CN217037764U - Fan-free heat dissipation type explosion-proof information terminal - Google Patents

Abstract

The utility model provides a no fan heat dissipation type explosion-proof information-based terminal, including the procapsid, set up the intraoral screen subassembly of casing window in the front, back cap, still including setting up in the procapsid, the control panel subassembly in the explosion-proof cavity between screen subassembly and the back cap, the control panel subassembly includes the high heat conduction mounting bracket of making by high heat conduction material, fix the control mainboard on high heat conduction mounting bracket, at least one electronic element that generates heat has on the control mainboard, at least one electronic element that generates heat contacts high heat conduction mounting bracket, procapsid and/or back cap and high heat conduction mounting bracket looks surface contact and fixed connection. The utility model provides a fanless heat dissipation type explosion-proof informatization terminal, wherein the heat dissipation adopts a fanless heat dissipation structure, a heating electronic element is in contact with a high heat conduction mounting rack, so that the heat on the heating electronic element is transferred to a front shell or a rear shell cover through the high heat conduction mounting rack, and a large area of shell heat dissipation space realizes a good heat dissipation effect on the heating electronic element.

Description

Fan-free heat dissipation type explosion-proof information terminal

Technical Field

The utility model relates to a fanless heat dissipation type explosion-proof informatization terminal.

Background

Based on the informatization popularization of dangerous places such as oil fields, chemical industry, ocean platforms, biological pharmacy and the like, the demand of explosion-proof informatization products is more and more, and the configuration is higher and higher. Due to the continuous upgrading of product configuration, the self heat productivity of the product becomes a problem which needs to be solved by the explosion-proof information terminal product. Traditional heat dissipation scheme adopts the fan to carry out the part and sweeps, can only make the heat circulate inside explosion-proof product, and the heat is inside the explosion-proof product to be conducted the back through the air, dispels the heat by the shell again. For some elements with large heat productivity, air with lower heat conductivity coefficient can not effectively conduct heat, and the cooling efficiency is poorer, so that the elements can not work normally. At present, the cooling requirement of the heating electronic element of the explosion-proof informatization terminal and the closed requirement of an explosion-proof product become contradiction points.

SUMMERY OF THE UTILITY MODEL

The utility model aims to provide a fan-free heat dissipation type explosion-proof informatization terminal.

In order to solve the technical problems, the technical scheme adopted by the utility model is as follows: the utility model provides a no fan heat dissipation type explosion-proof information-based terminal, is in including procapsid, setting screen subassembly, back cap in the procapsid window, still including setting up the control panel subassembly in the flame proof cavity between procapsid, screen subassembly and back cap, the control panel subassembly includes the high heat conduction mounting bracket of making by high heat conduction material, fixes control mainboard on the high heat conduction mounting bracket, at least one heating electronic component has on the control mainboard, at least one heating electronic component contacts high heat conduction mounting bracket, the procapsid with/or back cap with high heat conduction mounting bracket looks surface contact and fixed connection.

In some embodiments, the control motherboard has a front surface on which electronic components are mounted, and the heat-generating electronic components are chips mounted on a back surface of the control motherboard.

In some embodiments, the high thermal conductivity mounting rack includes a high thermal conductivity mounting plate for fixing the control motherboard through a bracket, and a high thermal conductivity pad fixed on the high thermal conductivity mounting plate, and two side surfaces of the high thermal conductivity pad are clamped between the high thermal conductivity mounting plate and the chip in a contact manner.

In some embodiments, a thermal silicone layer is coated between the high thermal conductivity pad and the chip.

In some embodiments, the front housing and the rear housing cover are also made of a highly thermally conductive material.

In some embodiments, the front housing includes a front housing wall, a front housing panel frame formed by extending a front edge portion of the front housing wall toward a center, the front housing panel frame forming the front housing window therein, the high thermal conductivity mounting plate includes a high thermal conductivity center plate located in a middle portion, and a heat dissipating pressure foot edge formed by folding back at least two opposite side edges of the high thermal conductivity center plate forward and extending laterally outward, the heat dissipating pressure foot edge being secured to an inner wall of the front housing panel frame in a face contact press fit.

In some embodiments, the front shell panel frame is provided with a step groove, the screen assembly comprises a touch screen and explosion-proof tempered glass which are sequentially encapsulated in the step groove from front to back, and the screen assembly further comprises a liquid crystal display screen arranged on the rear side of the explosion-proof tempered glass, and the heat dissipation presser foot edge is simultaneously pressed on the explosion-proof tempered glass and the inner wall of the front shell panel frame in a surface contact manner.

