JPH08116146A - Module substrate and packaging structure of module substrate - Google Patents

Abstract

PURPOSE: To realize variation of capacity and multiple function and to improve packaging efficiency by providing a male or female connector for connection with other module substrates to at least two parallel side end surfaces of a rectangular substrate. CONSTITUTION: In a module substrate 30, external connection connectors 34, 35, 36 are formed in three side end surfaces of a rectangular substrate. In other module substrates, a semiconductor integrated circuit device is also electrically connected to a wiring pattern in both surfaces of a rectangular substrate wherein a wiring pattern is formed. In a module substrate 38, connectors 39, 40 are formed in parallel side end surfaces. As for a packaging structure of the module substrates, large capacity and multiple function are possible by connecting a plurality of module substrates 38 in a plane to the module substrate 30 by sharing one packaging connector 35. The connectors 34, 35, 36 and the connectors 39, 40 can realize mechanical junction of a module substrate basically and electrical connection simultaneously.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a module board and a mounting structure for the module board.

[0002]

2. Description of the Related Art As shown in FIG. 9, a module substrate 10 such as a memory module or an IC card has a flat rectangular substrate 12 on which a wiring pattern is formed, and a semiconductor integrated circuit device 14 electrically connects to the wiring pattern. A plurality of devices are connected and mounted. These module boards 10 have a male connector 1 having a plurality of pins for external connection on one side end surface.
6 is formed, the male connector 16 is mounted on the mounting board 18
By inserting it into the socket 20 formed on the mounting board 18, a plurality of mounting boards 18 can be mounted (FIG. 10).

[0003]

By the way, in the conventional module substrate 10, if some of the semiconductor integrated circuit devices 11a and 11b in FIG. 9 fail, the entire module substrate 10 must be replaced. There was a problem. In addition, the conventional module substrate 1
In 0, each module board 10 itself has only a single capacity and a single function. Therefore, if another module board 10 is separately inserted into the socket 20 for expansion,
Or it had to be replaced with a large-capacity module substrate separately. Further, since the conventional mounting board 18 has to be provided with a large number of sockets 20, there is a problem that the mounting efficiency of the mounting board 18 itself is poor.

Therefore, the present invention has been made to solve the above problems, and an object of the present invention is to easily replace the module substrates in the case of a failure and to join and separate the module substrates. It is an object of the present invention to provide a module substrate in which the capacity can be easily changed and multifunction can be easily achieved, and a mounting structure of the module substrate that can improve the mounting efficiency.

[0005]

The present invention has the following constitution in order to achieve the above object. That is, in the module substrate according to the present invention, in a module substrate in which a plurality of semiconductor integrated circuit devices are electrically connected to and mounted on a flat rectangular substrate having a wiring pattern formed thereon, at least the rectangular substrate On two parallel end faces,
It is characterized in that a male or female connector for connection with another module board is provided.

In this case, connectors are formed on three side end surfaces including two parallel side end surfaces of a rectangular board, and the connectors formed on the two parallel side end surfaces are used as connectors for connecting to adjacent module boards. The other one can be used as a connector for mounting on a mounting board.

A large-capacity module board can be obtained by directly planarly connecting a plurality of the above-mentioned module boards through the corresponding female connector or male connector.

Further, in the mounting structure of the module board according to the present invention, a plurality of the module boards according to claim 1 or 2 are arranged parallel to each other and arranged on the mounting board. An appropriate number of module boards are mounted on the mounting board via connectors, and a connector having rigidity is fitted into a connector formed on a side end surface of the adjacent module boards, thereby electrically connecting the adjacent module boards. The feature is that they are connected to each other.

In this case, it is possible to enhance the heat radiation effect by providing a ventilation hole in the connector. Further, a space is provided between the plurality of module boards and the mounting board, and the semiconductor integrated circuit device is mounted on the mounting board in the space, so that the mounting efficiency of the mounting board can be improved. Further, the heat radiation effect can be further enhanced by connecting the heat radiator through the connector that is not involved in the connection with the adjacent module substrate.

