JPH0427920A - Liquid crystal display device - Google Patents
Liquid crystal display deviceInfo
- Publication number
- JPH0427920A JPH0427920A JP2336155A JP33615590A JPH0427920A JP H0427920 A JPH0427920 A JP H0427920A JP 2336155 A JP2336155 A JP 2336155A JP 33615590 A JP33615590 A JP 33615590A JP H0427920 A JPH0427920 A JP H0427920A
- Authority
- JP
- Japan
- Prior art keywords
- electrode
- pixel
- floating
- pixel electrode
- line
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004973 liquid crystal related substance Substances 0.000 title claims description 22
- 239000000758 substrate Substances 0.000 claims description 32
- 239000010409 thin film Substances 0.000 claims description 7
- 239000012769 display material Substances 0.000 claims description 4
- 239000003989 dielectric material Substances 0.000 claims 1
- 230000007547 defect Effects 0.000 abstract description 14
- 230000008878 coupling Effects 0.000 abstract description 3
- 238000010168 coupling process Methods 0.000 abstract description 3
- 238000005859 coupling reaction Methods 0.000 abstract description 3
- 239000010408 film Substances 0.000 description 44
- 239000003990 capacitor Substances 0.000 description 30
- 238000010586 diagram Methods 0.000 description 22
- 239000004065 semiconductor Substances 0.000 description 10
- 238000004544 sputter deposition Methods 0.000 description 8
- 238000005268 plasma chemical vapour deposition Methods 0.000 description 7
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 6
- 229910021417 amorphous silicon Inorganic materials 0.000 description 6
- 230000014759 maintenance of location Effects 0.000 description 6
- 229910052581 Si3N4 Inorganic materials 0.000 description 5
- 230000001681 protective effect Effects 0.000 description 5
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 5
- 229910052814 silicon oxide Inorganic materials 0.000 description 5
- 238000000034 method Methods 0.000 description 4
- 238000001259 photo etching Methods 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 238000000059 patterning Methods 0.000 description 3
- 229910052804 chromium Inorganic materials 0.000 description 2
- 238000001312 dry etching Methods 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 230000008020 evaporation Effects 0.000 description 2
- 238000001704 evaporation Methods 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- BPUBBGLMJRNUCC-UHFFFAOYSA-N oxygen(2-);tantalum(5+) Chemical compound [O-2].[O-2].[O-2].[O-2].[O-2].[Ta+5].[Ta+5] BPUBBGLMJRNUCC-UHFFFAOYSA-N 0.000 description 2
- 230000003071 parasitic effect Effects 0.000 description 2
- 229910001936 tantalum oxide Inorganic materials 0.000 description 2
- 241001239379 Calophysus macropterus Species 0.000 description 1
- 244000241838 Lycium barbarum Species 0.000 description 1
- 235000015459 Lycium barbarum Nutrition 0.000 description 1
- 235000015468 Lycium chinense Nutrition 0.000 description 1
- 229910016024 MoTa Inorganic materials 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000007772 electrode material Substances 0.000 description 1
- 230000005669 field effect Effects 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 229910052750 molybdenum Inorganic materials 0.000 description 1
Landscapes
- Liquid Crystal (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
- Thin Film Transistor (AREA)
Abstract
Description
【発明の詳細な説明】
[産業上の利用分野]
二の発明は、薄膜トランジスタアレイ基板(以下、TP
Tと称す。)を用いた液晶表示装置に関し、特にTFT
アレイ基板に設けられる電荷保持容量の短絡による画素
欠陥の発生を低減するようにした液晶表示装置に関する
ものである。[Detailed Description of the Invention] [Industrial Application Field] The second invention is a thin film transistor array substrate (hereinafter referred to as TP).
It's called T. ), especially TFT
The present invention relates to a liquid crystal display device that reduces the occurrence of pixel defects due to short circuits in charge holding capacitors provided on an array substrate.
[従来の技術]
液晶表示装置は、通常2枚の対向する基板の間に液晶等
の表示材料を挟持させ、この表示材料に電圧を印加させ
てその配列を変化させることにより透過光を制御し、画
像等の表示を行わせるものである。この際、少なくとも
一方の基板に71リクス状に配列した画素電極を設け、
これらの画素を選択的に動作させるために各画素ごとに
電界効果I・ランジスタ(FET)等の非線形特性を有
する機能素子を設けている。また、画質を向上させるた
めに各画素ごとに電荷保持容量を設けている。[Prior Art] A liquid crystal display device usually has a display material such as a liquid crystal sandwiched between two opposing substrates, and controls transmitted light by applying a voltage to this display material to change its arrangement. , images, etc. are displayed. At this time, pixel electrodes arranged in a 71x pattern are provided on at least one substrate,
In order to selectively operate these pixels, a functional element having nonlinear characteristics such as a field effect I transistor (FET) is provided for each pixel. Furthermore, a charge storage capacitor is provided for each pixel in order to improve image quality.
