JPH06235568A - Electronic refrigerating type cooling device - Google Patents

Abstract

PURPOSE:To obtain an electronic refrigerating type cooling device which is used for an electronic devices such as LSI, and has an effective cooling function and a simple construction for assembling. CONSTITUTION:An electronic refrigerating type cooling device consists of a housing 4 where a substrate 2 loaded with electronic devices (heating components) 1 is attached on a side, a corrugated plate pressing spring member 5 which is installed on the inner face of the opposite side wall facing the package of the electronic devices 1, and an electronic cooling module 3 having an assembly of Peltier elements, which is put inside the housing 4 and placed between the electronic device 1 and the pressing spring member 5, and the heat absorbing face of the electronic cooling module 3 is brought in press- contact with the package of the electronic devices 1 by the force of the pressing spring member 5.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic refrigeration type cooling apparatus applied to an electronic device such as an LSI incorporated in a large computer or the like.

[0002]

2. Description of the Related Art Electronic devices such as LSIs in which a large number of semiconductor elements are integrated at high density generate a large amount of heat per unit area. Therefore, it is usually necessary to keep the junction temperature of the semiconductor elements within the rated range. I try to force cooling. Conventionally, air-cooling, liquid-cooling, boiling-cooling, etc. have been widely used as this cooling method. On the other hand, as a cooling method corresponding to the high density of LSI, an electronic refrigeration cooling method applying the Peltier effect is used. Application is considered,
Development of the concrete cooling device is in progress.

[0003]

By the way, in order to construct a cooling device by combining an electronic device such as an LSI with an electronic cooling module composed of a Peltier element, the electronic cooling module is loaded onto an LSI package which is a heat-generating component. In addition to pressure contact to ensure high heat transfer between the two, simple assembling in consideration of maintainability is required.

The present invention has been made in view of the above points, and an object of the present invention is to secure an effective cooling function as a cooling device applied to an electronic device such as an LSI and an electronic device having a simple assembly structure. It is to provide a refrigeration type cooling device.

[0005]

In order to achieve the above object, the electronic refrigerating type cooling device of the present invention is a heat generating component L.
A housing for mounting an electronic device such as SI mounted side by side on one side to enclose the electronic device, a pressing spring member mounted inside the opposite side wall surface of the housing facing the electronic device, and loaded in the housing. Then, the electronic cooling module is composed of an assembly of Peltier elements interposed between the package of the electronic device and the pressing spring member.

Further, as an embodiment of the above-mentioned structure, a corrugated plate spring is adopted as the pressing spring member, and an elastic fixing tool is provided between the mounting substrate of the electronic device and the mounting seat surface on the housing side facing the mounting substrate. There is a combined configuration.

[0007]

According to the above construction, the package of the electronic device (heating component) such as the LSI mounted on the substrate inside the housing and the heat absorbing surface of the electronic cooling module overlap each other, and the spring force of the pressing spring member is provided between them. Since the load is pressure-welded with, good heat conductivity is secured between the package of the electronic device and the heat absorbing surface of the electronic cooling module. Here, the electronic cooling module is configured by arranging a large number of Peltier elements connected in series in a plane, and when a current is passed through the Peltier element as is well known, a heat absorption action due to the Peltier effect occurs in the junction, It absorbs the heat generated by electronic devices. The heat absorbed by the electronic cooling module is radiated to the outside of the system via, for example, a heat pipe.

Further, the electronic cooling module is attachable / detachable to / from the housing and press-contacts with the package of the electronic device at the loading position. This makes it easy to assemble and maintain the cooling system.

[0009]

Embodiments of the present invention will be described below with reference to the drawings. First, FIG. 1 shows a block diagram of the entire apparatus. In the figure, 1 is an electronic device (heating component) such as LSI, 2 is a printed circuit board on which a plurality of electronic devices 1 are mounted, 3 is an electronic cooling module, 4 is a housing of a cooling device, and 5 is an inner wall surface of the housing 4. The attached pressing spring member, 6 is an elastic fixture for attaching the substrate 2 to the housing 4, and 7 is an attachment for the electronic cooling module 3.

Here, the housing 4 is a box-shaped container whose upper surface is open with one side cut out, and the cut-out side surface has an LS.
A substrate 2 on which I1 is mounted has the electronic device 1 attached to the inside of the housing, and a side wall opposite to the housing of the electronic device 1 facing the package is pressed by a corrugated leaf spring. The spring member 5 is attached.

