JPH0430491A - Composite substrate - Google Patents
Composite substrateInfo
- Publication number
- JPH0430491A JPH0430491A JP13585790A JP13585790A JPH0430491A JP H0430491 A JPH0430491 A JP H0430491A JP 13585790 A JP13585790 A JP 13585790A JP 13585790 A JP13585790 A JP 13585790A JP H0430491 A JPH0430491 A JP H0430491A
- Authority
- JP
- Japan
- Prior art keywords
- hole
- conductor
- board
- solder
- metal plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000002131 composite material Substances 0.000 title claims abstract description 20
- 239000000758 substrate Substances 0.000 title claims description 14
- 239000004020 conductor Substances 0.000 claims abstract description 40
- 229910052751 metal Inorganic materials 0.000 claims abstract description 33
- 239000002184 metal Substances 0.000 claims abstract description 33
- 229910000679 solder Inorganic materials 0.000 claims abstract description 24
- 239000000463 material Substances 0.000 claims abstract description 9
- 230000017525 heat dissipation Effects 0.000 claims description 8
- 239000011347 resin Substances 0.000 claims description 4
- 229920005989 resin Polymers 0.000 claims description 4
- 230000000694 effects Effects 0.000 abstract description 14
- 238000007747 plating Methods 0.000 abstract description 4
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 abstract description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 abstract 2
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 abstract 1
- 238000001704 evaporation Methods 0.000 abstract 1
- 230000002452 interceptive effect Effects 0.000 abstract 1
- 238000000034 method Methods 0.000 abstract 1
- 229910052759 nickel Inorganic materials 0.000 abstract 1
- 239000010410 layer Substances 0.000 description 11
- 230000002093 peripheral effect Effects 0.000 description 6
- 238000010079 rubber tapping Methods 0.000 description 6
- 238000005476 soldering Methods 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 239000000155 melt Substances 0.000 description 2
- 230000005855 radiation Effects 0.000 description 2
- 229910000976 Electrical steel Inorganic materials 0.000 description 1
- 229910018487 Ni—Cr Inorganic materials 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 239000012790 adhesive layer Substances 0.000 description 1
- VNNRSPGTAMTISX-UHFFFAOYSA-N chromium nickel Chemical compound [Cr].[Ni] VNNRSPGTAMTISX-UHFFFAOYSA-N 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
Landscapes
- Insulated Metal Substrates For Printed Circuits (AREA)
- Combinations Of Printed Boards (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
この発明は、放熱又は電磁シールド効果などを得るため
に金属板にフレキシブル基板を接着などにより貼り合わ
せてなる複合基板に関するものである。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a composite board made by bonding a flexible board to a metal plate by adhesive or the like in order to obtain heat radiation or electromagnetic shielding effects.
第４図は従来例の複合基板を示す断面図であり、図にお
いて、１は従来例の複合基板、２は放熱性又は導電性を
有するけい素鋼や鉄などからなる金属板、３はこの金属
板２上に接着剤などにより貼着されたフレキシブル基板
であり、４はこのフレキシブル基板３のベースを構成し
ポリイミドなどからなる樹脂層、５はフレキシブル基板
３の樹脂層４上にエツチングなどにより形成された銅な
どからなる導体である。６は上記金属板２に設けられた
タッピング穴、７はこのタッピング穴に対向しフレキシ
ブル基板３にパンチング加工などにより設けられた透孔
である。８は放熱性を有するか電気的な良導体材料から
なる座金、９はこの座金８と同様に放熱性を有するか電
気的な良導体材料からなり座金８に嵌挿しタッピング穴
６に取付けられたネジである。FIG. 4 is a cross-sectional view showing a conventional composite board. In the figure, 1 is a conventional composite board, 2 is a metal plate made of silicon steel or iron having heat dissipation or conductivity, and 3 is this metal plate. A flexible substrate is attached to a metal plate 2 with an adhesive or the like, and 4 constitutes the base of the flexible substrate 3 and is a resin layer made of polyimide or the like. It is a conductor made of copper or the like. Reference numeral 6 indicates a tapping hole provided in the metal plate 2, and reference numeral 7 indicates a through hole provided in the flexible substrate 3 by punching or the like, facing the tapping hole. 8 is a washer made of a material that has heat dissipation properties or is a good electrical conductor, and 9 is a screw that is made of a material that has heat dissipation properties or is a good electrical conductor similarly to this washer 8 and is inserted into the washer 8 and attached to the tapping hole 6. be.