第22図は例えば、Proceeding of 9t
h INTERN^Tl0NAL DISPLAY R
ESEARCHC0NFERENCE (Japan
Display 89)(1989)p514−517
に示されたこの種液晶表示装置に用いられるTFTアレ
イ基板の−画素分を示す平面構成図、第23図は第22
図におけるA−A断面図、第14図は第22図における
等価回路図である。For example, Figure 22 shows the procedure of 9t.
h INTERN^Tl0NAL DISPLAY R
ESEARCHHC0NFERENCE (Japan
Display 89) (1989) p514-517
23 is a plan view showing the -pixel portion of the TFT array substrate used in this type of liquid crystal display device shown in FIG.
14 is an equivalent circuit diagram in FIG. 22.
図において、1はソース電極線、2はゲート電極線、3
は共通電極線、4はゲート絶縁膜、5は水素化アモルフ
ァスシリコン1層、7は水素化アモルファスシリコン0
3層、8はドレイン電極、9は画素電極、lOは保護膜
、14は支持体となる透明絶縁基板で、TFTアレイ基
板はこれらの要素によって構成される。、18は共通電
極3と画素電極9とをゲー)・絶縁膜4を介して積層配
置することによって形成された電荷保持容量、35は液
晶、38は透明絶縁基板14とともに液晶35を挟持す
る透明な対向電極を示している。In the figure, 1 is a source electrode line, 2 is a gate electrode line, and 3 is a source electrode line.
is a common electrode line, 4 is a gate insulating film, 5 is one layer of hydrogenated amorphous silicon, 7 is hydrogenated amorphous silicon 0
The TFT array substrate is composed of three layers: 8 is a drain electrode, 9 is a pixel electrode, IO is a protective film, and 14 is a transparent insulating substrate serving as a support. , 18 is a charge holding capacitor formed by laminating the common electrode 3 and the pixel electrode 9 with an insulating film 4 interposed therebetween; 35 is a liquid crystal; 38 is a transparent capacitor sandwiching the liquid crystal 35 together with the transparent insulating substrate 14; A counter electrode is shown.
このようなTFTアレイ基板は、次のような工程によっ
て製造される。Such a TFT array substrate is manufactured through the following steps.
まず、透明絶縁基板14上にM o T aでゲート電
極線2、共通電極線3を形成し、その後、ゲーI・電極
線2、共通電極線3の表面を陽極酸化する。First, the gate electrode line 2 and the common electrode line 3 are formed using MoTa on the transparent insulating substrate 14, and then the surfaces of the gate electrode line 2 and the common electrode line 3 are anodized.
次に、ケート絶縁膜4、水素化アモルファスシリコンi
層5. 水2化アモルファスシリコンn゛層7を形成
してパターン加工した後、画素電極9を形成する。そし
て、ソース電極線lおよびドレイン電極8を形成してT
PTを完成する。このTPTと画素電極9とによりT
F Tア1/イが構成される。このとき、共通電極#i
!3と画素電極9とをゲート絶縁膜4を介在させてオー
バーラツプさせる二とにより、電荷保持容量18が形成
されることになる。Next, the gate insulating film 4, hydrogenated amorphous silicon i
Layer 5. After forming and patterning a hydrated amorphous silicon layer 7, a pixel electrode 9 is formed. Then, a source electrode line l and a drain electrode 8 are formed, and T
Complete PT. By this TPT and the pixel electrode 9, T
FT A1/A is configured. At this time, common electrode #i
! A charge storage capacitor 18 is formed by overlapping the pixel electrode 9 and the pixel electrode 9 with the gate insulating film 4 interposed therebetween.
このようにして構成されたTFTアレイ基板に、カラー
フィルタや透明導電膜を有する対向電極基板をこれらの
間に液晶等を挟持させて対向配置させることにより、液
晶表示装置が構成される。A liquid crystal display device is constructed by arranging a counter electrode substrate having a color filter and a transparent conductive film so as to face the TFT array substrate thus constructed, with a liquid crystal or the like sandwiched therebetween.
[発明が解決しようとする問題点1
以上のような従来の液晶表示装置においては、共通電極
線3と画素電極9とが直接オーバーラツプして構成され
ているため、異物等により共通電極線3とドレイン電極
8とが短絡する欠陥が生じ易く、このような短絡欠陥が
生ずると、TPTによる画素電極9の電圧制御が困難と
なって表示装置としての歩留まりが低下する二とになっ
ていた。[Problem to be Solved by the Invention 1] In the conventional liquid crystal display device as described above, the common electrode line 3 and the pixel electrode 9 are configured to directly overlap. A short-circuiting defect with the drain electrode 8 is likely to occur, and when such a short-circuiting defect occurs, it becomes difficult to control the voltage of the pixel electrode 9 by TPT, resulting in a decrease in yield as a display device.
また1次段の画素電極用ゲート電極と画素電極との間に
電荷保持容量を形成する場合にも上記と同様の欠陥を生
ずるものであった。Furthermore, the same defects as described above occur when a charge storage capacitor is formed between the gate electrode for the pixel electrode of the primary stage and the pixel electrode.
