JPH0428489A - Laser beam machine - Google Patents

Abstract

PURPOSE:To increase holding rigidity of a laser beam head by fixing an optical axis of an infrared laser beam source in the XY direction, making a table movable in the XY direction with respect to an infrared laser beam and observing a machining condition of a workpiece on the table. CONSTITUTION:The workpiece is irradiated with the infrared laser beam and defects thereof are inspected and eliminated. The infrared laser beam whose optical axis is fixed in the XY direction is generated from the infrared laser beam source (laser beam head) 9. The XY table (stage) 3 is made movable in the XY direction with respect to the infrared laser beam and the workpiece is supported hereby. The machining condition of the workpiece on the XY table 3 is observed by an infrared optical system of a CCD camera 7, a defect inspection instrument 8, etc. Consequently, the defects of the workpiece such as a liquid-crystal display panel can be inspected.

Description

DETAILED DESCRIPTION OF THE INVENTION [Industrial Field of Application] The present invention relates to a defect inspection device, for example, a defect inspection device for inspecting defects in a liquid crystal display panel.

[Prior Art] Recently, liquid crystal display panels have been increasingly used in various electronic devices. Moreover, the amount of information displayed on liquid crystal display panels is increasing, and liquid crystal display panels with high display density are required. In order to increase the display density, it is necessary to make the wiring pattern between the liquid crystal display and the terminal thinner, and also to narrow the distance between adjacent patterns.

However, when the pattern density is increased, adjacent patterns may be electrically connected to each other due to insufficient etching in the pattern etching process. A liquid crystal repair device is used to detect such defects and restore the product to a non-defective product.

In conventional LCD repair equipment, the LCD panel to be inspected is placed on a stage, and an X is placed over it.

A head movable in the Y and Z directions is provided, and a C
It is equipped with a CD camera and a laser light source. Then, we image the wiring pattern with a CCD camera, monitor it on a monitor TV, find the parts where adjacent patterns are connected, and irradiate that part with laser light emitted from a laser light source, eliminating unnecessary gaps between the patterns. Burn off the parts.

[Problems to be Solved by the Invention] However, the above-mentioned liquid crystal repair device has a head in which a CCD camera and a laser light source are arranged in x and y directions.

Since it is designed to be movable in the Z direction, it has the disadvantage of weak holding rigidity.

Therefore, a main object of the present invention is to provide a laser processing apparatus that increases the holding rigidity of the head and is capable of inspecting a workpiece such as a liquid crystal display panel for defects.

[Means for Solving the Problems] The present invention is a laser processing device for inspecting and removing defects in a workpiece by irradiating infrared laser light,
an infrared laser light source whose optical axis is fixed in the XY force direction and emits an infrared laser beam; an XY child table that is movable in the XY force directions with respect to the infrared laser light source and supports a workpiece; It is equipped with an infrared optical system for observing the machining state of the workpiece on the XY child table.

[Function] The laser processing device according to the present invention uses an infrared laser light source as
The XY child table that supports the workpiece is fixed in the Y force direction and movable in the XY force direction, so the infrared laser light source only moves in the Z direction, which increases the holding rigidity. can. [Example] Fig. 1 is an external perspective view of an embodiment of the present invention, and Fig. 1 is an external perspective view of an embodiment of the present invention.
The figure is also a front view.

Referring to FIGS. 1 and 2, an XY stage 3 movable in the x and X directions is arranged on the base 2 of the casing 1. A liquid crystal panel as a workpiece is placed on this XY stage 3. In order to inspect the workpiece placed on the XY stage 3, a Z-axis table 4 is prohibited from moving in the XY force directions and can only move in the Z direction (vertical direction).
is provided. This Z-axis table 4 has an electric revolver 5.
, microscope illumination light source 6, CCD camera 7, and defect inspection bag!
f8 and a laser head 9 are provided. electric revolver 5
is for switching lenses with different magnifications, and the microscope illumination light source 6 illuminates the workpiece. The CCD camera 7 images the surface of the workpiece through the lens of the electric revolver 5. The defect inspection device 8 inspects defects on the surface of the workpiece, and is configured with a linear image sensor 7. The laser head 9 performs processing by irradiating the surface of the workpiece with laser light. Note that, as shown in FIG.
A light source 10 is provided for illumination.

FIG. 3 is a schematic block diagram of one embodiment of the present invention.

Next, referring to FIG. 3, the electrical configuration of an embodiment of the present invention will be described. The CPU 21 performs overall control according to a program stored in a built-in memory.

That is, the CPU 21 gives a command signal for moving the XY stage 3 in the X direction to the X pulse controller 23 via l1022. X pulse controller 23
generates an X pulse in response to a command signal. This X pulse is given to the X motor driver 24.

The X motor driver 24 rotates the X motor 25 by the number of pulses given. The X motor 25 moves the XY child table in the X direction. The rotation speed of the X motor 25 is detected by the X encoder 26. The X encoder 26 is
A pulse signal corresponding to the rotation of the motor 25 is generated and applied to the X counter 27. The X counter 27 counts the pulse signals, and the count output is sent to the X counter circuit 28. l102
2 to the CPU 21.

Similarly, the CPU 21 provides a command signal for moving the xy stage 3 in the Y direction to the Y pulse controller 30 via I 1029. The Y pulse controller 30 generates a Y pulse according to the command signal and supplies it to the Y motor driver 31.

The Y motor driver 31 drives the Y motor 32 by the number of Y pulses.
Rotate. A Y motor 32 is provided to move the XY stage 3 in the Y direction.

