JPH02121354A - Lsi case cooling device - Google Patents
Lsi case cooling deviceInfo
- Publication number
- JPH02121354A JPH02121354A JP63272997A JP27299788A JPH02121354A JP H02121354 A JPH02121354 A JP H02121354A JP 63272997 A JP63272997 A JP 63272997A JP 27299788 A JP27299788 A JP 27299788A JP H02121354 A JPH02121354 A JP H02121354A
- Authority
- JP
- Japan
- Prior art keywords
- thermally conductive
- electric heating
- lsi
- piston
- cold plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000001816 cooling Methods 0.000 title claims description 12
- 239000002826 coolant Substances 0.000 claims abstract description 6
- 238000005485 electric heating Methods 0.000 claims description 56
- 239000000463 material Substances 0.000 claims description 20
- 239000003566 sealing material Substances 0.000 claims description 2
- 238000007789 sealing Methods 0.000 abstract description 3
- 238000012856 packing Methods 0.000 abstract description 2
- 238000000034 method Methods 0.000 abstract 1
- 239000003507 refrigerant Substances 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 239000012528 membrane Substances 0.000 description 2
- 229920002379 silicone rubber Polymers 0.000 description 2
- 239000004945 silicone rubber Substances 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- XPDWGBQVDMORPB-UHFFFAOYSA-N Fluoroform Chemical compound FC(F)F XPDWGBQVDMORPB-UHFFFAOYSA-N 0.000 description 1
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 229920006332 epoxy adhesive Polymers 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052750 molybdenum Inorganic materials 0.000 description 1
- 239000011733 molybdenum Substances 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/161—Cap
- H01L2924/1615—Shape
- H01L2924/16195—Flat cap [not enclosing an internal cavity]
Landscapes
- Details Of Measuring And Other Instruments (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
Description
【発明の詳細な説明】 ［産業上の利用分野］ 本発明はＬＳＩケースの冷却装置に関する。[Detailed description of the invention] [Industrial application field] The present invention relates to a cooling device for an LSI case.
［従来の技術］
従来のこの種のＬＳＩケースの冷却装置としては、例え
ば第３図に示すようなものかある。[Prior Art] As a conventional cooling device for an LSI case of this type, there is one shown in FIG. 3, for example.
すなわち、プリント基板２６に搭載されたＬＳＩケース
２８上に、内部に冷却バイブ２２を設けたコールドプレ
ート２１を配し、ＬＳＩケース２８とコールドプレート
２１の間に内部に電熱ペースト２４を包んだフィルム幕
２５を挟み込んたものである（例えば、日経エレクトロ
ニクス１９８３年２−１４号第１４０〜１５１ページ）
。That is, a cold plate 21 with a cooling vibrator 22 inside is arranged on an LSI case 28 mounted on a printed circuit board 26, and a film curtain with an electric heating paste 24 wrapped inside is placed between the LSI case 28 and the cold plate 21. 25 (for example, Nikkei Electronics 1983 issue 2-14, pages 140-151)
.
この例は、ＬＳＩケース２８を取付けたプリント基板２
６ごとコールドプレート２１に押し付けることにより、
ＬＳＩケース２８の表面をフィルム膜２５と接触させ、
電熱ペースト２４を介してＬＳＩ２７の発する熱をコー
ルドプレート２１の中を流れる冷媒２３によって冷却す
るようにしたものである。This example shows a printed circuit board 2 with an LSI case 28 attached.
By pressing 6 against the cold plate 21,
Bringing the surface of the LSI case 28 into contact with the film membrane 25,
The heat generated by the LSI 27 is cooled by the refrigerant 23 flowing through the cold plate 21 via the electric heating paste 24.
電熱ペースト２４を包むフィルム膜２５は熱伝導率が低
いので、これに代えて良熱伝導製のシリコンゴムなどを
使用したものもある。Since the film membrane 25 surrounding the electric heating paste 24 has low thermal conductivity, a material such as silicone rubber made of good thermal conductivity may be used instead.
［解決すべき課題］
上述した従来のＬＳＩケースの冷却装置では、ＬＳＩケ
ース２８とコールドプレート２１の間の熱伝導のために
採用しているフィルム膜２５．電熱ペースト２４、シリ
コンゴム等の部材がいずれもあまり熱伝導性の高いもの
てはないため、各部材の部分で熱抵抗が大きくなるとい
う問題があった。[Problems to be Solved] In the conventional LSI case cooling device described above, the film 25. Since the electrical heating paste 24, silicone rubber, and other members do not have very high thermal conductivity, there is a problem in that the thermal resistance becomes large in each member.
