JP2503873B2 - Structure of integrated circuit package - Google Patents

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a structure of an integrated circuit package formed by mounting a plurality of semiconductor elements on a multi-layer substrate.

[0002]

2. Description of the Related Art This type of integrated circuit package generally has a structure in which a plurality of semiconductor elements and heat radiation fins are mounted on a multilayer substrate.

5 and 6 are side views showing the structure of a conventional integrated circuit package. In the structure of the integrated circuit package shown in these figures, a semiconductor element 103 such as an IC (integrated circuit) or an LSI (large-scale integrated circuit) is mounted on the lower surface of the multilayer substrate 101 shown in the figure, and the upper surface of the multilayer substrate 101 is shown in the figure. The heat radiation fins 105 are mounted according to the positions of the semiconductor elements 103, and external input / output terminals 109 and 111 are provided on the lower surface of the multilayer substrate 101 in the drawing. It is well known that the multilayer substrate 101 is made of a ceramic that has a high wiring density.

In the structure of the integrated circuit package described above, the external input / output terminal 109 of the multi-layer substrate 101 is shown in FIG.
As shown in FIG. 5, a pin-shaped member is planted on the plane of the multilayer substrate 101. In the structure of the integrated circuit package including the external input / output terminal 109, the external input / output terminal 109 is directly inserted into the printed board hole of the mother board to electrically connect to the outside. Therefore, the terminal pitch of the external input / output terminals 109 is, for example, 2.54.
[Mm] is the size that can be manufactured. Therefore, the area occupied by the external input / output terminal 109 on the multilayer substrate 101 becomes large. For example, assuming an external input / output terminal 109 of 1000 [pins] in a 100 [mm] square integrated circuit package, when the terminal pitch of the external input / output terminals 109 is 2.5 [mm], the multilayer substrate 101 64% of the total area, and its terminal pitch is 1.27
When [mm] is set, 16% of the total area is occupied by the input / output terminal 109.

Further, as shown in FIG. 6, when the external input / output terminal 111 has a structure in which a plate-like metal plate is formed around the multilayer substrate 101, the pitch that the external input / output terminal 111 can adopt is Considering the connection with the motherboard, 0.
Assuming a module of 100 mm square with a pitch of about 5 mm, 80 input / output terminals can be connected.
When the number of pins is reduced by 0 and the number of pins is increased, it is necessary to enlarge the multilayer substrate 101.

From such a background, the size of the integrated circuit package depends on the number of semiconductor elements 103 and the external input / output terminals 10.
It will be determined by the number of 9 or 111.

In recent years, the number of circuits integrated in a semiconductor device tends to increase, and the number of external input / output terminals also tends to increase. In other words, the dimensions of the integrated circuit package are determined by the external input / output terminals.

On the other hand, there has been proposed a structure in which a large number of semiconductor elements are mounted at a high density using a flexible substrate (see, for example, Japanese Patent Laid-Open No. 148842/1993, SHOKAI 6).
No. 3-67278), these are semiconductor elements mounted on a flexible board, and the flexible board on which the semiconductor elements are mounted is further mounted on a glass epoxy board (equivalent to a multilayer board) having external input / output pins. However, various problems due to the external input / output pins are the same as described above.

[0009]

In the case of the above-mentioned conventional integrated circuit package structure or a structure in which a large number of semiconductor elements are mounted at high density using a flexible substrate,
There were the following problems.

(1) There has been a problem that the size of the multi-layer substrate becomes large due to the increase of the external input / output terminals and the size cannot be reduced.

(2) When ceramic is used for the multi-layered board and a glass epoxy printed board is used for the mother board for mounting the integrated circuit package, the mechanical expansion and contraction of the external input / output terminals is caused by the thermal expansion difference of each board material. There is a problem in that it is unfavorable in terms of reliability due to physical stress.

An object of the present invention is to solve the above-mentioned problems and to provide a structure of an integrated circuit package which does not increase the basic size even if the number of input / output terminals is increased.

[0013]

In order to achieve the above object, the structure of an integrated circuit package according to the present invention is an integrated circuit package in which a plurality of semiconductor elements and heat radiation fins are mounted on a multilayer substrate. In the second aspect, an external input / output terminal is provided on one end side of the flexible substrate, and the other end of the flexible substrate is connected to the electrode pattern of the multilayer substrate.