以上のように構成されているので、フレキシブル基板３
上の導体５と金属板２は座金８及びネジ９を介して熱的
又は電気的に接続され、例えば導体５に周囲の取付電子
部品（図示せず）からの発熱があっても、その熱は金属
板２に放熱発散させることができる。又、導体５を電気
的アースとすれば、金属板２はシールド効果を奏し、複
合基板１と外部電磁系との間の電磁干渉を防止すること
ができる。With the above configuration, the flexible substrate 3
The upper conductor 5 and the metal plate 2 are thermally or electrically connected via a washer 8 and a screw 9. For example, even if the conductor 5 generates heat from surrounding electronic components (not shown), the heat will be removed. The metal plate 2 can radiate and dissipate heat. In addition, if the conductor 5 is used as an electrical ground, the metal plate 2 has a shielding effect and can prevent electromagnetic interference between the composite board 1 and an external electromagnetic system.
しかし、この従来例の複合基板は、フレキシブル基板３
に透孔７を設けるだけではなく、透孔７に対向して金属
板２にタッピング穴６を加工し、座金８、ネジ９を取付
けることが必要で、材料費や加工費が多くかかるという
問題点があった。However, in this conventional composite board, the flexible board 3
In addition to providing the through hole 7 in the metal plate 2, it is necessary to machine a tapping hole 6 in the metal plate 2 opposite the through hole 7, and to attach a washer 8 and a screw 9, which results in high material and processing costs. There was a point.
この発明は上記のような問題点を解消するためになされ
たもので、加工費、材料費共に安価で、信顆性の高い複
合基板を得ることを目的とする。This invention was made to solve the above-mentioned problems, and aims to obtain a composite substrate with high reliability and low processing and material costs.
この発明に係る複合基板は、金属板上に貼着したフレキ
シブル基板に透孔を設け、このフレキシブル基板の導体
と金属板とを、上記透孔部にはんだを充填溶融すること
により、放熱又は電磁シールド効果を得るようにしたも
のである。The composite board according to the present invention has a through hole in a flexible board stuck on a metal plate, and connects the conductor of the flexible board and the metal plate by filling solder in the through hole and melting the heat dissipation or electromagnetic It is designed to have a shield effect.
また請求項２の発明に係る複合基板は、上記フレキシブ
ル基板の透孔部に導体のスルーホールを設け、このスル
ーホールにはんだを充填溶融するようにしたものである
。Further, in the composite board according to the second aspect of the present invention, a conductor through-hole is provided in the through-hole portion of the flexible board, and the through-hole is filled with solder and melted.
この発明においては、金属板にタッピング穴を加工した
り、ネジや座金を用いないで、放熱又は電磁シールド効
果を達成し得る。In this invention, heat dissipation or electromagnetic shielding effects can be achieved without forming tapping holes in a metal plate or using screws or washers.
第１図はこの発明の一実施例を示す断面図であり、図に
おいて、１０は金属板２の表面にメツキや蒸着法などに
より錫やニッケルクロムなどのはんだ付性の良い材料を
形成してなるはんだ付接合層、Ｉｔはこのはんだ付接合
層１０に接しフレキシブル基板３の透孔７と周囲の導体
５に充填溶融してなるはＸ７だである。FIG. 1 is a sectional view showing an embodiment of the present invention. In the figure, 10 is a metal plate 2 having a material having good solderability such as tin or nickel chromium formed on the surface by plating or vapor deposition. The soldering bonding layer It is in contact with the soldering bonding layer 10 and is filled and melted into the through hole 7 of the flexible substrate 3 and the surrounding conductor 5, and is formed by X7.
以上のような構成においては、フレキシブル基板３上の
導体５と金属板２ははんだ１１及びはんだ付接合層ＩＯ
を介して熱的又は電気的に接続され、従来例の複合基板
と同様、導体５に周囲の取付は電子部品（図示せず）か
らの発熱があってもその熱は金属板２に放熱発散させる
ことができる。又、導体５を電気的アースとすれば、金
属板２はシールド効果を奏し、複合基板１と外部電磁系
との間の電磁干渉を防止することができる。In the above configuration, the conductor 5 on the flexible substrate 3 and the metal plate 2 are connected to the solder 11 and the solder bonding layer IO.
As with conventional composite boards, even if heat is generated from electronic components (not shown) around the conductor 5, the heat is radiated and dissipated to the metal plate 2. can be done. In addition, if the conductor 5 is used as an electrical ground, the metal plate 2 has a shielding effect and can prevent electromagnetic interference between the composite board 1 and an external electromagnetic system.
