JPH02170593A - Heat dissipating structure of ic - Google Patents
Heat dissipating structure of icInfo
- Publication number
- JPH02170593A JPH02170593A JP63325283A JP32528388A JPH02170593A JP H02170593 A JPH02170593 A JP H02170593A JP 63325283 A JP63325283 A JP 63325283A JP 32528388 A JP32528388 A JP 32528388A JP H02170593 A JPH02170593 A JP H02170593A
- Authority
- JP
- Japan
- Prior art keywords
- shield case
- heat
- heat dissipation
- adhesive
- sheet
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000463 material Substances 0.000 claims abstract description 3
- 239000000853 adhesive Substances 0.000 claims description 17
- 230000001070 adhesive effect Effects 0.000 claims description 17
- 230000017525 heat dissipation Effects 0.000 claims description 15
- 230000006378 damage Effects 0.000 abstract description 5
- 239000007767 bonding agent Substances 0.000 abstract 2
- 230000000694 effects Effects 0.000 description 4
- 230000005855 radiation Effects 0.000 description 4
- 230000007257 malfunction Effects 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- 229910000679 solder Inorganic materials 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Abstract
Description
【発明の詳細な説明】
［産業上の利用分野］
本発明は、シールドケースによりシールドを施したＩＣ
における放熱構造に関するものである。[Detailed Description of the Invention] [Industrial Application Field] The present invention provides an IC shielded by a shield case.
The present invention relates to a heat dissipation structure.
［従来の技術］
従来、ＩＣのシールドは、第６図に示すように、薄い導
電性を有する部材を成形して作られた下面に開口を有す
る箱型のシールドケース１３を基板１２に突き当ててＩ
ＣＩＩにかぶせ、さらに、シールドケース１３をグラン
ドパターン１４に半田１５で電気的に接続する構造が一
般的である。[Prior Art] Conventionally, as shown in FIG. 6, an IC shield is made by pressing a box-shaped shield case 13, which is made by molding a thin conductive member and has an opening on the lower surface, against a substrate 12. I
A common structure is to cover the CII and further electrically connect the shield case 13 to the ground pattern 14 with solder 15.
［発明が解決しようとす゛る課題］
第６図に示した従来のＩＣのシールド手段は、ＩＣＩ
１のシールドには大きな効果がある。しかし、ＩＣＩＩ
をシールドケース１３で囲んでしまうため、ＩＣＩ １
からの放熱の主要な手段であるＩＣＩＩの周辺の空気の
対流による放熱を妨げている。[Problems to be Solved by the Invention] The conventional IC shielding means shown in FIG.
1 shield has a great effect. However, ICII
is surrounded by shield case 13, so ICI 1
This prevents heat radiation by convection of the air around the ICII, which is the main means of heat radiation from the ICII.
そのため、ＩＣ１１を連続動作させると、ＩＣＩＩが高
熱源となってシールドケース１３内が高温となり、ｒｃ
ｔｔあるいはこれとともにシールドケース１３内に納め
られた部品１６の誤動作や破壊を引き起こすという問題
点があった。Therefore, when the IC 11 is operated continuously, the IC II becomes a high heat source and the inside of the shield case 13 becomes high temperature.
There is a problem in that this may cause malfunction or destruction of the component 16 housed in the shield case 13.
本発明は、このような問題点を解決しようとするもので
ある。すなわち、本発明は、シールドケース内のＩＣの
放熱が良好であって、シールドケース内のＩＣの熱によ
るＩＣおよび部品の誤動作や破損を防止することができ
るＩＣの放熱構造を提供することを目的とするものであ
る。The present invention attempts to solve these problems. That is, an object of the present invention is to provide an IC heat dissipation structure that has good heat dissipation from the IC inside the shield case and can prevent malfunction or damage to the IC and its components due to the heat of the IC inside the shield case. That is.