本発明は上述した問題点にかんがみなされたものて、重
量が軽＜、ＬＳＩケースとコールドプレートの間の熱伝
導のための部材を極力薄くして熱伝導性を高め、ＬＳＩ
の冷却性？良くしたしＳｌケースの冷却装置の提供を目
的とする。The present invention has been made in view of the above-mentioned problems.The present invention has been made in view of the above-mentioned problems.
Cooling property? The purpose of this invention is to provide a cooling device for a sl case.
［課題の解決手段］
上記目的を達成するために本発明のＬＳＩケースの冷却
装置は、ＬＳＩを搭載しプリント基板上に複数個実装さ
れたＬＳＩケースを、該ＬＳＩケースに対向して内部に
冷媒が流れるコールドプレートと前記プリント基板との
間て挟み、前記ＬＳＩから発生する熱を前記コールドケ
ース内を流れる冷媒により冷却するものであって、前記
ＬＳＩケースの上面に、電熱ペーストを充填する凹形電
熱材を配し、前記コールドプレートに前記凹形電熱材と
対応する位置でシリンダ穴を設け、該シリンダ穴に貫通
穴を備えた電熱ピストンを挿入し、該電熱ピストンの側
面と前記凹形電熱材間をシール材で密閉し、かつ前記電
熱ピストンの先端で前記凹形電熱材の凹部内の電熱ペー
ストを微小な隙間となるまで押圧して前記貫通穴内へ逃
がし、更に該貫通穴を密閉した構成としである。[Means for Solving the Problems] In order to achieve the above object, the LSI case cooling device of the present invention cools an LSI case, in which a plurality of LSIs are mounted on a printed circuit board, and coolant is placed inside the LSI case, facing the LSI case. is sandwiched between the printed circuit board and the cold plate through which the LSI flows, and the heat generated from the LSI is cooled by the refrigerant flowing inside the cold case, and the upper surface of the LSI case is filled with an electric heating paste. An electric heating material is arranged, a cylinder hole is provided in the cold plate at a position corresponding to the concave electric heating material, an electric heating piston with a through hole is inserted into the cylinder hole, and the side surface of the electric heating piston and the concave electric heating material are inserted into the cylinder hole. The space between the materials was sealed with a sealing material, and the electric heating paste in the concave portion of the concave electric heating material was pressed with the tip of the electric heating piston until it became a minute gap to escape into the through hole, and the through hole was further sealed. The composition is as follows.
［実施例］
以下１本発明の一実施例について図面を参照して説明す
る。[Example] An example of the present invention will be described below with reference to the drawings.
第１Ｆ２１は、本発明の一実施例の部分断面図である。1F21 is a partial cross-sectional view of one embodiment of the present invention.
ＬＳＩケース１は、プリント基板７に複数搭載されてお
り、ＬＳＩＳｌケースプリント基板７との反対面、すな
わち上面側にＬＳＩケース１と熱膨張率か近く、熱伝導
性のよい凹形電熱材２が接着されている。A plurality of LSI cases 1 are mounted on a printed circuit board 7, and a concave electric heating material 2 having a coefficient of thermal expansion close to that of the LSI case 1 and having good thermal conductivity is disposed on the opposite surface from the LSI case printed circuit board 7, that is, on the upper surface side. It is glued.
凹形電熱材２は、熱伝導性のよい接着剤によってＬＳＩ
Ｓｌケース接着されている１例えば、ＬＳＩＳｌケース
アルミナの場合、銅とモリブデンの焼結金属製の電熱材
を用い、接着剤としては銀エポキシ系のものを用いる。The concave electric heating material 2 is attached to an LSI using an adhesive with good thermal conductivity.
For example, in the case of an alumina LSIS case, an electric heating material made of sintered metal of copper and molybdenum is used, and a silver epoxy adhesive is used as the adhesive.
また、ＬＳＩＳｌケース対向してコールドプレート５か
設けられ、コールドプレート５の内部には冷媒６が流れ
ている。コールドプレート５は、サポート１０によって
プリント基板７と固定されている。また、コールドプレ
ート５には、ＬＳＩケース】の搭載位置と対応する位置
にシリンダ大工５が設けられ、このシリンダ穴１５に電
熱ピストン４が挿入されている。Further, a cold plate 5 is provided opposite the LSIS case, and a refrigerant 6 flows inside the cold plate 5. The cold plate 5 is fixed to the printed circuit board 7 by a support 10. Further, the cold plate 5 is provided with a cylinder carpenter 5 at a position corresponding to the mounting position of the LSI case, and the electric heating piston 4 is inserted into the cylinder hole 15.