なお、はんだ付接合層１０は、導体５と金属板２とのは
んだ付性が余り良くない場合に金属板２上にメツキなど
により形成するもので、これはなくても同様の効果を奏
する。Note that the soldering bonding layer 10 is formed by plating or the like on the metal plate 2 when the solderability between the conductor 5 and the metal plate 2 is not very good, and the same effect can be obtained even without this.
ところで上記実施例において、はんだ１１を充填しては
んだ付けする際、はんだ１１は透孔７の周囲平面部及び
周囲端面の導体５には溶融付着するが、透孔７の周囲端
面の樹脂層４及び接合層１０には溶融付着しに＜＜、従
って第２図のように該端面にはんだ１１が存在しないは
んだ欠落部を生じ、金属板２に対するはんだ１１の接触
面積が十分にとれず、時によっては、接触面積が全くＯ
になったり、はんだ１１が導体５と金属板２との間で分
断離散することが生じ易い、従って、導体５と金属板２
との熱的又は電気的な接合による放熱及び電磁シールド
が不完全になるおそれがある。By the way, in the above embodiment, when filling the solder 11 and soldering, the solder 11 melts and adheres to the conductor 5 on the peripheral plane part and the peripheral end surface of the through hole 7, but the solder 11 melts and adheres to the conductor 5 on the peripheral end surface of the through hole 7. And the bonding layer 10 is melted and adhered to <<. Therefore, as shown in FIG. 2, there is a solder missing part where the solder 11 does not exist on the end face, and the contact area of the solder 11 with the metal plate 2 is not sufficient, and sometimes In some cases, the contact area is completely O.
or the solder 11 is likely to be separated and dispersed between the conductor 5 and the metal plate 2. Therefore, the conductor 5 and the metal plate 2
Heat dissipation and electromagnetic shielding due to thermal or electrical bonding may become incomplete.
以上のような問題を解決するため、第３図の実施例にお
いては、上記フレキシブル基板３の透孔７の部分に、銅
などの導電性を有する材料でメツキ法などにより導体の
スルーホール１２を形成したものである。このような導
体スルーホール１２を有するフレキシブル基板３とはん
だ接合層１０を付着形成した金属板２とが、接着層１３
により接着されている。In order to solve the above problems, in the embodiment shown in FIG. 3, conductor through holes 12 are formed in the through holes 7 of the flexible substrate 3 by plating with a conductive material such as copper. It was formed. The flexible substrate 3 having such a conductor through hole 12 and the metal plate 2 on which the solder bonding layer 10 is attached are connected to the adhesive layer 13.
It is glued by.
このように構成されているので、フレキシブル基板３上
の導体５と金属板２は、スルーホール１２及びはんだ１
１、はんだ接合層ＩＯを介して熱的または電気的に接続
され、導体５の周囲の取付電子部品（図示なし）からの
発熱があっても、その熱は金属板２に放熱発散させるこ
とができるとともに、透孔７の周囲端面の樹脂層４によ
ってはんだ１１が欠落部を生じたり、導体５と金属板２
との間で分断離散するようなことも生じにくいものとな
る。With this configuration, the conductor 5 on the flexible substrate 3 and the metal plate 2 are connected to the through hole 12 and the solder 1.
1. Even if there is heat generated from electronic components (not shown) attached around the conductor 5 that are thermally or electrically connected via the solder bonding layer IO, the heat can be radiated and dissipated to the metal plate 2. At the same time, the resin layer 4 on the peripheral end surface of the through hole 7 may cause missing parts of the solder 11, and the conductor 5 and the metal plate 2 may be damaged.
It is also less likely that the system will become separated and dispersed between the two.
以上のようにこの発明によれば、フレキシブル基板に透
孔を設け、この透孔部にはんだを充填溶融することによ
り放熱シールド効果を得るようにしたので、従来例の複
合基板のように金属板にタッピング六を設けたり、ネジ
や座金を使用せずにすみ、材料費、加工費共に安価な複
合基板が得られる効果がある。As described above, according to the present invention, a through hole is provided in a flexible substrate, and the through hole is filled with solder and melted to obtain a heat radiation shielding effect. There is no need to provide a tapping hex or use screws or washers, and there is an effect that a composite board can be obtained with low material costs and processing costs.
また請求項２の発明によれば、透孔部に導体のスルーホ
ールを設け、透孔の周囲平面部及び周囲端面の導体やス
ルーホールの内壁面と透孔に対向するはんだ接合層がほ
ぼ連続的な位置関係になることにより、導体と金属板と
の熱的又は電気的な接合による信頼性の高い放熱及び電
磁シールド効果が得られる。According to the invention of claim 2, a conductor through-hole is provided in the through-hole part, and the conductor on the peripheral plane part and peripheral end surface of the through-hole, the inner wall surface of the through-hole, and the solder bonding layer facing the through-hole are substantially continuous. With this positional relationship, highly reliable heat dissipation and electromagnetic shielding effects can be obtained through thermal or electrical bonding between the conductor and the metal plate.
