JPH04232700A - Semiconductor storage device - Google Patents

Semiconductor storage device

Info

Publication number
JPH04232700A
JPH04232700A JP2408591A JP40859190A JPH04232700A JP H04232700 A JPH04232700 A JP H04232700A JP 2408591 A JP2408591 A JP 2408591A JP 40859190 A JP40859190 A JP 40859190A JP H04232700 A JPH04232700 A JP H04232700A
Authority
JP
Japan
Prior art keywords
semiconductor memory
writing
address
semiconductor storage
checker pattern
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2408591A
Other languages
Japanese (ja)
Inventor
Yoshiyuki Tanaka
良幸 田中
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electronics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electronics Corp filed Critical Matsushita Electronics Corp
Priority to JP2408591A priority Critical patent/JPH04232700A/en
Publication of JPH04232700A publication Critical patent/JPH04232700A/en
Pending legal-status Critical Current

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  • For Increasing The Reliability Of Semiconductor Memories (AREA)

Abstract

PURPOSE:To reduce the evaluating time of a semiconductor storage device. CONSTITUTION:A checker pattern write circuit 27 which disconnects semiconductor storage elements l-16 from the address lines 17-20 of an X-address decoder 25 and address lines 21-24 of a Y-address decoder 26 and, at the same time, connects checker pattern writing signal lines 30 for writing data (checker pattern) having a grid-like pattern for evaluating semiconductor storage elements to the elements 1-16 are added between the decoders 25 and 26 and the elements 1-16. Therefore, the data having the grid-like pattern for evaluation can be written in the semiconductor storage elements 1-16 in a short time as compared with the conventional example which makes the writing one bit by one bit and the evaluating time of this semiconductor device can be reduced.

Description

【発明の詳細な説明】[Detailed description of the invention]

【0001】0001

【産業上の利用分野】本発明は、半導体記憶装置、特に
その半導体記憶素子評価用データの書込み回路に関する
ものである。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor memory device, and more particularly to a write circuit for data for evaluating semiconductor memory elements thereof.

【0002】0002

【従来の技術】従来の半導体記憶装置とその評価方法を
、図2に示す16ビットの半導体記憶装置を例に取り説
明する。
2. Description of the Related Art A conventional semiconductor memory device and its evaluation method will be explained using a 16-bit semiconductor memory device shown in FIG. 2 as an example.

【0003】図2に示すように、半導体記憶素子1〜1
6はそれぞれ、Xアドレスデコーダ25のXアドレスデ
ータライン17〜20とYアドレスデコーダ26のYア
ドレスデータライン21〜24に接続されている。
As shown in FIG. 2, semiconductor memory elements 1 to 1
6 are connected to the X address data lines 17 to 20 of the X address decoder 25 and the Y address data lines 21 to 24 of the Y address decoder 26, respectively.

【0004】以上のように構成された半導体記憶装置に
ついて、以下その動作を説明する。まず、Xアドレスデ
コーダ25によりXアドレスデータライン17にアドレ
ッシング信号が送られ、Yアドレスデコーダ26により
Yアドレスデータライン21にアドレッシング信号が送
られ、Xアドレスデータライン17とYアドレスデータ
ライン21の交差する半導体記憶素子1がアドレッシン
グされる。アドレッシングされたと同時に半導体記憶素
子1に対して、ある情報の読みだし、書込みが行われる
。次に上述と同様の方法で半導体記憶素子2がアドレッ
シングされ、アドレッシングされたと同時に半導体記憶
素子2に対して、ある情報の読みだし、書込みが行われ
、このようにして半導体記憶素子1〜16について読み
だし、書込みが行われる。
The operation of the semiconductor memory device configured as described above will be explained below. First, an addressing signal is sent to the X address data line 17 by the X address decoder 25, an addressing signal is sent to the Y address data line 21 by the Y address decoder 26, and the X address data line 17 and the Y address data line 21 intersect. Semiconductor storage element 1 is addressed. At the same time as addressing, certain information is read or written to the semiconductor memory element 1. Next, the semiconductor memory element 2 is addressed in the same manner as described above, and at the same time as being addressed, certain information is read and written to the semiconductor memory element 2, and in this way, the semiconductor memory elements 1 to 16 are Reading and writing are performed.

