JPH042669B2 - - Google Patents

Info

Publication number
JPH042669B2
JPH042669B2 JP24218886A JP24218886A JPH042669B2 JP H042669 B2 JPH042669 B2 JP H042669B2 JP 24218886 A JP24218886 A JP 24218886A JP 24218886 A JP24218886 A JP 24218886A JP H042669 B2 JPH042669 B2 JP H042669B2
Authority
JP
Japan
Prior art keywords
metal layer
display device
transparent conductive
indium tin
deposition
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP24218886A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6294887A (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=6283676&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=JPH042669(B2) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed filed Critical
Publication of JPS6294887A publication Critical patent/JPS6294887A/ja
Publication of JPH042669B2 publication Critical patent/JPH042669B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing of the conductive pattern
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1633—Process of electroless plating
    • C23C18/1646—Characteristics of the product obtained
    • C23C18/165—Multilayered product
    • C23C18/1651—Two or more layers only obtained by electroless plating
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/1851—Pretreatment of the material to be coated of surfaces of non-metallic or semiconducting in organic material
    • C23C18/1872—Pretreatment of the material to be coated of surfaces of non-metallic or semiconducting in organic material by chemical pretreatment
    • C23C18/1875—Pretreatment of the material to be coated of surfaces of non-metallic or semiconducting in organic material by chemical pretreatment only one step pretreatment
    • C23C18/1882—Use of organic or inorganic compounds other than metals, e.g. activation, sensitisation with polymers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/032—Materials
    • H05K2201/0326—Inorganic, non-metallic conductor, e.g. indium-tin oxide [ITO]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0347—Overplating, e.g. for reinforcing conductors or bumps; Plating over filled vias

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Manufacturing & Machinery (AREA)
  • Inorganic Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Liquid Crystal (AREA)
  • Chemically Coating (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Manufacturing Of Electric Cables (AREA)
  • Non-Insulated Conductors (AREA)
JP61242188A 1985-10-16 1986-10-14 透明導電路のメタライズ方法 Granted JPS6294887A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE19853536821 DE3536821A1 (de) 1985-10-16 1985-10-16 Verfahren zur herstellung einer stromlos abgeschiedenen, loetbaren metallschicht
DE3536821.7 1985-10-16

Publications (2)

Publication Number Publication Date
JPS6294887A JPS6294887A (ja) 1987-05-01
JPH042669B2 true JPH042669B2 (enExample) 1992-01-20

Family

ID=6283676

Family Applications (1)

Application Number Title Priority Date Filing Date
JP61242188A Granted JPS6294887A (ja) 1985-10-16 1986-10-14 透明導電路のメタライズ方法

Country Status (5)

Country Link
US (1) US4726965A (enExample)
EP (1) EP0220541B1 (enExample)
JP (1) JPS6294887A (enExample)
AT (1) ATE45394T1 (enExample)
DE (2) DE3536821A1 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20180080818A (ko) * 2017-01-05 2018-07-13 (주)아이앤지엔지니어링 건설기계용 스크린 버켓

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3705251A1 (de) * 1987-02-19 1988-09-01 Standard Elektrik Lorenz Ag Verfahren zur herstellung einer stromlos abgeschiedenen, loetbaren metallschicht
DE4035362A1 (de) * 1990-11-07 1992-05-14 Licentia Gmbh Verfahren zum herstellen einer fluessigkristall-anzeigevorrichtung
DE4220621A1 (de) * 1992-06-24 1994-01-05 Daimler Benz Ag Verfahren zum stromlos chemischen Erzeugen einer strukturierten Metallschicht
GB2283123B (en) * 1993-10-23 1997-10-22 Samsung Display Devices Co Ltd A method of forming an electrode for a liquid crystal display
JPH08167608A (ja) * 1994-12-15 1996-06-25 Furon Tec:Kk 配線構造および液晶素子
CN1060420C (zh) * 1997-04-18 2001-01-10 清华大学 电镀后性能可恢复的片式元件的端电极的制备方法
US6232144B1 (en) * 1997-06-30 2001-05-15 Littelfuse, Inc. Nickel barrier end termination and method
JP3955156B2 (ja) * 1998-08-31 2007-08-08 エルジー フィリップス エルシーディー カンパニー リミテッド 電子機器用構成基板と電子機器
DE19850592C1 (de) * 1998-11-03 2000-10-12 Lpkf Laser & Electronics Ag Haftvermittlerschicht zur Erzeugung haftfester Leiterstrukturen auf Isoliermaterialien der Elektronik
WO2008053464A2 (en) * 2006-11-01 2008-05-08 Bar-Ilan University Nickel-cobalt alloys as current collectors and conductive interconnects and deposition thereof on transparent conductive oxides

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4002778A (en) * 1973-08-15 1977-01-11 E. I. Du Pont De Nemours And Company Chemical plating process
DE2509912C3 (de) * 1975-03-07 1979-11-29 Robert Bosch Gmbh, 7000 Stuttgart Elektronische Dünnfilmschaltung
DE2807350C2 (de) * 1977-03-02 1983-01-13 Sharp K.K., Osaka Flüssigkristall-Anzeigevorrichtung in Baueinheit mit einem integrierten Schaltkreis
US4387116A (en) * 1981-12-28 1983-06-07 Exxon Research And Engineering Co. Conditioner for adherence of nickel to a tin oxide surface
NL8105922A (nl) * 1981-12-31 1983-07-18 Philips Nv Werkwijze voor het partieel metalliseren van elektrisch geleidende niet-metallische patronen.
US4666078A (en) * 1982-04-20 1987-05-19 Seiko Epson Kabushiki Kaisha Electroless plated terminals of display panel
DE3326253A1 (de) * 1983-07-21 1985-01-31 Licentia Patent-Verwaltungs-Gmbh, 6000 Frankfurt Verfahren zur metallisierung eines festen koerpers

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20180080818A (ko) * 2017-01-05 2018-07-13 (주)아이앤지엔지니어링 건설기계용 스크린 버켓

Also Published As

Publication number Publication date
DE3536821C2 (enExample) 1987-07-23
EP0220541B1 (de) 1989-08-09
ATE45394T1 (de) 1989-08-15
DE3536821A1 (de) 1987-04-16
DE3664932D1 (en) 1989-09-14
JPS6294887A (ja) 1987-05-01
EP0220541A1 (de) 1987-05-06
US4726965A (en) 1988-02-23

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