[0010]

According to the module board of claim 2, the connector can be mounted on the mounting board by one of the three connectors, and can be mounted by the connector provided on the other parallel side end surface.
Alternatively, the module substrate of claim 2 can be connected. In connection with this module substrate, the connectors can be directly connected to each other in the same plane, and a plurality of module substrates can be easily connected in any arrangement through a U-shaped or Z-shaped connector. The module board according to claim 1 can be connected to the module board according to claim 2 as described above, and can be mounted on the mounting board by one of the connectors provided on the parallel side end faces, and the other connector can be used. Other module substrates can be connected to each other directly or by using a connecting tool as described above. Therefore, replacement at the time of failure can be easily performed, and capacity and multifunction can be easily achieved. A plurality of module boards can be connected to the mounting board by sharing one or an appropriate number of connectors. Therefore, the mounting efficiency of the mounting board can be improved. At this time, by mounting the semiconductor integrated circuit device on the mounting substrate by utilizing the space between the mounting substrate and the module substrate, the mounting efficiency of the mounting substrate can be further improved. Further, the radiator can be attached by utilizing the connector that is not involved in the connection between the module substrates, and the heat radiation effect can be improved.

[0011]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT A preferred embodiment of the present invention will be described in detail below with reference to the accompanying drawings. FIG. 1 shows a module substrate 30
Two examples are shown. The module substrate 30 is formed by mounting a plurality of semiconductor integrated circuit devices 32 electrically connected to a wiring pattern on a rectangular substrate 31 on which a wiring pattern (not shown) is formed. The semiconductor integrated circuit device 32 is mounted on one side or both sides of the rectangular substrate 31. In the module board 30 of this embodiment, connectors 34, 35, 36 for external connection are formed on three side end surfaces of a rectangular board 31. Each of the connectors 34, 35, 36 may be either a male connector having a plurality of pins or a female connector having a plurality of socket structures. The connector 35 is formed as a connector for mounting on a mounting board, which will be described later, and the connectors 34, 36 formed on the parallel side end surfaces are formed as connectors for connecting other adjacent module substrates as described later.

FIG. 2 shows another embodiment of the module substrate 38. The module substrate 38 of this embodiment is also formed by mounting a plurality of semiconductor integrated circuit devices 32 electrically connected to the wiring pattern on both sides of a rectangular substrate 31 on which a wiring pattern (not shown) is formed. The module board 38 of the present embodiment has connectors 39 and 40 formed on parallel side end surfaces. The connectors 39 and 40 may be either male connectors or female connectors as described above.

The module board 30 shown in FIG. 1 is an independent module board itself, and as shown in FIG. 3, it can be used by vertically mounting it on a mounting board 42 by means of a connector 35. As shown in FIG. 3, the module board 38 shown in FIG. 2 is formed by directly inserting the connector 39 (female connector in this embodiment) into the connector 36 (female connector in this embodiment) of the module board 30 so as to be flush with the module board 30. It can be used by connecting to each other. Module board 3
8 is connected as described above, so that the mounting connector 35 can be shared with the module board 30 and the memory capacity for the module board 30 can be increased.
Alternatively, other functions can be added. Although not shown, a plurality of module substrates 30 may be connected and used.

The module board mounting structure shown in FIG. 3 can be further connected to the module board 38 shown in FIG. 2 by utilizing the connector 34 on the opposite side of the module board 30, or the module of FIG. The module board 38 shown in FIG. 2 may be further connected to the board 38. That is, it is possible to planarly connect the plurality of module boards 38 to the module board 30 by sharing one mounting connector 35, thereby achieving a large capacity and multiple functions. Each connector 34, 35, 3
6 and the connectors 39 and 40 basically serve to mechanically join the module substrates and at the same time to electrically connect the module substrates. However, in some cases, the connector may have a structure for mechanically connecting a module substrate that does not participate in input / output.

In the figure, a connector that is not involved in the connection between the module boards (connector 3 in FIG. 3).
4 and the connector 40), connection modules 43 and 44 having wiring patterns formed therein may be connected using a connector to make necessary electrical connection, if necessary. Alternatively, when the connectors 34 and 40 are connectors that do not participate in input / output, the heat dissipation properties can be improved by attaching the radiators 43a and 44a having excellent heat dissipation properties, such as aluminum nitride, using the connectors. it can.