［課題を解決するための手段］
上記目的を達成するために、本発明は、シールドケース
によってシールドされたＩＣにおいて、前記シールドケ
ースの内面が該ＩＣの上面と近接するように形成され、
かつ、前記シールドケースの内面と該ＩＣの上面との間
に設けられて該ＩＣから前記シールドケースに放熱を可
能にした熱伝導性の良好な物質からなる放熱手段を備え
ているものとした。[Means for Solving the Problems] In order to achieve the above object, the present invention provides an IC shielded by a shield case, in which the inner surface of the shield case is formed in close proximity to the upper surface of the IC,
Further, a heat dissipation means made of a material with good thermal conductivity is provided between the inner surface of the shield case and the upper surface of the IC and allows heat to be dissipated from the IC to the shield case.
［作 用］
本発明によれば、シールドケースの内面が放熱を必要と
するＩＣの上面に近接する形状に成形されており、前記
シールドケースの内面と該ＩＣの上面の間に、電気的な
導通は無く、熱伝導性に優れた接着剤または熱伝導性に
優れたシート等が充てんあるいは挟み込まれているので
、ＩＣパッケージの熱をその接着剤またはシート等を介
して前記シールドケースに伝え、つまり、前記シールド
ケースを放熱板として利用することで、該ＩＣの放熱性
が改善される。[Function] According to the present invention, the inner surface of the shield case is formed in a shape close to the upper surface of an IC that requires heat radiation, and there is an electrical connection between the inner surface of the shield case and the upper surface of the IC. There is no electrical conduction, and an adhesive with excellent thermal conductivity or a sheet with excellent thermal conductivity is filled or sandwiched, so the heat of the IC package is transmitted to the shield case via the adhesive or sheet, etc. That is, by using the shield case as a heat sink, the heat dissipation performance of the IC is improved.
［実 施 例］
第１図ないし第５図は、本発明の第１実施例ないし第５
実施例を示している。[Embodiment] Figures 1 to 5 show the first to fifth embodiments of the present invention.
An example is shown.
第１図ないし第５図において、１は放熱を必要とするＩ
Ｃ，２は該ＩＣＩおよびシールドケース３の実装される
基板である。また４は熱を伝えるための熱伝導性の良好
な接着剤あるいはシートで、ＩＣＩの上面と、これに近
接するように形成されたシールドケース３の近接部３ａ
の下面の間に密着して設けられている。５は半田、６は
該ＩＣＩとともにシールドケース３内に実装された部品
、７はグランドパターンである。In Figures 1 to 5, 1 indicates I which requires heat dissipation.
C, 2 is a board on which the ICI and shield case 3 are mounted. Further, 4 is an adhesive or sheet with good thermal conductivity for transmitting heat, and is attached to the upper surface of the ICI and the adjacent portion 3a of the shield case 3 formed in proximity to this.
It is placed in close contact between the lower surfaces of the. 5 is solder, 6 is a component mounted in the shield case 3 together with the ICI, and 7 is a ground pattern.
上記構成において、ＩＣＩを連続動作させると、ＩＣＩ
が発熱し、その熱は接着剤あるいはシート４を介してシ
ールドケース３に伝えられ、シールドケース３が放熱板
の役目をはたして放熱が行なわれる。In the above configuration, when ICI is operated continuously, ICI
generates heat, and the heat is transferred to the shield case 3 via the adhesive or sheet 4, and the shield case 3 functions as a heat sink to radiate the heat.
したがって、シールドケース３内のＩＣＩの放熱が良好
に行なわれるので、シールドケース３内のＩＣＩの熱に
よるＩＣ１および部品６の誤動作や破損を避けることが
できる。Therefore, the heat of the ICI inside the shield case 3 is well radiated, so that malfunction or damage to the IC 1 and the components 6 due to the heat of the ICI inside the shield case 3 can be avoided.
第２図では、接着剤４のＩＣＩの上面からリード部分へ
の流れを抑制するため、シールドケース３の近接部３ａ
の周辺下方に突出した流れ止め用の突出部３ｂを設けて
いる。In FIG. 2, in order to suppress the flow of the adhesive 4 from the upper surface of the ICI to the lead part, the adjacent part 3a of the shield case 3 is
A protrusion 3b for preventing the flow of water is provided that protrudes downward around the periphery.
