JPH0429741B2 - - Google Patents

Info

Publication number
JPH0429741B2
JPH0429741B2 JP59162536A JP16253684A JPH0429741B2 JP H0429741 B2 JPH0429741 B2 JP H0429741B2 JP 59162536 A JP59162536 A JP 59162536A JP 16253684 A JP16253684 A JP 16253684A JP H0429741 B2 JPH0429741 B2 JP H0429741B2
Authority
JP
Japan
Prior art keywords
copper
treatment
zirconium
bismuth
aqueous solution
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP59162536A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6141775A (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP16253684A priority Critical patent/JPS6141775A/ja
Publication of JPS6141775A publication Critical patent/JPS6141775A/ja
Publication of JPH0429741B2 publication Critical patent/JPH0429741B2/ja
Granted legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/38—Coating with copper
    • C23C18/40—Coating with copper using reducing agents
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
    • H05K3/384—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal by plating

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Chemically Coating (AREA)
JP16253684A 1984-08-01 1984-08-01 銅の表面処理法 Granted JPS6141775A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP16253684A JPS6141775A (ja) 1984-08-01 1984-08-01 銅の表面処理法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP16253684A JPS6141775A (ja) 1984-08-01 1984-08-01 銅の表面処理法

Publications (2)

Publication Number Publication Date
JPS6141775A JPS6141775A (ja) 1986-02-28
JPH0429741B2 true JPH0429741B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1992-05-19

Family

ID=15756474

Family Applications (1)

Application Number Title Priority Date Filing Date
JP16253684A Granted JPS6141775A (ja) 1984-08-01 1984-08-01 銅の表面処理法

Country Status (1)

Country Link
JP (1) JPS6141775A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04324242A (ja) * 1991-04-24 1992-11-13 Yuasa Corp 蓄電池用蓋の製造方法
US6153530A (en) * 1999-03-16 2000-11-28 Applied Materials, Inc. Post-etch treatment of plasma-etched feature surfaces to prevent corrosion

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5371272A (en) * 1976-12-07 1978-06-24 Tokyo Shibaura Electric Co Method of producing printed circuit board

Also Published As

Publication number Publication date
JPS6141775A (ja) 1986-02-28

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