【0005】また、以上のように動作する半導体記憶装
置の評価方法について説明する。半導体記憶装置の評価
を行う場合、一例として半導体記憶素子1,3,6,8
,9,11,14,16に書込みを行い、格子状の模様
のデータ(以下、チェッカーパターンと称す)を形成す
る。 このチェッカーパターンにより、隣会う半導体記憶素子
間で誤書込み、誤読みだしが行われないかを検査するこ
とができる。
[0005] Also, a method for evaluating a semiconductor memory device operating as described above will be explained. When evaluating a semiconductor memory device, for example, semiconductor memory elements 1, 3, 6, 8
, 9, 11, 14, and 16 to form grid pattern data (hereinafter referred to as checker pattern). With this checker pattern, it is possible to check whether erroneous writing or erroneous reading occurs between adjacent semiconductor memory elements.

【0006】[0006]

【発明が解決しようとする課題】しかし、上記従来の半
導体記憶装置では半導体記憶素子1〜16の評価を行う
場合、1ビットずつ書込みを行い、1ビットずつ読みだ
しを行わなくてはならないため、評価にかかる時間が長
くなるという問題があった。
However, in the conventional semiconductor memory device described above, when evaluating semiconductor memory elements 1 to 16, it is necessary to write one bit at a time and read out one bit at a time. There was a problem that the evaluation took a long time.

【0007】本発明は上記問題を解決するものであり、
半導体記憶素子に短時間で評価用のチェッカーパターン
を書き込むことができる回路を付加し、評価時間を短縮
できる半導体記憶装置を提供することを目的とするもの
である。
[0007] The present invention solves the above problems, and
It is an object of the present invention to provide a semiconductor memory device that can shorten evaluation time by adding a circuit that can write a checker pattern for evaluation in a short time to a semiconductor memory element.

【0008】[0008]

【課題を解決するための手段】上記問題を解決するため
本発明の半導体記憶装置は、アドレスデコーダと半導体
記憶素子間に、前記アドレスデコーダのアドレスライン
と前記半導体記憶素子を切離すと同時に、半導体記憶素
子に半導体記憶素子評価用データを書き込む書込み用信
号ラインを接続する書込み回路を設けたことを特徴とす
るものである。
Means for Solving the Problems In order to solve the above problems, the semiconductor memory device of the present invention has a structure in which the address line of the address decoder and the semiconductor memory element are separated from each other between the address decoder and the semiconductor memory element. The present invention is characterized in that a write circuit is provided that connects a write signal line for writing semiconductor memory element evaluation data to the memory element.

【0009】[0009]

【作用】上記構成により、半導体記憶素子評価用データ
を書き込む回路から出力される信号で評価用のデータが
半導体記憶素子に書き込まれるため、従来1ビットずつ
書込みを行っていたときに比較して書込み時間が短縮さ
れ、評価時間が短縮される。
[Operation] With the above configuration, evaluation data is written to the semiconductor memory element using a signal output from the circuit that writes semiconductor memory element evaluation data, so compared to when writing was performed one bit at a time in the past, the writing speed is much faster. Saves time and reduces evaluation time.

【0010】0010

【実施例】以下、本発明の一実施例を図面に基づいて説
明する。なお、従来例の図2と同一の構成には同一の符
号を付して説明を省略する。
DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to the drawings. Note that the same components as those in the conventional example shown in FIG.