第３図では、接着剤４のＩＣＩの上面からの流れ出し、
あるいは接着剤４の硬化時の収縮の逃げ、またはＩＣＩ
とシールドケース３の実装後の接着剤４の充てんを目的
とする穴３ｃをシールドケース３の近接部３ａに設けて
いる。In FIG. 3, the adhesive 4 flows out from the top surface of the ICI,
Or escape of shrinkage when adhesive 4 cures, or ICI
A hole 3c for filling with adhesive 4 after the shield case 3 is mounted is provided in the proximal portion 3a of the shield case 3.
３４４図では、シールドケース３の近接部３ａとＩＣＩ
の上面の接着剤４を介しての接触を、より確実とするた
めに、ＩＣＩの上面に接するシールドケース３の一部に
、ばね性を有するばね部３ｄを設け、ＩＣＩをおさえ込
んで実装するようにしている。この実施例においては、
接着剤４の硬化時の収縮でＩＣＩがシールドケース３に
よって引張り上げられ、リード半田付は部がストレスを
受け、電気的接続の不良を起すことがないようにしであ
る。In Figure 344, the proximal portion 3a of the shield case 3 and the ICI
In order to ensure more reliable contact via the adhesive 4 on the top surface, a spring portion 3d having spring properties is provided in a part of the shield case 3 that is in contact with the top surface of the ICI, and the ICI is held down and mounted. That's what I do. In this example,
This is to prevent the ICI from being pulled up by the shield case 3 due to shrinkage of the adhesive 4 when it hardens, and the lead soldering portion being subjected to stress and causing electrical connection failure.
第５図では、ＩＣ１の上面とシールドケース３の近接部
３ａの間に接着剤またはシート４を設けているほか、Ｉ
ＣＩの直下と基板２の間にも、接着剤またはシート４を
設け、ｔＣｔから基板２への放熱により、ＩＣＩの放熱
効果を高めるようにしている。In FIG. 5, an adhesive or sheet 4 is provided between the upper surface of the IC 1 and the proximal portion 3a of the shield case 3, and
An adhesive or sheet 4 is also provided directly under the CI and between the substrate 2, and the heat dissipation effect of the ICI is enhanced by dissipating heat from tCt to the substrate 2.
［発明の効果コ
以上説明したように、本発明によれば、シールドケース
の内面が放熱を必要とするＩＣの上面に近接する形状に
形成されており、前記シールドケースの内面と該ＩＣの
上面の間に、熱伝導性の良好な接着剤あるいは熱伝導性
の良好なシート等が充てんあるいは挟み込まれているの
で、該ＩＣからの発生熱をその接着剤またはシート等を
介して前記シールドケースに伝え、該ＩＣの発熱による
該ＩＣおよび部品の誤動作や破損を防止することができ
る。しかも、放熱のための特別な部材を設けることなく
、接着剤の塗布またはシートの貼り付けなどの簡単な作
業のみにより、低コストで放熱効果を高めることが可能
となる。[Effects of the Invention] As explained above, according to the present invention, the inner surface of the shield case is formed in a shape close to the upper surface of an IC that requires heat radiation, and the inner surface of the shield case and the upper surface of the IC Since an adhesive with good thermal conductivity or a sheet with good thermal conductivity is filled or sandwiched in between, the heat generated from the IC is transferred to the shield case through the adhesive or sheet. It is possible to prevent the IC and its components from malfunctioning or being damaged due to heat generated by the IC. Moreover, the heat dissipation effect can be enhanced at low cost by simply applying an adhesive or pasting a sheet without providing any special member for heat dissipation.
