) 15 ... Terminal ((Connector for parallel arrangement) (Straight type through-hole connector)) 17 ... Stud

Continued on the front page F term (reference) 5E023 AA04 AA16 BB02 BB11 BB22 CC02 CC12 CC22 FF13 HH30 5E077 BB23 BB31 CC02 CC15 CC22 CC26 DD12 FF11 JJ20 JJ30 5E344 AA01 AA04 AA08 BB06 CC09 CD20 EE30 A01A06AEF

Claims (4)

[Claims] 1. A right-angle through-hole through-connector terminal which shares a parallel connector for connecting a motherboard and a daughter board in parallel and a connector for a right-angle connector for connecting the motherboard and a daughter board at a right angle. And the motherboard provided with a straight type through-hole through-connector terminal that shares a connector for parallel arrangement and a connector for right-angled arrangement for connecting between the motherboard and the daughterboard. Characterized stacked electronic circuit package structure. 2. The connector for right-angled arrangement arranged on the daughter board is mounted on a through hole formed in the daughter board from the component side of the daughter board, and the first housing is mounted on the solder side from the solder side. The connector for parallel arrangement, which is fixed to the right-angle through-hole through-hole connector terminal and is arranged on the motherboard, is mounted in a through-hole formed in the motherboard from the component side of the motherboard, The laminated electronic circuit package structure according to claim 1, further comprising a second housing fixed to the straight through-hole through-connector terminal from a surface. 3. When the daughter board and the motherboard are arranged in parallel, the connector in the first housing mounted on the solder surface side of the daughter board is mounted on the component surface of the motherboard. The multilayer electronic circuit package structure according to claim 2, further comprising: 4. When the daughter board and the motherboard are arranged at right angles, the right-angled connector mounted on the component surface of the daughter board is connected to the connector in the second housing mounted on the solder surface side of the motherboard. 3. The laminated electronic circuit package structure according to claim 2, further comprising a fitting.