The scope of the present invention is not limited to the specific combinations of the above-described features, and other embodiments in which the above-described features or their equivalents are arbitrarily combined are also intended to be encompassed. For example, the above features and the technical features (but not limited to) having similar functions disclosed in this application are replaced with each other to form the technical solution.

Due to the application of the technical scheme, compared with the prior art, the utility model has the following advantages: the utility model provides a fanless heat dissipation type explosion-proof informatization terminal, wherein the heat dissipation adopts a fanless heat dissipation structure, a heating electronic element is in contact with a high heat conduction mounting rack, so that the heat on the heating electronic element is transferred to a front shell or a rear shell cover through the high heat conduction mounting rack, and a large area of shell heat dissipation space realizes a good heat dissipation effect on the heating electronic element.

Drawings

FIG. 1 is a front view of a fanless heat dissipation type explosion-proof information terminal;

fig. 2 is a rear view (with a rear cover removed) of the fanless heat dissipation type explosion-proof information terminal;

FIG. 3 is a cross-sectional view A-A of FIG. 1;

wherein, 1, a front shell; 2. a screen assembly; 3. a control board assembly; 4. a rear shell cover; 5. an explosion-proof cavity; 11. a front housing enclosure wall; 12. a front shell panel frame; 21. a touch screen; 22. explosion-proof toughened glass; 23. a liquid crystal display screen; 31. a control main board; 311. a chip; 32. a high thermal conductivity mounting frame; 321. a high thermal conductivity mounting plate; 322. a high thermal conductivity cushion block; 323. the heat dissipation presser foot limit.

Detailed Description

The fanless heat dissipation type explosion-proof informatization terminal shown in each drawing comprises a front shell 1, a screen assembly 2 arranged in a window of the front shell 1, a rear shell cover 4 and a control panel assembly 3.

After current casing 1 and back cap 4 seal installation, just form confined flame proof cavity 5 between procapsid 1, back cap 4 and the 2 three of screen subassembly, control panel subassembly 3 sets up in this flame proof cavity.

The control board assembly 3 includes a control main board 31, and the control main board 31 has at least one heat generating electronic component, and the heat generating electronic component with a large heat generation amount is mainly a chip or the like in order to realize information transmission and exchange of the information terminal. To mainly address the heat dissipation of the chip, the control board assembly 3 further includes a high thermal conductive mounting frame 32 made of a high thermal conductive material. The control main board 31 is fixed on the high thermal conductive mounting bracket 32, and the heat generating electronic components on the control main board 31 transmit heat to the front case 1 by directly contacting or indirectly contacting the high thermal conductive mounting bracket 32 through a thermal conductive silicone layer. The front case 1 and the rear case cover 4 are also made of a highly heat conductive material.

The high heat conduction material is preferably made of copper, iron, aluminum or aluminum alloy and other materials which have no strong magnetism and high strength and are suitable for explosion-proof occasions.

In detail, as shown in fig. 3, the control motherboard 31 has a front surface for mounting electronic components, and the electronic components are usually fixed on the front surface of the control motherboard PCB, but in this embodiment, in order to facilitate the contact and cooperation between the flat chip 311 and the high thermal conductivity mounting frame 32, the chip is mounted on the back surface of the control motherboard 31 for sufficient heat dissipation. The high thermal conductivity mounting frame 32 comprises a high thermal conductivity mounting plate 321 and a high thermal conductivity cushion block 322 fixed on the high thermal conductivity mounting plate 321, and the control main board 31 is fixed on the high thermal conductivity mounting plate 321 through a bracket and covers the high thermal conductivity cushion block 322. Two side surfaces of the high thermal conductive pad 322 are clamped between the high thermal conductive mounting plate 321 and the chip 311 in a contact manner, and a thermal conductive silicone grease layer is coated between the high thermal conductive pad 322 and the chip 311 to eliminate a fine gap. The high heat-conducting cushion blocks 322 on the high heat-conducting mounting plate 321 are in surface contact with each other and are fixed through screws.

Preceding casing 1 includes preceding casing leg 11, extends the preceding casing panel frame 12 that forms to the direction of the centre by the preceding circle limit portion of preceding casing leg 11, forms 1 window of preceding casing in the preceding casing panel frame 12, and the screen subassembly encapsulation is in preceding casing panel frame 12 window promptly. The front shell panel frame 12 is provided with a step groove, and the screen assembly 2 comprises a touch screen 21 and an explosion-proof toughened glass 22 which are positioned in the step groove and encapsulated in the steps groove from front to back through explosion-proof surfaces, glue filling and other modes, and further comprises a liquid crystal display screen 23 arranged on the rear side of the explosion-proof toughened glass 22. The control main board 31 is connected with the flat cable of the touch screen 21 through the safety grid, and the signal is changed into a safety signal after being subjected to voltage limiting and current limiting processing of the safety grid.

