JPH0427177Y2 - - Google Patents
Info
- Publication number
- JPH0427177Y2 JPH0427177Y2 JP1986102017U JP10201786U JPH0427177Y2 JP H0427177 Y2 JPH0427177 Y2 JP H0427177Y2 JP 1986102017 U JP1986102017 U JP 1986102017U JP 10201786 U JP10201786 U JP 10201786U JP H0427177 Y2 JPH0427177 Y2 JP H0427177Y2
- Authority
- JP
- Japan
- Prior art keywords
- resin
- optical semiconductor
- lens
- pedestal
- molded optical
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000004065 semiconductor Substances 0.000 claims description 55
- 230000003287 optical effect Effects 0.000 claims description 41
- 239000011347 resin Substances 0.000 claims description 40
- 229920005989 resin Polymers 0.000 claims description 40
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical group C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 claims description 28
- 238000007789 sealing Methods 0.000 claims description 2
- 230000000694 effects Effects 0.000 description 6
- 230000005540 biological transmission Effects 0.000 description 3
- 238000004806 packaging method and process Methods 0.000 description 3
- JBRZTFJDHDCESZ-UHFFFAOYSA-N AsGa Chemical compound [As]#[Ga] JBRZTFJDHDCESZ-UHFFFAOYSA-N 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 238000005266 casting Methods 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
Classifications
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
- G11B33/00—Constructional parts, details or accessories not provided for in the other groups of this subclass
- G11B33/12—Disposition of constructional parts in the apparatus, e.g. of power supply, of modules
- G11B33/125—Disposition of constructional parts in the apparatus, e.g. of power supply, of modules the apparatus comprising a plurality of recording/reproducing devices, e.g. modular arrangements, arrays of disc drives
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1986102017U JPH0427177Y2 (fr) | 1986-07-04 | 1986-07-04 | |
US08/305,777 USRE35713E (en) | 1986-07-04 | 1994-09-14 | Disc recording and/or reproducing apparatus |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1986102017U JPH0427177Y2 (fr) | 1986-07-04 | 1986-07-04 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS639165U JPS639165U (fr) | 1988-01-21 |
JPH0427177Y2 true JPH0427177Y2 (fr) | 1992-06-30 |
Family
ID=30973280
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1986102017U Expired JPH0427177Y2 (fr) | 1986-07-04 | 1986-07-04 |
Country Status (2)
Country | Link |
---|---|
US (1) | USRE35713E (fr) |
JP (1) | JPH0427177Y2 (fr) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5748404A (en) * | 1995-09-18 | 1998-05-05 | Alps Electric Co., Ltd. | Magnetic recording/reproducing device with chassis support structure |
JP3659635B2 (ja) * | 2001-04-10 | 2005-06-15 | 株式会社東芝 | 光半導体装置 |
JP2008258414A (ja) * | 2007-04-05 | 2008-10-23 | Rohm Co Ltd | 半導体パッケージ |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4367502A (en) * | 1980-04-11 | 1983-01-04 | Shugart Technology | Fixed hard disc drive assembly and clean air system |
JPS59177760A (ja) * | 1983-03-28 | 1984-10-08 | Toshiba Corp | 磁気デイスク装置 |
US4754397A (en) * | 1985-02-15 | 1988-06-28 | Tandem Computers Incorporated | Fault tolerant modular subsystems for computers |
-
1986
- 1986-07-04 JP JP1986102017U patent/JPH0427177Y2/ja not_active Expired
-
1994
- 1994-09-14 US US08/305,777 patent/USRE35713E/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
JPS639165U (fr) | 1988-01-21 |
USRE35713E (en) | 1998-01-13 |
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