JPH02188995A - Circuit board cooler - Google Patents
Circuit board coolerInfo
- Publication number
- JPH02188995A JPH02188995A JP931589A JP931589A JPH02188995A JP H02188995 A JPH02188995 A JP H02188995A JP 931589 A JP931589 A JP 931589A JP 931589 A JP931589 A JP 931589A JP H02188995 A JPH02188995 A JP H02188995A
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- cooling
- contact
- circuit
- plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000001816 cooling Methods 0.000 claims abstract description 26
- 239000000498 cooling water Substances 0.000 abstract description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 abstract description 3
- 239000004020 conductor Substances 0.000 description 3
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000002262 irrigation Effects 0.000 description 1
- 238000003973 irrigation Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000003014 reinforcing effect Effects 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 230000005619 thermoelectricity Effects 0.000 description 1
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
Description
【発明の詳細な説明】 〔産業上の利用分野〕 本発明は回路基板冷却装置に関する。[Detailed description of the invention] [Industrial application field] The present invention relates to a circuit board cooling device.
第５図は従来の回路基板冷却装置の断面図である。同図
において電気部品２は絶縁性の補強部材から成る熱伝導
性のケース９により密封され、熱伝導部材１０を介して
電気部品上部から熱を放出する形状となっており、冷却
プレート３ａは前記熱伝導ケース上面に密着するように
、回路基板１ｂを冷却プレート３ａに固定金具１１によ
って取付ける。FIG. 5 is a sectional view of a conventional circuit board cooling device. In the figure, the electrical component 2 is sealed by a thermally conductive case 9 made of an insulating reinforcing member, and has a shape that radiates heat from the upper part of the electrical component via the thermally conductive member 10. The circuit board 1b is attached to the cooling plate 3a with the fixing fittings 11 so as to be in close contact with the upper surface of the thermally conductive case.
上述した従来の回路基板冷却装置はＩＣ等の電気部品を
熱伝導部材から成る緩衝機構で密封し、冷却プレートを
前記部材の上面に密着させる構造である。The conventional circuit board cooling device described above has a structure in which electric components such as ICs are sealed with a buffer mechanism made of a thermally conductive member, and a cooling plate is brought into close contact with the upper surface of the member.
しかし、この構造では搭載部凸金てに対し密封処理を行
い、さらに冷却プレート表面に対して、各々レベリング
調整を行って密着させなければならないという欠点があ
る。However, this structure has the disadvantage that it is necessary to perform a sealing process on the mounting part convex metal and further perform leveling adjustment on the surface of the cooling plate to bring it into close contact.
本発明の回路基板冷却装置は、表と裏の両面に電気部品
を搭載した回路基板を冷却する回路基板冷却装置におい
て、前記回路基板の電気部品を搭載していない部分に接
触する面を含み冷却用水路を内蔵した熱伝導性部材より
成る冷却プレートを有し、前記回路基板の表と裏の両面
から前記冷却プレートで挟むようにして構成される。The circuit board cooling device of the present invention is a circuit board cooling device that cools a circuit board that has electrical components mounted on both the front and back surfaces, and includes a surface that contacts a portion of the circuit board that is not mounted with electrical components. It has a cooling plate made of a thermally conductive member with built-in irrigation channels, and is configured to be sandwiched between the cooling plates from both the front and back sides of the circuit board.
次に、本発明について図面を参照して説明する。 Next, the present invention will be explained with reference to the drawings.
第１図は本発明の第一の実施例の断面図である。FIG. 1 is a sectional view of a first embodiment of the invention.
同図において回路基板１は電気部品２を両面に搭載して
いる。冷却プレート３は回路基板１の表と裏に接触面が
密着するように固定されており、さらに冷却プレート３
には給水口４および排水口５がとり付けており、これら
はプレート内部で冷却用水路により接続されている。In the figure, a circuit board 1 has electrical components 2 mounted on both sides. The cooling plate 3 is fixed to the front and back sides of the circuit board 1 so that its contact surfaces are in close contact with each other.