この発明は、上記のような従来の欠点を解消すするため
なされたもので、電荷保持容量の短絡による画素欠陥の
発生確立を低減することが可能な液晶表示装置を提供す
るものである。The present invention has been made in order to eliminate the above-mentioned conventional drawbacks, and provides a liquid crystal display device that can reduce the probability of pixel defects caused by short-circuiting of charge storage capacitors.
[問題を解決するための手段コ
この発明に係る液晶表示装置は、共通電極線および画素
電極を並設し、これらの電極と誘電体を介在させて浮遊
電極を対向配置させ、該浮遊電極と共通電極線および画
素電極との間に複数の容量からなる電荷保持容量を形成
するようにしたものである。[Means for Solving the Problem] The liquid crystal display device according to the present invention has a common electrode line and a pixel electrode arranged in parallel, and a floating electrode placed opposite to these electrodes with a dielectric interposed therebetween. A charge storage capacitor including a plurality of capacitors is formed between the common electrode line and the pixel electrode.
また、第2の発明に係る液晶表示装置は、ゲート電極線
および画素電極を並設し、これらの電極と誘電体を介在
させて浮遊電極を対向配置させ、該浮遊電極とゲート電
極線および画素電極との間に複数の容量からなる電荷保
持容量を形成するようにしたものである。Further, in the liquid crystal display device according to the second invention, a gate electrode line and a pixel electrode are arranged side by side, and a floating electrode is arranged facing each other with a dielectric interposed between these electrodes, and the floating electrode, gate electrode line, and pixel electrode are arranged in parallel. A charge holding capacitor consisting of a plurality of capacitors is formed between the electrode and the electrode.
[作用]
この発明の液晶表示装置によれば、共通電極線あるいは
ゲート電極線と画素電極とが並設されているため、一方
の容量が短絡しても共通電極線あるいはゲート電極線と
画素電極とが直接短絡することがなく、画素欠陥の発生
確率を低減させることができる。[Function] According to the liquid crystal display device of the present invention, since the common electrode line or the gate electrode line and the pixel electrode are arranged in parallel, even if one of the capacitances is short-circuited, the common electrode line or the gate electrode line and the pixel electrode There is no direct short circuit between the two, and the probability of pixel defects occurring can be reduced.
[実施例] 以下、この発明な一実施例である図について説明する。[Example] Hereinafter, a diagram illustrating an embodiment of the present invention will be described.
第1図はこの発明の一実施例であるTFTアレイ基板の
1画素分を示す平面構成図、第2図は第1図におけるA
−A断面図、第3図は第1図における回路構成図である
。図において、1はソース電極線、2はゲート電極線、
3は共通電極線、4はゲート絶縁膜、5は半導体i層、
6は上部絶縁膜、7は半導体n“層、8はドレイン電極
、9は画素電極、10は保護膜、12は浮遊電極、13
は誘電体膜、14は透明絶縁基板、15はTPT、16
はゲート・ドレイン間寄生容量、21は電荷保持容量(
1)、22は電荷保持容量(2)である。FIG. 1 is a plan configuration diagram showing one pixel of a TFT array substrate which is an embodiment of the present invention, and FIG. 2 is an A in FIG. 1.
-A sectional view, FIG. 3 is a circuit configuration diagram in FIG. 1. In the figure, 1 is a source electrode line, 2 is a gate electrode line,
3 is a common electrode line, 4 is a gate insulating film, 5 is a semiconductor i-layer,
6 is an upper insulating film, 7 is a semiconductor n'' layer, 8 is a drain electrode, 9 is a pixel electrode, 10 is a protective film, 12 is a floating electrode, 13
is a dielectric film, 14 is a transparent insulating substrate, 15 is TPT, 16
is the gate-drain parasitic capacitance, and 21 is the charge retention capacitance (
1) and 22 are charge storage capacitors (2).
このようなTFTアレイ基板は、次の工程によって製造
される。Such a TFT array substrate is manufactured through the following steps.
まず、ガラス等の透明絶縁基板14上にITO等の透明
導電膜なEB蒸着法で形成する。次に、ホトエツチング
等の方法で上記透明導電膜の不要部分を除去し、アイラ
ンド状に浮遊電極12を形成する。その後、プラズマC
VD法やスパッタ法等で=化シリコン、酸化シリコン、
酸化タンタルあるいはこれらのいずれか2層以上からな
る誘電体膜13を形成し、次に、スパッタ法等によりl
To等の透明導電薄膜を形成する。その後、ホトエツチ
ング等で不要な部分を除去して画素電極9を形成する。First, a transparent conductive film such as ITO is formed on a transparent insulating substrate 14 such as glass by EB evaporation. Next, unnecessary portions of the transparent conductive film are removed by photoetching or the like to form floating electrodes 12 in the form of islands. After that, plasma C
By VD method, sputtering method, etc. = silicon oxide, silicon oxide,
A dielectric film 13 made of tantalum oxide or two or more layers of any of these is formed, and then l is deposited by sputtering or the like.
