JPH0461506B2 - - Google Patents

Info

Publication number
JPH0461506B2
JPH0461506B2 JP25757285A JP25757285A JPH0461506B2 JP H0461506 B2 JPH0461506 B2 JP H0461506B2 JP 25757285 A JP25757285 A JP 25757285A JP 25757285 A JP25757285 A JP 25757285A JP H0461506 B2 JPH0461506 B2 JP H0461506B2
Authority
JP
Japan
Prior art keywords
heat dissipation
dissipation block
flat
heat
integrated circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP25757285A
Other languages
English (en)
Japanese (ja)
Other versions
JPS62118552A (ja
Inventor
Toshifumi Sano
Yoichi Matsuo
Mitsuo Takamoto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Electric Co Ltd filed Critical Nippon Electric Co Ltd
Priority to JP25757285A priority Critical patent/JPS62118552A/ja
Priority to EP86308975A priority patent/EP0225108B1/en
Priority to DE8686308975T priority patent/DE3666644D1/de
Priority to US06/931,847 priority patent/US4854377A/en
Publication of JPS62118552A publication Critical patent/JPS62118552A/ja
Publication of JPH0461506B2 publication Critical patent/JPH0461506B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/433—Auxiliary members in containers characterised by their shape, e.g. pistons
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/35—Mechanical effects
    • H01L2924/351—Thermal stress
    • H01L2924/3511—Warping

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP25757285A 1985-11-19 1985-11-19 集積回路の冷却構造 Granted JPS62118552A (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP25757285A JPS62118552A (ja) 1985-11-19 1985-11-19 集積回路の冷却構造
EP86308975A EP0225108B1 (en) 1985-11-19 1986-11-18 Liquid cooling system for integrated circuit chips
DE8686308975T DE3666644D1 (en) 1985-11-19 1986-11-18 Liquid cooling system for integrated circuit chips
US06/931,847 US4854377A (en) 1985-11-19 1986-11-18 Liquid cooling system for integrated circuit chips

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP25757285A JPS62118552A (ja) 1985-11-19 1985-11-19 集積回路の冷却構造

Publications (2)

Publication Number Publication Date
JPS62118552A JPS62118552A (ja) 1987-05-29
JPH0461506B2 true JPH0461506B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1992-10-01

Family

ID=17308134

Family Applications (1)

Application Number Title Priority Date Filing Date
JP25757285A Granted JPS62118552A (ja) 1985-11-19 1985-11-19 集積回路の冷却構造

Country Status (1)

Country Link
JP (1) JPS62118552A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3575829B2 (ja) * 1994-06-13 2004-10-13 東洋エアゾール工業株式会社 エアゾール用ディップチューブ
EP2166569A1 (de) * 2008-09-22 2010-03-24 ABB Schweiz AG Kühlvorrichtung für ein Leistungsbauelement

Also Published As

Publication number Publication date
JPS62118552A (ja) 1987-05-29

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