JPH04257498A - Data carrier - Google Patents

Abstract

PURPOSE:To enhance the insulating performance between the connecting terminals provided on a data carrier. CONSTITUTION:The insulating parts 21 between connecting terminals 20 are projected beyond the top surfaces of the connecting terminals 20. Therefore, this prevents water from being collected on the insulating parts 21 and abrasion chips of the connecting terminals 20 or foreign material from being accumulated thereon, thereby eliminating the possibility of their moisture absorption and hence the electric insulation deterioration between the connecting terminals 20.

Description

[Detailed description of the invention]

0001

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to data carriers such as IC cards and electronic coins.

0002

2. Description of the Related Art Conventional data carriers will be explained below. FIG. 8 is a plan view of a conventional IC card as an example of a data carrier. In the figure, 1 is a card base material;
This card base material 1 was provided with a recess 2, and an IC module 3 was embedded in this recess 2.

[0003] This IC module 3 is provided with a plurality of connection terminals 4 for connection to an external device (not shown), and each of the connection terminals 4 is electrically insulated by an insulating section 5. was. Further, the insulating portion 5 had a substantially concave shape with respect to the top surface of the connecting terminal 4. Note that a similar technique is described in, for example, Japanese Unexamined Patent Publication No. 188964/1983.

0004

[Problems to be Solved by the Invention] However, in such a conventional configuration, the insulating portion 5 has a concave shape with respect to the top surface of the connecting terminal 4, so water may accumulate in the insulating portion 5 and the connecting terminal There is a problem in that abrasion powder or foreign matter from the terminals 4 accumulates, which absorbs moisture and deteriorates the electrical insulation between the connecting terminals 4. Moreover, it was extremely difficult to completely remove them.

The present invention is intended to solve these conventional problems, and is aimed at improving the insulation between connection terminals.

[0006]

[Means for Solving the Problems] In order to achieve this object, the data carrier of the present invention has an insulating portion between the connecting terminals in a convex shape with respect to the top surface of the connecting terminals.

[0007]

[Operation] With this configuration, the insulating part formed between the connecting terminals has a convex shape with respect to the top surface of the connecting terminals, so
Water will no longer accumulate in this insulating section. Furthermore, there is no possibility that the electrical insulation will deteriorate due to accumulation of abrasion powder between the connection terminal and the contact point. Furthermore, foreign matter does not accumulate and absorb moisture, thereby preventing deterioration of the electrical insulation between the connection terminals. Therefore, the insulation between the connection terminals can always be maintained in a good state.

[0008]

[Embodiment] (Embodiment 1) An embodiment of the present invention will be described below with reference to the drawings. 1 and 2 are diagrams showing a first embodiment of the present invention, FIG. 2 is a plan view of an IC card used as a first example of a data carrier, and FIG.
It is an enlarged cross-sectional view of the main part in the -A cross section.

In FIGS. 1 and 2, 11 is a card base material, and a recess 12 provided in this card base material 11 has a
The IC module 13 is buried so that a portion thereof is exposed to the outside. This IC module 13 is adhered to the card base material 11 with an adhesive 14. Also, this I
The C module 13 includes a metal lead frame 15 and an IC chip 17 bonded to the main surface of the lead frame 15 with an adhesive 16. The pads of this IC chip 17 are connected to the lead frame 15 by metal lead wires 18 and sealed with resin with a protector 19. Further, the other surface of this lead frame 15 is formed as a plurality of connection terminals 20 and is exposed to the outside.
connected to. The plurality of connection terminals 20 are electrically insulated from each other by an insulating portion 21 integrally formed with the protector 19.

Note that it is also possible to integrally mold the insulating portion 21 and the connecting terminal 20 and then seal them with a resin using the protector 19.

The connecting terminal 20 and the insulating part 21 are made of thermosetting epoxy resin or thermoplastic PBT or PPS.
, PET-based resin or other highly insulating resin by transfer molding or injection molding, and the insulating portion 21 is molded in a more convex shape than the connecting terminal 20. In this embodiment, the height of the convex portion is 0.02 mm to 0.2 mm. Further, FIGS. 3, 4, and 5 are enlarged cross-sectional views of the connection terminal 20 and the insulating part 21, showing examples of the shape of the insulating part.

[0012] Here, the convex surface 22 of the insulating portion 21 is preferably made into a smooth curved surface as shown in FIG. By adopting such a shape, foreign matter does not adhere to the connection terminal 20. Furthermore, the IC card can be smoothly inserted into an external device (not shown) without damaging the contacts.

In this embodiment, the lead frame 15 is used for the IC module 13, but this lead frame 1
A printed circuit board can also be used instead of 5. That is, the IC module includes a printed wiring board, an IC chip placed on the main surface of the printed wiring board, a protector in which the IC chip is sealed with resin, and the other surface of the printed wiring board exposed to the outside. The configuration may include a plurality of connection terminals formed on the portion where the connection terminal is connected. In this case, an insulating resin such as silicone resin, acrylic resin, epoxy resin, etc. is formed by silk printing on the insulating part formed between the connecting terminals, and the insulating part is formed in a convex shape with respect to the connecting terminals. That's good.