A transparent conductive thin film such as To is formed. Thereafter, unnecessary portions are removed by photoetching or the like to form the pixel electrode 9.
二のとき、画素電極9が誘電体13を介在させて浮遊電
極I2の上方に位置するようにオーバーラツプさせ、こ
れらによって電荷保持容量<1> 21を形成する。In case 2, the pixel electrode 9 is overlapped with the dielectric 13 interposed therebetween so as to be located above the floating electrode I2, thereby forming a charge storage capacitor <1> 21.
次に、スパッタ法等でCrあるいはMO等の金属を堆積
し、ホトエツチング等でゲート電極線2および共通電極
線3を形成する。このとき、共通電極線3が画素電極9
と重ならないように並置させるとともに浮遊電極12と
誘電体膜13を介在させてオーバーラツプさせ、共通電
極線3、誘電体膜13および浮遊電極12とによって電
荷保持容量(2)22を形成する。Next, metal such as Cr or MO is deposited by sputtering or the like, and gate electrode line 2 and common electrode line 3 are formed by photoetching or the like. At this time, the common electrode line 3 is connected to the pixel electrode 9
The common electrode line 3, the dielectric film 13, and the floating electrode 12 form a charge storage capacitor (2) 22.
次に、窒化シリコン等のゲート絶縁膜4および水素化ア
モルファスシリ321層等の半導体1層5および上部絶
縁膜6を連続してプラズマCVD法等により堆積する。Next, a gate insulating film 4 made of silicon nitride or the like, a semiconductor layer 5 such as a hydrogenated amorphous silica layer 321, and an upper insulating film 6 are successively deposited by plasma CVD or the like.
その後、上部絶縁膜6をパターン加工し、さらに、水素
化アモルファスシリコンn8層7をプラズマCVD法等
で形成してパターン加工を施し、画素型ffL9とドレ
イン電極8とのコンタクトホールを形成する。その後、
AMo等の導電性薄膜をスパッタ法等で堆積し、ソス電
極線1とドレイン電極8にパターン加工する。さらに、
不要な半導体n゛層7および半導体1層5をドライエツ
チングでエッチオフし、最後に窒化シリコン膜あるいは
酸化シリコン膜等をプラズマCVD法等で堆積し、パタ
ーン加工して保護膜10を形成する。Thereafter, the upper insulating film 6 is patterned, and a hydrogenated amorphous silicon n8 layer 7 is formed by plasma CVD or the like and patterned to form a contact hole between the pixel type ffL9 and the drain electrode 8. after that,
A conductive thin film such as AMo is deposited by sputtering or the like and patterned into the sos electrode line 1 and the drain electrode 8. moreover,
Unnecessary semiconductor layer 7 and semiconductor layer 5 are etched off by dry etching, and finally a silicon nitride film or silicon oxide film is deposited by plasma CVD or the like and patterned to form a protective film 10.
このようにして形成されたTFTアレイ基板と、透明電
極およびカラーフィルタ等を有する対向電極基板38と
の間に液晶等の表示材料35を挟持させることによって
液晶表示装置が製造される。A liquid crystal display device is manufactured by sandwiching a display material 35 such as liquid crystal between the TFT array substrate thus formed and a counter electrode substrate 38 having transparent electrodes, color filters, etc.
このように本実施例では、画素電極9と共通電極3とが
オーバーラツプしないように並設するとともに、該画素
電極9および共通電極3と誘電体1]113を介在させ
て浮遊電極12を設けるように構成したため、浮遊電極
12と画素電極9、浮遊電極9と共通電極3との間に電
荷保持容量(1)(2)を形成することができ、しかも
、これらの直列結合により画素電極9と共通電極3とを
容量結合する構成とすることができ、したがって、浮遊
電極12と画素電極9あるいは浮遊電極12と共通電極
3との間のいずれか一方で短絡欠陥が発生しても直ちに
共通電極12およびドレイン電極8間を短絡させること
がなく、この結果、電荷保持容量の短絡による画素欠陥
を低減させることができる。In this embodiment, the pixel electrode 9 and the common electrode 3 are arranged side by side so as not to overlap, and the floating electrode 12 is provided with the pixel electrode 9 and the common electrode 3 interposed with the dielectric 113. Because of this configuration, charge storage capacitors (1) and (2) can be formed between the floating electrode 12 and the pixel electrode 9, and between the floating electrode 9 and the common electrode 3. Furthermore, by connecting these in series, the pixel electrode 9 and The common electrode 3 can be configured to be capacitively coupled. Therefore, even if a short-circuit defect occurs between the floating electrode 12 and the pixel electrode 9 or between the floating electrode 12 and the common electrode 3, the common electrode can be connected immediately. 12 and the drain electrode 8, and as a result, pixel defects due to shorting of the charge storage capacitor can be reduced.
