JPH0428446U - - Google Patents
Info
- Publication number
- JPH0428446U JPH0428446U JP1990069734U JP6973490U JPH0428446U JP H0428446 U JPH0428446 U JP H0428446U JP 1990069734 U JP1990069734 U JP 1990069734U JP 6973490 U JP6973490 U JP 6973490U JP H0428446 U JPH0428446 U JP H0428446U
- Authority
- JP
- Japan
- Prior art keywords
- resin
- semiconductor device
- sealed semiconductor
- mesh
- covered
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 6
- 239000000463 material Substances 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 3
- 239000002184 metal Substances 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Description
第1図は本考案による樹脂封止型半導体装置の
一実施例を示す図、第2図は本考案の第2実施例
となる樹脂封止型半導体装置を示す図、第3図は
従来例となる樹脂封止型半導体装置を示す図であ
る。 11……半導体チツプ、12a,12b,12
c……リード端子、13a,13b……電極、1
4a,14b……内部連結線、15……シールド
板、16,17a,17b,17c,17d……
孔、18a,18b……アース用リード端子、1
9,21……樹脂、22……金属膜。
一実施例を示す図、第2図は本考案の第2実施例
となる樹脂封止型半導体装置を示す図、第3図は
従来例となる樹脂封止型半導体装置を示す図であ
る。 11……半導体チツプ、12a,12b,12
c……リード端子、13a,13b……電極、1
4a,14b……内部連結線、15……シールド
板、16,17a,17b,17c,17d……
孔、18a,18b……アース用リード端子、1
9,21……樹脂、22……金属膜。
Claims (1)
- 半導体素子をメツシユ状のシールド材で覆つて
なる構成の樹脂封止型半導体装置。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1990069734U JPH0428446U (ja) | 1990-06-29 | 1990-06-29 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1990069734U JPH0428446U (ja) | 1990-06-29 | 1990-06-29 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH0428446U true JPH0428446U (ja) | 1992-03-06 |
Family
ID=31605293
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1990069734U Pending JPH0428446U (ja) | 1990-06-29 | 1990-06-29 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0428446U (ja) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2006126441A1 (ja) * | 2005-05-26 | 2006-11-30 | Murata Manufacturing Co., Ltd. | 電子部品用パッケージ、このパッケージを使用した電子部品、および電子部品用パッケージの製造方法 |
JP2008124510A (ja) * | 2008-02-12 | 2008-05-29 | Matsushita Electric Ind Co Ltd | 樹脂封止型半導体装置 |
CN102110670A (zh) * | 2009-12-28 | 2011-06-29 | 株式会社村田制作所 | 电子部件装置及引线框 |
-
1990
- 1990-06-29 JP JP1990069734U patent/JPH0428446U/ja active Pending
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2006126441A1 (ja) * | 2005-05-26 | 2006-11-30 | Murata Manufacturing Co., Ltd. | 電子部品用パッケージ、このパッケージを使用した電子部品、および電子部品用パッケージの製造方法 |
EP1885171A1 (en) * | 2005-05-26 | 2008-02-06 | Murata Manufacturing Co., Ltd. | Package for electronic component, electronic component using such package, and method for producing package for electronic component |
EP1885171A4 (en) * | 2005-05-26 | 2010-11-03 | Murata Manufacturing Co | HOUSING FOR AN ELECTRONIC COMPONENT, ELECTRONIC COMPONENT COMPRISING SUCH A HOUSING AND METHOD FOR MANUFACTURING A HOUSING FOR AN ELECTRONIC COMPONENT |
JP2008124510A (ja) * | 2008-02-12 | 2008-05-29 | Matsushita Electric Ind Co Ltd | 樹脂封止型半導体装置 |
CN102110670A (zh) * | 2009-12-28 | 2011-06-29 | 株式会社村田制作所 | 电子部件装置及引线框 |