JPH0427317B2 - - Google Patents

Info

Publication number
JPH0427317B2
JPH0427317B2 JP25998884A JP25998884A JPH0427317B2 JP H0427317 B2 JPH0427317 B2 JP H0427317B2 JP 25998884 A JP25998884 A JP 25998884A JP 25998884 A JP25998884 A JP 25998884A JP H0427317 B2 JPH0427317 B2 JP H0427317B2
Authority
JP
Japan
Prior art keywords
band
plating
hole
shaped
pin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP25998884A
Other languages
English (en)
Japanese (ja)
Other versions
JPS61139671A (ja
Inventor
Kenji Yamamoto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NIPPON EREKUTOROPUREITEINGU ENJINYAAZU KK
Original Assignee
NIPPON EREKUTOROPUREITEINGU ENJINYAAZU KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NIPPON EREKUTOROPUREITEINGU ENJINYAAZU KK filed Critical NIPPON EREKUTOROPUREITEINGU ENJINYAAZU KK
Priority to JP25998884A priority Critical patent/JPS61139671A/ja
Publication of JPS61139671A publication Critical patent/JPS61139671A/ja
Publication of JPH0427317B2 publication Critical patent/JPH0427317B2/ja
Granted legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/02—Electroplating of selected surface areas
    • C25D5/022—Electroplating of selected surface areas using masking means

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemically Coating (AREA)
  • Electroplating Methods And Accessories (AREA)
JP25998884A 1984-12-11 1984-12-11 部分メツキ用の回転ホイ−ル装置 Granted JPS61139671A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP25998884A JPS61139671A (ja) 1984-12-11 1984-12-11 部分メツキ用の回転ホイ−ル装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP25998884A JPS61139671A (ja) 1984-12-11 1984-12-11 部分メツキ用の回転ホイ−ル装置

Publications (2)

Publication Number Publication Date
JPS61139671A JPS61139671A (ja) 1986-06-26
JPH0427317B2 true JPH0427317B2 (enExample) 1992-05-11

Family

ID=17341719

Family Applications (1)

Application Number Title Priority Date Filing Date
JP25998884A Granted JPS61139671A (ja) 1984-12-11 1984-12-11 部分メツキ用の回転ホイ−ル装置

Country Status (1)

Country Link
JP (1) JPS61139671A (enExample)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03219084A (ja) * 1989-11-15 1991-09-26 Fuji Plant Kogyo Kk 部分メッキ用シール材、その製造方法、および部分メッキ方法
JP5914083B2 (ja) * 2011-10-19 2016-05-11 Ｄｏｗａメタルテック株式会社 部分めっき装置及び部分めっき方法

Also Published As

Publication number Publication date
JPS61139671A (ja) 1986-06-26

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