JPH0123237B2 - - Google Patents

Info

Publication number
JPH0123237B2
JPH0123237B2 JP58149081A JP14908183A JPH0123237B2 JP H0123237 B2 JPH0123237 B2 JP H0123237B2 JP 58149081 A JP58149081 A JP 58149081A JP 14908183 A JP14908183 A JP 14908183A JP H0123237 B2 JPH0123237 B2 JP H0123237B2
Authority
JP
Japan
Prior art keywords
laser
open groove
lcs
present
groove
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP58149081A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6040683A (ja
Inventor
Shunpei Yamazaki
Kenji Ito
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Semiconductor Energy Laboratory Co Ltd
Original Assignee
Semiconductor Energy Laboratory Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Semiconductor Energy Laboratory Co Ltd filed Critical Semiconductor Energy Laboratory Co Ltd
Priority to JP58149081A priority Critical patent/JPS6040683A/ja
Publication of JPS6040683A publication Critical patent/JPS6040683A/ja
Publication of JPH0123237B2 publication Critical patent/JPH0123237B2/ja
Granted legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/14—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor
    • B23K26/1462—Nozzles; Features related to nozzles
    • B23K26/1464—Supply to, or discharge from, nozzles of media, e.g. gas, powder, wire
    • B23K26/1476—Features inside the nozzle for feeding the fluid stream through the nozzle
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/14—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/362—Laser etching
    • B23K26/364—Laser etching for making a groove or trench, e.g. for scribing a break initiation groove

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)
  • Element Separation (AREA)
JP58149081A 1983-08-15 1983-08-15 レ−ザ加工方法 Granted JPS6040683A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP58149081A JPS6040683A (ja) 1983-08-15 1983-08-15 レ−ザ加工方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58149081A JPS6040683A (ja) 1983-08-15 1983-08-15 レ−ザ加工方法

Publications (2)

Publication Number Publication Date
JPS6040683A JPS6040683A (ja) 1985-03-04
JPH0123237B2 true JPH0123237B2 (enExample) 1989-05-01

Family

ID=15467276

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58149081A Granted JPS6040683A (ja) 1983-08-15 1983-08-15 レ−ザ加工方法

Country Status (1)

Country Link
JP (1) JPS6040683A (enExample)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3917698B2 (ja) 1996-12-12 2007-05-23 株式会社半導体エネルギー研究所 レーザーアニール方法およびレーザーアニール装置

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59191587A (ja) * 1983-04-13 1984-10-30 Inoue Japax Res Inc レ−ザ加工装置

Also Published As

Publication number Publication date
JPS6040683A (ja) 1985-03-04

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