JPH04335561A - Semiconductor device - Google Patents

Abstract

PURPOSE:To simply connect corresponding outer lead terminals of two electronic components to one another by a wiring of a single type. CONSTITUTION:A semiconductor device is formed of two electronic components 20, 30 in which protruding directions of outer lead terminals 25, 35 are directed reversely toward front and rear surfaces of a circuit board. Thus, in the case of single-sided mounting, when both outer lead terminals 25, 35 of the components 20, 30 are directed downward, the front and rear surfaces of both circuit boards 21, 31 are disposed upside down, and the terminals 25, 35 disposed oppositely inside the boards 21, 31 become the same number. Accordingly, the terminals 25, 35 of the same number may be connected by printed wiring 13.

Description

[Detailed description of the invention]

0001

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor device having two electronic components mounted on a mounting board.

0002

[Prior Art] As a conventional semiconductor device of this type, FIG.
And as shown in FIG. 7, one side of the mounting board 1 (surface 1A
), there is a single-sided mounting type in which electronic components 2, 2 such as two hybrid ICs are mounted side by side, and a single-sided mounting type in which electronic components 2, 2 such as two hybrid ICs are mounted side by side, and a single-sided mounting type in which electronic components 2, 2 such as two hybrid ICs are mounted side by side, and a single-sided mounting type in which electronic components 2, 2 such as two hybrid ICs are mounted side by side.
There is a double-sided mounting type that is mounted separately.

In any type of semiconductor device, two identical electronic components 2, 2 are mounted on a mounting board 1, and printed wiring 3 and through holes 4 formed on the mounting board 1 are mounted on a mounting board 1.
It has a structure in which the external lead terminals 5, 5 of both electronic components 2, 2 are connected in correspondence with each other by wiring such as.

[0004] The electronic component 2 has a semiconductor chip 7 mounted on the surface 6A of the circuit board 6, and is arranged so as to protrude downward from two opposing sides of the circuit board 6 with the surface 6A of the circuit board 6 facing upward. An external lead terminal 5 is attached to the terminal. There are 14 external lead terminals 5 on each side of the circuit board 6.
A total of 28 books are provided, each with L1 to L2.
It is individually numbered 8.

[0005] In the case of single-sided mounting type, two electronic components 2
, 2 are oriented in reverse order, and the external lead terminals 5, 5 of the same numbers of both electronic components 2, 2 are located diagonally. In addition, in the case of the double-sided mounting type, the two electronic components 2, 2 are arranged so as to face each other vertically, and both the electronic components 2,
Two external lead terminals 5, 5 having the same number are located diagonally. In addition, with this double-sided mounting type, printed wiring 3
The pattern and arrangement of through hole 4 will be complicated, so
Their illustration is omitted.

The ends of the external lead terminals 5, 5 of the two electronic components 2, 2 are placed on the printed wiring 3 formed on the mounting board 4 or on the electrode pads (not shown) of the through holes 4 and soldered. The printed wiring 3
Two electronic components 2 can be connected by mixed wiring of through-holes 4 and
, 2, the same numbered external lead terminals 5, 5 are connected to each other.

[0007]

[Problems to be Solved by the Invention] However, in any of the above-mentioned types of semiconductor devices, the following inconvenience occurs when connecting the external lead terminals 5, 5 of the two electronic components 2, 2 with the same number. There is room for improvement.

First, in the case of the single-sided mounting type shown in FIGS. 6 and 7, the external lead terminals 5, 5 with the same number of both electronic components 2, 2 are located diagonally, so that the external lead terminals 5, 5 with the same number , 5, the printed wirings 3 will intersect. In order to avoid this intersection of the printed wiring 3, a complicated wiring structure such as using both the printed wiring 3 and the through hole 4 must be considered, which makes the design complicated.

Furthermore, in the case of the double-sided mounting type shown in FIGS. 8 and 9, since the external lead terminals 5, 5 of the same numbers of both electronic components 2, 2 are located diagonally, the external leads of the same numbers It is impossible to connect the terminals 5, 5 with a simple through hole 4 that passes through the top and bottom, and in this case as well, a complicated wiring structure such as using both the printed wiring 3 and the through hole 4 must be considered. This makes the design complicated.