As shown in fig. 2 and 3, the high thermal conductive mounting plate 321 includes a central high thermal conductive plate located in the middle, and a heat dissipating presser foot edge 323 formed by folding the periphery of the central high thermal conductive plate forward and extending laterally outward, wherein the heat dissipating presser foot edge 323 is pressed on the explosion-proof tempered glass 22 and the inner wall of the front shell panel frame 12 in a surface contact manner.

The embodiment provides a fan-free heat dissipation type explosion-proof information terminal, which is a fan-free heat dissipation structure, and the heat of a heating electronic element is quickly transferred to a front shell through a main heating electronic element chip passing through a high heat conduction mounting plate 321, a high heat conduction cushion block 322 and a heat dissipation presser foot edge 323, so that a good heat dissipation effect on the chip is realized in a large-area shell heat dissipation space.

The above embodiments are only for illustrating the technical idea and features of the present invention, and the purpose of the present invention is to enable those skilled in the art to understand the content of the present invention and implement the present invention, and not to limit the protection scope of the present invention by this means. All equivalent changes and modifications made according to the spirit of the present invention should be covered in the protection scope of the present invention.

Claims (7)

1. The utility model provides a no fan heat dissipation type explosion-proof information-based terminal, is in including procapsid (1), setting screen subassembly (2), back cap (4) in procapsid (1) window, still including setting up control panel subassembly (3) in flame proof cavity (5) between procapsid (1), screen subassembly (2) and back cap (4), its characterized in that: the control panel assembly (3) comprises a high-heat-conduction mounting frame (32) made of high-heat-conduction materials and a control main board (31) fixed on the high-heat-conduction mounting frame (32), at least one heating electronic element is arranged on the control main board (31) and contacts with the high-heat-conduction mounting frame (32), and the front shell body (1) and/or the rear shell cover (4) are in surface contact with and fixedly connected with the high-heat-conduction mounting frame (32).

2. The fanless heat dissipation type explosion-proof information terminal according to claim 1, characterized in that: the control main board (31) is provided with a front surface for mounting electronic elements, and the heating electronic elements are chips (311) which are mounted on the back surface of the control main board (31).

3. The fanless heat dissipation type explosion-proof information terminal according to claim 2, characterized in that: the high-heat-conductivity mounting frame (32) comprises a high-heat-conductivity mounting plate (321) for fixing the control main board (31) through a support and a high-heat-conductivity cushion block (322) fixed on the high-heat-conductivity mounting plate (321), and two side faces of the high-heat-conductivity cushion block (322) are clamped between the high-heat-conductivity mounting plate (321) and the chip (311) in a contact manner.

4. The fanless heat dissipation type explosion-proof information terminal according to claim 3, characterized in that: and a heat-conducting silicone grease layer is coated between the high heat-conducting cushion block (322) and the chip (311).

5. The fanless heat dissipation type explosion-proof information terminal according to claim 3, characterized in that: the front housing (1) and the rear housing cover (4) are also made of a highly heat conductive material.

6. The fanless heat dissipation type explosion-proof information terminal according to claim 3, characterized in that: the front shell (1) comprises a front shell surrounding wall (11) and a front shell panel frame (12) formed by extending the front ring edge part of the front shell surrounding wall (11) to the center direction, a window of the front shell (1) is formed in the front shell panel frame (12), the high heat conduction mounting plate (321) comprises a high heat conduction central plate positioned in the middle, and heat dissipation presser foot edges (323) formed by folding at least two opposite side edges of the high heat conduction central plate forwards and then extending outwards in the transverse direction, and the heat dissipation presser foot edges (323) are fixedly arranged on the inner wall of the front shell panel frame (12) in a face contact pressing mode.

7. The fanless heat dissipation type explosion-proof information terminal according to claim 6, wherein: the explosion-proof tempered glass screen is characterized in that a step groove is formed in the front shell panel frame (12), the screen assembly (2) comprises a touch screen (21) and explosion-proof tempered glass (22) which are located in the step groove and sequentially encapsulated from front to back, and further comprises a liquid crystal display screen (23) arranged on the rear side of the explosion-proof tempered glass (22), and the heat dissipation presser foot edge (323) is arranged on the inner wall of the front shell panel frame (12) in a surface contact manner.

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