A water supply port 4 and a drain port 5 are attached to the plate, and these are connected by a cooling water channel inside the plate.
電気部品２は回路基板１の内部パターンにより相互に接
続され回路を形成しており、回路動作時に発生する熱は
接触している回路基板面より放出され、冷却プレート３
を介して冷却水に放出される。The electrical components 2 are interconnected by internal patterns of the circuit board 1 to form a circuit, and the heat generated during circuit operation is released from the circuit board surface in contact with the cooling plate 3.
is discharged into the cooling water via the
第２図は本発明の第二の実施例の断面図であり、回路基
板１の電気部品搭載面に熱電導バッド６を設けている。FIG. 2 is a sectional view of a second embodiment of the present invention, in which a thermally conductive pad 6 is provided on the electrical component mounting surface of the circuit board 1.
これに電気部品２を密着して搭載する事により、さらに
効率よく電気部品の熱を基板に放出できる。By mounting the electrical component 2 closely on this, the heat of the electrical component can be released to the board more efficiently.
第３図は本発明の第三の実施例を示す断面図であり、さ
らに冷却プレート３が密着する回路基板面にも熱伝導バ
ッド６ａを設けている。これにより、基板に放出された
熱は冷却プレート３に効率良く放出される。FIG. 3 is a sectional view showing a third embodiment of the present invention, in which a heat conductive pad 6a is also provided on the circuit board surface to which the cooling plate 3 is in close contact. Thereby, the heat released to the substrate is efficiently released to the cooling plate 3.
第４図は本発明の第四の実施例を示す断面図であり、回
路基板１ａ内に熱伝導部材からなるパターン７およびス
ルーホール８を設は熱伝導部材を充填している。そして
これにより、部品搭載面の熱伝導バッド６と冷却プレー
トの密着面の熱伝導バッド６ａとを接続している。電気
部品からの熱は、回路基板１ａ自身よりも熱伝導部材か
らなるパターン７およびスルーホール８により、さらに
効率良く放出されるので、さらに多くの熱電を外部に放
出することができる。FIG. 4 is a sectional view showing a fourth embodiment of the present invention, in which a pattern 7 made of a thermally conductive material and a through hole 8 are provided in a circuit board 1a and filled with a thermally conductive material. This connects the heat conduction pad 6 on the component mounting surface and the heat conduction pad 6a on the contact surface of the cooling plate. Heat from the electrical components is radiated more efficiently by the pattern 7 and the through holes 8 made of the thermally conductive material than by the circuit board 1a itself, so that even more thermoelectricity can be radiated to the outside.
以上説明したように本発明は、回路基板を介して熱を放
出する事により、電気部品を熱伝導性のケースで密封し
冷却プレートと熱伝導性のケースとの密着を調整する必
要がない。As explained above, the present invention radiates heat through the circuit board, thereby eliminating the need to seal the electrical components with a thermally conductive case and adjust the close contact between the cooling plate and the thermally conductive case.
第１図は本発明の第一の実施例を示す断面図、第２図は
第二の実施例を示す断面図、第３図は第三の実施例を示
す断面図、第４図は第四の実施例を示す断面図、第５図
は従来の例を示す断面図である。
１．１ａ・・・回路基板、２・・・電気部品、３・・・
冷却プレート、４・・・給水口、５・・・排水口、６，
６ａ・・・熱伝導バッド、７・・・熱伝導パターン、８
・・・熱伝導スルーホール。FIG. 1 is a sectional view showing a first embodiment of the present invention, FIG. 2 is a sectional view showing a second embodiment, FIG. 3 is a sectional view showing a third embodiment, and FIG. 4 is a sectional view showing a third embodiment. FIG. 5 is a sectional view showing a conventional example. 1.1a...Circuit board, 2...Electrical component, 3...