第１図は本発明の第１実施例を示した断面正面図、第２
図は同じく第２実施例を示した断面正面図、第３図は同
じく第３実施例を示した断面正面図、第４図は同じく第
４実施例を示した断面正面図、第５図は同じく第５実施
例を示した断面正面図、第６図は従来の技術の一例を示
した断面正面図である。
１・・・ＩＣ２・・・基板
３・・・シールドケース ３ａ・・・近接部３ｂ・・・
突出部 ３ｃ・・・穴３ｄ・・・ばね部
４・・・接着剤またはシート５・・・半１）
６・・・部品７・・・グランドパターン
他４名FIG. 1 is a cross-sectional front view showing the first embodiment of the present invention, and the second embodiment is a cross-sectional front view showing the first embodiment of the present invention.
The figure is a sectional front view showing the second embodiment, FIG. 3 is a sectional front view showing the third embodiment, FIG. 4 is a sectional front view showing the fourth embodiment, and FIG. Similarly, FIG. 6 is a cross-sectional front view showing the fifth embodiment, and FIG. 6 is a cross-sectional front view showing an example of the conventional technology. 1...IC2...Board 3...Shield case 3a...Proximity part 3b...
Projection part 3c...hole 3d...spring part
4...Adhesive or sheet 5...Half 1)
6...Parts 7...Ground pattern and 4 others
Claims (1)
て、前記シールドケースの内面が該ＩＣの上面と近接す
るように形成され、かつ、前記シールドケースの内面と
該ＩＣの上面との間に設けられて該ＩＣから前記シール
ドケースに放熱を可能にした熱伝導性の良好な物質から
なる放熱手段を備えていることを特徴とするＩＣの放熱
構造。 ２ 放熱手段が接着剤からなる請求項１記載のＩＣの放
熱構造。 ３ 放熱手段がシールドケースの内面とＩＣの上面との
間に挟み込まれたシートからなる請求項１記載のＩＣの
放熱構造。[Claims] 1. In an IC shielded by a shield case, the inner surface of the shield case is formed in close proximity to the upper surface of the IC, and there is a space between the inner surface of the shield case and the upper surface of the IC. 1. A heat dissipation structure for an IC, comprising a heat dissipation means made of a material having good thermal conductivity and capable of dissipating heat from the IC to the shield case. 2. The IC heat dissipation structure according to claim 1, wherein the heat dissipation means is made of an adhesive. 3. The IC heat dissipation structure according to claim 1, wherein the heat dissipation means comprises a sheet sandwiched between the inner surface of the shield case and the upper surface of the IC.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63325283A JPH02170593A (en) | 1988-12-23 | 1988-12-23 | Heat dissipating structure of ic |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63325283A JPH02170593A (en) | 1988-12-23 | 1988-12-23 | Heat dissipating structure of ic |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02170593A true JPH02170593A (en) | 1990-07-02 |
Family
ID=18175085
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP63325283A Pending JPH02170593A (en) | 1988-12-23 | 1988-12-23 | Heat dissipating structure of ic |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02170593A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100298166B1 (en) * | 1996-12-27 | 2001-08-07 | 가타오카 마사타카 | Radiating structure for electronic components |
| JP2014057066A (en) * | 2012-09-11 | 2014-03-27 | Lsis Co Ltd | Coupling assembly of power element and pcb and manufacturing method of the same |
| US10405468B2 (en) | 2017-06-08 | 2019-09-03 | Toshiba Client Solutions CO., LTD. | Shield case and electronic device |
-
1988
- 1988-12-23 JP JP63325283A patent/JPH02170593A/en active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100298166B1 (en) * | 1996-12-27 | 2001-08-07 | 가타오카 마사타카 | Radiating structure for electronic components |
| JP2014057066A (en) * | 2012-09-11 | 2014-03-27 | Lsis Co Ltd | Coupling assembly of power element and pcb and manufacturing method of the same |
| US9165856B2 (en) | 2012-09-11 | 2015-10-20 | Lsis Co., Ltd. | Coupling assembly of power semiconductor device and PCB and method for manufacturing the same |
| US10405468B2 (en) | 2017-06-08 | 2019-09-03 | Toshiba Client Solutions CO., LTD. | Shield case and electronic device |
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