なお、上記実施例では、浮遊電極12として透明導電膜
を用いた場合について説明したが、表示上差し支えなけ
れば金属膜等の不透明導電膜を用いてもよく、また、T
PT構成として第4図および第5図に示すように上部絶
縁膜6を用いない構造でもよい。In the above embodiment, a transparent conductive film is used as the floating electrode 12, but an opaque conductive film such as a metal film may be used as long as it does not interfere with display.
The PT structure may be a structure in which the upper insulating film 6 is not used as shown in FIGS. 4 and 5.
さらに、上記実施例では、最初に浮遊電極12を形成し
、その後、誘電体膜】3、画素電極9および共通電極線
3を順次形成するように構成したが、第6図、第7図あ
るいは第8図、第9図に示ずように画素電極9および共
通電極線3を形成したiL ゲー)・絶縁膜4を形成
し、さらに浮遊電極12をソース電極線1およびドレイ
ン電極線8を形成するとき、同一材料により同時に形成
することもできる。また、浮遊電極12を画素電極9お
よび共通電極線3の上下両方に形成することも可能であ
る。Further, in the above embodiment, the floating electrode 12 is first formed, and then the dielectric film 3, the pixel electrode 9, and the common electrode line 3 are sequentially formed. As shown in FIGS. 8 and 9, a pixel electrode 9 and a common electrode line 3 are formed, an insulating film 4 is formed, and a floating electrode 12 is formed, and a source electrode line 1 and a drain electrode line 8 are formed. In this case, they can be formed simultaneously using the same material. Furthermore, it is also possible to form the floating electrode 12 both above and below the pixel electrode 9 and the common electrode line 3.
さらに、上記実施例においては、浮遊電極12を1個と
した場合について示したが、第10図、第11図に示す
ように複数個に分割して構成してもよい。Further, in the above embodiment, the floating electrode 12 is one piece, but the floating electrode 12 may be divided into a plurality of pieces as shown in FIGS. 10 and 11.
次に、第2の発明を一実施例である図について説明する
。Next, the second invention will be explained with reference to a diagram which is an embodiment.
第12図は第2の発明の一実施例によるTFTアレイ基
板の1画素分を示す平面構成図、第13図は第12図に
おけるA−A断面図、第14図は第12図における回路
構成図である。図において、第1図〜第11図と同一符
号は同一部分を示すもので、この実施例では、浮遊電極
12を次段のゲート電極線2Aとも誘電体膜13を介し
て対向配置させ、これらによって電荷保持容量<3)2
3を形成させたことを特徴としている。FIG. 12 is a plan configuration diagram showing one pixel of a TFT array substrate according to an embodiment of the second invention, FIG. 13 is a sectional view taken along line AA in FIG. 12, and FIG. 14 is a circuit configuration diagram in FIG. 12. It is a diagram. In the figure, the same reference numerals as in FIGS. 1 to 11 indicate the same parts. In this embodiment, the floating electrode 12 is also placed opposite to the gate electrode line 2A of the next stage with the dielectric film 13 interposed therebetween. charge holding capacity<3)2
It is characterized by forming 3.
このようなTFTアレイ基板は次のような工程によって
製造される。Such a TFT array substrate is manufactured by the following steps.
まず、ガラス等の透明絶縁基板14上にITO等の透明
導電膜をEB蒸着法で堆積し、ホトエツチング等の方法
で透明導電膜の不要部分を除去してアイランド状に浮遊
電極12を形成する。次に、プラズマCVD法やスパッ
タ法等で窒化シリコン、酸化シリコン、酸化タンタルあ
るいはそれらのいずれか2層以上からなる誘電体膜13
を形成する。First, a transparent conductive film such as ITO is deposited on a transparent insulating substrate 14 made of glass or the like by EB evaporation, and unnecessary portions of the transparent conductive film are removed by a method such as photoetching to form floating electrodes 12 in the form of islands. Next, a dielectric film 13 made of silicon nitride, silicon oxide, tantalum oxide, or two or more layers of any of these is formed by a plasma CVD method or a sputtering method.
form.
その後、スパッタ法等により[T○等の透明導電薄膜を
形成し、ホI・エツチング等で画素電極9を形成する。Thereafter, a transparent conductive thin film such as T◯ is formed by sputtering or the like, and the pixel electrode 9 is formed by etching or the like.
このとき、画素電極9が誘電体13を挟んで浮遊電極1
2と対向するようにオーバラップさせ、電荷保持容量(
1) 21を形成する。At this time, the pixel electrode 9 is connected to the floating electrode 1 with the dielectric 13 in between.
2 and overlap it so that it faces the charge holding capacitor (
1) Form 21.
次に、スパッタ法等でCrあるいはMo等の金属を堆積
した後、ホI・エツチング等でゲート電極線2、共通電
極線3を形成する。このとよ、浮遊電極12と共通電極
線3および次の画素電極用のゲート電極線2Aとが誘電
体膜13を介してオーバーラツプするように配置させ、
これによって電荷保持容量<2)22および電荷保持容
量(3)23を形成する。Next, after depositing a metal such as Cr or Mo by sputtering or the like, the gate electrode line 2 and the common electrode line 3 are formed by etching or the like. In this case, the floating electrode 12, the common electrode line 3, and the gate electrode line 2A for the next pixel electrode are arranged so as to overlap with each other with the dielectric film 13 interposed therebetween.