Cooling plate, 4... Water supply port, 5... Drain port, 6,
6a...Heat conduction pad, 7...Heat conduction pattern, 8
...Heat conduction through hole.
Claims (1)
る回路基板冷却装置において、前記回路基板の電気部品
を搭載していない部分に接触する面を含み冷却用水路を
内蔵した熱伝導性部材より成る冷却プレートを有し、前
記回路基板の表と裏の両面から前記冷却プレートで挟む
ことを特徴とする回路基板冷却装置。In a circuit board cooling device that cools a circuit board that has electrical components mounted on both the front and back sides, a thermally conductive member that includes a surface that comes into contact with a portion of the circuit board that does not have electrical components mounted thereon and has a built-in cooling waterway. What is claimed is: 1. A circuit board cooling device characterized in that the circuit board is sandwiched between the cooling plates from both the front and back sides of the circuit board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP931589A JPH02188995A (en) | 1989-01-17 | 1989-01-17 | Circuit board cooler |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP931589A JPH02188995A (en) | 1989-01-17 | 1989-01-17 | Circuit board cooler |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02188995A true JPH02188995A (en) | 1990-07-25 |
Family
ID=11717037
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP931589A Pending JPH02188995A (en) | 1989-01-17 | 1989-01-17 | Circuit board cooler |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02188995A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6052284A (en) * | 1996-08-06 | 2000-04-18 | Advantest Corporation | Printed circuit board with electronic devices mounted thereon |
| JP2002504758A (en) * | 1998-02-23 | 2002-02-12 | アルストム・トランスポール・ソシエテ・アノニム | Cooling element for power electronics and power electronics including such element |
| KR100427525B1 (en) * | 2002-04-30 | 2004-04-28 | 위니아만도 주식회사 | The Assembling Structure for Heat-sink Assembly use PTC of Pre-heater |
-
1989
- 1989-01-17 JP JP931589A patent/JPH02188995A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6052284A (en) * | 1996-08-06 | 2000-04-18 | Advantest Corporation | Printed circuit board with electronic devices mounted thereon |
| JP2002504758A (en) * | 1998-02-23 | 2002-02-12 | アルストム・トランスポール・ソシエテ・アノニム | Cooling element for power electronics and power electronics including such element |
| KR100427525B1 (en) * | 2002-04-30 | 2004-04-28 | 위니아만도 주식회사 | The Assembling Structure for Heat-sink Assembly use PTC of Pre-heater |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP3949724B2 (en) | How to apply thermal grease to integrated circuits | |
| CN1984531A (en) | Allocation wiring structure of printing circuit board | |
| JPH02188995A (en) | Circuit board cooler | |
| JPH0846134A (en) | Semiconductor device | |
| JP2000338173A (en) | Ic cooler | |
| JPH10173371A (en) | Housing structure of electronic apparatus | |
| JPS5965457A (en) | Semiconductor device | |
| JPH02291160A (en) | Semiconductor device | |
| JP4469101B2 (en) | Electronic circuit device having heat dissipation structure | |
| JPH077109A (en) | Package mounting structure | |
| JPH0529502A (en) | Printed board | |
| JPH05160306A (en) | Heat radiation structure | |
| JPH02170593A (en) | Heat dissipating structure of ic | |
| JP2002158322A (en) | Semiconductor module | |
| JP2008226890A (en) | Electronic device | |
| JPH073187U (en) | Circuit board device | |
| JPS61133649A (en) | Semiconductor device | |
| JPH05327250A (en) | Heat radiating device for electronic equipment | |
| JP2007059535A (en) | Semiconductor module | |
| JPH06235568A (en) | Electronic refrigerating type cooling device | |
| JPH10340138A (en) | Electronic device | |
| JP2004158629A (en) | Shield case of electronic circuit | |
| JPH033352A (en) | Cooling structure for electronic parts | |
| JP2003197837A (en) | Semiconductor device for electric power | |
| JPH04256349A (en) | Cooling structure of board |