JPH0426549B2 - - Google Patents
Info
- Publication number
- JPH0426549B2 JPH0426549B2 JP60134842A JP13484285A JPH0426549B2 JP H0426549 B2 JPH0426549 B2 JP H0426549B2 JP 60134842 A JP60134842 A JP 60134842A JP 13484285 A JP13484285 A JP 13484285A JP H0426549 B2 JPH0426549 B2 JP H0426549B2
- Authority
- JP
- Japan
- Prior art keywords
- plate
- heat conduction
- cooling
- heat
- integrated circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000001816 cooling Methods 0.000 claims description 38
- 239000007788 liquid Substances 0.000 claims description 16
- 230000001629 suppression Effects 0.000 claims description 8
- 239000012530 fluid Substances 0.000 claims 1
- 239000003507 refrigerant Substances 0.000 claims 1
- 239000002826 coolant Substances 0.000 description 6
- 230000000694 effects Effects 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 230000005855 radiation Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/433—Auxiliary members in containers characterised by their shape, e.g. pistons
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
- H01L2023/4037—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink
- H01L2023/405—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink heatsink to package
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP60134842A JPS61292944A (ja) | 1985-06-20 | 1985-06-20 | 集積回路パツケ−ジの液体冷却構造 |
FR868608866A FR2583921B1 (fr) | 1985-06-20 | 1986-06-19 | Module de refroidissement par liquide de composants electroniques |
US06/876,381 US4693303A (en) | 1985-06-20 | 1986-06-19 | Liquid cooling module with springy contact elements and an aperture plate slidable thereover |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP60134842A JPS61292944A (ja) | 1985-06-20 | 1985-06-20 | 集積回路パツケ−ジの液体冷却構造 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS61292944A JPS61292944A (ja) | 1986-12-23 |
JPH0426549B2 true JPH0426549B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1992-05-07 |
Family
ID=15137738
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP60134842A Granted JPS61292944A (ja) | 1985-06-20 | 1985-06-20 | 集積回路パツケ−ジの液体冷却構造 |
Country Status (3)
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CA1303238C (en) * | 1988-05-09 | 1992-06-09 | Kazuhiko Umezawa | Flat cooling structure of integrated circuit |
US4882654A (en) * | 1988-12-22 | 1989-11-21 | Microelectronics And Computer Technology Corporation | Method and apparatus for adjustably mounting a heat exchanger for an electronic component |
US6665184B2 (en) | 2001-07-13 | 2003-12-16 | Lytron, Inc. | Tapered cold plate |
US7849914B2 (en) * | 2006-05-02 | 2010-12-14 | Clockspeed, Inc. | Cooling apparatus for microelectronic devices |
SG181180A1 (en) * | 2010-11-12 | 2012-06-28 | Semicaps Pte Ltd | Apparatus and method for cooling a semiconductor device |
WO2012131519A1 (en) | 2011-03-25 | 2012-10-04 | Koninklijke Philips Electronics N.V. | Thermal interface pad material with perforated liner |
US9917034B2 (en) | 2014-09-26 | 2018-03-13 | Semicaps Pte Ltd | Method and apparatus for cooling a semiconductor device |
JP7334433B2 (ja) * | 2019-03-19 | 2023-08-29 | 日本電気株式会社 | 放熱構造及び電子部品 |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4093971A (en) * | 1976-12-10 | 1978-06-06 | Burroughs Corporation | D-I-P On island |
US4226281A (en) * | 1979-06-11 | 1980-10-07 | International Business Machines Corporation | Thermal conduction module |
US4341432A (en) * | 1979-08-06 | 1982-07-27 | Cutchaw John M | Liquid cooled connector for integrated circuit packages |
US4381032A (en) * | 1981-04-23 | 1983-04-26 | Cutchaw John M | Apparatus for cooling high-density integrated circuit packages |
-
1985
- 1985-06-20 JP JP60134842A patent/JPS61292944A/ja active Granted
-
1986
- 1986-06-19 FR FR868608866A patent/FR2583921B1/fr not_active Expired
- 1986-06-19 US US06/876,381 patent/US4693303A/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
FR2583921A1 (fr) | 1986-12-26 |
FR2583921B1 (fr) | 1989-04-07 |
US4693303A (en) | 1987-09-15 |
JPS61292944A (ja) | 1986-12-23 |