第１図、第２図はこの発明の一実施例を示す断面図、第
３図はこの発明の他の実施例を示す断面図、第４図は従
来例の複合基板を示す断面図である。
図中、１は複合基板、２は金属板、３はフレキシブル基
板、４は樹脂層、５は導体、７は透孔、１１ははんだ、
１２は導体スルーホールである。
なお、図中同一符号は同−又は相当部分を示す。1 and 2 are cross-sectional views showing one embodiment of the present invention, FIG. 3 is a cross-sectional view showing another embodiment of the present invention, and FIG. 4 is a cross-sectional view showing a conventional composite substrate. . In the figure, 1 is a composite board, 2 is a metal plate, 3 is a flexible board, 4 is a resin layer, 5 is a conductor, 7 is a through hole, 11 is solder,
12 is a conductor through hole. Note that the same reference numerals in the figures indicate the same or equivalent parts.
Claims (2)
上に貼着されベースの樹脂層に導体を形成してなるフレ
キシブル基板とを有する複合基板において、上記フレキ
シブル基板に透孔を設けるとともに、この透孔の周囲の
一部又は全部が上記導体と接するようにし、該透孔に対
向した金属板の部分に接して上記透孔と透孔周囲にある
導体にはんだなど放熱性又は導電性を有する材料を充填
溶融して熱的又は電気的に接合したことを特徴とする複
合基板。(1) In a composite board having a metal plate having heat dissipation or conductivity, and a flexible board formed by adhering to the metal plate and forming a conductor in a base resin layer, a through hole is provided in the flexible board. At the same time, part or all of the periphery of the through hole is in contact with the conductor, and the through hole and the conductor around the through hole are in contact with the part of the metal plate facing the through hole, and solder or other heat dissipating or conductive material is applied to the through hole and the conductor around the through hole. 1. A composite substrate characterized by being filled with a material having properties, melted and thermally or electrically bonded.
ルーホールを設けたことを特徴とする請求項１記載の複
合基板。(2) The composite board according to claim 1, wherein a conductor through hole is provided around the through hole of the flexible board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13585790A JPH0430491A (en) | 1990-05-25 | 1990-05-25 | Composite substrate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13585790A JPH0430491A (en) | 1990-05-25 | 1990-05-25 | Composite substrate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0430491A true JPH0430491A (en) | 1992-02-03 |
Family
ID=15161395
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13585790A Pending JPH0430491A (en) | 1990-05-25 | 1990-05-25 | Composite substrate |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0430491A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0638225A1 (en) * | 1993-03-01 | 1995-02-15 | Motorola, Inc. | Feedthrough via connection method and apparatus |
| EP1376778A3 (en) * | 2002-06-25 | 2007-01-03 | Motorola, Inc. | Ground connector assembly with substrate strain relief and method of making the same |
| JP2010051046A (en) * | 2008-08-19 | 2010-03-04 | Panasonic Corp | Brushless motor |
| JP2012069816A (en) * | 2010-09-24 | 2012-04-05 | Ain:Kk | Wiring board using aluminum composite material |
| WO2015050111A1 (en) * | 2013-10-01 | 2015-04-09 | 株式会社フジクラ | Wiring board assembly and method for producing same |
-
1990
- 1990-05-25 JP JP13585790A patent/JPH0430491A/en active Pending
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0638225A1 (en) * | 1993-03-01 | 1995-02-15 | Motorola, Inc. | Feedthrough via connection method and apparatus |
| EP0638225A4 (en) * | 1993-03-01 | 1995-08-30 | Motorola Inc | Feedthrough via connection method and apparatus. |
| EP1376778A3 (en) * | 2002-06-25 | 2007-01-03 | Motorola, Inc. | Ground connector assembly with substrate strain relief and method of making the same |
| JP2010051046A (en) * | 2008-08-19 | 2010-03-04 | Panasonic Corp | Brushless motor |
| JP2012069816A (en) * | 2010-09-24 | 2012-04-05 | Ain:Kk | Wiring board using aluminum composite material |
| WO2015050111A1 (en) * | 2013-10-01 | 2015-04-09 | 株式会社フジクラ | Wiring board assembly and method for producing same |
| US10237971B2 (en) | 2013-10-01 | 2019-03-19 | Fujikura Ltd. | Wiring board assembly and method for producing same |
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