In order to achieve the above-mentioned object, the structure of the integrated circuit package according to the invention as defined in claim 2 is at least two flexible in the integrated circuit package in which a plurality of semiconductor elements and heat radiation fins are mounted on a multilayer substrate. An external input / output terminal is provided at one end of each board, and the other end of each flexible board is connected to an electrode pattern provided on each side of the multilayer board.

In order to achieve the above object, the structure of an integrated circuit package according to a third aspect of the invention is an integrated circuit package in which a plurality of semiconductor elements and heat radiation fins are mounted on a multilayer substrate, and at least two flexible elements are provided. An external input / output terminal is provided on one end of the substrate, and the other end of each flexible substrate is connected to an electrode pattern provided on one side of the multilayer substrate.

According to the first aspect of the present invention, the external input / output terminals are attached to the flexible substrate, and the connection to the mother board can be performed without attaching the external input / output terminals to the multilayer substrate as in the conventional case. In addition, claim 1
In the structure of the integrated circuit package according to the invention described above, since the flexible substrate provided with the external input / output terminals has a coefficient of thermal expansion similar to that of the board of the motherboard, there is no difference in coefficient of thermal expansion.

The invention according to claim 2 is the same as the invention according to claim 1, except that at least two flexible substrates are connected to electrode patterns provided on both sides of the multilayer substrate. The flexible board of can be used for input, and the other flexible board can be used for output.

According to the third aspect of the present invention, since at least two flexible boards are connected to the electrode pattern provided on one side of the multilayer board, one of them is connected to a predetermined connection portion of the motherboard, The other can be connected to other parts of the motherboard.

[0019]

DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be described in detail below with reference to embodiments.

FIG. 1 is a perspective view showing an embodiment of the structure of an integrated circuit package of the present invention. FIG. 2 is a longitudinal sectional view of FIG.

In the structure of the integrated circuit package shown in these figures, first, a plurality of semiconductor elements 3 are formed on the lower surface of the multilayer substrate 1.
Has been implemented. Further, on the upper surface of the multilayer substrate 1, heat radiation fins 5 are mounted at portions corresponding to the positions of the semiconductor elements 3. An electrode pattern 7 connected to the external input / output is provided on the upper surface of the multilayer substrate 1, and one end of a flexible substrate 9 is electrically connected to the electrode pattern 7. A terminal board 11 is provided on the tip of the flexible substrate 9 at a certain area. The terminal board 11 reinforces the strength of the flexible board 9. In addition, external input / output terminals 13 are planted in the terminal plate 11 so as to face downward in the drawing.

When the structure of this integrated circuit package is mounted on a motherboard (not shown), as shown in FIGS. 1 and 2, the central portion of the flexible substrate 9 is bent inward and the external input / output terminals 13 are formed on the lower surface of the multilayer substrate 1. It will be implemented after placing it in. In this case, metal fittings or the like for mechanically holding the multilayer substrate are provided, but they are omitted in the figure.

FIG. 3 is a vertical sectional view showing a second embodiment of the present invention. The embodiment shown in this figure has an external input / output terminal 1
3 is an example in which the flexible substrates 9a and 9b provided with 3 are drawn from the electrode patterns 7a and 7b on both side surfaces of the multilayer substrate 1. Reinforcing terminal plates 11a and 11b are provided on predetermined areas of the other ends of the flexible boards 9a and 9b, and input / output terminals 13a and 13b are planted from one surface of the terminal plates 11a and 11b, respectively. ing.

When mounting the structure of the integrated circuit package of the second embodiment on a mother board (not shown), as shown in FIG. 3, the central portions of the flexible substrates 9a and 9b are respectively bent inward and the respective packages are inserted. Output terminal 13
The a and 13b are arranged on the lower surface of the multilayer substrate 1 and then mounted. In this case, metal fittings or the like for mechanically holding the multilayer substrate are provided, but they are omitted in the figure.

According to the second embodiment, for example, one flexible board 9a can be divided for input only and the other flexible board 9b can be divided for output only. According to such another embodiment, the wiring efficiency in the multilayer substrate can be improved.