The present invention was devised in view of the above circumstances, and it connects corresponding external lead terminals of two electronic components to each other using a single type of wiring (either printed wiring or through-holes). The challenge is to make it easy to connect.

[0011]

[Means for Solving the Problems] In order to solve the above problems, the present invention has the following configuration.

In the semiconductor device of the present invention, first and second electronic components are mounted on a mounting board, and corresponding external lead terminals of both electronic components are electrically connected to each other by wiring formed on the mounting board. The first and second electronic components each include a semiconductor chip mounted on at least one surface of a circuit board, and a semiconductor chip mounted on two opposing sides of the circuit board in a direction perpendicular to the surface of the circuit board. It is characterized in that external lead terminals are attached so as to protrude, and the directions in which the external lead terminals of the first and second electronic components protrude are reversed from the front and back of the circuit board.

Note that the semiconductor device of the present invention has first and second
This includes those in which electronic components are mounted all together on one side of a mounting board, and those in which electronic components are mounted separately on both the front and back sides of a mounting board.

[0014]

[Operation] When a semiconductor device is constructed using two electronic components having different structures as described above, the corresponding external lead terminals of the two electronic components can be connected to each other by a single type of wiring.

First, when two electronic components are mounted side by side on one side of a mounting board, the circuit board of one electronic component faces upward, and the circuit board of the other electronic component The surface will now face downwards,
Corresponding external lead terminals of both electronic components are positioned symmetrically with respect to a line separating both electronic components. Therefore, the corresponding external lead terminals can be connected by printed wiring that does not cross each other.

Furthermore, when two electronic components are mounted one on each side of a mounting board, the surface of the circuit board of both electronic components faces upward, and the corresponding external leads of both electronic components The terminals are positioned so that they face each other with the mounting board in between. In other words, the corresponding external lead terminals of both electronic components can be placed in the same position on the front and back sides of the mounting board, and therefore, the corresponding external lead terminals can be connected with just a simple through hole that passes through each other vertically. become.

[0017]

Embodiments Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.

A first embodiment of the present invention is shown in FIGS. 1 and 2. In this embodiment, a single-sided mounting type is used in which the first electronic component 20 and the second electronic component 30 are mounted side by side on the surface 11 of the mounting board 10. In addition, the first
, the second electronic components 20 and 30 are each made of, for example, a hybrid IC.

The mounting board 10 is made of a rectangular insulating board, and has a first electronic component 20 and a second electronic component 3 on its surface 11.
A predetermined pattern of printed wiring 13 connecting the 0 and 0 is printed.

The first electronic component 20 has a semiconductor chip 24 mounted on the front surface 22 of a circuit board 21, and external leads are mounted on two opposing sides of the circuit board 21 with the front surface 22 of the circuit board 21 facing upward. The terminal 25 is attached so as to protrude downward (toward the back surface 23 side).

The second electronic component 30 has a semiconductor chip 34 mounted on the front surface 32 of a circuit board 31, and external leads on two opposing sides of the circuit board 31 with the back surface 33 of the circuit board 31 facing upward. The terminal 35 is attached so as to protrude downward (towards the surface 32).

There are a total of 28 external lead terminals 25 and 35, 14 on each side of the circuit boards 21 and 31.
A total of 1,000 units are provided, each of which is individually numbered L1 to L28. External lead terminals 25 and 35 having the same number are connected to each other by printed wiring 13 formed on the mounting board 10.

In this embodiment, the difference between the first and second electronic components 20 and 30 is that both circuit boards 21
, 31 with both surfaces 22 and 32 facing upward,
The protruding direction of each external lead terminal 25, 35 is upside down. That is, the first electronic component 20 has external lead terminals 25 protruding toward the back surface 23 of the circuit board 21, and the second electronic component 30 has external lead terminals 35 protruding toward the front surface 32 of the circuit board 31. There is.

In the single-sided mounting type as in this embodiment, the external lead terminals 25 and 35 of the first and second electronic components 20 and 30 having the same number are centered on the line O that partitions between the two electronic components 20 and 30. Therefore, the external lead terminals 25 and 35 with the same number are
As shown in the figure, the connection can be made by simply routing the printed wiring 13 so that it does not intersect.

A second embodiment of the invention is shown in FIGS. 3 and 4. In this embodiment, a double-sided mounting type is used in which the first electronic component 20 is mounted on the front surface 11 of the mounting board 10, and the second electronic component 30 is mounted on the back surface 12 of the mounting board 10.