【0011】本発明の半導体記憶装置は、新たに、Xア
ドレスデコーダ25およびYアドレスデコーダ26と半
導体記憶素子1〜16間に、Xアドレスデコーダ25の
アドレスライン17〜20およびYアドレスデコーダ2
6のアドレスライン21〜24と半導体記憶素子1〜1
6を切離すと同時に、半導体記憶素子1〜16に半導体
記憶素子評価用データであるチェッカーパターンを書き
込むチェッカーパターン書込み用信号ライン30を接続
するチェッカーパターン書込み回路27を付加している
。このチェッカーパターン書込み回路27には、アドレ
スライン17〜24とチェッカーパターン書込み用信号
ライン30を切り換える信号を入力するアドレスデータ
ライン切り換え信号入力端子28と、チェッカーパター
ン書込み用信号ライン30にチェッカーパターン書込み
信号を入力するチェッカーパターン書込み信号入力端子
29が設けられている。
The semiconductor memory device of the present invention newly includes address lines 17 to 20 of the X address decoder 25 and the Y address decoder 2 between the X address decoder 25 and the Y address decoder 26 and the semiconductor memory elements 1 to 16.
6 address lines 21 to 24 and semiconductor memory elements 1 to 1
At the same time, a checker pattern writing circuit 27 is added which connects a checker pattern writing signal line 30 for writing a checker pattern, which is semiconductor storage element evaluation data, to the semiconductor storage elements 1 to 16. This checker pattern writing circuit 27 includes an address data line switching signal input terminal 28 that inputs a signal for switching between the address lines 17 to 24 and a checker pattern writing signal line 30, and a checker pattern writing signal input terminal 28 for inputting a signal for switching between the address lines 17 to 24 and a checker pattern writing signal line 30. A checker pattern write signal input terminal 29 is provided to input the checker pattern write signal.

【0012】以上のように構成された本実施例の半導体
記憶装置について、以下その評価方法を説明する。まず
、アドレスデータライン切り換え信号入力端子28より
入力された切り換え信号により、たとえば切り換え素子
(図示せず)を駆動して、Xアドレスデコーダ25のア
ドレスライン17〜20およびYアドレスデコーダ26
のアドレスライン21〜24と半導体記憶素子1〜16
を切離すと同時に、半導体記憶素子1〜16にチェッカ
ーパターン書込み用信号ライン30を接続する。次に、
チェッカーパターン書込み信号入力端子29より入力さ
れたチェッカーパターン書込み信号により半導体記憶素
子1,3,6,8,9,11,14,16に書込みを行
う。この形成された格子状の模様のデータ、すなわちこ
のチェッカーパターンにより、隣会う半導体記憶素子1
〜16間で誤書込み、誤読みだしが行われないかを検査
することができる。
A method for evaluating the semiconductor memory device of this embodiment configured as described above will be explained below. First, a switching signal inputted from the address data line switching signal input terminal 28 drives, for example, a switching element (not shown) to control the address lines 17 to 20 of the X address decoder 25 and the Y address decoder 26.
address lines 21 to 24 and semiconductor memory elements 1 to 16
At the same time, the checker pattern writing signal line 30 is connected to the semiconductor memory elements 1 to 16. next,
Writing is performed in the semiconductor memory elements 1, 3, 6, 8, 9, 11, 14, and 16 by a checker pattern write signal inputted from the checker pattern write signal input terminal 29. The data of the formed lattice pattern, that is, the checker pattern, allows the adjacent semiconductor memory elements 1
It is possible to check whether erroneous writing or erroneous reading occurs between .

【0013】このように、本実施例によれば、チェッカ
ーパターン書込み回路27を設けたことにより、従来1
ビットずつ書込みを行っていたときに比較して短時間で
半導体記憶素子1〜16に評価のための格子状の模様の
データを書き込むことができ、短時間で半導体記憶装置
の評価を行うことができる。
As described above, according to this embodiment, by providing the checker pattern writing circuit 27, it is possible to
It is possible to write grid pattern data for evaluation into the semiconductor memory elements 1 to 16 in a shorter time than when writing bit by bit, and it is possible to evaluate the semiconductor memory device in a short time. can.