The module board 38 shown in FIG. 2 can also be used as an independent module board. That is, it is mounted on the mounting substrate 42 by the connector 39 as shown in FIG. In this case, the connection of the other module board 38 to this module board 38 is, for example, as shown in FIG.
Can be done as follows. That is, the required number of module boards 38 are arranged perpendicularly to the mounting board 42, and the connectors 39 on the lower end surfaces of the adjacent module boards 38 are arranged.
Between the connectors 40 on the upper end face, the module board 38 is fitted with a connector 46 having a U-shaped cross section as shown in the figure.
Can be connected in a zigzag fashion. A wiring pattern is basically formed in the connector 46, and electrical connection between the module substrates can be simultaneously achieved through the connector. In this case, since a space is formed between the mounting substrate 42 and the lower end of the intermediate module substrate 38, the other semiconductor integrated circuit device 32 should be mounted on the mounting substrate 42 using this space. Depending on the mounting board 42
The implementation efficiency of can be improved. In the example of FIG.
Since the module substrate 38 is arranged in a zigzag pattern in a plane perpendicular to the mounting substrate 42, if a fan (blowing means) (not shown) is used to ventilate the module substrate 38, the heat radiation effect of the module substrate 38 can be improved. Can be increased.

FIG. 6 shows an example of a mounting structure of another module substrate. In this embodiment, the module substrate 30 shown in FIG. 1 is mounted on the mounting substrate 42 by the connector 35, and the connectors 34, 3 on the parallel side end faces of the module substrate 30 are mounted.
2 is used to connect the module substrate 38 shown in FIG. 2 with a wiring pattern similar to that described above and having a U-shaped cross section.
6 are connected one after another in a zigzag pattern. Also in this embodiment, since a space is formed between the mounting board 42 and the lower end of the intermediate module substrate 38, the mounting board is mounted by mounting another semiconductor integrated circuit board 32 on the mounting board 42 using the space. The mounting efficiency of 42 can be improved. In the present embodiment, the module boards 30 and 38 are arranged in a zigzag shape in a plane parallel to the mounting board 42 (FIG. 7), and the connector 46 is arranged on a plane perpendicular to the mounting board 42. Ventilation from the same direction as above may hinder ventilation, so if ventilation holes are provided in the connector 46 at appropriate positions that do not obstruct the wiring pattern, ventilation is ensured. It is suitable. Further, similarly, the connection modules 43 and 44 and the radiators 43a and 44a are attached to the connectors which are not involved in the connection between the respective module boards in the same manner as described above to achieve the necessary electrical connection and enhance the heat radiation effect. You can

In each of the embodiments shown in FIGS. 5 and 6, the module boards 30 and 38 on both ends arranged in a zigzag pattern are connected to the mounting board 42 by connectors, but the module boards to be mounted on the mounting board 42 are connected. May mount one or more of the module boards at appropriate positions on the mounting board 42. In this case, when the mounting strength of the module board is weak or a reliable mounting structure is difficult to obtain, With respect to the module substrate that becomes spatially unstable in the mounting substrate 42, a mounting substrate 42 is
It is advisable to support them at a predetermined height position with respect to. In this case, as the support tool, the semiconductor integrated circuit device 32 having an appropriate height directly mounted on the mounting board is used as it is to support the module board from below, thereby improving the mounting efficiency. Alternatively, a radiation fin or the like attached to the upper surface of the semiconductor integrated circuit device 32 may be used as the support tool.

In the above-described embodiment, the module substrates are spatially arranged so as to have a zigzag shape, but by using the connection tool 46, the module substrates can be mounted in various spatial arrangements. it can. In this case, the connection tool 4
By forming 6 with a material having rigidity, the module substrate can be spatially supported. Of course, as shown in FIG. 3, it is possible to mount these on the mounting substrate 42 in a zigzag shape or in an arbitrary spatial arrangement by using a planar unit of module substrates as a basic unit. Further, by using a Z-shaped connector instead of the U-shaped connector, it is possible to connect adjacent module substrates in parallel in a stepwise manner as shown in FIG. It is needless to say that a printed circuit board can be basically used as the rectangular board 31 which is the module board body.
As the material of the substrate, glass cloth epoxy, glass cloth polyimide, BT resin or the like can be used. Further, a printed wiring board or a ceramic multilayer circuit board can be used as the connecting tool 46.