電熱ピストン４は、コールドプレート５の固定側に設け
たすり割１６に固定ネジ９をねし込んみ、すり割１６を
広げてコールドプレート１５に固定されている。The electric heating piston 4 is fixed to the cold plate 15 by screwing a fixing screw 9 into a slot 16 provided on the fixed side of the cold plate 5 and widening the slot 16.
また、コールドプレート１５の固定側から反対側にコー
ルドプレート１５固定側かテーバネジ１３て密閉可能な
貫通穴１４か設けられている。Further, on the opposite side from the fixed side of the cold plate 15, there is provided a through hole 14 which can be sealed with the taper screw 13 on the fixed side of the cold plate 15.
更に、電熱ピストン４の下端は、ＬＳＩケースｌ上の凹
形電熱材２の凹部２ａに入り込み、凹部２ａの底面と微
小な隙間を保持した位置となっている。Further, the lower end of the electric heating piston 4 enters the recess 2a of the recessed electric heating member 2 on the LSI case l, and is at a position where it maintains a small gap with the bottom surface of the recess 2a.
即ち、凹形電熱材２の凹部２ａに適量のＴＬ、１８ペー
スト３を入れて、電熱ピストン４の高さを設定した上で
コールドプレート５を固定すると、四部２ａ底面側に電
熱ピストン４の下端を押し付けて両者の間を微小隙間と
する際に、電熱ペースト３か貫通穴１４内に入り込み上
方へと押し出される。そして電熱ピストン４のすり割１
６の間。That is, when an appropriate amount of TL, 18 paste 3 is put into the recess 2a of the concave electric heating material 2, the height of the electric heating piston 4 is set, and the cold plate 5 is fixed, the lower end of the electric heating piston 4 is placed on the bottom side of the four parts 2a. When the electric heating paste 3 is pressed to create a minute gap between the two, the electric heating paste 3 enters the through hole 14 and is pushed upward. And slot 1 of electric heating piston 4
Between 6.
及び電熱ピストン４と凹形電熱材２の凹部２ａ側面との
間にパツキン１２を入れ、また電熱ピストン４の貫通穴
をテーパーネジ１３で密閉することにより電熱ペースト
３を密閉する。A gasket 12 is inserted between the electric heating piston 4 and the side surface of the concave portion 2a of the concave electric heating member 2, and the through hole of the electric heating piston 4 is sealed with a tapered screw 13, thereby sealing the electric heating paste 3.
すると、熱伝導の悪い材質による電熱部分が微小厚さに
押さえられ、熱抵抗が低くなってＬＳＩケースｌ上に搭
載されているＬＳＩＩＩて発生した熱か、凹形電熱材２
、電熱ペースト３．電熱ピストン４を介して良好に伝導
され、コールドプレート５内を流れる冷媒６により冷却
される。Then, the electric heating part made of a material with poor thermal conductivity is suppressed to a very small thickness, and the thermal resistance becomes low, and the heat generated by the LSIII mounted on the LSI case l may be caused by the heat generated by the concave electric heating material 2.
, electric heating paste 3. It is cooled by the refrigerant 6 which is well conducted through the electric heating piston 4 and flows through the cold plate 5 .
なお、電熱ピストン４に貫通穴１４を複数設けることに
より、更に余分な電熱ペースト３を押し出すことかでき
、凹形電熱材２、電熱ピストン４間に空気か入らぬよう
電熱ペースト３を充填することがてきる。また、各構成
部材がしっかりと固定されるのでプリント基板７を垂直
に実装しても良い。In addition, by providing a plurality of through holes 14 in the electric heating piston 4, it is possible to further push out the excess electric heating paste 3, and it is possible to fill the electric heating paste 3 so that air does not enter between the concave electric heating material 2 and the electric heating piston 4. It's coming. Further, since each component is firmly fixed, the printed circuit board 7 may be mounted vertically.
［発明の効果］
以上説明したよう本発明は、ＬＳＩケース上に配した凹
形電熱材の凹部底面と電熱ピストンの先端間の微小な隙
間を電熱ペーストで埋めることにより、熱伝導の悪い材
質である電熱ペーストフィルム膜等を微小厚さに抑える
ことかてきるため、ＬＳＩの発生する熱を低熱抵抗でコ
ールドプレート内の冷媒に伝えることができるようにな
るという効果がある。[Effects of the Invention] As explained above, the present invention uses electric heating paste to fill the minute gap between the bottom of the concave portion of the concave electric heating material placed on the LSI case and the tip of the electric heating piston, thereby making it possible to use a material with poor thermal conductivity. Since it is possible to reduce the thickness of a certain electrothermal paste film or the like, there is an effect that the heat generated by the LSI can be transferred to the coolant in the cold plate with low thermal resistance.