As a result, a charge storage capacitor <2) 22 and a charge storage capacitor (3) 23 are formed.
その後、窒化シリコン等のゲート絶縁膜4および水素化
アモルファスシリコ21層等の半導体1層5および上部
絶縁膜6を連続してプラズマCVD法等により堆積し、
上部絶縁膜6をパターン加工した後、水素化アモルファ
ス/クコ201層7をプラズマCVD法等で形成し、パ
ターン加工により画素電極9とドレイン電極10とのコ
ンタクトホールを形成する。その後、AI、MO等の導
電性薄膜をスパッタ法等で堆積し、ソース電極線1とド
レイン電極8にパターン加工するとともに不要な半導体
n4層7および半導体1層5をドライエツチングでエッ
チオフし、最後に窒化シリコン膜あるいは酸化シリコン
膜等をプラズマCVD法等で堆積し、パターン加工して
保護膜10を形成する。Thereafter, a gate insulating film 4 such as silicon nitride, a semiconductor layer 5 such as 21 layers of hydrogenated amorphous silicon, and an upper insulating film 6 are successively deposited by plasma CVD or the like.
After patterning the upper insulating film 6, a hydrogenated amorphous/wolfberry 201 layer 7 is formed by plasma CVD or the like, and a contact hole between the pixel electrode 9 and the drain electrode 10 is formed by patterning. After that, a conductive thin film such as AI or MO is deposited by sputtering or the like, and patterned into the source electrode line 1 and drain electrode 8, and unnecessary semiconductor n4 layer 7 and semiconductor 1 layer 5 are etched off by dry etching. Finally, a silicon nitride film, a silicon oxide film, or the like is deposited by plasma CVD or the like, and patterned to form a protective film 10.
このように本実施例では、画素電極9を次の画素電極用
のゲート電極2Aとオーバーラツプしないように並設す
るとともに該画素電極9とゲート電極2にわたる浮遊電
極12を誘電体13を介在させて設けることにより、こ
の浮遊電極12と画素電極9および浮遊電極12とゲー
ト電極2Aとによって電荷容量(1)(3)を形成し、
これらの容量結合により画素電極9とゲート電極2Aと
を容量結合する構成としている。このため、浮遊電極1
2と画素電極9あるいは浮遊電極12とゲート電極2と
の間のいずれか一方で短絡欠陥が生じたとてもゲート電
極2と画素電極9との間が直ちに短絡することがなく、
従って、短絡による画素欠陥の発生を抑制することがで
きる。In this embodiment, the pixel electrode 9 is arranged in parallel with the gate electrode 2A for the next pixel electrode so as not to overlap, and the floating electrode 12 spanning the pixel electrode 9 and the gate electrode 2 is provided with the dielectric 13 interposed therebetween. By providing this, charge capacitances (1) and (3) are formed by the floating electrode 12 and the pixel electrode 9 and the floating electrode 12 and the gate electrode 2A,
The structure is such that the pixel electrode 9 and the gate electrode 2A are capacitively coupled by these capacitive couplings. For this reason, floating electrode 1
Even if a short-circuit defect occurs between the gate electrode 2 and the pixel electrode 9 or between the floating electrode 12 and the gate electrode 2, there is no immediate short-circuit between the gate electrode 2 and the pixel electrode 9.
Therefore, the occurrence of pixel defects due to short circuits can be suppressed.
なお、上記実施例では、浮遊電極12とオーバーラツプ
させるゲーI・電極を次の画素@極用のものとしたが、
前段の画素電極用のゲート電極にオーバーラツプさせる
ように構成してもよい。また。In the above embodiment, the gate I electrode overlapping with the floating electrode 12 is for the next pixel @ electrode, but
It may be configured to overlap the gate electrode for the previous pixel electrode. Also.
浮遊電極12と共通電極3とのオーバーラツプ部を小さ
くして電荷保持容量(2>22を小さなものとしたが、
オーバラップ部を大きく形成してもよく、さらに、第一
15図、第16図、第17図に示すように、浮遊電極1
2を2分割して共通電極3との電荷保持容量を併設する
ように構成してもよい。また、浮遊電極12を第18図
、第19図に示すように複数個に分割して構成してもよ
い。Although the overlap between the floating electrode 12 and the common electrode 3 was made smaller to make the charge retention capacitance (2>22) smaller,
The overlapping portion may be formed to be large, and furthermore, as shown in FIGS. 15, 16, and 17, the floating electrode 1
2 may be divided into two to provide a charge retention capacitor with the common electrode 3. Furthermore, the floating electrode 12 may be divided into a plurality of parts as shown in FIGS. 18 and 19.