Although the present invention has been variously described with reference to the preferred embodiments, the present invention is not limited to these embodiments, and many modifications can be made without departing from the spirit of the invention. Of course.

[0021]

According to the module substrate of claim 2, 3
One of the two connectors can be mounted on the mounting board, and the connector provided on another parallel side end surface can connect the module board of claim 1 or claim 2.
In connection with this module substrate, the connectors can be directly connected to each other in the same plane, and a plurality of module substrates can be easily connected in any arrangement through a U-shaped or Z-shaped connector. The module board according to claim 1 can be connected to the module board according to claim 2 as described above, and can be mounted on the mounting board by one of the connectors provided on the parallel side end faces, and the other connector can be used. Other module substrates can be connected to each other directly or by using a connecting tool as described above. Therefore, replacement at the time of failure can be easily performed, and capacity and multifunction can be easily achieved. A plurality of module boards can be connected to the mounting board by sharing one or an appropriate number of connectors. Therefore, the mounting efficiency of the mounting board can be improved. At this time, by mounting the semiconductor integrated circuit device on the mounting substrate by utilizing the space between the mounting substrate and the module substrate, the mounting efficiency of the mounting substrate can be further improved. Further, the radiator can be attached by utilizing the connector that is not involved in the connection between the module substrates, and the heat radiation effect can be improved.

[Brief description of drawings]

FIG. 1 is an explanatory view showing a first embodiment of a module board.

FIG. 2 is an explanatory view showing a second embodiment of the module board.

FIG. 3 is an explanatory diagram showing an example of a state in which module substrates are connected in a plane.

FIG. 4 is an explanatory diagram showing an example in which a module substrate is mounted on a mounting substrate.

FIG. 5 is an explanatory diagram showing an example of a mounting structure of a module substrate.

FIG. 6 is an explanatory view showing another embodiment of the mounting structure of the module substrate.

FIG. 7 is a plan view of the embodiment of FIG.

FIG. 8 is an explanatory view showing another embodiment of the connector.

FIG. 9 is an explanatory diagram of a conventional module substrate.

FIG. 10 is an explanatory diagram showing a mounting structure of a conventional module substrate.

[Explanation of symbols]

 30 module substrate 31 rectangular substrate 32 semiconductor integrated circuit device 34 connector 35 connector 36 connector 38 module substrate 39 connector 40 connector 42 mounting substrate 43a, 44a heat sink 46 connecting tool 48 through hole

Claims (7)

[Claims] 1. A module substrate in which a plurality of semiconductor integrated circuit devices are electrically connected to a wiring pattern and mounted on a flat rectangular substrate on which a wiring pattern is formed, at least two parallel sides of the rectangular substrate. A module board, wherein a male or female connector for connection with another module board is provided on an end face. 2. A rectangular substrate having three parallel side end faces.
A connector is formed on one side end surface, the connectors formed on the two parallel side end surfaces are connectors for connecting to adjacent module boards, and the other one is a connector for mounting on a mounting board. The module board according to claim 1. 3. A module board, wherein a plurality of the module boards according to claim 1 or 2 are connected through the corresponding female connector or male connector to form the same plane. 4. A plurality of the module boards according to claim 1 or 2 are arranged parallel to each other and arranged on a mounting board, and an appropriate number of the module boards among the plurality of module boards are the mounting boards. Is mounted via a connector, and a connector having rigidity is fitted into a connector formed on the side end surface of an adjacent module substrate,
A mounting structure for a module substrate, wherein adjacent module substrates are electrically connected. 5. The mounting structure for a module substrate according to claim 4, wherein the connector is provided with a through hole for ventilation. 6. A semiconductor integrated circuit device is mounted on a space between the plurality of module substrates and the mounting substrate, and a semiconductor integrated circuit device is mounted on the mounting substrate. 5. The mounting structure of the module substrate according to 5. 7. The module board mounting structure according to claim 4, 5 or 6, wherein the radiator is connected through a connector that is not involved in connection with an adjacent module board.