JPH04276699A - Cooling structure for electronic apparatus - Google Patents

Abstract

PURPOSE:To provide a cooling structure for an electronic apparatus which has a thermal conductive medium flexibly corresponding to a component shape mounted on a printed board and particularly a component shape if the height side of the component is irregular and can replace efficient thermal energy in the structure having a heat generating component. CONSTITUTION:Contact of a mounting component 5 on a pair of printed board 3 with a baglike thin film 3 of an insulator having a low contact thermal resistance and a strength against the contact of the component, flexibly copes with a component shape since the film and inert liquid or gel-like substance 7 having excellent thermal conductivity therein are in an indeterminate form, its contact area is increased, thermal conductivity is improved, the thermal energy of the surface of each component is efficiently transferred to the liquid or the substance 7. The energy transferred to the liquid or the substance 7 is transferred to metal fins 2 of an excellent thermal conductivity associated within the film through a thermal conductor 8, and thermally transferred from the heat dissipating fins out of the film to cooling convection by means of thermal conduction of the fins 2.

Description

[Detailed description of the invention]

0001

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a cooling structure for electronic equipment, and more particularly to a cooling method for a device mounted with a printed circuit board having electrical components that are non-uniform in shape and generate different amounts of heat.

0002

[Prior Art] Conventionally, as shown in FIGS. 5 and 6, direct cooling convection 9 was mainly applied to electronic components 5 mounted on a printed circuit board 3.
Thermal energy was exchanged by applying . There is also a method of providing a thermally conductive spacer above the heat-generating component to conduct heat to a radiation fin, and a related device of this type includes, for example, the heat radiation structure of an electronic circuit unit disclosed in Japanese Patent Application Laid-Open No. 63-28098.

0003

[Problems to be Solved by the Invention] The above-mentioned conventional technology has problems with air stagnation and spacers when the part shape, especially in the height direction, is uneven, and when the medium that transfers heat to the part surface is air or a thermally conductive spacer. There was a problem in that gaps were formed between the parts and thermal conductivity was poor, making it impossible to efficiently exchange heat energy. The object of the present invention is to be able to correspond to such a wide variety of component shapes and to perform efficient thermal energy exchange.

0004

[Means for Solving the Problems] In order to achieve the above object, a bag-shaped thin film that has low contact resistance, is strong against component contact, and is an insulator is used as a medium for exchanging thermal energy with the component surface. use. Furthermore, an inert liquid or gel-like substance with good thermal conductivity is injected into the inside of the bag-like thin film and sealed. Furthermore, metal fins with good thermal conductivity are incorporated from the inside of the bag-like thin film to the outside of the bag-like thin film.

[0005]

[Operation] Thermal energy generated inside each component on the printed circuit board is transmitted through the component case and conducted onto the surface of each component. Here, the thermal energy conducted to the surface of each component is transferred to the bag-like thin film that is in contact with the surface of each part, and then to the inert liquid or gel-like substance inside the bag-top thin film, resulting in synthesized heat. It becomes energy. Furthermore, the synthesized thermal energy is transferred to the metal fins inside the bag-like thin film and is then thermally conducted to the outside of the bag-like thin film. Furthermore, this thermal energy is exchanged by heat transfer with external cooling convection.

[0006]

[Example] An example of the present invention is shown below in Figs. 1, 2, 3,
This will be explained with reference to FIG.

FIG. 1 is a perspective view of a cooling structure showing an embodiment of the invention, and FIG. 2 is an external view of a device unit showing an embodiment of the invention. The present invention consists of a pair of printed circuit boards 3, a board fixing fitting 4, a bag-shaped thin film 1, and metal fins 2 and 3 shown in FIG.
It consists of an inert liquid or gel-like substance 7 injected into the bag-like membrane 1 shown in the figure.

[0008] Two printed circuit boards 3 are screwed together with fixing fittings 4, and between the printed circuit boards 3, metal fins 2 and an inert liquid or gel-like substance 7 injected into the inside of the bag-like thin film 1 are fixed with screws. be done. Printed circuit board mounted component 5 shown in Figure 3
The contact area between the bag-like thin film 3 and the bag-like thin film 3 can be flexibly adapted to the shape of the part because the bag-like thin film and the inert liquid or gel-like substance 7 inside have an irregular shape, increasing the contact area and improving the heat transfer coefficient. The heat energy on the surface of each component is efficiently transferred to the inert liquid or gel-like substance 7. Thermal energy transferred to the inert liquid or gel-like substance 7 is transferred to the metal fins 2 incorporated inside the bag-like thin film by thermal conduction 8, and is transferred to the metal fins 2 incorporated inside the bag-like thin film by thermal conduction 8 inside the metal fins 2 as shown in FIG. Cooling convection 9 from the heat dissipation fins outside the bag-like thin film
Heat is transferred to.

[0009]

[Effects of the Invention] According to the present invention, the contact area between the heat generating component and the medium that directly transfers heat can be increased, improving the heat transfer coefficient, and since the heat generating component and the heat radiating section are isolated, the shape of the component can be improved. Regardless, the dedicated metal fins perform cooling convection and heat transfer, making it possible to exchange heat energy efficiently. Furthermore, when heat exchange is performed by forced cooling convection, it is possible to reduce the air volume and reduce noise.

[Brief explanation of the drawing]

FIG. 1 is a perspective view of a cooling structure showing an embodiment of the present invention.

FIG. 2 is an external view of an apparatus unit showing an embodiment of the present invention.

FIG. 3 is a sectional view taken along line AA in FIG. 1;

FIG. 4 is a side view of FIG. 1;

FIG. 5 is an external view of a device unit showing a prior art.

6 is a sectional view taken along line BB in FIG. 5. FIG.

[Explanation of symbols]

1... Bag-shaped thin film 2...Metal fin 3...Printed circuit board 4...Fixing metal fittings 5...Electronic parts 6...Frame 7...Inert liquid or gel-like substance 8...Heat conduction 9...Cooling convection

Claims (1)

[Claims] [Claim 1] In a cooling structure for an electronic device having heat-generating components, a bag-shaped thin film that is an insulator and has low contact thermal resistance and is strong against contact between components is brought into contact with the surface of the component on a printed circuit board. , Inject an inert liquid or gel material with good thermal conductivity into the bag and seal it. An electronic device cooling structure characterized in that heat energy is efficiently exchanged from electronic components having non-uniform shapes and different calorific values to the outside of the device by extending metal fins with good thermal conductivity from the inside of the bag-like thin film to the outside.