The number of rotations of the Y motor 32 is detected by the Y encoder 33, and a pulse signal corresponding to the number of rotations is given to the Y counter 34.The Y counter 34 counts the pulse signals and sends the counted output to the Y counter circuit. 35 and l1
029 to the CPU 21. The CPU 21 determines the position of the XY stage 3 in the X direction and the Y direction based on the count outputs of the X counter circuit 28 and the Y counter circuit 35.

The linear image sensor 8 serving as the defect inspection device 8 outputs defective pixel information of the workpiece and provides it to the image processing circuit 36 . The image processing circuit 36 performs image processing on the output of the defect inspection device 8, and sends defective pixel information to the CPU 2 via l1037.
Give to 1. The CPU 21 calculates the defective pixel information and the count output of the Y counter circuit 35, calculates defective position information, and stores it in the storage device 38. Note that this defect position information is also displayed on the monitor 40.

FIG. 4 is a flowchart for explaining the specific operation of an embodiment of the present invention, and FIG. 5 is a diagram for explaining a method for inspecting defects according to an embodiment of the present invention.

Next, with reference to FIGS. 1 to 5, a specific operation of an embodiment of the present invention will be described.

Step S in FIG. 4 (abbreviated as SP in the illustration)
In the PI, the CPU 21 moves the XY stage 3 in the X direction,
A command signal for movement in the Y direction is output, and the workpiece is moved to the measurement start position.

At this time, the defect inspection device 8 reads an image of the surface of the workpiece. This image signal is subjected to image processing by the image processing circuit 36 and is provided to the CPU 21 via l1037.

In step SP2, the CPU 21 reads image data for one line in the X direction on the workpiece 11, as shown in FIG. 5(a).

In step SP3, the CPU 21 determines whether or not there is a defect in one line based on the read image data. If there is no defect, the CPU 21 outputs a command signal to move the workpiece by one line in step SP6. If the CPU 21 determines that there is a defect in one line, in step SP4 it stores the pixel position of the defect on the linear image sensor. That is, as shown in FIG. 5(b), the defect inspection device 8 detects the defect 1 on the workpiece 11.
When 2 is detected, the pixel 81 at the location corresponding to that position changes. The CPU 21 recognizes the X coordinate of the defect position from the position of the pixel 81.

Further, in step SP5, the CPU 21 determines the current position of the XY stage 3 based on the count output of the Y counter circuit 35, and stores this.

Then, in step SP6, the CPU 21 outputs a command signal to move the workpiece in the Y direction by one line. In step SP7, the CPU 21 determines whether or not the XY stage 3 has been moved to the measurement end position, and if the XY stage 3 has not been moved to the end position, it returns to step SP2.
Return to step SP2 and repeat the operations of steps SP2 to SP7. After repeating this operation and determining that it has moved to the measurement end position, the pixel position of the defective location on the sensor in the X direction and the XY direction in the Y direction stored in step SP8 are
Based on the position of stage 3, calculate the defect position coordinates,
This is stored in the storage device 38, and the monitor 40
to be displayed. By irradiating the workpiece with laser light using the laser head 9 while viewing this display, unnecessary patterns on the liquid crystal display, for example, can be removed.

As mentioned above, according to this embodiment, the CCD camera 8.
The Z-axis table 4 equipped with the laser head 9 etc. is moved only in the Z direction, and the XY table 3 on which the workpiece is placed is moved in the X direction.
Since the workpiece is inspected for defects by moving it in the direction and the Y direction, the holding rigidity of the two-axis table 4 can be increased.

In addition, while moving the XY stage 3, the defect inspection device consisting of a linear image sensor scans the workpiece and detects pixels at defective positions.
1 allows the defect position on the workpiece to be digitally detected and stored.

[Effects of the Invention] As described above, according to the present invention, the XY child table supporting the workpiece is made movable in the XY force directions, and the infrared laser light source is fixed in the XY force directions. It is possible to increase the holding rigidity of the

[Brief explanation of the drawing]

FIG. 1 is an external photographic diagram of an embodiment of the present invention. Second
The figure is also a front view. FIG. 3 is a schematic block diagram of one embodiment of the present invention. FIG. 4 is a flowchart for explaining the specific operation of one embodiment of the present invention. Fifth
The figure is a diagram for explaining a defect inspection method according to an embodiment of the present invention. In the figure, 3 is an XY stage, 4 is a two-axis table, and 5 is a
6 is an electric revolver, 6 is a light source for microscope illumination, 7 is a CCD camera, 8 is a defect inspection device, 9 is a laser head, 10 is a light source for transmitted illumination, and 21 is a CPU. 22.29 is Ilo, 23 is X pulse controller, 2
4 is an X motor driver, 25 is an X motor, 26 is an X encoder, 27 is an X counter, 28 is an X counter circuit, 3
0 is the Y pulse controller, 31 is the Y motor driver,
32 is a Y motor, 33 is a Y encoder, 34 is a Y counter, 35 is a Y counter circuit, 36 is an image processing circuit, 38
indicates a storage device. Ko4koku October 30, 1990

Claims (2)

[Claims] (1) A laser processing device that inspects and removes defects in a workpiece by irradiating infrared laser light, the optical axis of which is fixed in the XY direction and emits the infrared laser light. An infrared laser light source, an XY table that is movable in XY directions with respect to the infrared laser beam and supports the workpiece, and an infrared laser light source for observing the processing state of the workpiece on the XY table. Laser processing equipment equipped with an external optical system. (2) The laser processing apparatus according to claim 1, wherein a light source for transmitted illumination for illuminating the workpiece is provided on the lower surface side of the XY table.