JPH0428447U - - Google Patents
Info
- Publication number
- JPH0428447U JPH0428447U JP6870390U JP6870390U JPH0428447U JP H0428447 U JPH0428447 U JP H0428447U JP 6870390 U JP6870390 U JP 6870390U JP 6870390 U JP6870390 U JP 6870390U JP H0428447 U JPH0428447 U JP H0428447U
- Authority
- JP
- Japan
- Prior art keywords
- main body
- resin mold
- plate
- mold main
- bent
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011347 resin Substances 0.000 claims description 4
- 229920005989 resin Polymers 0.000 claims description 4
- 229910000679 solder Inorganic materials 0.000 claims description 3
- 239000000758 substrate Substances 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
Landscapes
- Casings For Electric Apparatus (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Details Of Resistors (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Description
第１図および第２図は、それぞれ本考案の実施
例を示す面搭載型電子部品の外観図、第３図Ａは
、従来の面搭載型電子部品の外観図、第３図Ｂは
、同じく従来の面搭載型電子部品の正面図、第４
図は、基板へ面搭載型電子部品を実装した配置例
を示す平面図、第５図は、上記基板への面搭載型
電子部品の半田固着の方法を示す説明図である。
１……面搭載型電子部品、２……樹脂モールド
本体部、２ｂ……斜面、２ｃ……半球状、３，４
……板状リード、６……基板、７……ソルダフロ
ー、８……デツドスペース。
1 and 2 are external views of a surface-mounted electronic component showing an embodiment of the present invention, FIG. 3A is an external view of a conventional surface-mounted electronic component, and FIG. 3B is the same. Front view of conventional surface-mounted electronic components, No. 4
This figure is a plan view showing an example of the arrangement of surface-mounted electronic components mounted on a board, and FIG. 5 is an explanatory diagram showing a method of soldering the surface-mounted electronic components to the board. DESCRIPTION OF SYMBOLS 1...Surface-mounted electronic component, 2...Resin mold main body part, 2b...Slope, 2c...Semispherical shape, 3, 4
...Plate lead, 6... Board, 7... Solder flow, 8... Dead space.
Claims (1)
出され、該本体部の下面と略同一平面内に前記板
状リードが折曲げられ、この折曲げられ板状リー
ド側を基板に搭載・仮固定し、前記樹脂モールド
本体部を下向きにしてソルダバス上を通過させ、
基板に半田固着される面搭載型電子部品において
、前記樹脂モールド本体部の周辺が該本体部の中
央よりも低くなるように形成したことを特徴とす
る面搭載型電子部品。 Plate-shaped leads are led out from both sides of the resin mold main body, the plate-shaped leads are bent in substantially the same plane as the lower surface of the main body, and the bent plate-shaped lead sides are mounted and temporarily fixed on a board. , passing over a solder bath with the resin mold main body facing downward;
1. A surface-mounted electronic component fixed to a substrate by solder, characterized in that the periphery of the resin mold main body is formed to be lower than the center of the main body.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6870390U JPH0428447U (en) | 1990-06-28 | 1990-06-28 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6870390U JPH0428447U (en) | 1990-06-28 | 1990-06-28 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0428447U true JPH0428447U (en) | 1992-03-06 |
Family
ID=31603366
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6870390U Pending JPH0428447U (en) | 1990-06-28 | 1990-06-28 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0428447U (en) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6073229A (en) * | 1983-09-30 | 1985-04-25 | Matsushita Electric Ind Co Ltd | Dehumidifying operation control device for air- conditioning machine |
-
1990
- 1990-06-28 JP JP6870390U patent/JPH0428447U/ja active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6073229A (en) * | 1983-09-30 | 1985-04-25 | Matsushita Electric Ind Co Ltd | Dehumidifying operation control device for air- conditioning machine |