また、電熱ピストンと凹形電熱材の間及び貫通穴のコー
ルドプレート固定側との間を密閉ししっかりと固定する
ことによりプリント基板の垂直実装を可能にするという
効果もある。Further, by sealing and firmly fixing the space between the electric heating piston and the concave electric heating member and the cold plate fixing side of the through hole, there is an effect that vertical mounting of the printed circuit board is possible.
第１図は本発明の一実施例の部分断面図、第２図は電熱
ピストンの拡大平面図、第３図は従来のＬＳＩケースの
冷却装近を示す部分断面図である。
ａ
ＬＳＩケース
：凹部
：電熱ピストン
、冷媒
：固定ネジ
：パッキン
二貫通穴
２：凹形電熱材
３ 電熱ペースト
５；コールドプレート
７：プリント基板
１１：ＬＳＩ
１３・テーパネジ
１５ニジリンダ穴
第 ３ 因FIG. 1 is a partial cross-sectional view of an embodiment of the present invention, FIG. 2 is an enlarged plan view of an electric heating piston, and FIG. 3 is a partial cross-sectional view showing the cooling arrangement of a conventional LSI case. a LSI case: recess: electric heating piston, refrigerant: fixing screw: packing 2 through holes 2: concave electric heating material 3 electric heating paste 5; cold plate 7: printed circuit board 11: LSI 13, taper screw 15 cylinder hole 3rd cause
Claims (1)
Ｉケースを、該ＬＳＩケースに対向して内部に冷媒が流
れるコールドプレートと前記プリント基板との間で挟み
、前記ＬＳＩから発生する熱を前記コールドケース内を
流れる冷媒により冷却するＬＳＩケースの冷却装置にお
いて、 前記ＬＳＩケースの上面に、電熱ペーストを充填する凹
形電熱材を配し、前記コールドプレートに前記凹形電熱
材と対応する位置でシリンダ穴を設け、該シリンダ穴に
貫通穴を備えた電熱ピストンを挿入し、該電熱ピストン
の側面と前記凹形電熱材間をシール材で密閉し、かつ前
記電熱ピストンの先端で前記凹形電熱材の凹部内の電熱
ペーストを微小な隙間となるまで押圧して前記貫通穴内
へ逃がし、更に該貫通穴を密閉してなることを特徴とし
たＬＳＩケースの冷却装置。[Claims] A plurality of LSs equipped with LSIs and mounted on a printed circuit board
An LSI case cooling device in which an I case is sandwiched between the printed circuit board and a cold plate that faces the LSI case and in which a coolant flows, and the heat generated from the LSI is cooled by the coolant flowing inside the cold case. A concave electric heating material filled with electric heating paste is disposed on the upper surface of the LSI case, a cylinder hole is provided in the cold plate at a position corresponding to the concave electric heating material, and a through hole is provided in the cylinder hole. Insert an electric heating piston, seal the space between the side surface of the electric heating piston and the concave electric heating material with a sealing material, and apply the electric heating paste in the recess of the concave electric heating material with the tip of the electric heating piston until there is a minute gap. A cooling device for an LSI case, characterized in that the cooling device presses the air to escape into the through hole, and further seals the through hole.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63272997A JPH02121354A (en) | 1988-10-31 | 1988-10-31 | Lsi case cooling device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63272997A JPH02121354A (en) | 1988-10-31 | 1988-10-31 | Lsi case cooling device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02121354A true JPH02121354A (en) | 1990-05-09 |
Family
ID=17521715
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP63272997A Pending JPH02121354A (en) | 1988-10-31 | 1988-10-31 | Lsi case cooling device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02121354A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2016122864A (en) * | 2016-03-22 | 2016-07-07 | 株式会社日立製作所 | Cooling structure of heating element |
| US9807913B2 (en) | 2014-09-29 | 2017-10-31 | Hitachi, Ltd. | Cooling structure of heating element and power conversion device |
-
1988
- 1988-10-31 JP JP63272997A patent/JPH02121354A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9807913B2 (en) | 2014-09-29 | 2017-10-31 | Hitachi, Ltd. | Cooling structure of heating element and power conversion device |
| JP2016122864A (en) * | 2016-03-22 | 2016-07-07 | 株式会社日立製作所 | Cooling structure of heating element |
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