JPH0424307B2 - - Google Patents
Info
- Publication number
- JPH0424307B2 JPH0424307B2 JP62046371A JP4637187A JPH0424307B2 JP H0424307 B2 JPH0424307 B2 JP H0424307B2 JP 62046371 A JP62046371 A JP 62046371A JP 4637187 A JP4637187 A JP 4637187A JP H0424307 B2 JPH0424307 B2 JP H0424307B2
- Authority
- JP
- Japan
- Prior art keywords
- weight
- glass
- ceramic substrate
- copper
- gold
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C8/00—Enamels; Glazes; Fusion seal compositions being frit compositions having non-frit additions
- C03C8/14—Glass frit mixtures having non-frit additions, e.g. opacifiers, colorants, mill-additions
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C14/00—Glass compositions containing a non-glass component, e.g. compositions containing fibres, filaments, whiskers, platelets, or the like, dispersed in a glass matrix
- C03C14/004—Glass compositions containing a non-glass component, e.g. compositions containing fibres, filaments, whiskers, platelets, or the like, dispersed in a glass matrix the non-glass component being in the form of particles or flakes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
- H05K3/4673—Application methods or materials of intermediate insulating layers not specially adapted to any one of the previous methods of adding a circuit layer
- H05K3/4676—Single layer compositions
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Life Sciences & Earth Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Geochemistry & Mineralogy (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Ceramic Engineering (AREA)
- Dispersion Chemistry (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Compositions Of Oxide Ceramics (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP62046371A JPS63215559A (ja) | 1987-02-27 | 1987-02-27 | セラミツク基板 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP62046371A JPS63215559A (ja) | 1987-02-27 | 1987-02-27 | セラミツク基板 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS63215559A JPS63215559A (ja) | 1988-09-08 |
JPH0424307B2 true JPH0424307B2 (enrdf_load_stackoverflow) | 1992-04-24 |
Family
ID=12745291
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP62046371A Granted JPS63215559A (ja) | 1987-02-27 | 1987-02-27 | セラミツク基板 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS63215559A (enrdf_load_stackoverflow) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5290375A (en) * | 1989-08-05 | 1994-03-01 | Nippondenso Co., Ltd. | Process for manufacturing ceramic multilayer substrate |
JP2500691B2 (ja) * | 1989-08-28 | 1996-05-29 | 日本電気株式会社 | 低温焼結性低誘電率無機組成物 |
JP2500692B2 (ja) * | 1989-10-25 | 1996-05-29 | 日本電気株式会社 | 低温焼結性低誘電率無機組成物 |
JPH03159959A (ja) * | 1989-11-16 | 1991-07-09 | Inax Corp | セラミックス原料 |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS58151345A (ja) * | 1982-02-26 | 1983-09-08 | Asahi Glass Co Ltd | 低誘電率ガラス組成物 |
JPS599992A (ja) * | 1982-07-08 | 1984-01-19 | 株式会社日立製作所 | 多層配線基板の製造方法 |
JPS61186248A (ja) * | 1985-02-13 | 1986-08-19 | Nippon Electric Glass Co Ltd | ガラスセラミツク |
-
1987
- 1987-02-27 JP JP62046371A patent/JPS63215559A/ja active Granted
Also Published As
Publication number | Publication date |
---|---|
JPS63215559A (ja) | 1988-09-08 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
LAPS | Cancellation because of no payment of annual fees |