JPH0426957B2 - - Google Patents
Info
- Publication number
- JPH0426957B2 JPH0426957B2 JP58072558A JP7255883A JPH0426957B2 JP H0426957 B2 JPH0426957 B2 JP H0426957B2 JP 58072558 A JP58072558 A JP 58072558A JP 7255883 A JP7255883 A JP 7255883A JP H0426957 B2 JPH0426957 B2 JP H0426957B2
- Authority
- JP
- Japan
- Prior art keywords
- workpiece
- groove
- laser
- atmosphere
- laser beam
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/12—Working by laser beam, e.g. welding, cutting or boring in a special atmosphere, e.g. in an enclosure
- B23K26/127—Working by laser beam, e.g. welding, cutting or boring in a special atmosphere, e.g. in an enclosure in an enclosure
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/12—Working by laser beam, e.g. welding, cutting or boring in a special atmosphere, e.g. in an enclosure
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/362—Laser etching
- B23K26/364—Laser etching for making a groove or trench, e.g. for scribing a break initiation groove
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Laser Beam Processing (AREA)
- Photovoltaic Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58072558A JPS59197391A (ja) | 1983-04-25 | 1983-04-25 | レ−ザ加工方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58072558A JPS59197391A (ja) | 1983-04-25 | 1983-04-25 | レ−ザ加工方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS59197391A JPS59197391A (ja) | 1984-11-08 |
| JPH0426957B2 true JPH0426957B2 (enExample) | 1992-05-08 |
Family
ID=13492803
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP58072558A Granted JPS59197391A (ja) | 1983-04-25 | 1983-04-25 | レ−ザ加工方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS59197391A (enExample) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| AUPN736195A0 (en) * | 1995-12-29 | 1996-01-25 | Pacific Solar Pty Limited | Improved laser grooving method |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5582780A (en) * | 1978-12-16 | 1980-06-21 | Toshiba Corp | Surface processing method for metal or the like article |
-
1983
- 1983-04-25 JP JP58072558A patent/JPS59197391A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS59197391A (ja) | 1984-11-08 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP3633622B2 (ja) | レーザエッチング方法 | |
| US20110259417A1 (en) | Film removal method, photoelectric conversion device fabrication method, photoelectric conversion device, and film removal device | |
| CN108247208A (zh) | 激光标刻装置及其标刻方法 | |
| JPH034319B2 (enExample) | ||
| JPH0426957B2 (enExample) | ||
| CN113146061A (zh) | 双光束蚀刻大幅面导电薄膜的激光加工装置及其方法 | |
| JPH0514432B2 (enExample) | ||
| JPH10303444A (ja) | 太陽電池の製造方法 | |
| JPH06326337A (ja) | レーザ加工装置 | |
| JPH0123237B2 (enExample) | ||
| JP2008023547A (ja) | 薄膜除去方法及び薄膜除去装置 | |
| JPS59198771A (ja) | 光電変換装置作製方法 | |
| JPS6153731A (ja) | 紫外線によるエツチング方法及び装置 | |
| JPS59206195A (ja) | レ−ザ加工方法 | |
| CN215034520U (zh) | 双光束蚀刻大幅面导电薄膜的激光加工装置 | |
| JPS6037288A (ja) | レーザ加工方法 | |
| JPS6037283A (ja) | レ−ザ加工方法 | |
| JPH0353727B2 (enExample) | ||
| JPS59193782A (ja) | レ−ザ加工機 | |
| JP2594113B2 (ja) | 酸化錫膜の形成方法 | |
| JPS5898933A (ja) | 半導体装置の製造方法 | |
| JPS6066872A (ja) | 半導体装置作製方法 | |
| JPH01149978A (ja) | 薄膜の加工方法 | |
| JPS6082286A (ja) | レ−ザ加工方法 | |
| JPS60103622A (ja) | レ−ザ加工方法 |