FIG. 2 is a partially enlarged view of the housing 4 in FIG. 1, in which both ends of the substrate 2 and the mounting seat surfaces 4a of the housing 4 facing the both ends are each formed by processing a thin metal plate into a gutter-shaped convex shape. -Shaped elastic fixture 7 is attached,
The elastic fixtures 7 are butted against each other in a semi-lapped manner so that the substrate 2 is held at a fixed position in the housing 4. In addition, 8 is a retainer for fixing both ends of the pressing spring member 5 to the housing 4.

On the other hand, in the electronic cooling module 3, as shown in FIG. 3, a large number of Peltier elements 9 which are electrically connected in series and arranged in a plane are covered with a ceramic 10 having a high thermal conductivity to be integrally blocked. As shown in FIG. 1, the heat absorbing surface is loaded into the housing 4 from above toward the package of the electronic device 1 and is interposed between the package of the electronic device and the pressing spring member 5. It Also,
The U-shaped fittings 7 provided at both ends on the upper surface side of the electronic cooling module 3, and the convex elastic member similar to the elastic fixing member 7 described above on the outer surface of the housing 4 facing the tip of the fitting member 7. A fixture 10 is attached so that the electronic cooling module 3 is locked and fixed to the housing 4 at the loading position.

When the electronic cooling module 3 is loaded in the housing 4 with such a structure, the package of the electronic device 1 and the heat absorbing surface of the electronic cooling module 3 are pressed against each other by the spring force of the pressing spring member 5 so as to be in close contact with each other. At the same time, the elastic fixture 6 also acts to assist the load pressure contact by its elastic force.
This ensures high heat transfer between the package of the electronic device 1 and the electronic cooling module 3. And
In this assembled state, the Peltier element 9 of the electronic cooling module 3
When a current is applied to the Peltier effect, the Peltier element 9
An endothermic action occurs in the joint on one side, and the heat generated in the electronic device 1 is absorbed in the module 3. Although not shown, for example, a heat pipe is attached to the Peltier element 9 on the heat radiating surface side as a heat radiating means in a heat transfer manner.
The heat absorbed by the electronic cooling module 3 is radiated to the outside of the system via the heat pipe.

Further, the electronic cooling module 3 is locked and fixed at the loading position in the housing 4 via the elastic fixing tool 10 as described above, and the electronic cooling is performed by disengaging the elastic fixing tool 10. The module 3 can be easily pulled out from the housing 4.

[0015]

As described above, according to the configuration of the electronic refrigerating cooling device of the present invention, the electronic device (heating element) such as the LSI and the heat absorbing surface of the electronic cooling module are pressed by the pressing spring member inside the housing. The load is pressure-contacted via the, and a high heat transfer property is secured between the two. As a result, the heat generated by the electronic device can be taken away by the electronic cooling module by the endothermic action of the Peltier effect and can be effectively cooled. Moreover, the cooling device can be easily assembled by loading the electronic cooling module into the housing, and the electronic cooling module can be easily pulled out from the housing at the time of maintenance and inspection. To be

[Brief description of drawings]

FIG. 1 is an exploded perspective view showing an overall configuration of an embodiment of the present invention.

FIG. 2 is a partially enlarged plan view of the housing in FIG.

3 is a partial cross-sectional view of the electronic cooling module in FIG.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Electronic device (heat generating component) 2 Electronic device mounting substrate 3 Electronic cooling module 4 Housing 5 Pressing spring member 6 Elastic fixture 9 Peltier element

Claims (3)

[Claims] 1. An electronic refrigeration type cooling apparatus applied to an electronic device such as an LSI, wherein a substrate on which an electronic device as a heat-generating component is mounted is attached to one side surface, the housing encloses the electronic device, and the housing faces the electronic device. A pressure spring member mounted inside the opposite side wall surface of the housing, and an electronic cooling module comprising an assembly of Peltier elements mounted in the housing and interposed between the package of the electronic device and the pressure spring member. An electronic refrigeration type cooling device characterized in that 2. The electronic refrigeration type cooling device according to claim 1, wherein the pressing spring member is a corrugated leaf spring. 3. The electronic refrigeration system according to claim 1, wherein an electronic device mounting board and a housing-side mounting seat surface facing the electronic device mounting board are connected by an elastic fixture. Cooling device.