【0014】なお、本実施例では、半導体記憶素子が1
6ビットの半導体記憶装置を用いているが、他のビット
数の半導体記憶素子の半導体記憶装置を用いてもよい。
Note that in this embodiment, the number of semiconductor memory elements is one
Although a 6-bit semiconductor memory device is used, semiconductor memory devices with semiconductor memory elements having other bit numbers may also be used.

【0015】[0015]

【発明の効果】以上述べたように本発明によれば、評価
用データ書込み回路を設けたことにより、従来と比較し
て短時間で半導体記憶素子に評価のためのデータを書き
込むことができ、短時間で半導体記憶装置の評価を行う
ことができる。
As described above, according to the present invention, by providing the evaluation data writing circuit, it is possible to write evaluation data to a semiconductor memory element in a shorter time than in the past. A semiconductor memory device can be evaluated in a short time.

【図面の簡単な説明】[Brief explanation of the drawing]

【図1】本発明の一実施例における半導体記憶装置の概
略構成図である。
FIG. 1 is a schematic configuration diagram of a semiconductor memory device according to an embodiment of the present invention.

【図2】従来の半導体記憶装置の概略構成図である。FIG. 2 is a schematic configuration diagram of a conventional semiconductor memory device.

【符号の説明】[Explanation of symbols]

1〜16  半導体記憶素子 17〜20  Xアドレスデータライン21〜24  
Yアドレスデータライン25      Xアドレスデ
コーダ 26      Yアドレスデコーダ
1-16 Semiconductor storage elements 17-20 X address data lines 21-24
Y address data line 25 X address decoder 26 Y address decoder

Claims (1)

【特許請求の範囲】[Claims] 【請求項1】  アドレスデコーダと半導体記憶素子間
に、前記アドレスデコーダのアドレスラインと前記半導
体記憶素子を切離すと同時に、半導体記憶素子に半導体
記憶素子評価用データを書き込む書込み用信号ラインを
接続する書込み回路を設けた半導体記憶装置。
1. A write signal line for writing semiconductor memory element evaluation data into the semiconductor memory element is connected between an address decoder and a semiconductor memory element at the same time as the address line of the address decoder and the semiconductor memory element are separated. A semiconductor memory device equipped with a write circuit.
JP2408591A 1990-12-28 1990-12-28 Semiconductor storage device Pending JPH04232700A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2408591A JPH04232700A (en) 1990-12-28 1990-12-28 Semiconductor storage device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2408591A JPH04232700A (en) 1990-12-28 1990-12-28 Semiconductor storage device

Publications (1)

Publication Number Publication Date
JPH04232700A true JPH04232700A (en) 1992-08-20

Family

ID=18518027

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2408591A Pending JPH04232700A (en) 1990-12-28 1990-12-28 Semiconductor storage device

Country Status (1)

Country Link
JP (1) JPH04232700A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001236795A (en) * 2000-02-22 2001-08-31 Oki Electric Ind Co Ltd Semiconductor memory
JP2008146827A (en) * 1995-11-29 2008-06-26 Texas Instr Inc <Ti> Integrated circuit semiconductor random access memory device

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61292298A (en) * 1985-06-18 1986-12-23 Nec Corp Memory circuit
JPH01134799A (en) * 1987-11-20 1989-05-26 Sony Corp Memory device

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61292298A (en) * 1985-06-18 1986-12-23 Nec Corp Memory circuit
JPH01134799A (en) * 1987-11-20 1989-05-26 Sony Corp Memory device

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008146827A (en) * 1995-11-29 2008-06-26 Texas Instr Inc <Ti> Integrated circuit semiconductor random access memory device
JP2001236795A (en) * 2000-02-22 2001-08-31 Oki Electric Ind Co Ltd Semiconductor memory

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