JPH0426957B2 - - Google Patents

Info

Publication number
JPH0426957B2
JPH0426957B2 JP58072558A JP7255883A JPH0426957B2 JP H0426957 B2 JPH0426957 B2 JP H0426957B2 JP 58072558 A JP58072558 A JP 58072558A JP 7255883 A JP7255883 A JP 7255883A JP H0426957 B2 JPH0426957 B2 JP H0426957B2
Authority
JP
Japan
Prior art keywords
workpiece
groove
laser
atmosphere
laser beam
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP58072558A
Other languages
English (en)
Japanese (ja)
Other versions
JPS59197391A (ja
Inventor
Shunpei Yamazaki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Semiconductor Energy Laboratory Co Ltd
Original Assignee
Semiconductor Energy Laboratory Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Semiconductor Energy Laboratory Co Ltd filed Critical Semiconductor Energy Laboratory Co Ltd
Priority to JP58072558A priority Critical patent/JPS59197391A/ja
Publication of JPS59197391A publication Critical patent/JPS59197391A/ja
Publication of JPH0426957B2 publication Critical patent/JPH0426957B2/ja
Granted legal-status Critical Current

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/12Working by laser beam, e.g. welding, cutting or boring in a special atmosphere, e.g. in an enclosure
    • B23K26/127Working by laser beam, e.g. welding, cutting or boring in a special atmosphere, e.g. in an enclosure in an enclosure
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/12Working by laser beam, e.g. welding, cutting or boring in a special atmosphere, e.g. in an enclosure
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36Removing material
    • B23K26/362Laser etching
    • B23K26/364Laser etching for making a groove or trench, e.g. for scribing a break initiation groove

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)
  • Photovoltaic Devices (AREA)
JP58072558A 1983-04-25 1983-04-25 レ−ザ加工方法 Granted JPS59197391A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP58072558A JPS59197391A (ja) 1983-04-25 1983-04-25 レ−ザ加工方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58072558A JPS59197391A (ja) 1983-04-25 1983-04-25 レ−ザ加工方法

Publications (2)

Publication Number Publication Date
JPS59197391A JPS59197391A (ja) 1984-11-08
JPH0426957B2 true JPH0426957B2 (enExample) 1992-05-08

Family

ID=13492803

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58072558A Granted JPS59197391A (ja) 1983-04-25 1983-04-25 レ−ザ加工方法

Country Status (1)

Country Link
JP (1) JPS59197391A (enExample)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
AUPN736195A0 (en) * 1995-12-29 1996-01-25 Pacific Solar Pty Limited Improved laser grooving method

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5582780A (en) * 1978-12-16 1980-06-21 Toshiba Corp Surface processing method for metal or the like article

Also Published As

Publication number Publication date
JPS59197391A (ja) 1984-11-08

Similar Documents

Publication Publication Date Title
JP3633622B2 (ja) レーザエッチング方法
US20110259417A1 (en) Film removal method, photoelectric conversion device fabrication method, photoelectric conversion device, and film removal device
CN108247208A (zh) 激光标刻装置及其标刻方法
JPH034319B2 (enExample)
JPH0426957B2 (enExample)
CN113146061A (zh) 双光束蚀刻大幅面导电薄膜的激光加工装置及其方法
JPH0514432B2 (enExample)
JPH10303444A (ja) 太陽電池の製造方法
JPH06326337A (ja) レーザ加工装置
JPH0123237B2 (enExample)
JP2008023547A (ja) 薄膜除去方法及び薄膜除去装置
JPS59198771A (ja) 光電変換装置作製方法
JPS6153731A (ja) 紫外線によるエツチング方法及び装置
JPS59206195A (ja) レ−ザ加工方法
CN215034520U (zh) 双光束蚀刻大幅面导电薄膜的激光加工装置
JPS6037288A (ja) レーザ加工方法
JPS6037283A (ja) レ−ザ加工方法
JPH0353727B2 (enExample)
JPS59193782A (ja) レ−ザ加工機
JP2594113B2 (ja) 酸化錫膜の形成方法
JPS5898933A (ja) 半導体装置の製造方法
JPS6066872A (ja) 半導体装置作製方法
JPH01149978A (ja) 薄膜の加工方法
JPS6082286A (ja) レ−ザ加工方法
JPS60103622A (ja) レ−ザ加工方法