さらに、上記実施例では、浮遊電極12を形成した後、
誘電体膜13を形成するものについて説明したが、第2
0図、第21図に示すように、浮i!電極]2をソース
・ドレイン電極材料を用いて形成し、浮遊電極12、ゲ
ート電極線2A、画素電極9およびゲート絶縁膜4によ
って電荷保持容量H)22、電荷保持容量(3)23を
形成することもできる。また、浮遊電極を画素電極9お
よびゲート電極線2の上下両方に形成することも可能で
ある。Furthermore, in the above embodiment, after forming the floating electrode 12,
Although the method for forming the dielectric film 13 has been described, the second
As shown in Figure 0 and Figure 21, the floating i! [Electrode] 2 is formed using a source/drain electrode material, and a charge retention capacitor H) 22 and a charge retention capacitor (3) 23 are formed by the floating electrode 12, gate electrode line 2A, pixel electrode 9, and gate insulating film 4. You can also do that. Furthermore, it is also possible to form floating electrodes both above and below the pixel electrode 9 and the gate electrode line 2.
[発明の効果コ
以上にように、二の発明によれば、共通電極線あるいは
ゲート電極線と画素電極とを並設するとともにこれらと
誘電体を介して浮遊電極を設けるように構成したため、
共通電極線あるいはゲート電極線と画素電極との間で発
生する短絡欠陥を抑制させる二とができる。また、電荷
保持容量を複数のキャパシタで形成しているため、その
うちのひとつが短絡しても電荷保持容量としての機能を
保たせることができるという効果がある。[Effects of the Invention] As described above, according to the second invention, since the common electrode line or the gate electrode line and the pixel electrode are arranged side by side, and the floating electrode is provided between them and the dielectric,
It is possible to suppress short-circuit defects occurring between the common electrode line or the gate electrode line and the pixel electrode. Furthermore, since the charge storage capacitor is formed of a plurality of capacitors, the function as a charge storage capacitor can be maintained even if one of the capacitors is short-circuited.
第1図は本発明の一実施例である液晶表示装置に用いら
れるTFTアレイ基板を示す平面構成図、第2図は、第
1図におけるA−A断面図、第3図は第1図における回
路構成図、第4図、第6図、第8図は他の実施例である
TFTアレイ基板を示す構成図、第5図、第7図、第9
図は各々第4図、第6図、第8図におけるA−A断面図
、第10図、第11図は本発明の他の実施例を示す回路
図および構成図、第12図、第13図、第14図は第2
の発明の実施例であるT’ F Tアレイ基板を示す平
面構成図、A−A断面図および回路図、第15図、第1
6図、第17図は他の実施例であるTFTアレイ基板を
示す平面構成図、断面図および回路図、第18図、第1
9図は他の実施例を示す構成図および回路図、第20図
、第21図は他の実施例を示す構成図および断面図、第
22図は従来の液晶表示装置におけるTFTアレイ基板
の1画素分を示す平面構成図、第23図は第22図にお
けるAA断面図、第24図は第22図における等価回路
図である。
1 ソース電極線、2 ゲート電極線、3 共通電極線
、4 ゲート絶縁膜、5 半導体i層、6 ゛上部絶縁
膜、7・半導体n゛層、8 ドレイン電極、9 画素電
極、lO保護膜、12 浮遊電極、13・誘電体膜、I
4・透明絶縁基板、15−TFT、16・・ゲート・ド
レイン間寄生容量、17 遮光膜、18 電荷保持容量
、21・電荷保持容量(1〉、22 電荷保持容量(2
)、23 電荷保持容量(3)、35 液晶、38 対
向電極。
なお、図中、同一符号は同−又は相当部分を示す。FIG. 1 is a plan configuration diagram showing a TFT array substrate used in a liquid crystal display device according to an embodiment of the present invention, FIG. 2 is a sectional view taken along line A-A in FIG. 1, and FIG. Circuit configuration diagrams, FIGS. 4, 6, and 8 are configuration diagrams showing TFT array substrates of other embodiments, FIGS. 5, 7, and 9.
10 and 11 are circuit diagrams and configuration diagrams showing other embodiments of the present invention, and FIGS. 12 and 13 are sectional views taken along line A-A in FIGS. Figure 14 is the second
FIG.
6 and 17 are plan configuration diagrams, cross-sectional views, and circuit diagrams showing TFT array substrates of other embodiments, and FIGS. 18 and 1
9 is a block diagram and a circuit diagram showing another embodiment, FIGS. 20 and 21 are a block diagram and a cross-sectional diagram showing another embodiment, and FIG. 22 is a diagram showing one of the TFT array substrates in a conventional liquid crystal display device. FIG. 23 is a planar configuration diagram showing pixels, FIG. 23 is a sectional view taken along line AA in FIG. 22, and FIG. 24 is an equivalent circuit diagram in FIG. 22. 1 Source electrode line, 2 Gate electrode line, 3 Common electrode line, 4 Gate insulating film, 5 Semiconductor i layer, 6 Upper insulating film, 7 Semiconductor n layer, 8 Drain electrode, 9 Pixel electrode, IO protective film, 12 Floating electrode, 13・Dielectric film, I
4.Transparent insulating substrate, 15-TFT, 16...Gate-drain parasitic capacitance, 17. Light shielding film, 18. Charge storage capacitor, 21.Charge storage capacitor (1>, 22. Charge storage capacitor (2)
), 23 charge retention capacitor (3), 35 liquid crystal, 38 counter electrode. In addition, in the figures, the same reference numerals indicate the same or corresponding parts.