In the case of such a double-sided mounting type, the surfaces 22 and 32 of the circuit boards 21 and 31 of both the electronic components 20 and 30 face upward, and the first and second electronic components 20 and 30 External lead terminals 25 and 35 having the same number are positioned to face each other with the mounting board 10 in between. In other words, since the external lead terminals 25 and 35 with the same number of both electronic components 20 and 30 are arranged at the same position on the front and back of the mounting board 10, the external lead terminals 25 and 35 with the same number are simply passed through each other vertically. Connection can be made using only the through hole 14.

FIG. 5 shows a third embodiment of the present invention. In this embodiment, a single-sided mounting type is used in which the first electronic component 20 and the second electronic component 30 are mounted on the surface 11 of the mounting board 10 in a straight line.

In the single-sided mounting type as in this embodiment, the external lead terminals 25 and 35 of the first and second electronic components 20 and 30 having the same number are centered on the line O that partitions between the two electronic components 20 and 30. Therefore, the external lead terminals 25 and 35 with the same number are
As shown in the figure, the connection can be made by simply routing the printed wiring 13 so that it does not intersect.

Note that the electronic components 20, 30 of the above embodiments have the semiconductor chips 24, 34 mounted only on the surfaces 22, 32 of the circuit boards 21, 31, but the semiconductor chips 24, 34 are mounted on both surfaces. It may be installed.

Furthermore, in the above embodiment, individual numbers are written in the drawings so as to connect the external lead terminals of the same number of two electronic components, but there is no particular need for individual numbers, and the lead terminals Any material that can be electrically connected to each other may be used. Furthermore, it is not necessary to connect all the external lead terminals, as long as at least one set or more are connected.

[0031]

[Effects of the Invention] As explained above, according to the present invention,
Since we used two electronic components together with the difference that the protruding direction of the external lead terminals was upside down on the circuit board, when mounting the electronic components, the external lead terminals with the same number between the two electronic components were mounted on one side. In the case of double-sided mounting, it is possible to easily connect them by simply routing the printed wiring, and in the case of double-sided mounting, by using simple through holes that pass through the top and bottom.

[Brief explanation of drawings]

FIG. 1 is an exploded perspective view showing a semiconductor device according to a first embodiment of the present invention.

FIG. 2 is a plan view of the semiconductor device of the first embodiment.

FIG. 3 is an exploded perspective view showing a semiconductor device according to a second embodiment of the invention.

FIG. 4 is a side view of a semiconductor device according to a second embodiment.

FIG. 5 is a plan view showing a semiconductor device according to a third embodiment of the present invention.

FIG. 6 is an exploded perspective view showing a semiconductor device of Conventional Example 1.

FIG. 7 is a plan view of a semiconductor device of Conventional Example 1.

8 is an exploded perspective view showing a semiconductor device of conventional example 2. FIG.

9 is a side view of a semiconductor device of conventional example 2. FIG.

[Explanation of symbols]

10 Mounting board
11 Surface of mounting board 12 Back surface of mounting board 13
Printed wiring 14 Through hole 20 First electronic component 2
1 Circuit board 22 Surface of circuit board
23 Back side of circuit board 24 Semiconductor chip 2
5 External lead terminal 30 Second electronic component 3
1 Circuit board 32 Surface of circuit board
33 Back side of circuit board 34 Semiconductor chip 3
5 External lead terminal

Claims (3)

[Claims] 1. A semiconductor device in which first and second electronic components are mounted on a mounting board, and corresponding external lead terminals of both electronic components are electrically connected to each other by wiring formed on the mounting board. The first and second electronic components each include a semiconductor chip mounted on at least one surface of a circuit board,
External lead terminals are attached to two opposing sides of this circuit board so as to protrude in a direction perpendicular to the surface of the circuit board, and the protruding direction of the external lead terminals of the first and second electronic components is the same as that of the circuit board. A semiconductor device characterized by being turned upside down. 2. The semiconductor device according to claim 1, wherein the first and second electronic components are mounted on one side of a mounting board. 3. The semiconductor device according to claim 1, wherein the first and second electronic components are separately mounted on both the front and back surfaces of the mounting board.