FIG. 4 is a perspective view showing a third embodiment of the present invention. The flexible substrate 9 shown in this figure is divided according to the purpose to obtain a first flexible substrate 91a and a second flexible substrate 91b. One terminal of each of the flexible substrates 9a and 9b is connected to a predetermined portion of an electrode pattern 7 provided on one side of the multilayer substrate 1. Further, terminal boards 11a and 11b are provided at predetermined area portions on the tip side of the flexible boards 91a and 91b. External input / output terminals 13a and 13b are planted in these terminal plates 11a and 11b.

When the structure of the integrated circuit package of the third embodiment as described above is mounted on a mother board (not shown), as shown in FIG. 4, a first flexible substrate 91a is provided.
Is bent inward, the input / output terminals 13a are arranged on the lower surface of the multilayer substrate 1, and then connected to a predetermined place on a mother board (not shown).
Since it is possible to connect the input / output terminal 13b to other parts of the motherboard by linearizing b as shown in the drawing, it is useful when improving the wiring efficiency in the motherboard and coupling between the input / output terminals. is there.

[0028]

As described above, in the structure of the integrated circuit package according to the first aspect of the present invention, since the external input / output terminals can be connected to the motherboard without being attached to the multilayer substrate, the dimensions of the external input / output terminal portions can be increased. Is not required to be provided in the multi-layer substrate, the size can be reduced, and the input / output terminals can be connected to predetermined positions.

In the structure of the integrated circuit package according to the first aspect of the present invention, since there is no difference in the coefficient of thermal expansion between the flexible substrate having the external input / output terminals and the substrate of the mother board, the mechanical stress of the external input / output portion is increased. And a highly reliable structure of the integrated circuit package can be obtained.

According to the invention described in claim 2, in addition to the effect similar to that of the invention described in claim 1, at least two flexible substrates are connected to electrode patterns provided on both sides of the multilayer substrate, so Flexible board for input,
By using the other flexible substrate for output, the range of use is widened, and the wiring efficiency in the multilayer substrate can be improved.

According to the invention of claim 3, in addition to the same effect as the invention of claim 1, at least two flexible substrates are connected to an electrode pattern provided on one side of the multilayer substrate. Therefore, one side can be connected to a predetermined connection part of the motherboard, the other can be connected to other parts of the motherboard, etc.
This is effective when considering the improvement of wiring efficiency in the motherboard and the coupling between input and output terminals.

[Brief description of drawings]

FIG. 1 is a perspective view showing an embodiment of the structure of an integrated circuit package according to the present invention.

FIG. 2 is a vertical sectional view of the embodiment.

FIG. 3 is a vertical cross-sectional view showing a second embodiment of the present invention.

FIG. 4 is a vertical sectional view showing a third embodiment of the present invention.

FIG. 5 is a vertical cross-sectional view of the structure of a conventional integrated circuit package.

FIG. 6 is a vertical cross-sectional view of the structure of another conventional integrated circuit package.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Multilayer substrate 3 Semiconductor element 5 Radiating fin 7, 7a, 7b Electrode pattern 9, 9a, 9b Flexible substrate 11, 11a, 11b Terminal plate 13, 13a, 13b Input / output terminal 91a First flexible substrate 91b Second flexible substrate

Claims (3)

(57) [Claims] 1. An integrated circuit package in which a plurality of semiconductor elements and heat radiation fins are mounted on a multi-layer substrate, wherein an external input / output terminal is provided on one end side of the flexible substrate and the other end of the flexible substrate is connected to the multi-layer substrate. A structure of an integrated circuit package comprising a structure connected to an electrode pattern. 2. An integrated circuit package in which a plurality of semiconductor elements and heat radiation fins are mounted on a multi-layer substrate, wherein external input / output terminals are provided on one end sides of at least two flexible substrates, respectively. A structure of an integrated circuit package comprising a structure in which ends are respectively connected to electrode patterns provided on both sides of the multilayer substrate. 3. An integrated circuit package in which a plurality of semiconductor elements and heat radiation fins are mounted on a multi-layer board, wherein external input / output terminals are provided on one end side of at least two flexible boards, and the other end of each flexible board is provided. A structure of an integrated circuit package, characterized in that the structure is connected to an electrode pattern provided on one side of the multilayer substrate.