Claims (1)
および複数のゲート電極線、上記共通電極線およびゲー
ト電極線に交差して形成された複数のソース電極線、上
記ゲート電極線とソース電極線の交差部付近に設けられ
た薄膜トランジスタ、該薄膜トランジスタに接続された
画素電極からなるTFTアレイ基板と、該TFTアレイ
基板に対向して設けられた対向電極基板と、該対向電極
基板と上記TFTアレイ基板の間に挟持された液晶表示
材料とを備えた液晶表示装置において、上記共通電極線
あるいはゲート電極線と上記画素電極とを並設するとと
もにこれらの電極と誘電体を介して浮遊電極を設けるよ
うに構成したことを特徴とする液晶表示装置。(1) A plurality of common electrode lines and a plurality of gate electrode lines arranged in parallel on a transparent insulating substrate, a plurality of source electrode lines formed to intersect the common electrode line and the gate electrode line, and the above gate electrode line A TFT array substrate comprising a thin film transistor provided near the intersection of the source electrode line and the source electrode line, a pixel electrode connected to the thin film transistor, a counter electrode substrate provided opposite to the TFT array substrate, and a counter electrode substrate. In a liquid crystal display device comprising a liquid crystal display material sandwiched between the TFT array substrates, the common electrode line or the gate electrode line and the pixel electrode are arranged in parallel, and a floating electrode is provided between these electrodes and a dielectric material. A liquid crystal display device characterized in that it is configured to include electrodes.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP33615590A JP2711020B2 (en) | 1990-04-27 | 1990-11-29 | Liquid crystal display |
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2-114301 | 1990-04-27 | ||
JP11430190 | 1990-04-27 | ||
JP33615590A JP2711020B2 (en) | 1990-04-27 | 1990-11-29 | Liquid crystal display |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH0427920A true JPH0427920A (en) | 1992-01-30 |
JP2711020B2 JP2711020B2 (en) | 1998-02-10 |
Family
ID=26453074
Family Applications (1)
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---|---|---|---|
JP33615590A Expired - Fee Related JP2711020B2 (en) | 1990-04-27 | 1990-11-29 | Liquid crystal display |
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Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002033488A (en) * | 2001-05-14 | 2002-01-31 | Semiconductor Energy Lab Co Ltd | Semiconductor device |
KR20020054917A (en) * | 2000-12-28 | 2002-07-08 | 주식회사 현대 디스플레이 테크놀로지 | Method for forming capacitor for reducing image sticking using source/drain for fringe field switching structure |
KR100466393B1 (en) * | 2001-05-30 | 2005-01-13 | 비오이 하이디스 테크놀로지 주식회사 | Thin film transistor liquid crystal display |
KR100604125B1 (en) * | 2000-06-12 | 2006-07-24 | 엔이씨 엘씨디 테크놀로지스, 엘티디. | Liquid crystal display apparatus and manufacturing method for the same |
JP2007310334A (en) * | 2006-05-19 | 2007-11-29 | Mikuni Denshi Kk | Manufacturing method of liquid crystal display device using half-tone exposure method |
CN113380144A (en) * | 2021-06-07 | 2021-09-10 | 武汉天马微电子有限公司 | Display panel and display device |
-
1990
- 1990-11-29 JP JP33615590A patent/JP2711020B2/en not_active Expired - Fee Related
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100604125B1 (en) * | 2000-06-12 | 2006-07-24 | 엔이씨 엘씨디 테크놀로지스, 엘티디. | Liquid crystal display apparatus and manufacturing method for the same |
KR20020054917A (en) * | 2000-12-28 | 2002-07-08 | 주식회사 현대 디스플레이 테크놀로지 | Method for forming capacitor for reducing image sticking using source/drain for fringe field switching structure |
JP2002033488A (en) * | 2001-05-14 | 2002-01-31 | Semiconductor Energy Lab Co Ltd | Semiconductor device |
KR100466393B1 (en) * | 2001-05-30 | 2005-01-13 | 비오이 하이디스 테크놀로지 주식회사 | Thin film transistor liquid crystal display |
JP2007310334A (en) * | 2006-05-19 | 2007-11-29 | Mikuni Denshi Kk | Manufacturing method of liquid crystal display device using half-tone exposure method |
CN113380144A (en) * | 2021-06-07 | 2021-09-10 | 武汉天马微电子有限公司 | Display panel and display device |
Also Published As
Publication number | Publication date |
---|---|
JP2711020B2 (en) | 1998-02-10 |
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