JPS6037756A - Semiconductor device - Google Patents

Abstract

PURPOSE:To obtain the titled device of excellent cooling effect by a method wherein a cooling liquid flowing through a cooling device which hermetically seals a semiconductor module is brought into direct contact with the backs of semiconductor chips, and the upper surface of module other than those is covered with a member not passing the cooling liquid. CONSTITUTION:Semiconductor chips 3 are bonded on a module substrate 4, and a thermosetting resin 8 is uniformly applied thin on the back surfaces of the chips 3. After the resin is hardened, the joint of the substrate 4 with the cooling device 7 and the sections of backs of the chips are selectively removed. Next, passing the cooling liquid 6 under the junction of the device 7 enables to prevent the characteristic deterioration due to the liquid and then to obain excellent cooling effect.

Description

DETAILED DESCRIPTION OF THE INVENTION [Technical Field of the Invention] The present invention relates to a semiconductor device, and more particularly to a cooling structure for efficiently dissipating heat from a semiconductor chip of a flip module type semiconductor device to the outside.

[Prior art]

Figure 1 is a cross-sectional view showing the structure of a conventional device. Cooling device [1] cools the heat generated by the chip (3)
(4) is the module substrate, (5) is the input/output bin, and (5) is the cooling liquid flowing through the flow path provided in the cooling device (1).

The cooling device +11 is made of a metal with good thermal conductivity, such as aluminum, and the contact (2) is bonded to it in such a manner that the thermal resistance is reduced. Then, the cooling device (1) is joined to the module substrate tl) so that the contactor (2) is brought into contact with the semiconductor chip (3), and the entire module is hermetically sealed L5. Here, the contact (2
) should only make contact with the semiconductor chip (3), and avoid applying excessive mechanical force to the semiconductor chip (3).
Shi et al. 1. The heat generated in the semiconductor chip (3) is mainly transferred from the back of the chip to the cooling device (1) via the contacts (2), and the liquid (6) flowing inside the cooling device (1) cools the module. It is carried outside and dissipated by a heat exchanger (not shown) or the like.

As mentioned above, in the configuration of conventional semiconductor devices, cooling device +
Is heat transfer from 1) to the liquid (6) flowing inside it extremely efficient?The contact thermal resistance between the contact (2) and the semiconductor chip (3) is large, and the contact (2
) and the cooling device f11, a large contact thermal resistance may occur between them, so the semiconductor chip (3)
There was a drawback that the heat generated in the FAT could not be efficiently transferred to the cooling device.

[Invention planting]

This invention was made in view of the above-mentioned points, and by removing the contacts in the conventional device and bringing the liquid flowing through the cooling device into direct contact with the back surface of the semiconductor chip, a large cooling effect can be achieved. The present invention provides a semiconductor device.

[Embodiments of the invention]

FIG. 2 is a cross-sectional view showing the structure of an embodiment of the present invention, in which the same reference numerals as in the conventional example of FIG. 1 indicate equivalent parts, and the explanation thereof will be omitted. (7) is a cooling device used in this embodiment, which hermetically seals the module and is configured so that the liquid (6) flowing through the cooling device FN7) comes into contact with the semiconductor tip (3). (8) is a member that does not allow the liquid (6) to pass through, and covers all the module board surfaces except for the back surface of the semiconductor chip (3). )
Since it comes into direct contact with the back surface of the semiconductor chip (3), an excellent cooling effect can be obtained.

Figures 3 and 4 are back sectional views illustrating how to attach the member (8) that does not allow the liquid (6) to pass through.
As shown in the figure, the semiconductor chip (3) is mounted on the module board f4)l.
), then coat the liquid (6) or a thermosetting resin as an impermeable material (8) uniformly with a spin cord or the like, and if you are a skilled person, apply multiple coats to form the chip (3). Make the film thick enough to cover the back surface.

Next, after curing and hardening the resin, as shown in FIG. Remove the remaining resin.

Note that the present invention is not limited to the number of semiconductor chips in the module, the shape of the cooling device, etc., and the embodiments described above.

〔Effect of the invention〕

As explained above, in the half-body device of this invention,
The cooling liquid that flows through the cooling device that hermetically seals the semiconductor module comes into direct contact with the back of the semiconductor chip, and the rest of the top surface of the module is covered with a material that does not allow the cooling liquid to pass through, thus preventing deterioration due to the liquid. At the same time, a good cooling effect can be obtained.

[Brief explanation of drawings]

Fig. 1 is a sectional view showing the structure of a conventional device, Fig. 2 is a sectional view showing the structure of an embodiment of the present invention, and Figs. In Figure 0, which is a cross-sectional view of a part explaining the method of promotion, (3) is a semiconductor chip, (4) is a substrate, (
6) is a cooling liquid, (7) is a cooling device, and (8) is a thermosetting St resin (a material that does not permeate the cooling liquid). Note that the same reference numerals in the figures indicate the same parts. Agent: Masuo Oiwa Figure 1 Figure 2 Figure 2 Figure 33 Figure 4-Double-cut, continuous manuscript (spontaneous) Special feature 1; 'I Director +', 1i-d1 Indication of ``1'' 1 Counterfeit No. 58-147495 2 Name of the invention Semiconductor device; 3 Supplement 4-4 Relationship with 1'1 1.1 Permission 19 (1 person Address: Marunouchi, 1.11 Ward, Seventh Generation, Tokyo) -Ding 1'12 No. 33g Name
(60'l) Guryo Electric Co., Ltd. Representative Kata Ill Jin Hachibu 4 Agent Address 2-142-a Okibi-no-uchi, 11.1 Chiyo, Tokyo
, '3 CJ5, Detailed explanation of the invention in the specification subject to amendment 6, Contents of amendment - Base

Claims (1)

[Scope of Claims] fi+ A heat dissipation device that airtightly seals the semiconductor chip on a substrate on which the semiconductor chip is mounted and has a flow path for passing a cooling liquid therein, wherein A semiconductor device characterized in that at least a part of the back surface on the opposite side from the surface on which the semiconductor device is attached to the base body is brought into contact with the cooling liquid. (2) The entire surface of the base on which the semiconductor chip is mounted and airtightly restrained by a cooling device is covered with a member that does not allow the cooling liquid to pass through, except for the part that comes into contact with the cooling liquid on the back of the semiconductor chip. A semiconductor device according to claim 1.