(Embodiment 2) A second embodiment of the present invention is shown in FIG.
and shown in FIG. FIG. 6 is a plan view of an electronic coin used as a second example of the data carrier, and FIG. 7 is a sectional view taken along line BB.

In FIGS. 6 and 7, reference numeral 31 denotes an exterior member as a base material, and an IC module 33 is inserted into a recess 32 provided in this exterior member 31 so that a portion thereof is exposed to the outside.
is buried. This IC module 33 is bonded to the exterior member 31 with an adhesive 34. Further, in this IC module 33, an IC chip 37 is mounted on the main surface of a printed wiring board (hereinafter referred to as a printed circuit board) 35 using an adhesive 36.
It is glued and mounted. And this IC chip 3
The pad 44 of No. 7 is connected to the printed pattern 39 of the printed circuit board 35 by a metal lead wire 38, and this printed pattern 39 is connected to the other surface of the printed circuit board 35 exposed to the outside through the through hole 40. It is connected to the formed connection terminal 41. A plurality of connection terminals 41 are provided. Then, it is connected to an external device (not shown) via this connection terminal 41. The plurality of connection terminals 41 are electrically insulated from each other by an insulating section 42. Further, the IC chip 37 side of this printed circuit board 35 is sealed with resin with a protector 43. Therefore, the insulation part 4
2. Water does not collect there, and there is little chance of foreign matter adhering to it. Moreover, even if foreign matter adheres, it can be easily cleaned.

The insulating part 42 is made of an insulating resin such as silicon resin, acrylic resin, epoxy resin, etc. by silk printing, and is made higher than the top surface of the connecting terminal 41 so that the insulating part 42 can be connected. The terminal 41 has a convex shape with respect to the top surface. The height of this convex shape is 0.02 mm ~
It is set to 0.2 mm.

[0017] Also, in the electronic coin of this embodiment,
As in the first embodiment, the convex surface of the insulating portion 42 is preferably made into a smooth curved surface as shown in FIG.

Furthermore, although the printed circuit board 35 is used for the IC module 33 in this embodiment, a lead frame may be used instead of the printed circuit board 35 as described in the first embodiment. That is, the IC module in this case includes a lead frame, an IC chip placed on the main surface of the lead frame, a protector in which the IC chip is sealed with resin, and a protector formed on the other surface of the lead frame. The configuration may include a plurality of connection terminals. The connecting terminal and the insulating part are molded by transfer molding or injection molding using a highly insulating resin such as thermosetting epoxy resin or thermoplastic PBT, PPS, or PET resin, and the insulating part is the connecting terminal. It is better to make it more convex.

[0019]

[Effects of the Invention] As described above, in the present invention, since the insulating portion formed between the connecting terminals has a convex shape with respect to the top surface of the connecting terminal, water does not accumulate in this insulating portion. Moreover, there is no possibility that abrasion powder from the contacts of the connecting terminals will accumulate and deteriorate electrical insulation. Furthermore, foreign matter accumulates,
There is no possibility that it will absorb moisture and deteriorate the electrical insulation between the connection terminals. Therefore, the insulation between the connection terminals can always be kept in a good state, and as a result, the reliability of data transmission of the data carrier is improved.

Furthermore, since the insulating part has a convex shape with respect to the top surface of the connection terminal, moisture adhering to the insulating part can be easily wiped off, so that the insulation properties of the data carrier can be immediately improved. can be recovered, and therefore can be used, for example, in sea baths or saunas, thereby expanding the range of uses of the data carrier.

[Brief explanation of the drawing]

FIG. 1 is a diagram showing an IC card according to a first embodiment of the present invention, and is an enlarged cross-sectional view of main parts taken along the line A-A in FIG.

[Figure 2]
Plan view of the IC card

[Fig. 3] An enlarged cross-sectional view showing an example of the shape of the connection terminal and insulating part in the same embodiment.

[Fig. 4] An enlarged cross-sectional view showing an example of the shape of the connection terminal and insulating part in the same embodiment.

[Fig. 5] An enlarged sectional view showing an example of the shape of the connecting terminal and insulating part in the same embodiment.

FIG. 6 is a plan view of an electronic coin in a second embodiment of the present invention.

[Fig. 7] Cross-sectional view taken along the BB section in Fig. 6

[Figure 8] Plan view of conventional IC card

[Explanation of symbols]

11 Card base material 12, 32 recess 13,33 IC module 17,37 IC chip 20, 41 Connection terminal 21, 42 Insulation section 31 Exterior parts

Claims (2)

[Claims] Claim 1: Consisting of a base material and an IC module embedded in a recessed part of the base material so that a part thereof is exposed to the outside, and a plurality of connection terminals are connected to each other in the exposed part of the IC module. A data carrier that is provided in an insulated state and has an insulating portion between the connection terminals in a convex shape with respect to a top surface of the connection terminals. 2. The data carrier according to claim 1, wherein the insulating portion between the connecting terminals has a convex shape with a smooth surface.